Woodward MicroNet TMR User manual

Product Manual 26167V3
(Revision NEW, 10/2016)
Original Instructions
MicroNet TMR Digital Control
Manual 26167 consists of 3 volumes (26167V1, 26167V2, & 26167V3).
Installation and Operation Manual

MicroNet TMR Digital Control Manual 26167V3
Woodward 2
General
Precautions
Read this entire manual and all other pertinent publications prior to installing,
operating, or servicing this equipment.
Practice all plant and safety instructions and precautions.
Failure to follow instructions can cause personal injury and/or property
damage.
Revisions
This publication may have been revised or updated since this copy was
produced. To verify that you have the latest revision, check manual
26455 ,
Customer Publication Cross Reference and Revision Status & Distribution
Restrictions, on the publications page of the Woodward website:
www.woodward.com/publications
The latest version of most publications is available on the publications page. If
your publication is not there, please contact your customer service
representative to get the latest copy.
Proper Use
Any unauthorized modifications to or use of this equipment outside its
specified mechanical, electrical, or other operating limits may cause personal
injury and/or property damage, including damage to the equipment. Any such
unauthorized modifications: (i) constitute "misuse" and/or "negligence" within
the meaning of the product warranty thereby excluding warranty coverage for
any resulting damage, and (ii) invalidate product certifications or listings.
Translated
Publications
If the cover of this publication states "Translation of the Original Instructions"
please note:
The original source of this publication may have been updated since this
translation was made. Be sure to check manual
26455 , Customer Publication
Cross Reference and Revision Status & Distribution Restrictions, to verify
whether this translation is up to date. Out-of-date translations are marked with
. Always compare with the original for technical specifications and for proper
and safe installation and operation procedures.
Revisions—A black line alongside the text highlights changes in this publication since the
previous revision.
Woodward reserves the right to update any portion of this publication at any time. Information provided by
Woodward is believed to be correct and reliable. However, no responsibility is assumed by Woodward
unless otherwise expressly undertaken.
Manual 26167V3
Copyright © Woodward, Inc. 2016
All Rights Reserved

MicroNet TMR Digital Control Manual 26167V3
Woodward 3
Contents
WARNINGS AND NOTICES............................................................................ 7
ELECTROSTATIC DISCHARGE AWARENESS.................................................. 8
CHAPTER 1. GENERAL INFORMATION .......................................................... 9
Introduction .............................................................................................................9
CHAPTER 2. CPUS................................................................................... 10
Introduction ...........................................................................................................10
2.1. CPU_040 Module ..........................................................................................10
CHAPTER 3. COMMUNICATION................................................................... 19
3.1. Main Transceiver (XCVR) Module.................................................................19
3.2. Remote Transceiver (XCVR) Module............................................................20
3.3. Transceiver Accessories ...............................................................................23
3.4. Ethernet Module ............................................................................................25
CHAPTER 4. DISCRETE I/O MODULES........................................................ 29
4.1. 24/12 TMR Discrete I/O Module....................................................................29
4.2. 48/24 Discrete Combo Module......................................................................42
4-3. 32 Channel Discrete Output Module .............................................................52
CHAPTER 5. ANALOG I/O MODULES .......................................................... 57
5.1. TMR 24/8 Analog Module..............................................................................57
5.2. TMR Analog Combo Module – 3 MPU, 1 Prox..............................................64
5.3. 24/8 Analog Module.......................................................................................79
5.4. Dataforth 24/8 Analog Module.......................................................................85
5.5. 34 Ch. High Density Versatile Input Module (HDVIM) ..................................94
5.6. Current Input Modules .................................................................................103
5.7. 8 Ch. Current Input (4–20 mA) Module .......................................................103
5.8. Non-Standard 8Ch Current Input (4-20 mA) Module ..................................108
5.9. Voltage Input Module...................................................................................113
5.10. 8 Channel Voltage Input (0-10 Vdc) Module .............................................113
5.11. Current Output Modules ............................................................................117
5.12. 8Ch Current Output (4-20 mA) Module .....................................................117
5.13. 8Ch Current Output (0–1 mA) Module ......................................................121
5.14. Voltage Output Modules............................................................................123
5.15. 8Ch Voltage Output (0-5 Vdc ) Module .....................................................123
5.16. 8Ch Voltage Output (0-10 Vdc) Module ....................................................126
5.17. Thermocouple Input Modules....................................................................128
5.18. 8Ch TC (Fail Low) Module.........................................................................128
5.19. 8Ch TC (Fail High) Module........................................................................132
5.20. RTD Input Modules....................................................................................134
5.21. 8Ch RTD Input (10 ohm) ...........................................................................134
5.22. 8Ch RTD Input (100 ohm) .........................................................................139
5.23. 8Ch RTD Input (200 ohm) .........................................................................140
5.24. 8Ch RTD Input (500 ohm) .........................................................................142
5.25. 4Ch MPU/Proximity Module ......................................................................143
CHAPTER 6. ACTUATOR MODULES.......................................................... 149
6.1. Four Channel Actuator Module ...................................................................149
6.2. EM/TM Position Controller...........................................................................151
CHAPTER 7. FIELD TERMINATION MODULES (FTMS)................................ 155

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7.1. Service Panel ..............................................................................................155
7.2. CPU Interfaces ............................................................................................158
Illustrations and Tables
Figure 2-1. 040 CPU Module................................................................................10
Figure 2-1. CPU Module.......................................................................................11
Figure 2-2. CPU Module Block Diagram ..............................................................12
Figure 2-3. 68040 CPU Communications Port.....................................................13
Figure 3-1. Main XCVR Module Block Diagram ...................................................19
Figure 3.2. Main XCVR Module............................................................................19
Figure 3-3. Remote XCVR Module Block Diagram ..............................................20
Figure 3-4. Remote XCVR Module Jumpers........................................................21
Figure 3-5. Remote XCVR Module.......................................................................22
Figure 3-6. T-Module (I/O XCVR-Module)............................................................23
Figure 3-7. Cables [Available in 3 ft. (0.9 m) and 10 ft. (3 m) lengths].................23
Figure 3-8. Expansion I/O Chassis.......................................................................24
Figure 3-9. Termination ........................................................................................25
Figure 3-10. Ethernet Module...............................................................................26
Figure 4-1. 24/12 TMR Discrete I/O Module ........................................................29
Figure 4-2. 24/12 TMR Discrete I/O Module Block Diagram................................30
Figure 4-3. Example TMR System Configuration.................................................31
Figure 4-4. Wiring Diagram for a FT Relay/Discrete Input Module ......................32
Figure 4-5. Optional Internal 24 Vdc Contact Wetting Configuration ...................33
Figure 4-6. Optional External 24/125 Vdc Contact Wetting Configuration...........34
Figure 4-7. TMR Discrete Output .........................................................................35
Figure 4-8. Latent Fault Detection Verification Graph–18-32 Vdc Circuitry .........37
Figure 4-9. Latent Fault Detection Verification Graph–18-132 Vac Circuitry .......37
Figure 4-10. Latent Fault Detection Verification Graph–100–150 Vdc Circuitry ..38
Figure 4-11. Jumper and Relay Location Diagram...............................................39
Figure 4-12. FT Relay/Discrete Input Module Labels...........................................39
Figure 4-13. Example Relay Output Wiring Diagram ...........................................40
Figure 4-14. Discrete Combo Module ..................................................................43
Figure 4-15. Configuration 1, One 48/24 Discrete FTM with Relay Module(s) ....44
Figure 4-16. Discrete Input Interface Wiring to a 24 Vdc 48/24 Discrete FTM ....45
Figure 4-17. Discrete Input Interface Wiring to a 125 Vdc 48/24 Discrete FTM ..45
Figure 4-18. Relay Output Interface Wiring to a 16 Ch. Relay Module................47
Figure 4-19. Relay Output Interface Wiring to a 32 Ch. Relay Module................47
Figure 4-20. Configuration 2, Two 24/12 Discrete FTMs .....................................48
Figure 4-21. Discrete Input Interface Wiring to a 24/12 Discrete FTM.................49
Figure 4-22. Relay Output Interface Wiring to a 24/12 Discrete FTM..................50
Figure 4-23. 48/24 Discrete Combo Module Block Diagram................................51
Figure 4-24. Discrete Output Module ...................................................................53
Figure 4-25. 32 Ch. DO Module with Relay Modules...........................................54
Figure 4-26. Relay Output Interface Wiring to a 16 Ch. Relay Module................54
Figure 4-27. Relay Output Interface Wiring to a 32 Ch. Relay Module................55
Figure 4-28. Discrete Output Module (32 Channel) Block Diagram.....................56
Figure 5-1. 24/8 Analog Module ...........................................................................57
Figure 5-2. Example TMR System Configuration.................................................59
Figure 5-3. Analog Input Wiring for a 24/8 Analog FTM.......................................60
Figure 5-4. Analog Output Wiring for a 24/8 Analog FTM....................................61
Figure 5-5. Analog Combo Module ......................................................................64

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Figure 5-6. Example Fault Tolerant System Configuration ..................................66
Figure 5-7. MPU Interface Wiring to TMR Analog Combo FTM (Speed 1-3) ......68
Figure 5-8. Prox Interface Wiring to TMR Analog Combo FTM (Speed 4) ..........68
Figure 5-9—Current Input Wiring for an Analog Combo Module FTM.................69
Figure 5-10. Voltage Input Wiring for an Analog Combo Module FTM (Simplex)70
Figure 5-11. Analog Output and Actuator Wiring for an Analog Combo FTM......72
Figure 5-12. TMR MPU and Analog I/O Module FTM Fuse Locations ................78
Figure 5-13. Simplex MPU and Analog I/O Module FTM Fuse Locations ...........79
Figure 5-14. 24/8 Analog Module .........................................................................80
Figure 5-15. Simplex System Configuration Example..........................................81
Figure 5-16. Analog Input Wiring for a 24/8 Analog FTM.....................................82
Figure 5-17. Analog Output Wiring for a 24/8 Analog FTM..................................83
Figure 5-18. Dataforth 24/8 Analog Module .........................................................85
Figure 5-19. Simplex Dataforth Configuration Example.......................................87
Figure 5-20. Thermocouple Wiring to Simplex Dataforth FTM.............................88
Figure 5-21. RTD Wiring to Simplex Dataforth FTM ............................................89
Figure 5-22. Loop powered 4–20 mA Signal Wiring to Simplex Dataforth FTM ..89
Figure 5-23. Self-powered 4–20 mA Signal Wiring to Simplex Dataforth FTM....90
Figure 5-24. 0–5 Vdc Signal Wiring to Simplex Dataforth FTM ...........................90
Figure 5-25. Analog Output Signal Wiring to Simplex Dataforth FTM..................91
Figure 5-26. Dataforth Plug-in Modules ...............................................................91
Figure 5-27. 34 Channel HDVIM Module .............................................................95
Figure 5-28. Simplex System Configuration Example..........................................98
Figure 5-29. Wiring Diagram for 34 Ch. HDVIM FTM ..........................................99
Figure 5-30. Analog Interface Wiring to 34 Ch. HDVIM Module Inputs .............101
Figure 5-31. Analog Interface Wiring to the 34 Ch. HDVIM Module Inputs .......101
Figure 5-32. 4–20 mA Interface Wiring to 34 Ch. HDVIM Module RTD Inputs..101
Figure 5-33. RTD Interface Wiring to the 34 Ch. HDVIM Module RTD Inputs...101
Figure 5-34. 8 Channel Current Input (4–20 mA) Module..................................104
Figure 5-35. 8 Ch. Current Input (4–20 mA) Module Configuration ...................104
Figure 5-36. Analog Input Wiring for an 8 Ch. Current Input (0–25 mA) Module106
Figure 5-37. 8 Ch. Current Input (0–25 mA) Module Block Diagram .................107
Figure 5-38. Non-standard 8 Channel Current Input (4–20 mA) Module...........109
Figure 5-39. Non-Standard 8 Channel Module Configuration............................110
Figure 5-40. Analog Input Wiring for a Non-Standard Module ...........................111
Figure 5-41. 8 Channel Voltage Input (0–10 Vdc) Module.................................113
Figure 5-42. 8 Ch. Voltage Input (0–10 Vdc) Module Configuration ..................114
Figure 5-43. Voltage Input Wiring for an 8 Chnl Voltage Input Module..............115
Figure 5-44. 8 Ch. Voltage Input (0–10 Vdc) Module Block Diagram ................116
Figure 5-45. 8 Channel Current Output (4–20 mA) Module ...............................118
Figure 5-46. 8 Ch. Current Output (4–20 mA) Module Configuration ................119
Figure 5-47. Analog Output Wiring for 8 Chnl Output (4–20 mA) Module .........120
Figure 5-48. Current Output (4–20 mA) Module Block Diagram ........................121
Figure 5-49. 8 Channel Current Output (0–1 mA) Module .................................122
Figure 5-50. 8 Channel Voltage Output (0–5 Vdc) Module ................................123
Figure 5-51. 8 Ch. Voltage Output (0–5 Vdc) Module Configuration .................124
Figure 5-52. Analog Output Wiring for an 8 Chnl Voltage Output Module .........125
Figure 5-53. 8 Ch. Voltage Output (0–5 Vdc) Module Block Diagram ...............126
Figure 5-54. 8 Channel Voltage Output (0–10 Vdc) Module ..............................127
Figure 5-55. 8 Channel TC (Fail Low) Module ...................................................128
Figure 5-56. 8 Ch. TC (Fail Low) Module Configuration ....................................129
Figure 5-57. 8 Ch. TC Input (Fail Low) Module Field Wiring..............................130
Figure 5-58.Thermocouple Input Block Diagram................................................131
Figure 5-59. 8 Channel TC (Fail High) Module ..................................................133
Figure 5-60. 8 Channel RTD Input Module (10 ohm).........................................134
Figure 5-61. 8Ch RTD Module Configuration.....................................................135

MicroNet TMR Digital Control Manual 26167V3
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Figure 5-62. 8Ch RTD Input Module Field Wiring ..............................................137
Figure 5-63. RTD Input Block Diagram ..............................................................138
Figure 5-64. 8 Channel RTD Input Module (100 ohm).......................................139
Figure 5-65. 8 Channel RTD Input Module (200 ohm).......................................141
Figure 5-66. 8 Channel RTD Input Module (500 ohm).......................................142
Figure 5-67. 4 Channel MPU/Proximity Module .................................................144
Figure 5-68. 4 Ch. MPU/Proximity Module.........................................................145
Figure 5-69. MPU and Proximity Probe Interface Wiring ...................................146
Figure 5-70. Digital Speed Sensor Module Block Diagram................................147
Figure 6-1. Four Channel Actuator Driver Module .............................................149
Figure 6-2. Four Channel Actuator Driver Module Block Diagram.....................150
Figure 6-3. EM/TM Position Control Module ......................................................151
Figure 6-4. Position Control Module as used with various Remote Drivers.......152
Figure 6-5. Position Controller Module Block Diagram ......................................154
Figure 7-2. Service Panel Block Diagram ..........................................................156
Figure 7-3. Service Panel Outline Dimensions...................................................156
Figure 7-4. Service Panel Cutout Dimensions ...................................................157
Figure 7-5. Service Panel Optional 19 Inch Mounting Panel .............................157
Figure 7-6. Ethernet Interface FTM ....................................................................158
Figure 7-7. Ethernet Interface FTM Outline Drawing .........................................158
Figure 7-8. Kit Configuration (040 CPU) ............................................................159
Table 2-1. Off-line Tests .......................................................................................13
Table 2-2. Flash Codes ........................................................................................14
Table 2-3. On-Line Tests......................................................................................15
Table 2-4. Test Failure Messages........................................................................15
Table 2-5. Operation Errors..................................................................................16
Table 2-6. Numbered System Errors....................................................................16
Table 2-7. System Alarms ....................................................................................17
Table 2-8. System Alarms ....................................................................................18
Table 2-9. Numbered System Alarms ..................................................................18
Table 3-1. Remote XCVR Module Jumpers (JPR1–4).........................................21
Table 3-2. Ethernet Module LED Annunciations ..................................................26
Table 3-3. RJ45 Ethernet Pinout ..........................................................................28
Table 4-1. LED Indications of Failure ...................................................................41
Table 4-2. Discrete Outputs/Relay Module Configuration....................................46
Table 4-3. LED Indications of Failure ...................................................................51
Table 5-1. LED Indications of Failure ...................................................................61
Table 5-2. LED Indications of Failure ...................................................................73
Table 5-3. LED Indications of Failure ...................................................................83
Table 5-4. Module Accuracy.................................................................................86
Table 5-5. LED Indications of Failure ...................................................................92
Table 5-6. LED Indications of Failure .................................................................102
Table 5-7. Thermocouple Types and ranges .....................................................129
Table 5-8. Thermocouple Types and ranges .....................................................133
Table 5-9. 4Ch. MPU/Proximity Modules Compatibility with CPU5200 .............143
Table 6-1. LED Indications of Failure .................................................................153
The following are trademarks of Woodward, Inc.:
Woodward
The following are trademarks of their respective companies:
Modbus (Schneider Automation Inc.)
Pentium (Intel Corporation)

MicroNet TMR Digital Control Manual 26167V3
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Warnings and Notices
Important Definitions
This is the safety alert symbol used to alert you to potential personal injury hazards. Obey all
safety messages that follow this symbol to avoid possible injury or death.
DANGER - Indicates a hazardous situation, which if not avoided, will result in death or serious injury.
WARNING - Indicates a hazardous situation, which if not avoided, could result in death or serious
injury.
CAUTION - Indicates a hazardous situation, which if not avoided, could result in minor or moderate
injury.
NOTICE - Indicates a hazard that could result in property damage only (including damage to the
control).
IMPORTANT - Designates an operating tip or maintenance suggestion.
Overspeed /
Overtemperature /
Overpressure
The engine, turbine, or other type of prime mover should be equipped
with an overspeed shutdown device to protect against runaway or
damage to the prime mover with possible personal injury, loss of life,
or property damage.
The overspeed shutdown device must be totally independent of the
prime mover control system. An overtemperature or overpressure
shutdown device may also be needed for safety, as appropriate.
Personal Protective
Equipment
The products described in this publication may present risks that
could lead to personal injury, loss of life, or property damage. Always
wear the appropriate personal protective equipment (PPE) for the job
at hand. Equipment that should be considered includes but is not
limited to:
Eye Protection
Hearing Protection
Hard Hat
Gloves
Safety Boots
Respirator
Always read the proper Material Safety Data Sheet (MSDS) for any
working fluid(s) and comply with recommended safety equipment.
Start-up
Be prepared to make an emergency shutdown when starting the
engine, turbine, or other type of prime mover, to protect against
runaway or overspeed with possible personal injury, loss of life, or
property damage.
Battery Charging
Device
To prevent damage to a control system that uses an alternator or
battery-charging device, make sure the charging device is turned off
before disconnecting the battery from the system.

MicroNet TMR Digital Control Manual 26167V3
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Electrostatic Discharge Awareness
Electrostatic
Precautions
Electronic controls contain static-sensitive parts. Observe the following
precautions to prevent damage to these parts:
Discharge body static before handling the control (with power to the
control turned off, contact a grounded surface and maintain contact
while handling the control).
Avoid all plastic, vinyl, and Styrofoam (except antistatic versions) around
printed circuit boards.
Do not touch the components or conductors on a printed circuit board
with your hands or with conductive devices.
To prevent damage to electronic components caused by improper handling,
read and observe the precautions in Woodward manual
82715 , Guide for
Handling and Protection of Electronic Controls, Printed Circuit Boards, and
Modules.
Follow these precautions when working with or near the control.
1. Avoid the build-up of static electricity on your body by not wearing clothing made of synthetic
materials. Wear cotton or cotton-blend materials as much as possible because these do not store
static electric charges as much as synthetics.
2. Do not remove the printed circuit board (PCB) from the control cabinet unless necessary. If you must
remove the PCB from the control cabinet, follow these precautions:
Do not touch any part of the PCB except the edges.
Do not touch the electrical conductors, the connectors, or the components with conductive
devices or with your hands.
When replacing a PCB, keep the new PCB in the plastic antistatic protective bag it comes in
until you are ready to install it. Immediately after removing the old PCB from the control cabinet,
place it in the antistatic protective bag.

MicroNet TMR Digital Control Manual 26167V3
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Chapter 1.
General Information
Introduction
This manual contains obsolete boards, cards, and CPUs from the MicroNet Simplex and MicroNet Plus
Digital Controls, created to serve as a reference volume for customers who are using this equipment in
their systems. All safety and compliance information is contained in Volume 1 and Volume 2 of this
manual.
Refer to Manual 26166, Volumes 1 and 2 for Required Safety Instructions,
Special Conditions for Safe Use and Hazardous Location Requirements to
insure the control is used in a safe manner in Ordinary, Marine, Hazardous,
ATEX and IECEx locations. Volume 1 must be fully understood and
complied with for all applications.
Obsolete Boards,
Cards and CPUs
The information contained within this volume pertains to modules, which may
be active in the field, but are obsolete and no longer supported by Woodward.
These modules are not recommended for news systems or designs.

MicroNet TMR Digital Control Manual 26167V3
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Chapter 2.
CPUs
Introduction
This chapter contains information on CPUs and each section pertains to a different CPU with all of the
data from the original manual.
2.1. CPU_040 Module
2.1.1—Module Description
Figure 2-1. 040 CPU Module

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Figure 2-1. CPU Module
The information in this chapter on the CPU_040s is for legacy
systems that use the old CPU_040 CPUs. Use the CPU_5200 CPUs for
all new designs.
Every MicroNet TMR control contains three CPU modules, one located in the second slot of each kernel,
just to the right of the kernel power supply.
For CPU module installation and replacement instructions, see the instructions for installing the VME
module in Chapter 14, and for replacement in Chapter 15.
The CPU modules run the application program. Figure 5-7 is a block diagram of a CPU module. When
the reset switch is toggled to the Run position, the CPU modules will perform diagnostic tests, sync
together, and then run the application program.
The CPU has a PCMCIA (Personal Computer Memory Card International Association) slot on its front
panel. The PCMCIA slot is used to download application files to the CPU module.
The CPU module contains a battery to power the real time clock when power to the control is off. This
battery is not user-replaceable. During normal operation, on-board circuitry keeps the battery charged.
Once the battery is fully charged (taking a maximum of three days), the battery will continue to run the
clock for a minimum of three months without external power to the control. If power is removed from the
CPU module for longer than three months, the real time clock may need to be reset. The resolution of the
real time clock is 10 milliseconds.

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Figure 2-2. CPU Module Block Diagram
2.1.2—RS-232 Serial Port COM1
An RS-232 serial port is located on the front of the CPU module. This port should only be connected to a
device with an isolated serial port. Baud rate is selectable from 300 baud to 38.4 Kbaud. Before this port
can be used, Woodward kit P/N 8298-096 must be installed. To install this kit, the CPU must have screw
posts. Some of Woodward’s earlier CPU modules have slide lock posts. These must be sent to
Woodward for upgrade before the port may be used. See Chapter 12 for details on how to install this port
filter kit. Shielded cable is required when connecting to the CPU module’s serial port. Using shielded
cable will help ensure the robustness of the serial communications.
This communication port is non-isolated. Shielded cable and a Serial Port Isolator/ Converter is required
when using this port to avoid susceptibility to EMI noise and ground loops related to PC connections and
typical industrial environments. The following standard options are available:
RS-232–RS-232 Isolator and Filter
RS-232–RS-485 Isolator/Converter and Filter
RS-232–RS-422 Isolator/Converter and Filter
A Serial Port Isolator/Converter must be properly installed,
grounded, and powered prior to connection with the CPU. Once
properly installed, it may be connected to a field device at any time.
Alternatively, the isolator may be connected to the field device.
However, it must be properly installed, grounded, and powered prior
to connection to the CPU.

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Figure 2-3. 68040 CPU Communications Port
2.1.3—FTM Reference
No FTM is used with this CPU. However, additional installation and application information can be found
in Chapter 12.
2.1.4—Troubleshooting and Tuning
The MicroNet Operating System runs both off-line and on-line diagnostics. Diagnostics are run at power-
up or when the Reset switch is toggled (off-line), and automatically when operating under application-
program control (on-line).
2.1.4.1. 68040 CPU Off-Line Diagnostics
The following table shows the tests run by off-line diagnostics, and the order in which they are run. Off-
line diagnostics are started immediately after the Reset has toggled.
Table 2-1. Off-line Tests
TEST EXPLANATION OF TEST
1. CSR (Control Status
Register) Test
The CSR register of the CPU is tested by writing to it, reading from it, and
then testing the value read back.
2. Simple DUART (dual
universal asynchronous
transmitter)
This test checks the DUART counter/timer, and on Channel A of the CPU
module, it does a receiver/internal wrap-around test. If the Channel passes
the test, the display is initialized, and communication with the VFD
(vacuum-fluorescent display) is set up. If the VFD does not respond, the
system sets up for a dumb terminal.
3. Local RAM Test This test checks all of the local RAM installed by performing the following
tests:
A. Marching One test (writes to a bit location in memory, then reads that
location back to verify it his is repeated for every bit-location in memory.
B. Write Byte, read word; write word, read byte, etc.
C. If memory is less than 512 KB, perform wraparound test (writes past
word boundaries).
D. Misalign test (accesses memory on a misaligned word boundary).
4. Application RAM Test This test determines whether the memory for the application is RAM or
PROM. If application memory is PROM, no tests are done. If application
memory is RAM, the following tests are performed.
A. Marching One test.
B. Write Byte, read word; write word, read byte, etc.
C. If me
D. Misalign test.
5. Extensive DUART
Test
This test checks both channels of the DUART with:
A. Internal wrap-around test

MicroNet TMR Digital Control Manual 26167V3
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TEST EXPLANATION OF TEST
B. Different BAUD rates, data bits, etc.
6. Clock interrupt Test This test enables the interrupt timer and checks that the interrupts are
being generated.
7. Local Bus Timeout
Test
This test writes to a location on the Woodward I/O bus with no memory
(module) installed and checks that a bus error occurs.
8. VME Bus Timeout
Test
This test writes to a location on the VME bus with no module installed, and
verifies that a bus error occurs.
9. PROM Write Test This test makes the CPU think that PROM is installed. It then writes to a
location and verifies that the CPU generates a bus error.
10. EEPROM Test This test uses the last few locations in the EEPROM. It writes to a location,
reads the data back, and checks to see if the write was successful. It then
repeats the procedure for different locations.
11. FPU (Floating Point) This test checks the register locations on the Unit) Test co-processor, does
some math calculations with known answers, and checks to be sure the
answers returned are correct.
12. BOOT If the self-test has been successful so far, the system checks to see if
PROM is installed. If PROM is installed, and if it has a valid application
program in it, that program will be executed.
If RAM is installed, the system checks the VME bus to see if there is a
memory module with a valid application program. If it finds one, it will
download it to the CPU RAM and execute it.
If there is no application program, the system sets up for a download and
requests the operator to download an application program.
If PCMCIA module is installed, the CPU will download the application from
the PCMCIA module and execute it.
If during diagnostics, a particular test fails, testing stops and a message identifying the cause of the
failure will be displayed. Also, the FAILED LED on the CPU module will periodically repeat bursts of
flashes; the number of flashes in each burst indicates the test that failed as shown in Table 2-2.
Table 2-2. Flash Codes
FLASHES IN BURST ERROR DETECTED
1 Start Up test failed
2 Control Status Register test failed
3 DUART test Failed
4 Local RAM test failed
5 Local RAM Misaligned test failed
6 Application RAM test Failed
7 Application RAM Misaligned test failed
8 Clock Interrupt test failed
9 Local Bus Timeout test failed
10 VME Bus Timeout test failed
11 PROM Write test failed
12 EEPROM test failed
13 Floating Point Math Co-processor test failed
2.1.4.2. 68040 CPU On-Line Diagnostics
As soon as the application program starts running, the system will use a small portion of run time to
continuously run the following on-line diagnostic tests.

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Table 2-3. On-Line Tests
TEST EXPLANATION OF TEST
1. Local Memory Test This test gets a location from memory, saves the data from that
location, and then writes several different values to that location. It
reads each value back, and checks it to be sure it is correct. It then
restores the saved original data back to the RAM and repeats the
process at another location.
2. Application Memory
Test
RAM only: If the memory is RAM, this test gets a location from memory,
saves the data from that location, and then writes several different
values to that location. It reads each value back, and checks it to be
sure it is correct. It then restores the saved original data back to the
RAM and repeats the process at another location.
UVPROM, RAM, and Flash: The test then calculates the sumcheck
value and compares it to the sumcheck value previously calculated
offline and stored in memory.
3. FPU (Floating Point
Unit) Test
This test checks the register locations on the co-processor, does some
math calculations with known answers, and checks to be sure the
answers are returned correct.
4. Task Overview This test checks the last eight locations in the task that has just
completed to make sure that the values that were set up when the task
was created have not changed. If they have, it indicates that the task
has overflowed its memory, and destroyed memory in another task.
A failure of any one of the on-line tests results in the I/O lock being asserted and display of a message as
shown in Table 2-4. The message will be displayed on the Service Panel at the time the error occurs, and
it also will go into the Fault Mode Buffer so that it can be displayed in the Fault Mode.
Table 2-4. Test Failure Messages
TEST MESSAGE ON FAILURE
Local RAM Local RAM Failed
Application RAM Application RAM Failed
FPU (Co-processor) FPU C0-processor Failed
During execution, an operating system
task ran out of memory, or its memory was
corrupted by a different task
Task overrun
5.2.4.3. 68040 CPU Operation Errors
Certain other errors can occur during system operation. These errors and their associated messages are
listed in Tables 2-5 and 2-6.

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Table 2-5. Operation Errors
MESSAGE MEANING
Checksum Error Local RAM Failed
System Error (#) Application RAM Failed (ref. Table 5-6)
EEPROM Fault FPU C0-processor Failed
Math Exception The FPU (Co-processor) has received an illegal instruction
Rate Group Slip (#) Rate group # (number) is scheduled to run and it did not complete
its previous scheduled run.
EEPROM Initialization Fault The CPU attempted to program the EEPROMs during system
initialization and failed, or the EEPROM was detected bad
(EEPROM FAULT). The system is not permitted to run because
the EEPROM data is not current.
Exception Error Vector # An error was detected by the processor. The vector number
indicates which exception the 68040 processor took. For an
explanation of exceptions, refer to page 8-5 of Motorola Manual
M 68040 UM/AD, MC68040 Enhanced 32-bit Microprocessor
User’s Manual.
Table 2-6. Numbered System Errors
NUMBER
OPER. SYS. FILE MEANING
1 CREATE Cannot create task with priority less than one.
2 CREATE Stack size requested is smaller than the minimum size.
3 NEWPID The priority is greater than the maximum allowed.
4 NEWPID The rate group Proctab entry is not free.
5 NEWPID All the Proctab entries are full.
6 GETMEM Tried to get a (zero-byte) block of memory.
7 GETMEM No memory available.
8 GETMEM Not enough memory available for block size requested.
9 FREEMEM Returned a (zero-byte) block of memory.
10 FREEMEM Returned a block of memory outside of heap boundaries.
11 FREEMEM Unable to return the block of memory
12 NEWSEM No semaphores available.
13 SUSPEND Cannot suspend a task that is not current or ready.
14 SCOUNT The semaphore number is invalid.
15 SCOUNT The semaphore number passed in is undefined.
16 SCREATE The initial count is smaller than zero.
17 SIGNAL The semaphore number is invalid.
18 SIGNAL The semaphore number passed in is undefined.
19 SIGNALN The semaphore number is invalid.
20 SIGNALN The semaphore number passed in is undefined.
21 SIGNALN Must signal semaphore one or more times.
22 SRESET The semaphore number is invalid.
23 SRESET The semaphore number passed in is undefined.
24 RESET Must set semaphore to zero or larger.
25 WAIT The semaphore number is invalid.
26 WAIT The semaphore number passed in is undefined.
When the system detects an error when starting or running an application, the CPU will flash the FAILED
LED on the CPU module with two bursts of flashes separated by a medium longer pause. The CPU will
re-start flashing the fault codes after a long pause. The number of flashes will match the display message
or it can be determined by counting the two groups of short flashes between the medium pause. The
number of flashes in each burst indicates the detected failure as shown in Table 2-7.

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Table 2-7. System Alarms
FLASHES IN BURST ERROR DETECTED
5,4 TheApplicationsdonotmatch,CPU_Cdifferent.
5,1 TheApplicationsdonotmatch,CPU_Bdifferent.
5,2 TheApplicationsdonotmatch,CPU_Adifferent.
5,3 TheApplicationsdonotmatch,ALLdifferent.
5,7 TheLadderLogicApplicationsdonotmatch.
5,8 TheEE(tunable)valuesdonotmatch,CPU_Adifferent.
5,9 TheEE(tunable)valuesdonotmatch,CPU_Bdifferent.
5,10 TheEE(tunable)valuesdonotmatch,CPU_Cdifferent...
5,11 TheEE(tunable)valuesdonotmatch,allCPUsdifferent.
5,14 PickupCPUfailed,re‐syncprocess
5,15 PickupCPUfailed,ApplicationdoesnotmatchrunningCPUs
5,16 PickupCPUfailed,EE(tunable)valuesdonotmatch
5,17 PickupCPUfailed,EE(tunable)valuesdonotmatch
5,19 PickupCPUfailed,LadderLogicApplicationsdonotmatch
5,20 PickupCPUfailedattempttore‐syncwithrunningCPUs
5,21 PickupCPUfailedattempttore‐syncwithrunningCPUs
5,22 PickupCPUfailedattempttore‐syncwithrunningCPUs
5,23 PickupCPUfailedattempttore‐syncwithrunningCPUs
5,24 PickupCPUfailedattempttore‐syncwithrunningCPUs
5,25 PickupCPUfailedattempttore‐syncwithrunningCPUs
6,4 Dual‐portRAMerrordetected(LocalRight)
6,5 Dual‐portRAMerrordetected(LocalLeft)
6,7 Dual‐portRAMerrordetected(RemoteRight)
6,8 Dual‐portRAMerrordetected(RemoteLeft)
6,9 Dual‐portRAMerrordetected(Unknown)
6,14 Votebusted
6,10 KillCPUcalledonCPU_A
6,11 KillCPUcalledonCPU_B
6,12 KillCPUcalledonCPU_C
6,13 KillCPUcalledonallCPUs
7,1 LadderLogicerror,flashprogramfailed
7,2 LadderLogicerror,flashprogramfailed
7,4 LadderLogicerror,flashprogramfailed
7,5 LadderLogicerror,flashinitializationfailed
7,6 LadderLogicerror,flasherasefailed
7,8 LadderLogicerror,flasherasefailed
7,9 LadderLogicerror,badflash
7,10 LadderLogicerror,badflash
7,11 LadderLogicerror,badflash
7,12 LadderLogicerror,
9,1 Buserror
9,2 Faultdetected–Checksum,RGSlip,TaskOver,SystemError,Exception,MathException,
9,3 buserrorfromDualportbroadcastaddress
9,4 LLCPUrequired(needstohavethe2ndbankofFLASHinstalled
9,6 memoryfaultstackoverflow
10,1 insertfailed,requestedkeyisgreaterthanNPROC
10,2 insertfailed,taskisalreadyonaqueue
10,3 insertfailed,taskisalreadyonaqueue
10,4 readyfailed,taskisalreadyREADYorCURRENT
10,5 reinsertfailed,requestedkeyisgreaterthanNPROC
10,6 reinsertfailed,taskisalreadyonaqueue
88,12 PCMCIAtransferfailed

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2.1.4.4. CPU_040 Alarms
The possible system alarms are listed in Table 2-8. The numbered system alarms are listed in Table 2-9.
The ALARMS in Tables 2-8 and 2-9 do not automatically display; they are stored by the system and to
see them, you must use the OPSYS_FAULTS Mode of the Service Panel.
Table 2-8. System Alarms
MESSAGE MEANING
SIO n Configuration Fails
port x
A configuration error occurred on Port n of SIO x module.
n (1-…) = SIO number
x (1-4) = port number
SIO n Missing SIO n module is not installed.
n (1-…) = SIO number
SIO n Self-Test Failed SIO n module failed its self-test.
n (1-…) = SIO number
SIO n Initialization Failed SIO n module failed to initialize.
n (1-…) = SIO number
System Alarm # n A numbered system alarm has occurred. The number of the
alarm is n (see Table 20-8, Numbered System Alarms).
Divide by Zero A divide by zero operation was performed.
Real to Int Conversion
Overflow
An Overflow has occurred during a Real-to-integer conversion
operation.
Table 2-9. Numbered System Alarms
NUMBER OPER SYS.
FILE MEANING
1 CLOSE The device number is invalid.
2 CONTROL The device number is invalid.
3 GETC The device number is invalid.
4 INIT The device number is invalid.
5 OPEN The device number is invalid.
6 PUTC The device number is invalid.
7 READ The device number is invalid.
8 RECVTIM The time passed inn was less than zero.
9 SEND The PID number is invalid.
10 SEND Cannot send message to undefined task.
11 SEND Process has message pending.
12 SENDF The PID number is invalid.
13 SENDF Cannot send message to undefined task.
14 WRITE The device number is invalid.
15 IOERR The function is not implemented for this device.
16 TTYCNTL Baud rate invalid.
17 TTYCNTL Mode (line/char) invalid.
18 TTYCNTL Function invalid.
19 TTYREAD Attempt to read fewer than zero characters.
20 TTYWRITE Attempt to write fewer than zero characters.
21 ICCCNTL Function invalid.
22 ICCINIT Too many SIO modules are defined.

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Chapter 3.
Communication
3.1. Main Transceiver (XCVR) Module
3.1.1—Module Description
The Main XCVR module is only used with CPU 68040 systems. It allows extension of the VME back
plane to the expansion I/O Chassis. The Main XCVR module sends and receives control, data, and
address information to and from its associated Remote Transceiver module (see next section of this
chapter) in an I/O chassis through a copper transceiver cable. The Main XCVR module is used in the
Main Chassis. See Figure 6-6 for a block diagram of the module.
Figure 3-1. Main XCVR Module Block Diagram
3.1.2—Module Specification
Parallel Interface: High-speed, differential line drivers operating at VME transmission rate
Cable Interface: 100 pin metal shell Micro-D connector (2 per module)
Figure 3.2. Main XCVR Module

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3.1.3—Installation
The Main XCVR module can be installed in any slot in the Main Chassis.
No jumpers are used to configure this module.
This Transceiver module has no switches or LEDs.
3.1.4—Troubleshooting
1. If the Main XCVR module is not functioning or not functioning properly, verify cable connections.
2. If the module is still not functioning properly after verifying the cable connections, replace the cables
connecting to module.
3. If the module is still not functioning properly after replacing cables, replace the module.
3.2. Remote Transceiver (XCVR) Module
3.2.1—Module Description
The Remote XCVR module is only used with CPU 68040 systems. The Remote XCVR module receives
and sends control, data, and address information via cable to and from its associated Main XCVR
module. This module must be used in each Remote I/O Chassis that is connected to the Main Chassis via
copper cables.
The Remote XCVR module connects to the VME bus of the chassis. The bus receiver/driver of the
Remote Transceiver module interfaces with the VME bus, exchanging control, data, and address
information. The chassis decoder determines if this chassis is to be accessed, and if so, it activates the
receiver/driver of this chassis' Remote Transceiver module to receive or send information. Figure 6-8
(Chapter 6-1 in Volume 1) is a block diagram of the Remote Transceiver module.
Figure 3-3. Remote XCVR Module Block Diagram
The bus-arbitration logic determines priority of bus-access operations and controls the receiver/driver
accordingly.
Table 3-1 shows the jumpers on the Remote XCVR module used to configure the chassis ID.