Yamaha MU100 User manual

SERVICE MANUAL
TONE GENERATOR
CONTENTS
SPECIFICATIONS··································································································· 3
PANEL LAYOUT······································································································· 4
CIRCUIT BOARD LAYOUT··············································································· 5
BLOCK DIAGRAM··································································································· 6
DISASSEMBLY PROCEDURE······································································· 7
LSI PIN DESCRIPTION···················································································· 12
IC BLOCK DIAGRAM························································································· 14
CIRCUIT BOARDS······························································································· 16
TEST PROGRAM·································································································· 18
MIDI / COMPUTER CONNECTING CABLES···································· 23
ERROR MESSAGES·························································································· 24
INITIALIZE················································································································· 25
MIDI IMPLEMENTATION CHART······························································ 26
OVERALL CIRCUIT DIAGRAM··································································· 27
PARTS LIST
SY 011450
PLG-100DX PLG-100VL PLG-100VH
HAMAMATSU, JAPAN
0.32K-3942 Printed in Japan '99.01

MU100
2
WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (where
applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possibly
other entities) to cause cancer and/or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON
WHAT SO EVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose eyes
to solder/flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling
food.
LITHIUM BATTERY HANDLING
This product uses a lithium battery for memory back-up.
WARNING: Lithium batteries are dangerous because they can be exploded by improper handling. Observe the following
precautions when handling or replacing lithium batteries.
Leave lithium battery replacement to qualified service personnel.
Always replace with batteries of the same type.
When installing on the PC board by soldering, solder using the connection terminals provided on the battery cells.
Never solder directly to the cells. Perform the soldering as quickly as possible.
Never reverse the battery polarities when installing.
Do not short the batteries.
Do not attempt to recharge these batteries.
Do not disassemble the batteries.
Never heat batteries or throw them into fire.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af samme fabrikat og type. Levér det
brugte batteri tilbage til leverandøren.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren.
Kassera använt batteri enligt fabrikantens instruktion.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
The following information complies with Dutch Official Gazette 1995. 45; ESSENTIALS OF ORDER ON THE COLLECTION OF
BATTERIES.
•Please refer to the diassembly procedure for the removal of Back-up Battery.
•Leest u voor het verwijderen van de backup batterij deze beschrijving.
IMPORTANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed that
basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and understood by
the users, and have therefore not been restated.
WARNING: Failure to follow appropriate service and safety procedures when servicing this product may result in personal
injury, destruction of expensive components and failure of the product to perform as specified. For these
reasons, we advise all Yamaha product owners that all service required should be performed by an authorized
Yamaha Retailer or the appointed service representative.
IMPORTANT: This presentation or sale of this manual to any individual or firm does not constitute authorization, certification,
recognition of any applicable technical capabilities, or establish a principal-agent relationship of any form.
The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and
service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable and
changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to exist,
please contact the distributor's Service Division.
WARNING: Static discharges can destroy expensive components. Discharge any static electricity you body may have
accumulated by grounding yourself to the ground buss in the unit (heavy gauge black wires connect to this
buss.)
IMPORTANT: Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power to the
unit.

SPECIFICATIONS
MU100
3
Tone Generation Method
AWM2 (Advanced Wave Memory 2)
Maximum Simultaneous Polyphony
64-note
Sound Module Modes
XG, TG300B, C/M, and Performance
Multi-timbral Capacity
32-Part (on 32 MIDI channels; with element reserve priority for later notes and dynamic Voice allocation)
Internal Voice/Program Structure
Normal Programs
Total Voices···································· 1267
XG mode········································· 1074
TG300B mode ································ 614
C/M mode······································· 128 (Parts 1 — 9), 64 (Parts 11 — 16)
Drum Programs
Total Kits········································ 46
XG mode········································· 36
TG300B mode ································ 10
C/M mode······································· 1
Performance Programs
Up to four Voices plus all effect settings can be memorized to a Performance.
Preset Programs······························ 100
User Programs ································ 100
Effects
Six sections of multi-effects: Reverb (12 Types), Chorus (14 Types),
Variation (70 Types), Insertion 1, 2 (43 Types), Multi EQ (4 Types), and Part EQ (1 Type)
Display
Custom back-lit LCD
Controls
POWER/VOL control, A/D INPUT level control; Mode select buttons: PLAY, UTIL (UTILITY), MODE, EDIT, EFFECT, EQ; other buttons:
MUTE/SOLO, ENTER, EXIT, PART ,SELECT , VALUE
Jacks and Terminals
Front panel: PHONES jack (Stereo Mini-pin), A/D INPUT (stereo 1/4” plug)
Rear panel: OUTPUT R,L (RCA-pin), INPUT R, L (RCA-pin); DC IN jack; TO HOST terminal; HOST SELECT switch; MIDI IN-A/B, MIDI OUT
and MIDI THRU terminals
Computer/MIDI Interface
Direct connection to host computer port (RS-232C, RS-422); MIDI terminals allow connection to MIDI sequencer or MIDI controller
Data Transfer (Baud) Rate
MIDI — 31,250 bps (bits per second)
Mac — 31,250 bps
PC-1 — 31,250 bps
PC-2 — 38,400 bps
Power Supply
Yamaha PA-5B AC Adaptor (included)
Dimensions (W XD XH)
220 X210 X44 mm (8-11/16" X8-1/4" X1-3/4")
Weight
1.3 kg (2 lbs., 14 oz.)
Included Accessories
Owner’s Manual, Yamaha PA-5B AC Adaptor,
XGtools Setup Guide, CD-ROM “XGtools”
Output Level
Refer to the TEST PROGRAM section of this manual on page,19 and 20.

MU100
4
A/D INPUT
A/D INPUT level control
PHONES jack
POWER/VOL control
PLAY button
EDIT button
UTIL (UTILITY) button
MODE button
EQ button
MUTE / SOLO button
ENTER button
EXIT button
PART / buttons
SELECT / buttons
VALUE / buttons
EFFECT button
PANEL LAYOUT
Front Panel
MIDI THRU terminal
MIDI OUT terminal
MIDI IN-A terminal
MIDI IN-B terminal
HOST SELECT switch
TO HOST terminal
DC IN jack
OUTPUT L,R jacks (Left,Right)
INPUT L,R jacks (Left,Right)
MIDI
THRU OUTOUT IN-AI N-A I N-BIN-B
MIDIMIDI MacMac
PC-2PC-2 PC-1
HOST SELECT
TO HOSTTO HOST DC INDC IN
SER NO.
R
L
OUTPUT INPUT
Rear Panel

MU100
5
CIRCUIT BOARD LAYOUT
DM
PSWPVR Front panel LCD
CN10
CN 7
1
CN 14
1
CN6
CN13
CN5
CN9
1
1
1
1
VR cable
(10P)
PSW cable
(2P) SW2 cable
(7P)
SW1 cable
(10P)
LCD cable
CN1 1

CONTRAST
ADDRESS BUS
DATA BUS
16M
PROGRAM
(16bit)
1M
SRAM
(8bit)
32M
MASK
ROM
(16bit)
32M
MASK
ROM
(16bit)
4M
DRAM
(16bit)
SWP30
MPU
H8S
16MHz
33.8688
MHz A/D INPUT
OUTPUT-L
OUTPUT-R
HEAD PHONE
PEAK
DETECT
MUTING
LPF AMP
LPF AMP
AMP
AMP
AMP
D/A
A/D
ANALOG
FRONT
END
GAIN
SELECT
9V
REGULATOR
5V
REGULATOR
5V
REGULATOR
3.3V
REGULATOR
AC-ADAPTOR
PA-5B
POWER SWITCH
MIDI-INB
MIDI-INA
MIDI-OUT
MIDI-THRU
TO-HOST
HOST-SELECT OFF LINE
CHECK
PLUGIN BOARD CABLE
+5VA +9VA
+5V
+3.3V
+9VA
AMP
INPUT VOL
MASTER VOL
LPF
LPF
INPUT-L
INPUT-R
32M
MASK
ROM
(16bit)
32M
MASK
ROM
(16bit)
16M
MASK
ROM
(16bit)
16M
MASK
ROM
(16bit)
DM
PVR
IC2
IC16
IC17 IC18 IC35
IC34
IC39 IC38
IC37
IC20
3 3
31 21
1
IC10
28CA1-8811650
1
IC8 IC9
IC36
IC29 IC30
IC2162 21
12 26
13 75
13
2
75
6
67
11 6
IC11 IC12
110
62
109
105 107
30 33 63
IC12
64 111
61 60 59
PVR
PSW
BATTERY
PANEL SW
LCD UNIT
BACK UP
MU100
BLOCK DIAGRAM
MU100
6

MU100
7
DISASSEMBLY PROCEDURE
1-1 Remove the four (4) screws marked [60], the screw
marked [75], the screw marked [76] and the two (2)
screws marked [80]. The bottom assembly can then
be removed. (Fig. 1)
*When you reattach the bottom assembly, you should
tighten the screws in the order described in figure 1.
1. Bottom Assembly
Front assembly
Rear panel
[80]
[76]
[60]
[75]
[60]
[60]: Bind Head Tapping Screw-B 3.0X8 MFZN2BL (EP600190)
[75]: Bind Head Screw 3.0X6 MFZN2BL (EG330360)
[76]: Bind Head Screw 3.0X6 MFNI33 (EG330370)
[80]: Flat Head Tapping Screw-C 3.0X8 MFZN2BL (VR060800)(Fig.1)
Bottom assembly
7
86
4
1
3
2
5
2-1 Remove the bottom assembly. (See Procedure 1.)
2-2 Remove the two (2) screws marked [30]. The top
assembly can then be removed from the front
assembly. (Fig. 2)
2. DM Circuit Board
Front assembly
[30]
[30]: Flat Head Tapping Screw-C 3.0X8 MFZN2BL (VR060800)(Fig.2)
Top assembly

MU100
8
3. PSW & PVR circuit boards and LCD
[F40][
F30] [F90]
[F90]
PVR
PSW
Front panel
LCD
[F60]
21
43
2
43
12
[F30]: Bind Head Tapping Screw-B 3.0X10 MFZN2Y (EP600220)
[F40]: Bind Head Tapping Screw-B 2.6X10 MFZN2Y (VD791000)
[F60]: Bind Head Tapping Screw-B 2.6X10 MFZN2Y (VD791000)
[F90]: Bind Head Tapping Screw-B 2.6X6 MFZN2Y (VC069600)
(Fig.5)
2-3 Remove the five (5) screws marked [T30]. The DM
circuit board can then be removed. (Fig. 3)
Pull off the A/D INPUT knob from the DM circuit
board.
Melt and remove the solder of the four (4) points
marked [A]. The rear shield can then be remove from
the DM circuit board. (Fig. 4-1,4-2)
* When you reattach the DM circuit board, you should
tighten the screws in the order described in figure 3.
The cables plugged into the connector CN9 should
be inserted as shown in figure 4-1.
[T30]
[T30]
[A]
DM
DM
DM
SW2
(7P)
Rear shield
Rear shield
SW1
(10P)
CN9
CN5
1
1
17
16
1
34
52 CN1
[T30]: Bind Head Tapping Screw-B 3.0X6 MFZN2BL (EP600230)
(Fig.4-1)
(Fig.4-2)
(Fig.3)
3-1 Remove the bottom assembly. (See Procedure 1.)
3-2 Remove the top assembly. (See Procedure 2.)
3-3 Remove the four (4) screws marked [F90]. The PSW
circuit board can then be removed. (Fig. 5)
Pull off the OP buttons and the mode buttons from
the PSW Circuit board.
3-4 Remove the screw marked [F30] and the screw
marked [F40]. The PVR circuit board can then be
removed. (Fig. 5)
3-5 Remove the four (4) screws marked [F60]. The LCD
can then be removed. (Fig. 5)
* When you reattach the circuit boards, you should
tighten the screws in the order described in figure 5.

MU100
9
Installing a Plug-in Board into the MU100
Warning
Installation and removal of a plug-in board into/from the MU100 initializes some of the setup and multi-
part settings of the main unit. Be sure to save any of your important settings onto a personal computer or
MIDI Data Filer MDF3 before installing or removing a plug-in board.
CAUTION!
Be careful not to injure your hands or fingers while installing or removing the plug-in board.
Be careful not to injure yourself when handling the jagged surfaces or sharp areas of the plug-in board.
CAUTION!
Accidents can occur if the plug-in board is installed or removed while the AC adaptor is connected to a
power source. Be sure to unplug the AC adaptor of the MU100 before installing or removing the plug-in
board.
Instructions
1. Turn off the power of any devices that may be connected to the MU100 and remove the MU100’s AC adaptor from its
power source.
2. Turn the MU100 upside down.
Remove the DB cover by removing the four (4) silver screws that secure it to the MU100.

Holder
Insert the connector so
that the tabs on the right
and left sides lock.
Tab Expansion connector
XG Plug-in Connector
XG Plug-in Board
MU100
10
3. Remove the four (4), black, XG Plug-in Board installation screws that are secured to the inside of the DB cover.
Unlatch and remove the holder that secures the connector. Extend the connector.
Keep the holder for use when the XG Plug-in Board is removed.
4. Remove the XG Plug-in Board from the anti-static bag.
5. Insert the expansion connector of the MU100 into the connector of the XG Plug-in Board.
Make sure to insert the connector so that it faces the proper direction and the right and left tabs of the expansion
connector lock into place (as shown in the illustration).
CAUTION!
Before handling the XG Plug-in Board, be sure to touch a grounded, metal surface in order to remove
any static electricity from your clothes or body. Do not touch any of the patterned surfaces of the board
or its connector.

MU100
11
6. Attach the XG Plug-in Board to the DB cover using the four (4), black screws that were removed in Step 3.
Install the XG Plug-in Board so that the side with the IC chips is facing the DB cover.
Position the XG Plug-in Board from above, onto the DB cover, making sure to align the holes of the board with the
holes on the lid. If the holes are not properly aligned, you may damage the plug-in board.
Side without the connector
Screw (black)
XG Plug-in Board
7. Secure the DB cover back onto the MU100 by using the same four (4) silver screws that were removed in Step 2.
Secure the screws in the order shown in the illustration.
Arrange the cables of the
connector as shown, so
that they do not become
pinched or damaged.
Screw (silver)
1
2
3
4

LSI PIN DESCRIPTION
PIN
NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
I/O
O
O
-
-
-
O
O
O
O
-
O
O
O
O
O
O
O
O
-
O
O
O
O
O
O
O
O
-
O
I
O
O
I
O
-
-
O
O
-
I/O
I/O
I/O
I/O
-
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
-
I/O
I/O
I/O
I/O
-
O
O
I
I
O
O
CS1
CS0
Vss
Vss
Vcc
A0
A1
A2
A3
Vss
A4
A5
A6
A7
A8
A9
A10
A11
Vss
A12
A13
A14
A15
A16
A17
A18
A19
Vss
A20
PA5
PA6
PA7
P67
P66
Vss
Vss
P65
P64
Vcc
D0
D1
D2
D3
Vss
D4
D5
D6
D7
D8
D9
D10
D11
Vss
D12
D13
D14
D15
Vcc
TXD0
TXD1
RXD0
RXD1
P34
P35
NAME
Chip Select for System RAM (CS1)
Chip Select for System RAM (CS0)
GND
Power Supply
Address Bus
GND
Address Bus
GND
Address Bus
GND
Address Bus
Off Line Detection
Signal for Rotary encoder(REB)
Signal for Rotary encoder(REA)
Plug Detection of A/D Input
NC
GND
GND
Reset Signal for SWP30
Reset Signal for PB
Power Supply
Two Way Data Bus
GND
Two Way Data Bus
GND
Two Way Data Bus
Power Supply
Serial MIDI OUT (TXD0)
Serial Host OUT (TXD1)
Serial MIDI IN B (RXD0)
Serial MIDI IN A (RXD1) or Host IN
A/D Gain Control Signal(ADG1)
A/D Gain Control Signal(ADG2)
FUNCTION
MU100
12
HD6432655A00F (XT443A00) CPU
PIN
NO.
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
I/O
-
O
-
-
O
O
O
O
O
O
O
O
O
O
O
O
I
I
I
-
-
-
O
O
O
O
O
O
O
O
I
-
-
O
O
I
I
I
I
I
I
I
I
I
I
-
-
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
O
O
O
Vss
P60
Vss
Vss
P61
P62
P63
P27
P26
P25
P24
P23
P22
P21
P20
WDT0VF
RES
NMI
STBV
Vcc
XTAL
EXTAL
Vss
Vcc
AS
RD
HWR
LWR
PF2
PF1
PF0
TXD2
RXD2
Vss
Vss
SCK2
P53
AVcc
Vref
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
AVss
Vss
P17
P16
P15
P14
P13
P12
P11
P10
MD0
MD1
MD2
PG0
CS3
CS2
NAME
GND
NC
GND
GND
NC
PB Select (SW1)
PB Select (SW2)
NC
1 MHz Clock for Serial Interface
LCD Contrast (LCDC-C)
LCD Contrast (LCDC-B)
LCD Contrast (LCDC-A)
LCD Control (LCD-E)
LCD Control (LCD-R/W)
LCD Control (LCD-RS)
NC
Reset Signal
not used
not used
Power Supply
Quartz Cristal 16 MHz
Quartz Cristal 16 MHz
GND
NC
Power Supply
NC
Read Signal
Write Signal
NC
PB Select (SW4)
SW Data Read Control (SWD)
LED,SW Strobe Data Latch (SWS)
Serial Output for PB (TXD2)
Serial Input for PB (RXD2)
GND
GND
Serial Sync Clock for PB (MIDCLK)
Reset Signal for Rotary Encoder
Power Supply for A/D
Reference Voltage for A/D
Analog Level Input R
not used
Analog Level Output L
not used
Detection of Host SW Position
not used
Battery Voltage Check
ModelCheck (MU100:GND)
GND
GND
LCD Data(DB7),SW Data,LED6
LCD Data(DB6),SW Strobe Data
LCD Data(DB5),SW Strobe Data
LCD Data(DB4),SW Data,LED5
LCD Data(DB3),SW Data,LED4
LCD Data(DB2),SW Data,LED3
LCD Data(DB1),SW Data,LED2
LCD Data(DB0),SW Data,LED1
GND
GND
+5 D
PB Select (SW3)
NC
Chip Select for SWP30 (CS2)
FUNCTION

MU100
13
TC203C760HF-001 (XR738A00) TC203C760HF-002 (XS725A00)
SWP30 (AWM Tone Generator coped with MEG) Standard Wave Processor)
PIN
NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
I/O
I
I
I
I
I
I
I
I
I
I
I
I
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
O
O
O
O
O
O
O
O
O
O
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
O
O
O
O
O
O
O
O
O
O
O
O
I
I
I
I
I
I
I
I
O
O
O
O
O
O
O
O
O
O
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Vss
CA0
CA1
CA2
CA3
CA4
CA5
CA6
CA7
CA8
CA9
CA10
CA11
VSS
CD0
CD1
CD2
CD3
CD4
CD5
CD6
CD7
CD8
CD9
CD10
CD11
CD12
CD13
CD14
VDD
VSS
CD15
/CS
/WR
/RD
VDDS
SYSH0
SYSH1
SYSH2
SYSH3
SYSH4
SYSH5
SYSH6
SYSH7
KONO0
KONO1
KONO2
KONO3
VSS
SYSL0
SYSL1
SYSL2
SYSL3
SYSL4
SYSL5
SYSL6
SYSL7
KONI0
KONI1
VDDS
VSS
KONI2
KONI3
DAC0
DAC1
WCLK
MELO0
MELO1
MELO2
MELO3
MELO4
MELO5
MELO6
MELO7
VDDS
ADLR
MELI0
MELI1
MELI2
MELI3
MELI4
MELI5
MELI6
MELI7
VSS
/RCAS
RA8
RA7
RA6
VDD
VSS
RA5
RA4
RA3
RA2
RA1
RA0
/RRAS
/RWE
VSS
RD7
RD6
RD5
RD4
RD3
RD2
RD1
RD0
VSS
RD17
RD16
RD15
RD14
RD13
RD12
RD11
RD10
RD9
RD8
VDDS
NAME
(Ground)
Address bus internal register
(Ground)
Data bus of internal register
(Power supply)
(Ground)
Chip select
Write strobe
Read strobe (Power supply)
NSYS/LNSYS upper 16 bits
Key on data
(Ground)
NSYS input/LNSYS output lower 8 bits
Key on data (Power supply)
(Ground)
DAC output
DAC output
DAC0/DAC1 word clock
MEL wave data output
(Power supply)
ADC word clock
MEL wave data input
(Ground)
DRAM column address strobe
(Power supply)
(Ground)
DRAM address bus
DRAM row address strobe
DARM write enable (Ground)
(Ground)
DRAM data bus
(Power supply)
FUNCTION PIN
NO.
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
I
I
O
I
O
I
I
I
I
I
I
VSS
HMD0
HMD1
HMD2
HMD3
HMD4
HMD5
HMD6
HMD7
HMD8
HMD9
HMD10
HMD11
HMD12
HMD13
HMD14
HMD15
VSS
HMA0
HMA1
HMA2
HMA3
HMA4
HMA5
HMA6
HMA7
HMA8
HMA9
HMA10
VSS
VDD
HMA11
HMA12
HMA13
HMA14
HMA15
HMA16
HMA17
HMA18
HMA19
HMA20
HMA21
HMA22
HMA23
HMA24
VSS
/MRAS
/MCAS
/MOE
/MWE
VSS
LMD0
LMD1
LMD2
LMD3
LMD4
LMD5
LMD6
LMD7
VDDS
VSS
LMD8
LMD9
LMD10
LMD11
LMD12
LMD13
LMD14
LMD15
VSS
LMA0
LMA1
LMA2
LMA3
LMA4
LMA5
LMA6
LMA7
LMA8
LMA9
LMA10
LMA11
VSS
LMA12
LMA13
LMA14
LMA15
LMA16
LMA17
VDD
VSS
LMA18
LMA19
LMA20
LMA21
LMA22
LMA23
LMA24
VSS
SYO
SYOD
QCLK
HCLK
CK256
SYSCLK
VDDS
SYI
MCLKI
MCLKO
VDD
XIN
XOUT
VSS
/IC
CHIP2
SLAVE
/TESTO
/ACI
DCTEST
VDDS
NAME
(Ground)
Wave memory data bus (Upper data memory)
(Ground)
(Ground)
(Power supply)
Wave memory address bus (Upper 16 bits)
(Ground)
RAS when DRAM(s) is connected to wave memory
CAS when DRAM(s) is connected to wave memory
Wave memory output enable
Wave memory write enable
(Ground)
Wave memory data bus (Lower data memory)
(Power supply)
(Ground)
(Ground)
(Ground)
Wave memory address bus (Lower data memory)
(Power supply)
(Ground)
(Ground)
Sync. signal for master clock
Sync. signal for HCLK/QCLK
1/12 master clock (64 Fs)
1/6 master clock (128 Fs)
1/3 master clock (256 Fs)
1/2 master clock (384 Fs)
(Power supply)
Sync. clock
Master clock input
Master clock output (Power supply)
Crystal osc. input
Crystal osc. output (Ground)
Initial clear
2 chips mode enable
Master/Slave select when 2 chips mode
Test pin
(Power supply)
FUNCTION

MU100
14
PIN
NO.
1
2
3
4
5
6
7
8
I/O
I
I
O
4/8F
D. GND
16 BIT
D. VDD
A. GND
R. OUT
A. VDD
A. VDD
NAME
4/8 Fs selection
Digital ground
16 bit/18 bit selection
Digital power supply
Analog ground
Channel R output
Analog power supply
FUNCTION
µPD63200GS-E1 (XP867A00) DAC (Digital to Analog Converter)
PIN
NO.
9
10
11
12
13
14
15
16
I/O
O
I
I
I
I
R. REF
L. REF
L. OUT
A. GND
WDCK
RSI
SI/LSI
CLK
NAME
Channel R voltage reference
Channel L voltage reference
Channel L output
Analog ground
Word clock
Channel R series input
Series input/Channel L series input
Clock
FUNCTION
IC BLOCK DIAGRAM
TC74HC245F-T1 (XD603A00)
Octal 3-State Bus Transceiver SN74HC273NSR (XH223A00) Octal D-Type Flir Flop
TC74HC4051AF-TP(XR056A00)
Triple 2-channel Multiplexer
/Demultiplexer
SN74HC14AF-TP1 (XD657A00)
Hex Inverter TC74HC126AF (XS776A00)
Bus Buffer TC74LVC139F9EL (XS048A00) Dual 2 to 4 Demultiplexer
1
2
3
4
5
6
7
1A
1Y
2A
2Y
3A
3Y
GND
14
13
12
11
10
9
8
VDD
6A
6Y
5A
5Y
4A
4Y
1
2
3
4
5
6
7
1G
1A
2Y
2G
2A
2Y
GND
14
13
12
11
10
9
8
Vcc
4G
4A
4Y
3G
3A
3Y
1
2
3
4
5
6
7
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
AG
B
Y0
Y1
Y2
Y3
16
15
14
13
12
11
10
Vcc
2G
2A
2B
2Y0
2Y1
2Y2
8
GND 92Y3
Y2
Y3
Y1
Y0
B
A
G
1
2
3
4
5
6
7
20
19
18
17
16
15
14
Vcc
G
B1
B2
B3
B4
B5
B6
B7
B8
8
9
10
12
11
GND
A8
A7
A6
A5
A4
A3
A2
A1
D1R
13
CLEAR
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLOCK
120
219
318
417
516
615
714
813
912
10 11
Q
DCK
CL
D
Q
CK
CL
Q
DCK
CL
D
Q
CK
CL
D
Q
CK
CL
Q
DCK
CL
D
Q
CK
CL
Q
DCK
CL
1
Switches IN/OUT
2
3
4
5
6
7
8
Z
Z0
Commons OUT/IN
Swiches IN/OUT
Control Inhibit
-DC Voltage Supply
GND
VDD
Y
X
X1
X0
A
B
C9
10
11
12
13
14
15
16 +DC Voltage Supply
Commons OUT/IN Y
Commons OUT/IN X
Swiches IN/OUT X1
Swiches IN/OUT X0
Control Input A
Control Input B
Control Input C
Y1
Y0
Z1
Z
Z0
INH
VEE
VSS
Y1
Switches IN/OUT
Y0
Switches IN/OUT
Z1

MU100
15
TC7S32F (XM588A00)
OR µPC4570G2 (XF291A00) NJM4556AMT1 (XQ138A00)
Dual Operational Amplifier
TC7W14FU (XN883A00)
Triple lnverter
MC34051MEL (XP881A00)
M5M34051FP (XV103A00)
Dual EIA-422/423 Line
Transceiver
TC74HC4066AF-T1 (XG385A00)
Quad Bilateral Analog Switch SC7SU04FEL (XI348A00) Inverter
TC7S66F (XR682A00)
Bilateral Switch TL32088CNST (XS893A00) AD FRONT END
1
2
3
4
5
6
7
REC1 IN -
REC1 IN +
REC1 OUT
DR1 EN
REC2 OUT
REC2 IN +
REC2 IN -
16
15
14
13
12
Vcc
DR1 IN
DR1 OUT
DR1 OUT
DR2 EN
DR2 OUT
DR2 OUT
8
GAN DR2 IN
9
11
10
+
-
+
-
1
2
3
4
5
6
7
IN/OUT 1
OUT/IN 1
OUT/IN 2
IN/OUT 2
Control 2
Control 3
VSS
14
13
12
11
10
9
8
VDD
Control 1
Control 4
IN/OUT 4
OUT/IN 4
OUT/IN 3
IN/OUT 3
1
2
3
5
4
NC
VSS
VDD
OUT
IN
1 5
2
34
IN A
Vss
Vss
OUT
IN B
1
2
3
4-V
8
7
6
5
Output A +V
Non-Inverting
Input A
-DC Voltage Supply
+DC Voltage
Supply
Output B
Inverting
Input B
Non-Inverting
Input B
Inverting
Input A
+-
+-
1
2
3
4
8
7
6
5
1A
2A
GND
Vcc
1Y
3A
2Y
3Y
NJU7660M-T1 (XP596A00)
DC/DC Voltage Converter
1
2
3
5
4
IN/OUT
GND
VCC
CNTRL
OUT/IN 1
2
3
4
5
6
7
8
9
10 11
12
13
14
15
16
17
18
19
20
REF1
IN L+
OUTL
LI
AOUT L1
AVSS
IN L-
VRE FL
LO
AOUT L2
L ch
Single Differential
Converter
R ch
Single Differential
Converter
REF2
IN R+
IN R-
OUTR
VREFR
RI
RO
AOUT R2
AOUT R1
AVCC
-+
-+
-+
-+
BIAS CIRCUIT
AMP
L1
AMP
R1
AMP
L2
AMP
R2
5K
5K R
OUT
R
OUT R
OUT
R
OUT
5K
5K
367
POWER
SUPPLY
RC
OSC. VOLTAGE CONVERTER
2
LOGIC
OSC VR GND
18
2
3
4
6
7
NC
C+
GND
C- VOUT
VR
OSC
5
VOUT
5V+
8
4
2
C-
C+
V+
TLC320AD58CDWT (XS892A00)
128
2
3
4
5
6
7
8
9
10
11
12
13
14
21
20
19
18
17
16
15
22
23
24
26
27
INLP
INLM
REFI
AVDD
AVSS
AnaPD
TEST1
MODE2
OSFL
DigPD
TEST2
CMODE
MODE0
LRCIk
MODE1
NC
Vlogic
LGND
REFO
INRM
25
INRP
SCLK
DOUT
Fsync
DVDD
DVSS
MCLK
OSFR
45
19
16
17
14
76 10
24 25
21
23
9
15
1811
26
3
1
2
27
20
12
13
22
8
28
Sigma-Delta
Modulator
VREF
Decimation
Filter Low-Cut
Filter
Sigma-Delta
Modulator
CONTROL
Serial
Interface
Decimation
Filter Low-Cut
Filter
AVDD AVSS AnaPD TEST1 DigPD
Dout
Fsync
LRCIk
OSFR
OSFL
SCLK
INLP
INLM
REFO
REFI
INRP
INRM
MCLK
CMODE
MODE0
MODE1
MODE2
TEST2 DVDD DVSS NC Vlogic LGND

CIRCUIT BOARDS
MU100
16
A/D INPUT
Component side
INPUT
L,R
OUTPUT
L,R
DC INTO HOST
HOST
SELECT
IN-BIN-AOUTTHRU
MIDI
DM Circuit Board
Note: See parts list for details of circuit board component parts.
DM
Battery holder
Lithium battery
DM
When removing
When installing
DM
Battery holder
Push
Lithium battery
Battery VN103500
VN103600(Battery holder for VN103500)
Notice for back-up battery removal
Push the battery as shown in figure,
then the battery will pop up.
Druk de batterij naar beneden zoals
aangeven in de tekening de batterij
springt dan naar voren.
*The lithium battery is not a part of the DM circuit board
Battery
Battery holder
.
CN9 Installing
DM
SW2
(7P)
Rear shield
SW1
(10P)
CN9
CN5
1
1
17
16
CN1
2NA1-VZ01320-1/2 1

Pattern side
MU100
17
DM Circuit Board
2NA1-VZ01320-2/2 1
Note: See parts list for details of circuit board component parts.
Pattern side
PVR Circuit Board
POWER/VOL
PUSH ON/OFF
PHONES to DM : CN 6
to DM : CN 13
Component side
Pattern side
PSW Circuit Board
PLAY EDIT
CN5: to DM-CN9
UTIL EFFECT
MODE EQ
MUTE/
SOLO
ENITER SELECT
PART
EXIT
Component side
VALUE

MU100
18
PREPARATIONS
The following measuring instruments and jigs are
necessary during the test.
Measuring instruments :
Audio signal generator, oscilloscope,
amplifier/speaker system, etc.
Jigs : MIDI cables, etc.
The test "Not using" is written in the column of remarks
and is not performed on the MU100.
When performing the tests numbered 21 to 24, connect the
Plug-in Board to the connector CN1of the MU100 before
starting the test.
A. HOW TO ENTER THE TEST PROGRAM
While pressing the [PLAY] and the [MUTE/SOLO]
buttons, turn the MU100 POWER switch on.
When the test program is initiated, the version of the
program ROM will appear on the LCD.
(#.##=Version number of the MU100 program ROM)
After displaying the version message shown above, the
following display will appear.
The factory settings should be performed before any test
when a circuit board or the backup battery is replaced. The
factory settings are performed by turning the MU100
POWER switch on while pressing the [UTIL] and the
[ENTER] buttons.
B. PROCEEDING THROUGH THE TEST
When entering the test program, the following display will
appear.
Use the [SELECT ] and [SELECT ] buttons to move
through the various tests of the test program.
After having selected the test, press the [ENTER] button to
start the test in succession from that number.
Pressing without selecting the test will start the test from
"1. SRAM test".
TEST SELECTION WHEN AN ERROR IS
DETECTED
In each test, if an NG (No Good) error is detected, press the
[EXIT] button. The MU100 will then wait for the entry of a
test number.
1. SRAM TEST
The Write/Read check for SRAM (IC 9 and IC 10) will be
performed automatically on the following address.
IC9, IC10= h'200000 ~ h'20FFFF (16-bit Data Bus)
DISPLAY OF TEST RESULTS
OK
NG
TEST PROGRAM
No.
A
B
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Test
TEST ENTRY
PROCEEDING THROUGH THE TEST AND
SELECTION WHEN AN ERROR IS DETECTED
SRAM
BATTERY
LCD ALL DOTS ON
SWITCH & LED
DIAL
MIDI 1
MIDI 2
HOST SELECT
TO HOST TX/RX
WAVE ROM
1 kHz OUTPUT(L)
1 kHz OUTPUT(R)
1 kHz INDIV.OUT1
1 kHz INDIV.OUT2
INPUT HIGH
INPUT LOW
MEG & DRAM
64 SOUNDS OUTPUT
FACTORY SETTINGS
EXIT
PB1 NAME
PB1 RAM
PB1 MIDI IN
PB1 MEL
PB2 NAME
PB2 RAM
PB2 MIDI IN
PB2 MEL
Remarks
SRAM Read/Write
A/D check on CPU
SWITCH ON/OFF & LED ON/OFF
Not using
Connect MIDI IN A to MIDI OUT
Connect MIDI IN A to MIDI OUT
Slide HOST SELECT
Factory use
WAVE ROM READ
Using measuring instruments
Using measuring instruments
Not using
Not using
Using measuring instruments
Using measuring instruments
Using measuring instruments
By listening
Circuit Board test of CN 1
Circuit Board test of CN 1
Circuit Board test of CN 1
Circuit Board test of CN 1
Not using
Not using
Not using
Not using
MU100 TEST MODE
Ver#. ## ##-###-##
TEST END
After displaying the test result on the LCD, the test will be
completed and proceed to the next test. If an error is
detected during the test, refer to section B, "PROCEEDING
TROUGH THE TEST". All SRAM data is preserved.
2. BATTERY TEST
This test checks that the voltage of the battery is greater
than 2.9 V and less than 3.4 V.
DISPLAY OF TEST RESULTS
OK
NG
TEST END
After displaying the test result on the LCD, the test will be
completed and proceed to the next test. If an error is
detected during the test, refer to section B, "PROCEEDING
TROUGH THE TEST".
3. LCD-ALL DOTS "ON" TEST
Check that all dots of the LCD change to black.
After checking the back light, press the [SELECT]
button to control the LCD contrast in eight (8) steps.
TEST END
Press the [ENTER] button. The MU100 will then
proceed to enter the following test.
If the [EXIT] button is pressed, the MU100 will wait
for the entry of the test number.
4. SWITCH & LED TEST
Press the panel switches consecutively from the [PLAY]
button to the [VALUE+] button, according to the order
indicated on the LCD. At this time, check that the LED of
the testing switch is lighted up.
(e.g. when checking the [ENTER] switch)
The switch & LED test proceeds in the order as below.
[PLAY] [UTIL] [MODE] [EDIT]
[EFFECT] [EQ] [MUTE/SOLO] [ENTER]
[EXIT] [PART-] [SELECT ] [VALUE-]
[PART+] [SELECT ] [VALUE+]
If the switch is OK, a beep will sound and the test will
proceed to the next switch. If the wrong switch is pressed,
the program does not proceed and no sound will heard.
DISPLAY OF TEST RESULTS
OK
NG no appearing
TEST END
When the button [VALUE+] is pressed, if the test is OK, the
test will be completed and proceed to the next test.
If an error is detected during the test, turn the POWER off.
5. DIAL TEST
This test is not performed on the MU100. After pressing
the [EXIT] button, press the [SELECT ] or [SELECT ]
button to select the next test.
6. MIDI 1 TEST
After connecting the [MIDI IN A] to the [MIDI OUT] and
the [MIDI THRU] to the [MIDI IN B] via MIDI cables,
execute the test. The [HOST SELECT] switch must be set
at the [MIDI] during the test.
DISPLAY OF TEST RESULTS
OK
NG
TEST END
If the test is OK, "OK" will be displayed on the LCD and
the test will be completed and proceed to the next test. If an
error is detected during the test, refer to section B,
"PROCEEDING TROUGH THE TEST".
7. MIDI 2 TEST
After connecting the [MIDI IN A] to the [MIDI OUT] and
the [MIDI THRU] to the [MIDI IN B] via MIDI cables,
execute the test. The [HOST SELECT] switch must be set
at the [MIDI] during the test.
DISPLAY OF TEST RESULTS
OK
NG
02 BATTERY
04 SWITCH & LED
[PLAY]
04 SWITCH & LED
[ENTER]
02 BATTERY
ok
02 BATTERY
err
04 SW & LED
ok
06 MIDI 1
07 MIDI 2
06 MIDI 1
ok
06 MIDI 1
err
07 MIDI 2
ok
07 MIDI 2
err
01 RAM
01 RAM
01 RAM
01 RAM
ok
01 RAM
err

TEST END
If the test is OK, "OK" will be displayed on the LCD and
the test will be completed and proceed to the next test. If an
error is detected during the test, refer to section B,
"PROCEEDING TROUGH THE TEST".
8. HOST SELECT TEST
(where ZZ : minimum value, YY : maximum value,
XX : current value)
Change the [HOST SELECT] switch from [Mac] to
[MIDI], according to the order indicated on the LCD.
(when requiring to select the [PC2])
If an unexpected code is received, the system will not
proceed to the next step.
Check that "OK" is displayed at each position of the HOST
SELECT switch.
Decision value MIDI: 0 V –0.6 V
PC2: 1.25 V –2.1 V
PC1: 2.8 V –3.7 V
MAC: 4.7 V –5 V
DISPLAY OF TEST RESULTS
OK
TEST END
When the HOST SELECT switch is set at [MIDI], if the test
is OK, the test will be completed and proceed to the next test.
During the test, if the [EXIT] button is pressed, the MU100
will wait for the entry of the test number.
If NG is detected during the test, refer to section B,
"PROCEEDING TROUGH THE TEST".
9. TO HOST TX/RX TEST
This test is utilized by the factory and it is not intended for
field service use.
DISPLAY OF TEST RESULTS
OK
NG
TEST END
When this test is initiated without a jig for checking, an
error will occur. If an error is detected during the test, refer
to section B, "PROCEEDING TROUGH THE TEST".
10. WAVE ROM TEST
The Read/Verify check for the four WAVE ROMs via the
SWP20-LSI will be performed automatically.
DISPLAY OF TEST RESULTS
OK
NG
TEST END
If the test is OK, "OK" will be displayed on the LCD and
the test will be completed and proceed to the next test. If an
error is detected during the test, refer to section B,
"PROCEEDING TROUGH THE TEST".
11. 1 kHz SOUND OUTPUT (L) TEST
Check that the correct signal is output from the OUTPUT
(L) and the PHONES (L) jacks.
Insert the appropriate phone plug into the OUTPUT(L, R),
the PHONES and the INDIV.OUTPUT (1,2) jacks and
check the output. If necessary, verify the frequency, output
waveform, output level, and THD of the OUTPUT (L,R)
and the PHONES output using a frequency counter,
oscilloscope, AC voltmeter(with 12.47 kHz filter) and
distortion meter. If a plug is inserted to the A/D INPUT, it
must be pulled out. The VOLUME control must be set at
maximum for this check.
ITEMS TO BE CHECKED
OUTPUT (L): 1 kHz +/-3 Hz, sin wave, +2.0 dBm +/-2
dB (10 k ohm load), distortion 0.25 % or
less
OUTPUT (R): less than -80 dBm
PHONES (L): 1 kHz +/-3 Hz sin wave, -4.5 dBm +/-2
dB (33 ohm load), distortion 0.5 % or less
PHONES (R): less than -65 dBm
INDIV.OUTPUT1: less than -80 dBm
INDIV.OUTPUT2: less than -80 dBm
If the plug connected to the OUTPUT (R) is pulled out:
OUTPUT (L): -3.0 dBm +/-2 dB
TEST END
Press the [ENTER] button. The MU100 will then
automatically proceed to the next test.
If the [EXIT] button is pressed, the MU100 will wait for
the entry of the test number.
MU100
19
08 HOST SELECT
Mac ZZ--YY=XX
08 HOST SELECT
PC2 ZZ--YY=XX
08 HOST SELECT
ok
09 TO HOST
09 TO HOST
ok
09 TO HOST
err
10 WAVE ROM
ok
10 WAVE ROM
err
10 WAVE ROM
11 OUTPUT L 1 kHz

MU100
12. 1 kHz SOUND OUTPUT (R) TEST
Check that the current signal is output from the OUTPUT
(R) and the PHONES (R) jacks.
Insert the appropriate phone plug into the OUTPUT (L, R), the
PHONES and the INDIV.OUTPUT (1,2) jacks and check the
output. If necessary, verify the frequency, output waveform,
output level, and THD of the OUTPUT (L,R) and the
PHONES outputs using a frequency counter, oscilloscope,
AC voltmeter(with 12.47 kHz filter) and distortion meter. If a
plug is inserted to the A/D INPUT, it must be pulled out. The
VOLUME control must be set at maximum for this check.
ITEMS TO BE CHECKED
OUTPUT (L): less than -80 dBm
OUTPUT (R): 1 kHz +/-3 Hz, sin wave, +2.0 dBm +/-2 dB
(10 k ohm load), distortion 0.25 % or less
PHONES (L): less than -65 dBm
PHONES (R): 1 kHz +/-3 Hz sin wave, -4.5 dBm +/-2
dB (33 ohm load), distortion 0.5 % or less
INDIV.OUTPUT1: less than -80 dBm
INDIV.OUTPUT2: less than -80 dBm
TEST END
Press the [ENTER] button. The MU100 will then
automatically proceed to the next test.
If the [EXIT] button is pressed, the MU100 will wait for
the entry of the test number.
13. INDIV.1 1kHz SOUND OUTPUT TEST
14. INDIV.2 1kHz SOUND OUTPUT TEST
This test is not performed on the MU100. After pressing
the [EXIT] button, press the [SELECT ] or [SELECT ]
button to select the next test.
15. INPUT HIGH TEST
Apply a signal to [A/D INPUT], and check that the signal
obtained at the [OUTPUT] is controlled in gain with the
A/D INPUT.
Check that the level meters on the LCD light up when the
provided signal is applied to [INPUT].
Insert the appropriate phone plug into the OUTPUT (L, R) and
the PHONES jacks and check the output. If necessary, verify
the frequency, output waveform, output level, and THD of the
OUTPUT (L,R) and the PHONES outputs using a
frequency counter, oscilloscope, AC voltmeter (with 12.47
kHz filter) and distortion meter. The VOLUME control
must be set at maximum for this check.
ITEMS TO BE CHECKED
Listed below are the specifications and conditions of the
OUTPUT(L,R) outputs during this test.
When a sine wave signal of -36.0 dBm, 1 kHz is applied to
A/D INPUT (L), and A/D INPUT is set at maximum, and
A/D INPUT (R) is connected to the ground:
OUTPUT (L): +5 dBm +/-2 dB (10 ohm load), distortion
0.5 % or less
OUTPUT (R): less than -48 dBm
When a sine wave signal of -36.0 dBm, 1 kHz is applied to
A/D INPUT (R), and A/D INPUT is set at maximum, and
A/D INPUT (L) is connected to the ground:
OUTPUT (L): less than -48 dBm
OUTPUT (R): +5 dBm +/-2 dB (10 ohm load), distortion
0.5% or less
When a sine wave signal of -36.0 dBm, 1 kHz is applied to
A/D INPUT (L), and A/D INPUT is set at minimum, and
A/D INPUT (R) is connected to the ground:
OUTPUT (L): less than -66 dBm
When a sine wave signal of -36.0 dBm, 1 kHz is applied to
A/D INPUT (R), and A/D INPUT is set at minimum, and
A/D INPUT (L) is connected to the ground:
OUTPUT (R): less than -66 dBm
Check that the level meters on the LCD will light up, when
the sine wave of -29.0 dBm +/-2 dB, 1 kHz is applied to the
A/D INPUT (L).
TEST END
Press the [ENTER] button. The MU100 will then
automatically proceed to the next test.
If the [EXIT] button is pressed, the MU100 will wait for
the entry of the test number.
16. INPUT LOW TEST
Apply a signal to [A/D INPUT], and check that the signal
obtained at the [OUTPUT] is controlled in gain with the
A/D INPUT.
Check that the level meters on the LCD light up when the
provided signal is applied to [INPUT].
Insert the appropriate phone plug into the OUTPUT (L, R)
and the PHONES jacks and check the output. If necessary,
verify the frequency, output waveform, output level, and
THD of the OUTPUT (L,R) and the PHONES outputs
using a frequency counter, oscilloscope, AC voltmeter(with
12.47 kHz filter) and distortion meter. The VOLUME
control must be set at maximum for this check.
ITEMS TO BE CHECKED
Listed below are the specifications and conditions of the
OUTPUT(L,R) outputs during this test.
12 OUTPUT R 1 kHz
15 INPUT HIGH
16 INPUT LOW
20