-ii-
3.2.1 SCBF ................................................................................................................................ 3-16
3.2.2 VTIEF............................................................................................................................... 3-17
3.2.3 ATIGN .............................................................................................................................. 3-17
3.2.4 Splitter Board.................................................................................................................... 3-18
3.2.5 EICM ................................................................................................................................ 3-18
3.2.6 FEC................................................................................................................................... 3-19
3.2.7 Enhanced Ethernet Subboard (FNC card)......................................................................... 3-20
3.2.8 EICG................................................................................................................................. 3-20
3.2.9 Line Protection & Control Board (LTC)........................................................................... 3-21
3.2.10 Embedded BAS (RPCK) ................................................................................................ 3-21
3.2.11 Backplane (MDSLA) ...................................................................................................... 3-21
4 Hardware Structure................................................................................................................................ 4-1
4.1 Overall Architecture of the System................................................................................................ 4-1
4.1.1 Cabinet................................................................................................................................ 4-3
4.1.2 Frame .................................................................................................................................. 4-5
4.1.3 Single-frame Configuration ................................................................................................4-5
4.1.4 Arrangement Diagram of Integrated Equipment................................................................. 4-6
4.2 Introduction to Boards ................................................................................................................... 4-8
4.2.1 SCBF .................................................................................................................................. 4-8
4.2.2 VTIEF............................................................................................................................... 4-10
4.2.3 ATIGN .............................................................................................................................. 4-12
4.2.4 VDSL Splitter Board (VSEN/VSET)................................................................................ 4-14
4.2.5 PSUN/PSUT ..................................................................................................................... 4-15
4.2.6 EICM ................................................................................................................................ 4-16
4.2.7 EICG................................................................................................................................. 4-18
4.2.8 LTC ................................................................................................................................... 4-20