xolo MIRAGE PLUS User manual

Mobile Phone Xolo Mirage Plus (Smartphone) Service Manual
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SERVICE MANUAL
For XOLO Mirage Plus Only
MOBILE TERMINAL
(V1.0)
COMPANY CONFIDENTIAL
All Rights Reserved

Mobile Phone Xolo Mirage Plus (Smartphone) Service Manual
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CONTENT
CHAPTER 1: SUMMARY....................................................................................................................4
CHAPTER 2: PCBA OVERVIEW .......................................................................................................6
2.1 MIRAGE PLUS-TOP SIDE-LAYOUT.............................................................................................6
2.2 MIRAGE PLUS-BACK SIDE-LAYOUT .........................................................................................6
CHAPTER 3: EXPLANATION OF SCHEMATIC.............................................................................7
3.1 BASE BAND CHIP MSM8939 FEATURES..........................................................................................7
3.2 POWER MANAGER UNIT PM8916 INTRODUCTION...........................................................................8
3.3 RF CHIP WCN3620 DEVICE INTRODUCTION ...................................................................................9
3.4 INTERFACE FUNCTIONAL CIRCUIT.................................................................................................10
3.4.1 Charging Circuit....................................................................................................................10
3.4.2 Microphone Interface............................................................................................................10
3.4.3 Headset Interface...................................................................................................................11
3.4.4 Receiver Interface .................................................................................................................11
3.4.5 LCD Connector Interface......................................................................................................12
3.4.6 Camera Interface Circuit .......................................................................................................12
3.4.7 Key and RGB LED Circuit ...................................................................................................14
3.4.8 Sensor Interface.....................................................................................................................14
3.4.9 SIM Cart Tray Interface ........................................................................................................15
CHAPTER 4: MOBILE FAILURE ANALYSIS................................................................................16
4.1 POWER ON ISSUE ANALYSIS ...........................................................................................................17
4.2 DISPLAY ISSUE ANALYSIS...............................................................................................................18
4.3NO INCOMING &OUTGOING VOICE ISSUE ANALYSIS......................................................................19
4.4 HEADSET ISSUE ANALYSIS .............................................................................................................21
4.5 NO VOICE IN SPEAKER ISSUE ANALYSIS .........................................................................................22
4.6 FM ISSUE ANALYSIS.......................................................................................................................23
4.7 TOUCH SCREEN ISSUE ANALYSIS....................................................................................................24
4.8 CAMERA ISSUE ANALYSIS ..............................................................................................................25

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4.9VIBRATING ISSUE ANALYSIS ...........................................................................................................26
4.10CHARGING ISSUE ANALYSIS..........................................................................................................27
4.11 BLUETOOTH ISSUE ANALYSIS.......................................................................................................28
4.12 WI-FI ISSUE ANALYSIS.................................................................................................................28
4.13 GPS ISSUE ANALYSIS...................................................................................................................29
4.14 CANNOT DOWNLOAD SOFTWARE .................................................................................................29
4.15 SIGNAL ISSUE ANALYSIS ..............................................................................................................30
CHAPTER 5: SOFTWARE UPGRADE GUIDANCE......................................................................31
5.1 PREPARATIONS BEFORE UPGRADE .................................................................................................31
5.2USB CABLE DRIVER INSTALL........................................................................................................32
5.3 SOFTWARE UPGRADE PROCEDURE ................................................................................................35
5.4 SW DOWNLOAD TROUBLESHOOTING............................................................................................39
CHAPTER 6: PRODUCT EXPLODE VIEW ...................................................................................40

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Chapter 1: Summary
The MIRAGE PLUS is an excellent smartphone and running Google's latest Android 5.0 OS. The
details of specification shows as below:
Phone Type
Full Touch+3 Physical Buttons
OS System
Android 5.0.2
Antenna Type
Monopole
Dimension
Length/Width/Thickness:154mm/76.6mm/7.2 mm
Platform
MSM 8939
Band
GSM: 900/1800/1900 MHz
WCDMA(UMTS): BAND1(2100)\BAND8(900)
FDD-LTE: BAND3(1800), TDD-LTE: BAND40(2300)
SIM Card
Dual SIM, Dual online, One talk; Mirco SIM+Nano SIM/TF
eMMC
( 16G ) Byte+ ( 16G ) Bit
RAM
N/A

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Nand Flash
N/A
Expansion Memory
Single T-FLASH CARD (Support hotplug)
Maximum Capacity of T-F card
( 32G ) Byte
Battery Capacity
(3200 ) mAh
Charging Time
< ( TBD ) Minutes
Talk Time
> ( TBD) Minutes
Standby Time
( TBD ) Hours
Main LCD
SIZE/Resolution/Screen Material:5.5'/FHD
Touch Screen
Capacitive Touch Lens
Function Key
N/A
Side Key
Yes(Power key ,Volume key, Shutter key)
Top Key
N/A
Back Camera Pixel
13M AF+2M FF
Front Camera Pixel
5.0 Mega Fixed Focus
Bluetooth
Bluetooth 4.0
USB
USB 2.0
WiFi
YES, Support Access Point
PC Sync
N/A
IrDA
N/A
Input Method
Google input
SMS
Yes
MMS
Yes
STK
Yes
Polyphonic Melody
64-Tone Wavetable
Stereo
Yes
Melody Format
MP3/MIDI/WAV/AMR/AAC/AAC+
Video Format
MP4/3GP
Recorder
Yes
FM Radio
Only support FM RX
TV
N/A
TV-OUT
N/A
I/O Connector
5PIN Micro USB
Independent Earphone Jack
Φ3.5mm
Sensor
G-Sensor, Proximity, ALS, Magnetic, Gyro
Number &Type of Speakers
( 1 ) PCS ( 1318 ) Speaker
Vibrator Mode
Independent vibrator
GPS
Yes, with navigation
Voice Recognize
N/A
Others
N/A

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Chapter 2: PCBA Overview
2.1 MIRAGE PLUS-TOP SIDE-Layout
2.2 MIRAGE PLUS-BACK SIDE-Layout

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Chapter 3: Explanation of Schematic
3.1 Base Band Chip MSM8939 Features

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3.2 Power Manager Unit PM8916 introduction
The PM8916 device integrates all wireless handset power management, general housekeeping,
and user interface support functions into a single mixed-signal IC. The versatile design is
suitable for multimode, multiband phones and other wireless products such as data cards and
PDAs. The PM8916 mixed-signal HV-CMOS device is available in the 176-pin nanoscale
package (NSP) that includes several ground pins for improved electrical ground, mechanical
stability, and thermal continuity. Since the PM8916 device includes so many diverse
functions, its operation can be understood better by studying the major functional blocks
individually. Therefore, the PM8916 document set is organized by the device functionality as
follows:
Input power management
Output power management
General housekeeping
User interfaces
IC interfaces
–either multipurpose pins (MPPs) or general-purpose input/output
(GPIOs) –that can be configured to function within some of the other categories.
Figure 3.2 PM8916 Function Block Diagram

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3.3 RF Chip WCN3620 device introduction
The WCN3620 IC integrates three different wireless connectivity technologies into a single
device suitable for handsets and other mobile devices:
Wireless local area network (WLAN) compliant with the IEEE 802.11 b/g/n
specification
Bluetooth (BT) compliant with the BT specification version 4.0 (BR/EDR+BLE)
Worldwide FM radio, with Rx modes supporting the Radio Data System (RDS) for
Europe and the Radio Broadcast Data System (RBDS) for the USA
The WCN3620 is a highly integrated IC using the 3.32 ×3.55 ×0.63 mm, 61-pin wafer-level
nanoscale package (61 WLNSP) –and is supplemented by modem IC processing (such as the
MSM8x26 IC, a device in the MSM™ chipset family) to create a wireless connectivity
solution that reduces the part count and PCB area. The WCN3620 IC ensures hardware and
software compatibility with companion Qualcomm Atheros (QCA) chipsets to simplify the
design cycle and reduce the OEM time-to-market cycle.
The WCN3620 IC uses low-power 65 nm RF CMOS fabrication technology, making it
perfectly suited for battery-operated devices where power consumption and performance are
critical.
The WCN3620 device’s major functional blocks are:
A single-band WLAN RF
BT radio (RF and digital processing)
FM radio (RF and digital processing)
Shared WLAN + BT RF front-end (RF FE) circuits
Top-level support circuits that interface with the modem IC, buffer the XO input,
generate the wireless connectivity network (WCN) internal clocks, and gate and
distribute DC power to the other blocks
New features introduced into the WCN3620 IC
65 nm RF CMOS technology in the small 61 WLNSP
Highly integrated front-end eliminates external PA and LNA matching, and antenna
Tx/Rx switching.
Support for ANT
Support for the IEEE802.11b/g/n standard
Single-band WLAN: 2.4 GHz RF transceivers
Compliant with BT specification version 4.0
Concurrent WLAN + BT reception in the 2.4 GHz band
Lower power consumption
Smaller IC footprint, lower parts count, and less PCB area overall

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3.4 Interface Functional Circuit
3.4.1 Charging Circuit
Figure 3.4.1-MIRAGE PLUS Charging Circuit
3.4.2 Microphone Interface
Figure 3.4.2-1 MIRAGE PLUS Primary Microphone Circuit
Figure 3.4.2-2 MIRAGE PLUS Secondary Microphone Circuit

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3.4.3 Headset Interface
Figure 3.4.3-2 MIRAGE PLUS Headset Circuit
3.4.4 Receiver Interface
Figure 3.4.4 MIRAGE PLUS Receiver Circuit

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3.4.5 LCD Connector Interface
Figure 3.4.5 MIRAGE PLUS LCD Connector Circuit
3.4.6 Camera Interface Circuit
Figure 3.4.6-1 MIRAGE PLUS Main Camera circuit

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Figure 3.4.6-2 MIRAGE PLUS 3D Camera circuit
Figure 3.4.6-3 MIRAGE PLUS Front Camera circuit

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3.4.7 Key and RGB LED Circuit
Figure 3.4.7 MIRAGE PLUS Key and RGB LED Circuit
3.4.8 Sensor Interface
Figure 3.4.8-1 MIRAGE PLUSAmbient light and Proximity Sensor Circuit
Figure 3.4.8-2 MIRAGE PLUS Magnetic Sensor

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Figure 3.4.8-3 MIRAGE PLUS Gyro and G-sensor connector
3.4.9 SIM Cart Tray Interface
Figure 3.4.9-1 MIRAGE PLUS SIM 1 Interface
Figure 3.4.9-2 MIRAGE PLUS SIM 1 Interface

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Chapter 4: Mobile Failure Analysis
Basically, MIRAGE PLUS main failure cases including:
Power on problem (No power on, Auto-Power on/off, Phone totally dead, Restart
automatically)
Display failure (No display, LCD backlight malfunction, Segments missing, Black display,
and Contrast malfunction)
Signal problem (No signal, Weak signal, No signal intermittent)
Charging problem (No charging)
Call problem (Call drop, No incoming audio, No outgoing audio, Cannot receive call,
Cannot dial out, Bad voice quality, and Low receiving volume)
Other Function problem ( No ringing tone, No vibration, Vibrator abnormity, Clock fault,
Cannot read SIM /T-F card, Phone password locked, Cannot upgrade software, Show "high
temperature", FM Radio fault, Touchscreen issue, Bluetooth issue, Camera issue, Wi-Fi
issue, etc.)
In the mobile circuit system, all the electrical connecting trace can be divided into three types,
such as power supply trace, controlling trace and signal trace. When analyzing the RF failure case,
for the active circuit we should first check the power supply, then control circuit followed by the
signal flow path to remove the failure step by step. When debugging the RF malfunction, we
should diagnose the RX part first before TX.

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4.1 Power on issue analysis
Power on
failure
Is battery normal?
Defective
mainboard
Test power on
current
repair relevant
chip and circuit
Charging or
replace
battery
N
End
Figure 4.1 Power on failure repair process
1) Battery cannot power on
❶Check the battery is normal or not, if the battery is broken or lower voltage, replace it; ❷
Check battery connector (J100) is normal or not, if the connector is broken, missing, disconnect,
re-solder or replace it; ❸Check the power on switcher is normal or not, if it is abnormal, replace
it; completed all above steps, you still cannot solve this issue, please follow the next steps.
2) No power on Current
❶If the mobile phone can‟t powered on by battery, we can use the DC Power Supply to check the
mobile phone‟s power on current. After connect mobile phone with DC Power Supply, press
power on key, then check the current value; ❷For No current (0mA) issue, it means power supply
circuit problem, and we can follow the product circuit diagram to check this power supply circuit
step by step until find out the defective component.
3) Small power on Current
For small current issue, it means software or periphery circuit problem, we can try to upgrade the
new software or check all of the periphery circuit.
4) High power on Current

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For high current issue, it means this mobile phone must be short circuit, the most probable cause
chipset are Baseband IC (U600), Memory IC, RF IC, RF PA (GSM & WCDMA), ESD protection
Diode, etc.). We can attempt to touch these chipset, and feel the temperature is normal or not. If
one of the chipset‟s temperatures is abnormal, replace it.
4.2 Display issue analysis
Is FPC/connector
normal?
Is FPC/connector
normal?
Is LCD normal?
Is LCD normal?
Replace CPU U600
Replace CPU U600
End
End
Resolder/replace
Resolder/replace
N
N
N
N
Y
Y
Upgrade firmware
Upgrade firmware
Y
Y
Replace LCD
Replace LCD
Is the relevant
component normal
Is the relevant
component normal
N
N
Y
Y
Replace the
component
Replace the
component
Figure 4.2 Display failure repair process
❶Upgrade new software for the mobile phone; ❷MIRAGE PLUS‟s LCD is connected to
mainboard with FPC. We can check the FPC and FPC connector (J904) is normal or not, if it is
abnormal, re-solder or replace it. ❸After upgrade new software and LCD replaced, the problem is
still not solved. Please try to follow the product circuit diagram to check the LCD data path, LCD
power supply path and CPU.

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4.3No Incoming & Outgoing Voice issue analysis
No received
voice
Is audio setting normal? Adjust setting
Is receiver connect
contact point normal?
Clean or adjust
receiver
Is receiver normal? Replace receiver
Repair audio circuit
End
Y
Y
Y
N
N
Upgrade firmware
N
Figure 4.3-1 No received voice failure repair process

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No outcoming
voice
Is audio setting normal? Adjust setting
Is MIC normal? Replace MIC
Repair audio circuit
End
N
Y
Y
N
Is FPC/connector normal? Rectify or
replace
N
Y
Upgrade firmware
Figure 4.3-2 No outgoing voice failure repair process
This issue often occurs in a mobile phone.
For incoming no voice failure
❶Upgrade the latest firmware and try again; ❷Check the phone call volume is OK or not;
❸Check if the connection of receiver is ok or not; ❹Measure the resistance of receiver and
check if it’s normal, the standard value should be 32 ohm;
For outgoing no voice failure:
❶You can enter into „Factory Mode‟ by keep press “Power on” key, volume “-” key the same
time; ❷Select “Audio Handset”and blow at main microphone, the echo at the receiver indicate
the microphone is OK; ❸If test fail, please check the microphone bias circuit, test bias
voltage and output signal, microphone resistance should be 2.2k ohm.
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