VIPA CPU 013C User manual

CPU | 013-CCF0R00 | Manual
HB300 | CPU | 013-CCF0R00 | en | 17-20
VIPA System SLIO
SPEED7 CPU 013C
www.vipa.com/en/service-support/manual

013-CCF0R0_000_CPU 013C,3,EN - © 2017
VIPA GmbH
Ohmstr. 4
91074 Herzogenaurach
Telephone: [phone]
Fax: [phone]
Email: [email protected]
Internet: www.vipa.com

Table of contents
1 General.................................................................................................................... 7
1.1 Copyright © VIPA GmbH ................................................................................. 7
1.2 About this manual............................................................................................. 8
1.3 Safety information............................................................................................. 9
2 Basics and mounting........................................................................................... 10
2.1 Safety information for users............................................................................ 10
2.2 System conception......................................................................................... 11
2.2.1 Overview...................................................................................................... 11
2.2.2 Components................................................................................................ 12
2.2.3 Accessories................................................................................................. 14
2.3 Dimensions..................................................................................................... 15
2.4 Mounting......................................................................................................... 18
2.4.1 Mounting CPU 01xC.................................................................................... 18
2.5 Wiring............................................................................................................. 20
2.5.1 Wiring CPU 01xC........................................................................................ 20
2.5.2 Wiring periphery modules............................................................................ 23
2.5.3 Wiring power modules................................................................................. 25
2.6 Demounting.................................................................................................... 30
2.6.1 Demounting CPU 01xC............................................................................... 30
2.6.2 Demounting periphery modules................................................................... 32
2.7 Trouble shooting - LEDs................................................................................. 34
2.8 Installation guidelines..................................................................................... 36
2.9 General data................................................................................................... 38
3 Hardware description........................................................................................... 40
3.1 Properties....................................................................................................... 40
3.2 Structure......................................................................................................... 41
3.2.1 Compact CPU.............................................................................................. 41
3.2.2 Interfaces..................................................................................................... 41
3.2.3 Memory management.................................................................................. 45
3.2.4 Slot for storage media................................................................................. 45
3.2.5 Buffering mechanisms................................................................................. 45
3.2.6 Operating mode switch................................................................................ 46
3.2.7 LEDs............................................................................................................ 46
3.3 Technical data................................................................................................. 50
4 Deployment CPU 013-CCF0R00.......................................................................... 62
4.1 Assembly........................................................................................................ 62
4.2 Start-up behavior............................................................................................ 62
4.3 Addressing...................................................................................................... 63
4.3.1 Overview...................................................................................................... 63
4.3.2 Default address assignment of the I/O part................................................. 63
4.3.3 Addressing periphery modules.................................................................... 64
4.4 Hardware configuration - CPU........................................................................ 65
4.5 Hardware configuration - System SLIO modules........................................... 67
4.6 Hardware configuration - Ethernet PG/OP channel........................................ 68
4.6.1 Time-of-day synchronization....................................................................... 69
4.7 Setting standard CPU parameters.................................................................. 70
4.7.1 Parametrization via Siemens CPU.............................................................. 70
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4.7.2 Parameter CPU........................................................................................... 70
4.7.3 Parameter for MPI/DP ................................................................................ 73
4.8 Setting VIPA specific CPU parameters........................................................... 74
4.9 Project transfer............................................................................................... 76
4.9.1 Transfer via MPI.......................................................................................... 76
4.9.2 Transfer via Ethernet................................................................................... 77
4.9.3 Transfer via memory card............................................................................ 77
4.10 Accessing the web server............................................................................. 78
4.10.1 Access via the Ethernet PG/OP channel................................................... 78
4.10.2 Structure of the web page......................................................................... 78
4.10.3 Web page with selected CPU.................................................................... 78
4.10.4 Web page with selected module................................................................ 81
4.11 Operating modes.......................................................................................... 82
4.11.1 Overview.................................................................................................... 82
4.11.2 Function security........................................................................................ 83
4.12 Overall reset................................................................................................. 85
4.12.1 Overall reset by means of the operating mode switch............................... 85
4.12.2 Overall reset by means of the Siemens SIMATIC Manager ..................... 85
4.12.3 Actions after a memory reset..................................................................... 85
4.13 Firmware update........................................................................................... 86
4.14 Reset to factory settings............................................................................... 88
4.15 Deployment storage media - VSD, VSC....................................................... 88
4.16 Extended know-how protection.................................................................... 90
4.17 CMD - auto commands................................................................................. 91
4.18 Control and monitoring of variables with test functions................................ 93
4.19 Diagnostic entries......................................................................................... 94
5 Deployment I/O periphery.................................................................................... 95
5.1 Overview......................................................................................................... 95
5.2 Address assignment....................................................................................... 96
5.3 Analog input.................................................................................................... 97
5.3.1 Properties.................................................................................................... 97
5.3.2 Analog value representation........................................................................ 97
5.3.3 Wiring.......................................................................................................... 98
5.3.4 Parametrization........................................................................................... 99
5.4 Digital input................................................................................................... 100
5.4.1 Properties.................................................................................................. 100
5.4.2 Wiring........................................................................................................ 100
5.4.3 Parametrization......................................................................................... 101
5.4.4 Status indication........................................................................................ 102
5.5 Digital output................................................................................................. 103
5.5.1 Properties.................................................................................................. 103
5.5.2 Wiring........................................................................................................ 103
5.5.3 Parametrization......................................................................................... 104
5.5.4 Status indication........................................................................................ 104
5.6 Counting....................................................................................................... 105
5.6.1 Properties.................................................................................................. 105
5.6.2 Wiring........................................................................................................ 105
5.6.3 Proceeding................................................................................................ 107
5.6.4 Parametrization......................................................................................... 107
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5.6.5 Counter operating modes.......................................................................... 112
5.6.6 Counter - Additional functions.................................................................... 119
5.6.7 Diagnostics and interrupt........................................................................... 125
5.7 Frequency measurement.............................................................................. 125
5.7.1 Properties.................................................................................................. 125
5.7.2 Wiring........................................................................................................ 126
5.7.3 Proceeding................................................................................................ 127
5.7.4 Parametrization......................................................................................... 127
5.7.5 Status indication........................................................................................ 129
5.8 Pulse width modulation - PWM..................................................................... 130
5.8.1 Properties.................................................................................................. 130
5.8.2 Wiring........................................................................................................ 130
5.8.3 Proceeding................................................................................................ 131
5.8.4 Parametrization......................................................................................... 131
5.8.5 Status indication........................................................................................ 133
5.9 Pulse train..................................................................................................... 134
5.9.1 Properties.................................................................................................. 134
5.9.2 Wiring........................................................................................................ 135
5.9.3 Proceeding................................................................................................ 135
5.9.4 Parametrization......................................................................................... 136
5.9.5 Status indication........................................................................................ 137
5.10 Diagnostic and interrupt.............................................................................. 138
5.10.1 Overview.................................................................................................. 138
5.10.2 Process interrupt..................................................................................... 138
5.10.3 Diagnostic interrupt.................................................................................. 140
6 Deployment PtP communication...................................................................... 147
6.1 Fast introduction........................................................................................... 147
6.2 Principle of the data transfer......................................................................... 148
6.3 Enable PtP functionality................................................................................ 149
6.4 Deployment of RS485 interface for PtP........................................................ 150
6.5 Parametrization............................................................................................ 151
6.5.1 FC/SFC 216 - SER_CFG - Parametrization PtP....................................... 151
6.6 Communication............................................................................................. 151
6.6.1 FC/SFC 217 - SER_SND - Send to PtP.................................................... 151
6.6.2 FC/SFC 218 - SER_RCV - Receive from PtP........................................... 151
6.7 Protocols and procedures............................................................................. 152
6.8 Modbus - Function codes ............................................................................ 155
7 Deployment PG/OP communication - productive........................................... 160
7.1 Basics - Industrial Ethernet in automation.................................................... 160
7.2 Basics - ISO/OSI reference model............................................................... 161
7.3 Basics - Terms.............................................................................................. 162
7.4 Basics - Protocols......................................................................................... 163
7.5 Basics - IP address and subnet.................................................................... 164
7.6 Fast introduction........................................................................................... 166
7.7 Hardware-Konfiguration................................................................................ 166
7.8 Configure Siemens S7 connections............................................................. 166
7.9 Configure Open Communication.................................................................. 172
8Option: Deployment PROFIBUS communication............................................ 175
8.1 Overview....................................................................................................... 175
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8.2 Fast introduction........................................................................................... 176
8.3 Hardware configuration - CPU...................................................................... 176
8.4 Deployment as PROFIBUS DP master........................................................ 178
8.5 Deployment as PROFIBUS DP slave........................................................... 179
8.6 PROFIBUS installation guidelines................................................................ 181
8.7 Commissioning and Start-up behavior......................................................... 183
9 Configuration with VIPA SPEED7 Studio......................................................... 185
9.1 SPEED7 Studio - Overview.......................................................................... 185
9.2 SPEED7 Studio - Work environment............................................................ 186
9.2.1 Project tree ............................................................................................... 188
9.2.2 Catalog ..................................................................................................... 189
9.3 SPEED7 Studio - Hardware configuration - CPU......................................... 191
9.4 SPEED7 Studio - Hardware configuration - Ethernet PG/OP channel......... 191
9.5 SPEED7 Studio - Hardware configuration - I/O modules............................. 194
9.6 Deployment I/O periphery............................................................................. 195
9.6.1 Overview.................................................................................................... 195
9.6.2 Analog input............................................................................................... 195
9.6.3 Digital input................................................................................................ 195
9.6.4 Digital output.............................................................................................. 196
9.6.5 Counter...................................................................................................... 196
9.6.6 Frequency measurement........................................................................... 200
9.6.7 Pulse width modulation - PWM.................................................................. 202
9.6.8 Pulse Train................................................................................................ 204
9.7 SPEED7 Studio - Project transfer................................................................. 206
9.7.1 Transfer via MPI........................................................................................ 206
9.7.2 Transfer via Ethernet................................................................................. 208
9.7.3 Transfer via memory card.......................................................................... 209
10 Configuration with TIA Portal............................................................................ 210
10.1 TIA Portal - Work environment .................................................................. 210
10.1.1 General.................................................................................................... 210
10.1.2 Work environment of the TIA Portal........................................................ 210
10.2 TIA Portal - Hardware configuration - CPU................................................. 211
10.3 TIA Portal - Hardware configuration - Ethernet PG/OP channel................ 214
10.4 TIA Portal - VIPA-Include library................................................................. 217
10.5 TIA Portal - Project transfer........................................................................ 218
10.5.1 Transfer via MPI...................................................................................... 218
10.5.2 Transfer via Ethernet............................................................................... 218
10.5.3 Transfer via memory card........................................................................ 219
Appendix............................................................................................................. 220
A System specific event IDs............................................................................... 222
B Integrated blocks............................................................................................. 271
C SSL partial list................................................................................................. 274
VIPA System SLIO
Table of contents
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1 General
1.1 Copyright © VIPA GmbH
This document contains proprietary information of VIPA and is not to be disclosed or used
except in accordance with applicable agreements.
This material is protected by the copyright laws. It may not be reproduced, distributed, or
altered in any fashion by any entity (either internal or external to VIPA), except in accord-
ance with applicable agreements, contracts or licensing, without the express written con-
sent of VIPA and the business management owner of the material.
For permission to reproduce or distribute, please contact: VIPA, Gesellschaft für Visuali-
sierung und Prozessautomatisierung mbH Ohmstraße 4, D-91074 Herzogenaurach, Ger-
many
Tel.: [phone]
Fax.: [phone]
EMail: [email protected]
http://www.vipa.com
Every effort has been made to ensure that the information contained in
this document was complete and accurate at the time of publishing. Nev-
ertheless, the authors retain the right to modify the information.
This customer document describes all the hardware units and functions
known at the present time. Descriptions may be included for units which
are not present at the customer site. The exact scope of delivery is
described in the respective purchase contract.
Hereby, VIPA GmbH declares that the products and systems are in compliance with the
essential requirements and other relevant provisions. Conformity is indicated by the CE
marking affixed to the product.
For more information regarding CE marking and Declaration of Conformity (DoC), please
contact your local VIPA customer service organization.
VIPA, SLIO, System 100V, System 200V, System 300V, System 300S, System 400V,
System 500S and Commander Compact are registered trademarks of VIPA Gesellschaft
für Visualisierung und Prozessautomatisierung mbH.
SPEED7 is a registered trademark of profichip GmbH.
SIMATIC, STEP, SINEC, TIA Portal, S7-300 and S7-400 are registered trademarks of
Siemens AG.
Microsoft and Windows are registered trademarks of Microsoft Inc., USA.
Portable Document Format (PDF) and Postscript are registered trademarks of Adobe
Systems, Inc.
All other trademarks, logos and service or product marks specified herein are owned by
their respective companies.
Contact your local VIPA Customer Service Organization representative if you wish to
report errors or questions regarding the contents of this document. If you are unable to
locate a customer service centre, contact VIPA as follows:
All Rights Reserved
CE Conformity Declaration
Conformity Information
Trademarks
Information product sup-
port
VIPA System SLIO General
Copyright © VIPA GmbH
HB300 | CPU | 013-CCF0R00 | en | 17-20 7

VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany
Telefax: [phone]
EMail: [email protected]
Contact your local VIPA Customer Service Organization representative if you encounter
problems with the product or have questions regarding the product. If you are unable to
locate a customer service centre, contact VIPA as follows:
VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany
Tel.: [phone] (Hotline)
EMail: [email protected]
1.2 About this manual
This manual describes the CPU 013-CCF0R00 of the System SLIO from VIPA. It contains
a description of the construction, project implementation and usage.
Product Order number as of state:
CPU-HW CPU-FW
CPU 013C 013-CCF0R00 01 V2.2.8
The manual is targeted at users who have a background in automation technology.
The manual consists of chapters. Every chapter provides a self-contained description of a
specific topic.
The following guides are available in the manual:
nAn overall table of contents at the beginning of the manual
nReferences with page numbers
The manual is available in:
nprinted form, on paper
nin electronic form as PDF-file (Adobe Acrobat Reader)
Important passages in the text are highlighted by following icons and headings:
DANGER!
Immediate or likely danger. Personal injury is possible.
CAUTION!
Damages to property is likely if these warnings are not heeded.
Technical support
Objective and contents
Target audience
Structure of the manual
Guide to the document
Availability
Icons Headings
VIPA System SLIO
General
About this manual
HB300 | CPU | 013-CCF0R00 | en | 17-20 8

Supplementary information and useful tips.
1.3 Safety information
The system is constructed and produced for:
ncommunication and process control
ngeneral control and automation tasks
nindustrial applications
noperation within the environmental conditions specified in the technical data
ninstallation into a cubicle
DANGER!
This device is not certified for applications in
–in explosive environments (EX-zone)
The manual must be available to all personnel in the
nproject design department
ninstallation department
ncommissioning
noperation
CAUTION!
The following conditions must be met before using or commis-
sioning the components described in this manual:
– Hardware modifications to the process control system should only be
carried out when the system has been disconnected from power!
–Installation and hardware modifications only by properly trained per-
sonnel.
– The national rules and regulations of the respective country must be
satisfied (installation, safety, EMC ...)
National rules and regulations apply to the disposal of the unit!
Applications conforming
with specifications
Documentation
Disposal
VIPA System SLIO General
Safety information
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2 Basics and mounting
2.1 Safety information for users
VIPA modules make use of highly integrated components in MOS-Technology. These
components are extremely sensitive to over-voltages that can occur during electrostatic
discharges. The following symbol is attached to modules that can be destroyed by elec-
trostatic discharges.
The Symbol is located on the module, the module rack or on packing material and it indi-
cates the presence of electrostatic sensitive equipment. It is possible that electrostatic
sensitive equipment is destroyed by energies and voltages that are far less than the
human threshold of perception. These voltages can occur where persons do not dis-
charge themselves before handling electrostatic sensitive modules and they can damage
components thereby, causing the module to become inoperable or unusable. Modules
that have been damaged by electrostatic discharges can fail after a temperature change,
mechanical shock or changes in the electrical load. Only the consequent implementation
of protection devices and meticulous attention to the applicable rules and regulations for
handling the respective equipment can prevent failures of electrostatic sensitive modules.
Modules must be shipped in the original packing material.
When you are conducting measurements on electrostatic sensitive modules you should
take the following precautions:
nFloating instruments must be discharged before use.
nInstruments must be grounded.
Modifying electrostatic sensitive modules you should only use soldering irons with
grounded tips.
CAUTION!
Personnel and instruments should be grounded when working on electro-
static sensitive modules.
Handling of electrostatic
sensitive modules
Shipping of modules
Measurements and altera-
tions on electrostatic sen-
sitive modules
VIPA System SLIO
Basics and mounting
Safety information for users
HB300 | CPU | 013-CCF0R00 | en | 17-20 10

2.2 System conception
2.2.1 Overview
System SLIO is a modular automation system for assembly on a 35mm mounting rail. By
means of the peripheral modules with 2, 4 or 8 channels this system may properly be
adapted matching to your automation tasks. The wiring complexity is low, because the
supply of the DC 24V power section is integrated to the backplane bus and defective
modules may be replaced with standing wiring. By deployment of the power modules in
contrasting colors within the system, further isolated areas may be defined for the DC
24V power section supply, respectively the electronic power supply may be extended with
2A.
VIPA System SLIO Basics and mounting
System conception > Overview
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2.2.2 Components
nCPU (head module)
nBus coupler (head module)
nLine extension
nPeriphery modules
nAccessories
CAUTION!
Only modules of VIPA may be combined. A mixed operation with third-
party modules is not allowed!
With this CPU 01xC, the CPU electronic, input/output components and power supply are
integrated to one casing. In addition, up to 64 periphery modules of the System SLIO can
be connected to the backplane bus. As head module via the integrated power supply
CPU electronic and the I/O components are power supplied as well as the electronic of
the connected periphery modules. To connect the power supply of the I/O components
and for DC 24V power supply of via backplane bus connected peripheral modules, the
CPU has removable connectors. By installing of up to 64 periphery modules at the back-
plane bus, these are electrically connected, this means these are assigned to the back-
plane bus, the electronic modules are power supplied and each periphery module is con-
nected to the DC 24V power section supply.
With this CPU 01x, the CPU electronic and power supply are integrated to one casing. As
head module, via the integrated power module for power supply, CPU electronic and the
electronic of the connected periphery modules are supplied. The DC 24 power section
supply for the linked periphery modules is established via a further connection of the
power module. By installing of up to 64 periphery modules at the backplane bus, these
are electrically connected, this means these are assigned to the backplane bus, the elec-
tronic modules are power supplied and each periphery module is connected to the DC
24V power section supply.
CAUTION!
CPU part and power module may not be separated!
Here you may only exchange the electronic module!
With a bus coupler bus interface and power module is integrated to one casing. With the
bus interface you get access to a subordinated bus system. As head module, via the inte-
grated power module for power supply, bus interface and the electronic of the connected
periphery modules are supplied. The DC 24 power section supply for the linked periphery
modules is established via a further connection of the power module. By installing of up to
64 periphery modules at the bus coupler, these are electrically connected, this means
these are assigned to the backplane bus, the electronic modules are power supplied and
each periphery module is connected to the DC 24V power section supply.
CPU 01xC
CPU 01x
Bus coupler
VIPA System SLIO
Basics and mounting
System conception > Components
HB300 | CPU | 013-CCF0R00 | en | 17-20 12

CAUTION!
Bus interface and power module may not be separated!
Here you may only exchange the electronic module!
In the System SLIO there is the possibility to place up to 64 modules in on line. By means
of the line extension you can divide this line into several lines. Here you have to place a
line extension master at each end of a line and the subsequent line has to start with a line
extension slave. Master and slave are to be connected via a special connecting cable. In
this way, you can divide a line on up to 5 lines. For each line extension the maximum
number of pluggable modules at the System SLIO bus is decreased by 1. To use the line
extension no special configuration is required.
Each periphery module consists of a terminal and an electronic module.
1 Terminal module
2 Electronic module
The terminal module serves to carry the electronic module, contains the backplane bus
with power supply for the electronic, the DC 24V power section supply and the staircase-
shaped terminal for wiring. Additionally the terminal module has a locking system for
fixing at a mounting rail. By means of this locking system your SLIO system may be
assembled outside of your switchgear cabinet to be later mounted there as whole system.
Line extension
Periphery modules
Terminal module
VIPA System SLIO Basics and mounting
System conception > Components
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The functionality of a SLIO periphery module is defined by the electronic module, which is
mounted to the terminal module by a sliding mechanism. With an error the defective
module may be exchanged for a functional module with standing installation. At the front
side there are LEDs for status indication. For simple wiring each module shows a corre-
sponding connection diagram at the front and at the side.
2.2.3 Accessories
The shield bus carrier (order no.: 000-0AB00) serves to carry the shield bus (10mm x
3mm) to connect cable shields. Shield bus carriers, shield bus and shield fixings are not
in the scope of delivery. They are only available as accessories. The shield bus carrier is
mounted underneath the terminal of the terminal module. With a flat mounting rail for
adaptation to a flat mounting rail you may remove the spacer of the shield bus carrier.
With each head module, to protect the backplane bus connectors, there is a mounted bus
cover in the scope of delivery. You have to remove the bus cover of the head module
before mounting a System SLIO module. For the protection of the backplane bus con-
nector you always have to mount the bus cover at the last module of your system again.
The bus cover has the order no. 000-0AA00.
There is the possibility to fix the assignment of electronic and terminal module. Here
coding pins (order number 000-0AC00) from VIPA can be used. The coding pin consists
of a coding jack and a coding plug. By combining electronic and terminal module with
coding pin, the coding jack remains in the electronic module and the coding plug in the
terminal module. This ensures that after replacing the electronics module just another
electronic module can be plugged with the same encoding.
Electronic module
Shield bus carrier
Bus cover
Coding pins
VIPA System SLIO
Basics and mounting
System conception > Accessories
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2.3 Dimensions
Dimensions CPU 01xC
Dimensions CPU 01x
VIPA System SLIO Basics and mounting
Dimensions
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Dimensions bus coupler
and line extension slave
Dimensions line extension
master
VIPA System SLIO
Basics and mounting
Dimensions
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Dimensions in mm
Dimension periphery
module
Dimensions electronic
module
VIPA System SLIO Basics and mounting
Dimensions
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2.4 Mounting
2.4.1 Mounting CPU 01xC
There are locking lever at the top side of the CPU. For mounting and demounting these
locking lever are to be turned upwards until these engage. Place the CPU at the
mounting rail. The CPU is fixed to the mounting rail by pushing downward the locking
levers. The CPU is directly mounted at a mounting rail. Up to 64 modules may be
mounted. The electronic and power section supply are connected via the backplane bus.
Please consider here that the sum current of the electronic power supply does not
exceed the maximum value of 1A. By means of the power module 007-1AB10 the current
of the electronic power supply may be expanded accordingly.
1. Mount the mounting rail! Please consider that a clearance from the middle of the
mounting rail of at least 80mm above and 60mm below, respectively 80mm by
deployment of shield bus carriers, exist.
Proceeding
VIPA System SLIO
Basics and mounting
Mounting > Mounting CPU 01xC
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2. Turn the locking lever upwards, place the CPU at the mounting rail and turn the
lever downward.
ðIf you want to use the CPU without periphery modules, the mounting is now
complete.
1. Before mounting the periphery modules you have to remove the bus cover at the
right side of the CPU by pulling it forward. Keep the cover for later mounting.
2. Mount the periphery modules you want.
Mounting periphery
modules
VIPA System SLIO Basics and mounting
Mounting > Mounting CPU 01xC
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3. After mounting the whole system, to protect the backplane bus connectors at the
last module you have to mount the bus cover, now. If the last module is a clamp
module, for adaptation the upper part of the bus cover is to be removed.
2.5 Wiring
2.5.1 Wiring CPU 01xC
For wiring the CPU 01xC has removable connectors. With the wiring of the connectors a
"push-in" spring-clip technique is used. This allows a quick and easy connection of your
signal and supply lines. The clamping off takes place by means of a screwdriver.
Umax 240V AC / 30V DC
Imax 10A
Cross section 0.08 ... 1.5mm2 (AWG 28 ... 16)
Stripping length 10mm
Use for wiring rigid wires respectively use wire sleeves. When using stranded wires you
have to press the release button with a screwdriver during the wiring.
1 Labeling on the casing
2 Pin no. at the connector
3 Release button
4 Connection hole for wire
CPU connector
Data
Wiring procedure
VIPA System SLIO
Basics and mounting
Wiring > Wiring CPU 01xC
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