VIA Technologies Mobile360 M820 User manual

USER MANUAL
VIA Mobile360 M820
Fanless ultra-compact
in-vehicle 360° surround view
surveillance & ADAS system
1.00-08282019-181700

Copyright
Copyright ©2019 VIA Technologies Incorporated. All rights reserved.
No part of this document may be reproduced, transmied, transcribed, stored in a retrieval system, or translated into any language, in any
form or by any means, electronic, mechanical, magnec, opcal, chemical, manual or otherwise without the prior wrien permission of
VIA Technologies, Incorporated.
Trademarks
All trademarks are the property of their respecve holders.
Disclaimer
No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no warranes,
implied or otherwise, in regard to this document and to the products described in this document. The informaon provided in this
document is believed to be accurate and reliable as of the publicaon date of this document. However, VIA Technologies assumes no
responsibility for the use or misuse of the informaon (including use or connecon of extra device/equipment/add-on card) in this
document and for any patent infringements that may arise from the use of this document. The informaon and product specicaons
within this document are subject to change at any me, without noce and without obligaon to nofy any person of such change.
VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any me without prior noce.
Regulatory Compliance
FCC-A Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC rules.
These limits are designed to provide reasonable protecon against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instrucon manual, may cause harmful interference to radio communicaons. Operaon of this equipment in a residenal area is likely to
cause harmful interference, in which case the user will be required to correct the interference at his personal expense.
Noce 1
The changes or modicaons not expressly approved by the party responsible for compliance could void the user's authority to operate
the equipment.
Noce 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.
Noce 3
The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conicts or
damages arising from incompability of the product. Check compability issue with your local sales representaves before placing an
order.

Baery Recycling and Disposal
• Only use the appropriate baery specied for this product.
• Do not re-use, recharge, or reheat an old baery.
• Do not aempt to force open the baery.
• Do not discard used baeries with regular trash.
• Discard used baeries according to local regulaons.
Safety Precauons
• Always read the safety instrucons carefully.
• Keep this User’s Manual for future reference.
• All cauons and warnings on the equipment should be noted.
• Keep this equipment away from humidity.
• Put this equipment on a reliable at surface before seng it up.
• Check the voltage of the power source and adjust to 110/220V before connecng the equipment to
the power inlet.
• Do not place the power cord where people will step on it.
• Always unplug the power cord before inserng any add-on card or module.
• If any of the following situaons arise, get the equipment checked by authorized service personnel:
• The power cord or plug is damaged.
• Liquid has entered into the equipment.
• The equipment has been exposed to moisture.
• The equipment is faulty or you cannot get it work according to User’s Manual.
• The equipment has been dropped and damaged.
• The equipment has an obvious sign of breakage.
• Do not leave this equipment in extreme temperatures or in a storage temperature above 70°C (158°F). The
equipment may be damaged.
• Do not leave this equipment in direct sunlight.
• Never pour any liquid into the opening. Liquid can cause damage or electrical shock.
• Do not place anything over the power cord.
• Do not cover the venlaon holes. The openings on the enclosure protect the equipment from
overheang.

VIA Moblie360 M820 User Manual
Box Contents
• 1 x VIA Moblie360 M820 system
• 1 x Phoenix plug to DC jack
• 1 x COM cable (for debugging)
• 1 x GPS antenna
• 2 x Wi-Fi/BT antennas
• 1 x Mounting bracket
• 1 x Screw pack for mounting
Ordering Informaon
Part Number Descripon
M360-820-1Q21A1 Fanless mobile system with 2.342GHz Qualcomm®APQ8096SG™Embedded
Processor, 4GB POP LPDDR4 RAM, HDMI, 2 USB 3.0, Micro USB 2.0 (debugging),
DIO, COM, CAN bus, Gigabit Ethernet, 9 FAKRA connectors for camera-in,
Wi-Fi, Bluetooth 4.1, GPS, SIM card slot, Micro SD card slot, 2 M.2 slots,
2 2.5" HDD/SSD bays, 12V DC-out, 9~36V DC-in with ACC/IGN
Oponal Accessories
Camera and Accessories
Part Number Descripon
99G40-08075Z 1.0MP FOV-40 720p CMOS automove-grade camera
99G40-08074Z 1.0MP FOV-190 720p CMOS automove-grade camera
99G33-230396 10M FAKRA cable
99G33-230406 15M FAKRA cable
Display Accessories
Part Number Descripon
99G73-01030C 7” Resisve touch monitor (1280x800)
Storage Opons
Part Number Descripon
99G61-080554 512GB Transcend 2.5" MLC SSD (-40°C-90°C)
99G61-080904 128GB Transcend 2.5" MLC SSD (-40°C-90°C)
Wireless Accessories
Part Number Descripon
99G40-071467 4G LTE/DC-HSPA+/EGPRS Mobile broadband full size miniPCIe module
(For North America Regions)
99G40-071967 4G LTE/DC-HSPA+/EGPRS Mobile broadband full size miniPCIe module
(For APAC+ South America Regions)
99G40-071457 4G LTE/DC-HSPA+/EGPRS Mobile broadband full size miniPCIe module
(For EU/APAC Regions)
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VIA Mobile360 M820 User Manual
Table of Contents
1. Product Overview .............................................................................................................. 1
1.1 Key Features ......................................................................................................................................... 1
1.1.1 High-Performance.......................................................................................................................... 1
1.1.2 Fanless, Compact, Ruggedized Chassis .......................................................................................... 1
1.1.3 OpmizedIntegraonwithMulpleI/OAccess ........................................................................... 1
1.1.4 MulpleCameraSupport .............................................................................................................. 1
1.1.5 SupportforaWideRangeofPowerSources ................................................................................ 1
1.1.6 StorageExpansion.......................................................................................................................... 2
1.1.7 NetworkingSupport....................................................................................................................... 2
1.1.8 MounngSoluon ......................................................................................................................... 2
1.1.9 EmbeddedOperangSystemReady.............................................................................................. 2
1.2 ProductSpecicaons ......................................................................................................................... 3
1.3 Layout Diagram .................................................................................................................................... 5
1.4 Product Dimensions ............................................................................................................................ 6
2. ExternalI/OPinDescriponsandFunconality ................................................................ 7
2.1 HDMI®Port ........................................................................................................................................... 7
2.2 USB3.0Ports........................................................................................................................................ 7
2.3 MicroUSB2.0Port ............................................................................................................................... 8
2.4 GigabitEthernetPort............................................................................................................................ 8
2.5 MicroSDCardSlot................................................................................................................................ 9
2.6 SIMCardSlot ........................................................................................................................................ 9
2.7 DIOPort.............................................................................................................................................. 10
2.8 HeadphoneandMic-inPort ............................................................................................................... 10
2.9 COMPort............................................................................................................................................ 10
2.10 CANBusPort ...................................................................................................................................... 11
2.11 FAKRAConnectors .............................................................................................................................. 11
2.12 PowerBuon...................................................................................................................................... 12
2.13 DC-in Jack ........................................................................................................................................... 12
2.14 DC-out Jack......................................................................................................................................... 12
2.15 AntennaConnectors........................................................................................................................... 13
3. OnboardI/O.................................................................................................................... 14
3.1 MiniPCIeSlot ...................................................................................................................................... 14
4. HardwareInstallaon ...................................................................................................... 15
4.1 Installingthe2.5"SATAHDD/SSD....................................................................................................... 15
4.2 InstallingtheWi-FiAntennas ............................................................................................................. 17
4.3 InstallingtheGPSAntenna ................................................................................................................. 17
4.4 InstallingtheFOVCamerasandFAKRACables ................................................................................... 18
4.5 UnpluggingtheFAKRACable.............................................................................................................. 19
4.6 ConnecngVIAMobile360M820totheVehicle'sIgnion(IGN) ...................................................... 20
4.7 InstallingthePhoenixPlugtoDCJack ................................................................................................ 21
5. SowareandTechnicalSupport ...................................................................................... 22
5.1 AndroidSupport................................................................................................................................. 22
5.2 TechnicalSupportandAssistance....................................................................................................... 22
AppendixA.InstallingWirelessAccessories............................................................................ 23
A.1. InstallingtheMobileBroadbandMiniPCIeModule ........................................................................... 23
AppendixB.InstallingMounngBracket ................................................................................ 26
B.1. InstallingtheMounngBracket ......................................................................................................... 26
AppendixC.InstallingVIAMobile360M820........................................................................... 29
C.1. MounngtheVIAMobile360M820................................................................................................... 29
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AppendixD.InstallingFOVAutomove-gradeCamerastotheCameraBrackets .................... 30
D.1. InstallingtheFOV-190Automove-gradeCameratotheSVSCameraBracket.................................. 30
D.2. InstallingtheFOV-40Automove-gradeCameratotheBSDCameraBracket ................................... 32
D.3. InstallingtheFOV-40Automove-gradeCameratotheFCWCameraBracket .................................. 34

VIA Mobile360 M820 User Manual
List of Figures
Figure1: FrontpanelI/Olayout.......................................................................................................................... 5
Figure2: BackpanelI/Olayout ........................................................................................................................... 5
Figure3: DimensionsoftheVIAMobile360M820(frontview) ......................................................................... 6
Figure4: DimensionsoftheVIAMobile360M820(sideview)........................................................................... 6
Figure5: DimensionsoftheVIAMobile360M820(boomview)...................................................................... 6
Figure6: HDMIportdiagram ............................................................................................................................. 7
Figure7: USB3.0portdiagram .......................................................................................................................... 7
Figure8: MicroUSB2.0portdiagram................................................................................................................. 8
Figure9: GigabitEthernetportdiagram ............................................................................................................. 8
Figure10: MicroSDcardslotdiagram .................................................................................................................. 9
Figure11: SIMcardslotdiagram .......................................................................................................................... 9
Figure12: DIOportdiagram ............................................................................................................................... 10
Figure13: HeadphoneandMic-inportdiagram................................................................................................. 10
Figure14: COMportdiagram ............................................................................................................................. 10
Figure15: CANbusportdiagram ........................................................................................................................ 11
Figure16: FAKRAconnectordiagram.................................................................................................................. 11
Figure17: Powerbuondiagram ....................................................................................................................... 12
Figure 18: DC-in jack diagram ............................................................................................................................. 12
Figure 19: DC-out jack diagram........................................................................................................................... 12
Figure20: Wi-Fiantennaconnectorsdiagram .................................................................................................... 13
Figure21: 4GandGPSantennaconnectorsdiagram.......................................................................................... 13
Figure22: MiniPCIeslotdiagram ........................................................................................................................ 14
Figure23: UnlockingtheSATAHDD/SSDbay ..................................................................................................... 15
Figure24: RemovingtheSATAHDD/SSDbays..................................................................................................... 15
Figure25: Installingthe2.5"SATAHDD/SSD...................................................................................................... 16
Figure26: ReinstallingtheSATAHDD/SSDbays .................................................................................................. 16
Figure27: InstallingtheWi-Fiantennas.............................................................................................................. 17
Figure28: InstallingtheGPSantenna ................................................................................................................. 17
Figure29: ConnecngtheFOVcameratotheFAKRAcable ............................................................................... 18
Figure30: ConnecngtheFAKRAcabletotheFAKRAconnector ....................................................................... 18
Figure31: UpluggingtheFAKRAcable ................................................................................................................ 19
Figure32: GPIOport'spin8 ................................................................................................................................ 20
Figure33: VIAMobile360M820andIGNconneconmethoddiagram............................................................. 20
Figure34: ConnecngthebaerycablesontothePhoenixplugtoDCjack ...................................................... 21
Figure35: ConnecngthePhoenixplugtoDCjack ............................................................................................ 21
Figure36: Unscrewingtheboomplatecover................................................................................................... 23
Figure37: Removingtheboomplatecover...................................................................................................... 24
Figure38: Installingthemobilebroadbandmodule........................................................................................... 24
Figure39: Connecngthe4Gantennacabletothemicro-RFconnectoronthemodule .................................. 25
Figure40: Installingthe4Gantenna ................................................................................................................... 25
Figure41: Installingtherubberdampers............................................................................................................ 26
Figure42: Installingthemounngbracket ......................................................................................................... 27
Figure43: Securingthemounngbracket .......................................................................................................... 28
Figure44: MounngtheVIAMobile360M820 .................................................................................................. 29
Figure45: InstallingtheFOV-190automove-gradecameraontheinternalbracket(SVScamerabracket) ..... 30
Figure46: Aachingtheinternalbrackettotheexternalbracket(SVScamerabracket).................................... 30
Figure47: Installingthedouble-sidedadhesivetapeontheexternalbracket(SVScamerabracket)................. 31
Figure48: Removingthedouble-sidedadhesivetapeprotecvecover(SVScamerabracket) .......................... 31
Figure49: InstallingtheFOV-40automove-gradecameraontheinternalbracket(BSDcamerabracket)....... 32
Figure50: Aachingtheinternalbrackettotheexternalbracket(BSDcamerabracket) ................................... 32
Figure51: Installingthedouble-sidedadhesivetapeontheexternalbracket(BSDcamerabracket) ................ 33
Figure52: Removingthedouble-sidedadhesivetapeprotecvecover(BSDcamerabracket).......................... 33
Figure53: InstallingtheFOV-40automove-gradecameraontheinternalbracket(FCWcamerabracket)...... 34
Figure54: Aachingtheinternalbrackettotheexternalbracket(FCWcamerabracket) .................................. 34
Figure55: Aachingtherotate-baseplatetotheexternalbracket(FCWcamerabracket)................................ 35
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VIA Mobile360 M820 User Manual
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Figure56: Aachingthedouble-sidedadhesivetapetotherotate-baseplate(FCWcamerabracket) ............. 35
Figure57: Removingthedouble-sidedadhesivetapeprotecvecover(FCWcamerabracket)......................... 36

VIA Mobile360 M820 User Manual
List of Tables
Table1: HDMIportpinouts .............................................................................................................................. 7
Table2: USB3.0pinouts ................................................................................................................................... 7
Table3: MicroUSB2.0portpinouts.................................................................................................................. 8
Table4: GigabitEthernetportpinouts .............................................................................................................. 8
Table5: GigabitEthernetportLEDcolordenion........................................................................................... 8
Table6: MicroSDcardslotpinouts ................................................................................................................... 9
Table7: SIMcardslotpinouts ........................................................................................................................... 9
Table8: DIOportpinouts ................................................................................................................................ 10
Table9: HeadphoneandMic-inportpinouts.................................................................................................. 10
Table10: COMportpinouts .............................................................................................................................. 10
Table11: CANbusportpinouts ......................................................................................................................... 11
Table12: FAKRAconnectorpinouts................................................................................................................... 11
Table13: Powerbuonbehaviordescripon ................................................................................................... 12
Table 14: DC-in jack pinouts .............................................................................................................................. 12
Table 15: DC-out jack pinouts ........................................................................................................................... 12
Table16: MiniPCIeslotpinouts ......................................................................................................................... 14
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VIA Mobile360 M820 User Manual
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1. Product Overview
TheVIAMobile360M820isafanlessultra-compactin-vehicle360°surroundviewsurveillanceandADAS
system.Itdeliversreal-mein-vehicle360°videomonitoringandrecordingforuptonineautomove-grade
camerastreams,andboostvehiclesafetyandeciencywithADAStechnology.
Withitsruggedizeddesignthathasbeenopmizedforthemostdemandingon-roadando-roadcondions,
theVIAMobile360M820providesaexibleandhigh-performancesoluonforawidevarietyofapplicaons
rangingfromFreightTransportaon&Delivery,Construcon,Industrial,&Mining,andAgriculture&Forestry
toRefuseCollecon,ArmoredCars&SecureFreightShipping,andBusesandCoaches.
TheVIAMobile360M820ispoweredbytheQualcomm®APQ8096SGEmbeddedProcessor,whichfeatures
twohigh-performanceKryo™coresupto2.342GHztwolow-powerKryocoresupto1.593GHz.Itcombines
advancedcompung,graphicsandAIprocessingperformance,richconnecvityopons,andI/Operipheral
integraoncapabiliesinanultra-compactfanlesssystem.
Measuringjust240mm(W)x53mm(H)x180mm(D),thesystemintegratesarichsetofI/Ofeaturesthrough
thefrontandbackpanelsofitsultra-compactchassis,includinganHDMIport,twoUSB3.0ports,Gigabit
Ethernet,CANBus,nineFAKRAconnectorsforcamera-in,andaMicroSDcardslot.Otherfeaturesinclude4GB
POPLPDDR4SDRAM,16GBeMMCashmemory,aSIMcardslot,DIO,COM,andaheadphone&mic-inport.
TheVIAMobile360M820supportshighcompungpoweroperaonwithlowpowerconsumpon,andithasa
built-in power management system that protects from power surges – guarding against damage from transient
carpower.Withthepowermanagementsystem,itiscapableofhandlingawiderangeofDCpowerinputs
from9V~36V.
1.1 Key Features
1.1.1 High-Performance
TheVIAMobile360M820systemispoweredbyaQualcomm®APQ8096SG™EmbeddedProcessorthat
providesafullrangeofrichfeaturesincludingsuperbmul-taskingperformanceanddeliverspowerful
performancetoahostofconnecteddeviceapplicaons.
1.1.2 Fanless, Compact, Ruggedized Chassis
TheVIAMobile360M820deliversfanlessoperaoninasealedaluminumalloychassisthatdoesdoubleduty
asathermalsoluon.Thecompactchassisdesignmakesitsuitabletoinstallinaspace-cricalenvironment
andensuremaximumreliability.
1.1.3 OpmizedIntegraonwithMulpleI/OAccess
WithfrontandbackpanelI/Oaccess,theVIAMobile360M820canbeeasilyconguredtosupportawide
varietyofapplicaonswitheasyintegraonandquicksetup.
1.1.4 MulpleCameraSupport
TheVIAMobile360M820isequippedwithnineFAKRAcameraconnectorsforcforin-vehicle360°surround
viewsurveillanceandADAS(AdvancedDriverAssistanceSystem).
1.1.5 SupportforaWideRangeofPowerSources
TheVIAMobile360M820supportsawiderangeofinputpowerfrom9Vto36VDC.Theexibilityofthepower
inputenablestheVIAMobile360M820tobedeployableforvariousautomaonenvironments.

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1.1.6 StorageExpansion
TheVIAMobile360M820has16GBeMMCashstorageonboardandfeaturesMicroSDcardslotsupportand
addional32GB,andtwoHDD/SSDbaysfor2.5"SATAHDD/SSD.
1.1.7 NetworkingSupport
TheVIAMobile360M820isequippedwithWi-Fi,GPSandanRJ-45portthatsupportshigh-speeddataGigabit
Ethernet.The4GconnecvitycanbeaddedthroughtheminiPCIeslotusingtheoponalmobilebroadband
miniPCIemodule.
1.1.8 MounngSoluon
TheVIAMobile360M820supportsmulplemethodsformounngthechassissecurely.TheruggedMobile360
M820canbemountedonaside-panelofacar,oorbed,oranyatsurface.
1.1.9 EmbeddedOperangSystemReady
TheVIAMobile360M820featuresacompletesowareevaluaonimagefeaturingAndroid8.0.

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1.2 ProductSpecicaons
Processor
• Qualcomm®APQ8096SG™EmbeddedProcessor
◦Twohigh-performanceKryocoresupto2.342GHz
◦Two low power Kryo cores up to 1.593GHz
System Memory
• 4GBPOPLPDDR4SDRAM
Storage
• 16GBeMMCashmemory
• 2xM.2SATAslots
• 2x2.5SATAHDD/SSDstoragebays
Graphics
• Qualcomm®Adreno™530 GPU
◦ 3Dgraphicsacceleratorwith64-bitaddressing624MHz
◦GraphicsenginesupporngOpenGLES3.1/GEP,GL4.4,DX11.3/4,OpenCL2.0,Renderscript-Next
◦SupportsH.264,VP8,HEVC8/10-bit,VP9videodecodingupto:4K@60fps,1080p@240fps,
8x1080p@30fps
Trusted Plaorm Module
• TPM1.2:ST33TPM12I2C
Camera-in Interface
• 3xDS90UB964-Q1QuadFPD-LinkIIIdeserializerHub
LAN
• RTL8111GEthernetController
Wireless Connecvity
• NFA324A-12H32QCA6174A-1Wi-Fi802.11a/b/g/n/ac+BT4.1comboLGAmodule
• MAX-7C-0u-blox7GNSSmodule
Audio
• QualcommWCD9335AudioCodec
HDMI
• IntegratedHDMI2.0transmier
Expansion I/O
• 1xminiPCIeslot(USBonly)
Front Panel I/O
• 2xUSB3.0ports
• 1xMicroUSB2.0port(fordebugging)
• 1xMicroSDcardslot
• 1xSIMcardslot
• 2x2.5"SATAHDD/SSDbays
• 1xPowerbuon

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Back Panel I/O
• 1xHDMIport
• 1xDIOport
• 1xCOMport
• 1xCANBusport
• 1xGigabitEthernetport
• 9xFAKRAconnectorsforcamera-in
• 1xHeadphoneandMic-inport
• 4xAntennaconnectorsforWi-Fi,4GandGPS
• 1x4-polePhoenix9V~36VDC-in
• 1x2-polePhoenix12VDC-out
Power Supply
• 9V~36VDC-inwithACC/IGN
Operang System
• Android8.0
VIA Smart ETK
• RTCWake-up,Suspend,Watchdogmer,CANbus,GPIO
Operang Temperature
• -20°C~70°C
Storage Temperature
• -20°C~70°C
Operang Humidity
• 0%~95%(non-condensing)
Vibraon Loading During Operaon
• ISO-16750-3TestVIIcompliance
Shock During Operaon
• ISO-16750-3TestVIIcompliance
Mechanical Construcon
• Aluminumtopcover
• Metalchassishousing
Dimensions
• 240mm(W)x53mm(H)x180mm(D)(9.45"x2.09"x7.09")
Weight
• 3.0kg(6.61lbs)
Compliance
• CE,FCC
Notes:
1.AstheoperangtemperatureprovidedinthespecicaonsisaresultoftesngperformedinVIA’schamber,a
numberofvariablescaninuencethisresult.Pleasenotethattheworkingtemperaturemayvarydependingon
theactualsituaonandenvironment.Itishighlyrecommendedtoexecuteasolidtesngprogramandtakeallthe
variablesintoconsideraonwhenbuildingthesystem.Pleaseensurethatthesystemrunswellundertheoperang
temperatureintermsofapplicaon.
2.PleasenotethatthelifespanoftheonboardeMMC/UFSmemorychipmayvarydependingontheamountof
access.MorefrequentandlargerdataaccessontheeMMCmemorymakesitslifespanshorter.Therefore,itishighly
recommendedtouseareplaceableexternalstorage(e.g.,SDcard)forlargedataaccess.

VIA Mobile360 M820 User Manual
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1.3 Layout Diagram
Figure 1:FrontpanelI/Olayout
Figure 2:BackpanelI/Olayout

VIA Mobile360 M820 User Manual
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1.4 Product Dimensions
Figure 3:DimensionsoftheVIAMobile360M820(frontview)
Figure 4:DimensionsoftheVIAMobile360M820(sideview)
Figure 5:DimensionsoftheVIAMobile360M820(boomview)

VIA Mobile360 M820 User Manual
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2. External I/O Pin Descripons and Funconality
TheVIAMobile360M820hasawideseleconofinterfaces.Itincludesaseleconoffrequently-usedportsas
partoftheexternalI/Ocoastline.
2.1 HDMI®Port
TheVIAMobile360M820isequippedwithoneHDMIportonthebackpanelwhichusesanHDMIportTypeA
receptacleconnectortoconnectHighDenionvideoanddigitalaudiousingasinglecable.Thepinoutsofthe
HDMIportareshownbelow.
Table 1: HDMIportpinouts
2.2 USB3.0Ports
TheVIAMobile360M820isequippedwithtwoUSB3.0portsinthefrontpanel.EachUSB3.0porthasa
maximumdatatransferrateofupto5GbpsandiscompablewithUSB2.0specicaons.TheUSBportsgive
completePlugandPlayandhotswapcapabilityforexternaldevices.ThepinoutsoftheUSB3.0portsare
shown below.
Table 2: USB3.0portpinouts
Figure 6:HDMIportdiagram
Figure 7:USB3.0portdiagram
Pin Signal Pin Signal
1D2+ 11 GND
2 GND 12 CLK-
3 D2- 13 CEC
4D1+ 14 NC
5 GND 15 DDC_CLK
6 D1- 16 DDC_DATA
7D0+ 17 GND
8 GND 18 HDMI_5V
9 D0- 19 PLUG_DET
10 CLK+
Pin Signal
1VBUS
2 D-
3D+
4 GND
5RX-
6RX+
7 GND
8TX-
9TX+

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2.3 MicroUSB2.0Port
TheVIAMobile360M820isequippedwithoneMicroUSB2.0portlocatedonthefrontpanel.TheMicroUSB
2.0portsupportsOTG(On-The-Go)fordebugging.ThepinoutsoftheMicroUSB2.0portareshownbelow.
Table 3: MicroUSB2.0portpinouts
2.4 GigabitEthernetPort
TheVIAMobile360M820comeswithoneGigabitEthernetportonthebackpanelwhichusesan8Posion
and8Contact(8P8C)receptacleconnectorcommonlyknownasRJ-45.ItisfullycompliantwiththeIEEE802.3
(10BASE-T),802.3u(100BASE-TX),and802.3ab(1000BASE-T)standards.ThepinoutsoftheGigabitEthernet
port are shown below.
Table 4: GigabitEthernetportpinouts
TheGigabitEthernetport(RJ-45)isequippedwithtwoLEDindicatorsonthefrontsidetoshowitsAcve/Link
statusandSpeedstatus.
Table 5: GigabitEthernetportLEDcolordenion
Pin Signal
1VBUS
2 D-
3D+
4ID
5 GND
Figure 8:MicroUSB2.0portdiagram
Pin Signal
1TX1+
2TX1-
3TX2+
4TX2-
5TX3+
6TX3-
7TX4+
8TX4-
Acve LED
(Le LED on RJ-45 port)
Link LED
(Right LED on RJ-45 port)
Linko LEDiso LEDiso
Speed_10Mbit Greenash LEDiso
Speed_100Mbit Redash LEDiso
Speed_1000Mbit LEDiso Orangeash
Figure 9:GigabitEthernetportdiagram

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2.5 MicroSDCardSlot
TheVIAMobile360M820comeswithaMicroSDcardslotlocatedonthefrontpanelwithsupportfora
maximumstoragecapacityof32GB.ThepinoutsoftheMicroSDcardslotareshownbelow.
Table 6: MicroSDcardslotpinouts
2.6 SIMCardSlot
TheVIAMobile360M820comeswithaSIMcardslotlocatedonthefrontpanelthatcansupporta4GSIM
card.UsingtheSIMcardslotontheVIAMobile360M820requiresa4GmoduletobeinstalledintheminiPCIe
slottoenablethe4Gfuncon,otherwisetheSIMcardslotisdisabled.TheSIMcardslotisdesignedonlyfora
4Gmodulewithoutabuilt-inSIMcardslotonit.ThepinoutsoftheSIMcardslotareshowbelow.
Table 7: SIMcardslotpinouts
Pin Signal
1VSIM_VCC
2 GND
3VSIM_RST
4VSIM_VCC
5VSIM_CLK
6VSIM_DATA
7 GND
8 NC
Figure 10: MicroSDcardslotdiagram
Figure 11: SIMcardslotdiagram
Pin Signal
1SD_DAT2
2SD_DAT3
3SD_CMD
4VDD
5SD_CLK
6 GND
7SD_DAT0
8SD_DAT1
9SD_CD-

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2.7 DIOPort
TheVIAMobile360M820isequippedwithaDIOportlocatedonthebackpanel.TheDIOportoersaDigital
I/Ocommunicaoninterfacetosupport8-bitGPIO.ThepinoutsoftheDIOportareshowbelow.
Table 8: DIOportpinouts
2.8 HeadphoneandMic-inPort
TheVIAMobile360M820isequippedwithaHeadphoneandMic-inportlocatedonthebackpanel.The
HeadphoneandMic-inportisforconnecngexternalspeakerssuchasaheadphoneoramicrophone.The
pinoutsoftheHeadphoneandMic-inportareshownbelow.
Table 9: HeadphoneandMic-inportpinouts
2.9 COMPort
TheVIAMobile360M820isequippedwithaCOMportlocatedonthebackpanelwhichsupportsTX/RXfor
debugging.ThepinoutsoftheCOMportareshownbelow.
Table 10: COMportpinouts
Pin Signal
1MIC1
2 Jack_det
3HPH_GND_SENSE_CONN
4 CDC_HPH_R_CONN
5 CDC_HPH_L_CONN
Figure 12: DIOportdiagram
Figure 13: HeadphoneandMic-inportdiagram
Pin Signal
1 GPO0
2 GPO1
3 GPO2
4 GPO3
5GPI0
6GPI1
7GPI2
8IGN
9DIO_GND
Figure 14: COMportdiagram
Pin Signal
1TX
2RX
3 GND
4+5V
5+12V

VIA Mobile360 M820 User Manual
11
2.10 CANBusPort
TheVIAMobile360M820isequippedwithaCANbusportlocatedonthebackpanel.TheCANbusport
supportsoneCANbusandonedebugCOM(TX/RX)fordebugging.TheCANbussupportsprotocolspecicaon
Version2.0B.ThepinoutsoftheCANbusportareshowbelow.
Table 11: CANbusportpinouts
2.11 FAKRAConnectors
TheVIAMobile360M820isequippedwithnineFAKRAconnectorslocatedonthebackpanel.TheFAKRA
connectorsareforFOV-40andFOV-190automove-gradecameras.ThepinoutsoftheFAKRAconnectorsare
shown below.
Table 12: FAKRAconnectorpinouts
Pin Signal
1RIN_P
2 GND
Figure 15: CANbusportdiagram
Figure 16: FAKRAconnectordiagram
Pin Signal
1RS232_TXD
2CANL
3 GND
4 GND
5 GND
6 GND
7CANH
8RS232_RXD
9VDD12V_OUT/1A
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