Woodward MicroNet TMR User manual

Product Manual 26167V3
(Revision NEW, 10/2016)
Original Instructions
MicroNet TMR Digital Control
Manual 26167 consists of 3 volumes (26167V1, 26167V2, & 26167V3).
Installation and Operation Manual

MicroNet TMR Digital Control Manual 26167V3
Woodward 2
General
Precautions
Read this entire manual and all other pertinent publications prior to installing,
operating, or servicing this equipment.
Practice all plant and safety instructions and precautions.
Failure to follow instructions can cause personal injury and/or property
damage.
Revisions
This publication may have been revised or updated since this copy was
produced. To verify that you have the latest revision, check manual
26455 ,
Customer Publication Cross Reference and Revision Status & Distribution
Restrictions, on the publications page of the Woodward website:
www.woodward.com/publications
The latest version of most publications is available on the publications page. If
your publication is not there, please contact your customer service
representative to get the latest copy.
Proper Use
Any unauthorized modifications to or use of this equipment outside its
specified mechanical, electrical, or other operating limits may cause personal
injury and/or property damage, including damage to the equipment. Any such
unauthorized modifications: (i) constitute "misuse" and/or "negligence" within
the meaning of the product warranty thereby excluding warranty coverage for
any resulting damage, and (ii) invalidate product certifications or listings.
Translated
Publications
If the cover of this publication states "Translation of the Original Instructions"
please note:
The original source of this publication may have been updated since this
translation was made. Be sure to check manual
26455 , Customer Publication
Cross Reference and Revision Status & Distribution Restrictions, to verify
whether this translation is up to date. Out-of-date translations are marked with
. Always compare with the original for technical specifications and for proper
and safe installation and operation procedures.
Revisions—A black line alongside the text highlights changes in this publication since the
previous revision.
Woodward reserves the right to update any portion of this publication at any time. Information provided by
Woodward is believed to be correct and reliable. However, no responsibility is assumed by Woodward
unless otherwise expressly undertaken.
Manual 26167V3
Copyright © Woodward, Inc. 2016
All Rights Reserved

MicroNet TMR Digital Control Manual 26167V3
Woodward 3
Contents
WARNINGS AND NOTICES............................................................................ 7
ELECTROSTATIC DISCHARGE AWARENESS.................................................. 8
CHAPTER 1. GENERAL INFORMATION .......................................................... 9
Introduction .............................................................................................................9
CHAPTER 2. CPUS................................................................................... 10
Introduction ...........................................................................................................10
2.1. CPU_040 Module ..........................................................................................10
CHAPTER 3. COMMUNICATION................................................................... 19
3.1. Main Transceiver (XCVR) Module.................................................................19
3.2. Remote Transceiver (XCVR) Module............................................................20
3.3. Transceiver Accessories ...............................................................................23
3.4. Ethernet Module ............................................................................................25
CHAPTER 4. DISCRETE I/O MODULES........................................................ 29
4.1. 24/12 TMR Discrete I/O Module....................................................................29
4.2. 48/24 Discrete Combo Module......................................................................42
4-3. 32 Channel Discrete Output Module .............................................................52
CHAPTER 5. ANALOG I/O MODULES .......................................................... 57
5.1. TMR 24/8 Analog Module..............................................................................57
5.2. TMR Analog Combo Module – 3 MPU, 1 Prox..............................................64
5.3. 24/8 Analog Module.......................................................................................79
5.4. Dataforth 24/8 Analog Module.......................................................................85
5.5. 34 Ch. High Density Versatile Input Module (HDVIM) ..................................94
5.6. Current Input Modules .................................................................................103
5.7. 8 Ch. Current Input (4–20 mA) Module .......................................................103
5.8. Non-Standard 8Ch Current Input (4-20 mA) Module ..................................108
5.9. Voltage Input Module...................................................................................113
5.10. 8 Channel Voltage Input (0-10 Vdc) Module .............................................113
5.11. Current Output Modules ............................................................................117
5.12. 8Ch Current Output (4-20 mA) Module .....................................................117
5.13. 8Ch Current Output (0–1 mA) Module ......................................................121
5.14. Voltage Output Modules............................................................................123
5.15. 8Ch Voltage Output (0-5 Vdc ) Module .....................................................123
5.16. 8Ch Voltage Output (0-10 Vdc) Module ....................................................126
5.17. Thermocouple Input Modules....................................................................128
5.18. 8Ch TC (Fail Low) Module.........................................................................128
5.19. 8Ch TC (Fail High) Module........................................................................132
5.20. RTD Input Modules....................................................................................134
5.21. 8Ch RTD Input (10 ohm) ...........................................................................134
5.22. 8Ch RTD Input (100 ohm) .........................................................................139
5.23. 8Ch RTD Input (200 ohm) .........................................................................140
5.24. 8Ch RTD Input (500 ohm) .........................................................................142
5.25. 4Ch MPU/Proximity Module ......................................................................143
CHAPTER 6. ACTUATOR MODULES.......................................................... 149
6.1. Four Channel Actuator Module ...................................................................149
6.2. EM/TM Position Controller...........................................................................151
CHAPTER 7. FIELD TERMINATION MODULES (FTMS)................................ 155

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7.1. Service Panel ..............................................................................................155
7.2. CPU Interfaces ............................................................................................158
Illustrations and Tables
Figure 2-1. 040 CPU Module................................................................................10
Figure 2-1. CPU Module.......................................................................................11
Figure 2-2. CPU Module Block Diagram ..............................................................12
Figure 2-3. 68040 CPU Communications Port.....................................................13
Figure 3-1. Main XCVR Module Block Diagram ...................................................19
Figure 3.2. Main XCVR Module............................................................................19
Figure 3-3. Remote XCVR Module Block Diagram ..............................................20
Figure 3-4. Remote XCVR Module Jumpers........................................................21
Figure 3-5. Remote XCVR Module.......................................................................22
Figure 3-6. T-Module (I/O XCVR-Module)............................................................23
Figure 3-7. Cables [Available in 3 ft. (0.9 m) and 10 ft. (3 m) lengths].................23
Figure 3-8. Expansion I/O Chassis.......................................................................24
Figure 3-9. Termination ........................................................................................25
Figure 3-10. Ethernet Module...............................................................................26
Figure 4-1. 24/12 TMR Discrete I/O Module ........................................................29
Figure 4-2. 24/12 TMR Discrete I/O Module Block Diagram................................30
Figure 4-3. Example TMR System Configuration.................................................31
Figure 4-4. Wiring Diagram for a FT Relay/Discrete Input Module ......................32
Figure 4-5. Optional Internal 24 Vdc Contact Wetting Configuration ...................33
Figure 4-6. Optional External 24/125 Vdc Contact Wetting Configuration...........34
Figure 4-7. TMR Discrete Output .........................................................................35
Figure 4-8. Latent Fault Detection Verification Graph–18-32 Vdc Circuitry .........37
Figure 4-9. Latent Fault Detection Verification Graph–18-132 Vac Circuitry .......37
Figure 4-10. Latent Fault Detection Verification Graph–100–150 Vdc Circuitry ..38
Figure 4-11. Jumper and Relay Location Diagram...............................................39
Figure 4-12. FT Relay/Discrete Input Module Labels...........................................39
Figure 4-13. Example Relay Output Wiring Diagram ...........................................40
Figure 4-14. Discrete Combo Module ..................................................................43
Figure 4-15. Configuration 1, One 48/24 Discrete FTM with Relay Module(s) ....44
Figure 4-16. Discrete Input Interface Wiring to a 24 Vdc 48/24 Discrete FTM ....45
Figure 4-17. Discrete Input Interface Wiring to a 125 Vdc 48/24 Discrete FTM ..45
Figure 4-18. Relay Output Interface Wiring to a 16 Ch. Relay Module................47
Figure 4-19. Relay Output Interface Wiring to a 32 Ch. Relay Module................47
Figure 4-20. Configuration 2, Two 24/12 Discrete FTMs .....................................48
Figure 4-21. Discrete Input Interface Wiring to a 24/12 Discrete FTM.................49
Figure 4-22. Relay Output Interface Wiring to a 24/12 Discrete FTM..................50
Figure 4-23. 48/24 Discrete Combo Module Block Diagram................................51
Figure 4-24. Discrete Output Module ...................................................................53
Figure 4-25. 32 Ch. DO Module with Relay Modules...........................................54
Figure 4-26. Relay Output Interface Wiring to a 16 Ch. Relay Module................54
Figure 4-27. Relay Output Interface Wiring to a 32 Ch. Relay Module................55
Figure 4-28. Discrete Output Module (32 Channel) Block Diagram.....................56
Figure 5-1. 24/8 Analog Module ...........................................................................57
Figure 5-2. Example TMR System Configuration.................................................59
Figure 5-3. Analog Input Wiring for a 24/8 Analog FTM.......................................60
Figure 5-4. Analog Output Wiring for a 24/8 Analog FTM....................................61
Figure 5-5. Analog Combo Module ......................................................................64

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Figure 5-6. Example Fault Tolerant System Configuration ..................................66
Figure 5-7. MPU Interface Wiring to TMR Analog Combo FTM (Speed 1-3) ......68
Figure 5-8. Prox Interface Wiring to TMR Analog Combo FTM (Speed 4) ..........68
Figure 5-9—Current Input Wiring for an Analog Combo Module FTM.................69
Figure 5-10. Voltage Input Wiring for an Analog Combo Module FTM (Simplex)70
Figure 5-11. Analog Output and Actuator Wiring for an Analog Combo FTM......72
Figure 5-12. TMR MPU and Analog I/O Module FTM Fuse Locations ................78
Figure 5-13. Simplex MPU and Analog I/O Module FTM Fuse Locations ...........79
Figure 5-14. 24/8 Analog Module .........................................................................80
Figure 5-15. Simplex System Configuration Example..........................................81
Figure 5-16. Analog Input Wiring for a 24/8 Analog FTM.....................................82
Figure 5-17. Analog Output Wiring for a 24/8 Analog FTM..................................83
Figure 5-18. Dataforth 24/8 Analog Module .........................................................85
Figure 5-19. Simplex Dataforth Configuration Example.......................................87
Figure 5-20. Thermocouple Wiring to Simplex Dataforth FTM.............................88
Figure 5-21. RTD Wiring to Simplex Dataforth FTM ............................................89
Figure 5-22. Loop powered 4–20 mA Signal Wiring to Simplex Dataforth FTM ..89
Figure 5-23. Self-powered 4–20 mA Signal Wiring to Simplex Dataforth FTM....90
Figure 5-24. 0–5 Vdc Signal Wiring to Simplex Dataforth FTM ...........................90
Figure 5-25. Analog Output Signal Wiring to Simplex Dataforth FTM..................91
Figure 5-26. Dataforth Plug-in Modules ...............................................................91
Figure 5-27. 34 Channel HDVIM Module .............................................................95
Figure 5-28. Simplex System Configuration Example..........................................98
Figure 5-29. Wiring Diagram for 34 Ch. HDVIM FTM ..........................................99
Figure 5-30. Analog Interface Wiring to 34 Ch. HDVIM Module Inputs .............101
Figure 5-31. Analog Interface Wiring to the 34 Ch. HDVIM Module Inputs .......101
Figure 5-32. 4–20 mA Interface Wiring to 34 Ch. HDVIM Module RTD Inputs..101
Figure 5-33. RTD Interface Wiring to the 34 Ch. HDVIM Module RTD Inputs...101
Figure 5-34. 8 Channel Current Input (4–20 mA) Module..................................104
Figure 5-35. 8 Ch. Current Input (4–20 mA) Module Configuration ...................104
Figure 5-36. Analog Input Wiring for an 8 Ch. Current Input (0–25 mA) Module106
Figure 5-37. 8 Ch. Current Input (0–25 mA) Module Block Diagram .................107
Figure 5-38. Non-standard 8 Channel Current Input (4–20 mA) Module...........109
Figure 5-39. Non-Standard 8 Channel Module Configuration............................110
Figure 5-40. Analog Input Wiring for a Non-Standard Module ...........................111
Figure 5-41. 8 Channel Voltage Input (0–10 Vdc) Module.................................113
Figure 5-42. 8 Ch. Voltage Input (0–10 Vdc) Module Configuration ..................114
Figure 5-43. Voltage Input Wiring for an 8 Chnl Voltage Input Module..............115
Figure 5-44. 8 Ch. Voltage Input (0–10 Vdc) Module Block Diagram ................116
Figure 5-45. 8 Channel Current Output (4–20 mA) Module ...............................118
Figure 5-46. 8 Ch. Current Output (4–20 mA) Module Configuration ................119
Figure 5-47. Analog Output Wiring for 8 Chnl Output (4–20 mA) Module .........120
Figure 5-48. Current Output (4–20 mA) Module Block Diagram ........................121
Figure 5-49. 8 Channel Current Output (0–1 mA) Module .................................122
Figure 5-50. 8 Channel Voltage Output (0–5 Vdc) Module ................................123
Figure 5-51. 8 Ch. Voltage Output (0–5 Vdc) Module Configuration .................124
Figure 5-52. Analog Output Wiring for an 8 Chnl Voltage Output Module .........125
Figure 5-53. 8 Ch. Voltage Output (0–5 Vdc) Module Block Diagram ...............126
Figure 5-54. 8 Channel Voltage Output (0–10 Vdc) Module ..............................127
Figure 5-55. 8 Channel TC (Fail Low) Module ...................................................128
Figure 5-56. 8 Ch. TC (Fail Low) Module Configuration ....................................129
Figure 5-57. 8 Ch. TC Input (Fail Low) Module Field Wiring..............................130
Figure 5-58.Thermocouple Input Block Diagram................................................131
Figure 5-59. 8 Channel TC (Fail High) Module ..................................................133
Figure 5-60. 8 Channel RTD Input Module (10 ohm).........................................134
Figure 5-61. 8Ch RTD Module Configuration.....................................................135

MicroNet TMR Digital Control Manual 26167V3
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Figure 5-62. 8Ch RTD Input Module Field Wiring ..............................................137
Figure 5-63. RTD Input Block Diagram ..............................................................138
Figure 5-64. 8 Channel RTD Input Module (100 ohm).......................................139
Figure 5-65. 8 Channel RTD Input Module (200 ohm).......................................141
Figure 5-66. 8 Channel RTD Input Module (500 ohm).......................................142
Figure 5-67. 4 Channel MPU/Proximity Module .................................................144
Figure 5-68. 4 Ch. MPU/Proximity Module.........................................................145
Figure 5-69. MPU and Proximity Probe Interface Wiring ...................................146
Figure 5-70. Digital Speed Sensor Module Block Diagram................................147
Figure 6-1. Four Channel Actuator Driver Module .............................................149
Figure 6-2. Four Channel Actuator Driver Module Block Diagram.....................150
Figure 6-3. EM/TM Position Control Module ......................................................151
Figure 6-4. Position Control Module as used with various Remote Drivers.......152
Figure 6-5. Position Controller Module Block Diagram ......................................154
Figure 7-2. Service Panel Block Diagram ..........................................................156
Figure 7-3. Service Panel Outline Dimensions...................................................156
Figure 7-4. Service Panel Cutout Dimensions ...................................................157
Figure 7-5. Service Panel Optional 19 Inch Mounting Panel .............................157
Figure 7-6. Ethernet Interface FTM ....................................................................158
Figure 7-7. Ethernet Interface FTM Outline Drawing .........................................158
Figure 7-8. Kit Configuration (040 CPU) ............................................................159
Table 2-1. Off-line Tests .......................................................................................13
Table 2-2. Flash Codes ........................................................................................14
Table 2-3. On-Line Tests......................................................................................15
Table 2-4. Test Failure Messages........................................................................15
Table 2-5. Operation Errors..................................................................................16
Table 2-6. Numbered System Errors....................................................................16
Table 2-7. System Alarms ....................................................................................17
Table 2-8. System Alarms ....................................................................................18
Table 2-9. Numbered System Alarms ..................................................................18
Table 3-1. Remote XCVR Module Jumpers (JPR1–4).........................................21
Table 3-2. Ethernet Module LED Annunciations ..................................................26
Table 3-3. RJ45 Ethernet Pinout ..........................................................................28
Table 4-1. LED Indications of Failure ...................................................................41
Table 4-2. Discrete Outputs/Relay Module Configuration....................................46
Table 4-3. LED Indications of Failure ...................................................................51
Table 5-1. LED Indications of Failure ...................................................................61
Table 5-2. LED Indications of Failure ...................................................................73
Table 5-3. LED Indications of Failure ...................................................................83
Table 5-4. Module Accuracy.................................................................................86
Table 5-5. LED Indications of Failure ...................................................................92
Table 5-6. LED Indications of Failure .................................................................102
Table 5-7. Thermocouple Types and ranges .....................................................129
Table 5-8. Thermocouple Types and ranges .....................................................133
Table 5-9. 4Ch. MPU/Proximity Modules Compatibility with CPU5200 .............143
Table 6-1. LED Indications of Failure .................................................................153
The following are trademarks of Woodward, Inc.:
Woodward
The following are trademarks of their respective companies:
Modbus (Schneider Automation Inc.)
Pentium (Intel Corporation)

MicroNet TMR Digital Control Manual 26167V3
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Warnings and Notices
Important Definitions
This is the safety alert symbol used to alert you to potential personal injury hazards. Obey all
safety messages that follow this symbol to avoid possible injury or death.
DANGER - Indicates a hazardous situation, which if not avoided, will result in death or serious injury.
WARNING - Indicates a hazardous situation, which if not avoided, could result in death or serious
injury.
CAUTION - Indicates a hazardous situation, which if not avoided, could result in minor or moderate
injury.
NOTICE - Indicates a hazard that could result in property damage only (including damage to the
control).
IMPORTANT - Designates an operating tip or maintenance suggestion.
Overspeed /
Overtemperature /
Overpressure
The engine, turbine, or other type of prime mover should be equipped
with an overspeed shutdown device to protect against runaway or
damage to the prime mover with possible personal injury, loss of life,
or property damage.
The overspeed shutdown device must be totally independent of the
prime mover control system. An overtemperature or overpressure
shutdown device may also be needed for safety, as appropriate.
Personal Protective
Equipment
The products described in this publication may present risks that
could lead to personal injury, loss of life, or property damage. Always
wear the appropriate personal protective equipment (PPE) for the job
at hand. Equipment that should be considered includes but is not
limited to:
Eye Protection
Hearing Protection
Hard Hat
Gloves
Safety Boots
Respirator
Always read the proper Material Safety Data Sheet (MSDS) for any
working fluid(s) and comply with recommended safety equipment.
Start-up
Be prepared to make an emergency shutdown when starting the
engine, turbine, or other type of prime mover, to protect against
runaway or overspeed with possible personal injury, loss of life, or
property damage.
Battery Charging
Device
To prevent damage to a control system that uses an alternator or
battery-charging device, make sure the charging device is turned off
before disconnecting the battery from the system.

MicroNet TMR Digital Control Manual 26167V3
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Electrostatic Discharge Awareness
Electrostatic
Precautions
Electronic controls contain static-sensitive parts. Observe the following
precautions to prevent damage to these parts:
Discharge body static before handling the control (with power to the
control turned off, contact a grounded surface and maintain contact
while handling the control).
Avoid all plastic, vinyl, and Styrofoam (except antistatic versions) around
printed circuit boards.
Do not touch the components or conductors on a printed circuit board
with your hands or with conductive devices.
To prevent damage to electronic components caused by improper handling,
read and observe the precautions in Woodward manual
82715 , Guide for
Handling and Protection of Electronic Controls, Printed Circuit Boards, and
Modules.
Follow these precautions when working with or near the control.
1. Avoid the build-up of static electricity on your body by not wearing clothing made of synthetic
materials. Wear cotton or cotton-blend materials as much as possible because these do not store
static electric charges as much as synthetics.
2. Do not remove the printed circuit board (PCB) from the control cabinet unless necessary. If you must
remove the PCB from the control cabinet, follow these precautions:
Do not touch any part of the PCB except the edges.
Do not touch the electrical conductors, the connectors, or the components with conductive
devices or with your hands.
When replacing a PCB, keep the new PCB in the plastic antistatic protective bag it comes in
until you are ready to install it. Immediately after removing the old PCB from the control cabinet,
place it in the antistatic protective bag.

MicroNet TMR Digital Control Manual 26167V3
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Chapter 1.
General Information
Introduction
This manual contains obsolete boards, cards, and CPUs from the MicroNet Simplex and MicroNet Plus
Digital Controls, created to serve as a reference volume for customers who are using this equipment in
their systems. All safety and compliance information is contained in Volume 1 and Volume 2 of this
manual.
Refer to Manual 26166, Volumes 1 and 2 for Required Safety Instructions,
Special Conditions for Safe Use and Hazardous Location Requirements to
insure the control is used in a safe manner in Ordinary, Marine, Hazardous,
ATEX and IECEx locations. Volume 1 must be fully understood and
complied with for all applications.
Obsolete Boards,
Cards and CPUs
The information contained within this volume pertains to modules, which may
be active in the field, but are obsolete and no longer supported by Woodward.
These modules are not recommended for news systems or designs.

MicroNet TMR Digital Control Manual 26167V3
Woodward 10
Chapter 2.
CPUs
Introduction
This chapter contains information on CPUs and each section pertains to a different CPU with all of the
data from the original manual.
2.1. CPU_040 Module
2.1.1—Module Description
Figure 2-1. 040 CPU Module