
vicorpower.com Applications Engineering: 800 927.9474 Page 2
Mechanical Considerations
The MicroPAC power supply can be mounted on four of the six surfaces using
standard 6-32 screws with a maximum torque of 7 inch-lb.
When using the mounting points the maximum insertion depth of the screw
into the chassis from the outside surface must not exceed 0.125”.
When considering a mounting location and/or orientation it is important not
to restrict the air flow entering and exiting the MicroPAC. Air is drawn into the
MicroPAC through the fan guard located next to the input power connector at the
rear of the power supply and exhausts through the load side of the power supply
next to the LED display panel. Westcor recommends a minimum clearance of 2”
be kept at the front and rear of the MicroPAC.
Care should be taken to minimize the output cabling as not impede the air
exhausting from the MicroPAC, the output screw securing the cabling to the
output terminals should be torque to 15 inc-lb not to exceed 20 inc-lb.
Product Description
The MicroPAC is a factory configurable power supply providing up to 1,300 W of
continuous power in a small slimline 1 u package. The power supply provides
up to 4 isolated outputs and combines power factor correction along with high eciency
and power density. The MicroPAC boasts a power density of 25 Win3and eciency up
to 92%, the power supply is available in a wide temperature range configuration and
for harsh environments and mil-cots applications conformal coated. All configurations
carry full safety agency approvals i.E. Ul60950 en60950 and are CE marked.
The MicroPAC power supply platform supports a wide range of customer power
requirements and is especially suited for distributed power architectures. The design
oers a small flexible cost-eective solution for applications requiring high eciency
and power density. The isolated outputs may be placed in parallel/series configurations
with automatic current sharing. For applications requiring higher power levels the
MicroPAC's can be configured in arrays with box to box current sharing.
Applications Include
nFactorized power architectures nPrinting
nDistributed bus architectures nMIL-COTS applications
nIndustrial nTelecommunications
nAutomation equipment nRenewable energy
Standard Features
nHigh eciency up to 92% nOutput series capability
nSmall Size nOutput current sharing
nHigh power density (25 W/In3) nMicroPAC to MicroPAC current sharing
nUp to 1300 W nPower shed capability
(Configuration dependent) nVibration MIL-STD 810-F
nLow power standby mode Figure 514.5C-17
(Green mode) nOvertemperature warning
nUniversal Input nOvertemperature shutdown
(85 to 264 Vac) (47 to 400 Hz)