Zte ZXRAN V9200 Technical specifications

ZXRAN V9200 Product Description

ZXRAN V9200 Product Description
ZTE Confidential & Proprietary 1
ZXRAN V9200 Product Description
© 2020 ZTE Corporation. All rights reserved.
ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used
without the prior written permission of ZTE.
Due to update and improvement of ZTE products and technologies, information in this document is subjected to
change without notice.

ZXRAN V9200 Product Description
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TABLE OF CONTENTS
1 Overview............................................................................................................................6
1.1 Introduction......................................................................................................................... 6
1.2 Benefits................................................................................................................................7
1.3 Application Scenarios........................................................................................................7
2 Product Architecture................................................................................................... 10
2.1 Physical Structure............................................................................................................10
2.2 Hardware Structure......................................................................................................... 11
2.2.1 Switching Board (VSW).................................................................................................. 11
2.2.2 Baseband Processing Board (VBP)............................................................................. 14
2.2.3 Environment Monitoring Board (VEM)......................................................................... 24
2.2.4 Power Distribution Board (VPD)....................................................................................27
2.2.5 Fan Array Module (VF)................................................................................................... 27
2.3 Functionality..................................................................................................................... 28
3 Technical Specifications.............................................................................................29
3.1 Physical Specification..................................................................................................... 29
3.2 Capacity............................................................................................................................ 29
3.3 Power Specification.........................................................................................................30
3.3.1 Power Supply................................................................................................................... 30
3.3.2 Power Consumption........................................................................................................30
3.4 Environment Specification..............................................................................................30
3.5 Electromagnetic Compatibility Specification............................................................... 31
3.6 Reliability Specification...................................................................................................31
4 Cabinet/Rack for the V9200........................................................................................32
4.1 Outdoor Cabinet BS9900A (VC9910A + PC9910A)..................................................32
4.2 Outdoor Cabinet BS8906B.............................................................................................35
4.3 Indoor Cabinet VC9810.................................................................................................. 36
4.4 Indoor Cabinet VC9811.................................................................................................. 38
4.5 Indoor Cabinet VC9182.................................................................................................. 39
4.6 Indoor L-Rack-I1.............................................................................................................. 40
4.7 Indoor H-Rack.................................................................................................................. 41
4.8 Indoor BBU Vertical Installation Shelf VC9183...........................................................42
5 Abbreviations.................................................................................................................44

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FIGURES
Figure 1- 1 V9200 in the GSM/UMTS/LTE/NB-IoT/5G Multi-mode Network.............................6
Figure 1- 2 Indoor Scenario: V9200 and RRUs Integrated in L-Rack-I1....................................8
Figure 1- 3 Outdoor Scenario: V9200 in BS9900A Connected to RRUs/AAUs Nearby..........8
Figure 1- 4 Centralized Deployment Scenario: V9200 in V9810 Connected to RRUs/AAUs
Faraway...................................................................................................................................................9
Figure 2- 1 Appearance of V9200.................................................................................................. 10
Figure 2- 2 Hardware Architecture of V9200................................................................................ 11
Figure 2- 3 VSWc0 Panel................................................................................................................ 12
Figure 2- 4 VSWc2 Panel................................................................................................................ 12
Figure 2- 5 VSWd1 Panel................................................................................................................ 12
Figure 2- 6 VSWd2 Panel................................................................................................................ 12
Figure 2- 7 VBPc0 Panel................................................................................................................. 16
Figure 2- 8 VBPc1 Panel................................................................................................................. 18
Figure 2- 9 VBPc5 Panel................................................................................................................. 19
Figure 2- 10 VBPc7 Panel............................................................................................................... 20
Figure 2- 11 VBPd0 Panel...............................................................................................................21
Figure 2- 12 VBPd1 Panel...............................................................................................................23
Figure 2- 13 VBPd2 Panel...............................................................................................................24
Figure 2- 14 VEMc1 Panel.............................................................................................................. 25
Figure 2- 15 VEMc2 Panel.............................................................................................................. 25
Figure 2- 16 VEMc4 Panel.............................................................................................................. 26
Figure 2- 17 VPDc1 Panel...............................................................................................................27
Figure 2- 18 VFC1 Panel................................................................................................................. 28
Figure 4- 1 Appearance of BS9900A (VC9910A + PC9910A).................................................. 32
Figure 4- 2 Internal Structure of VC9910A (with ZXDU68 B201)..............................................33
Figure 4- 3 Internal Structure of the VC9910A (with ZXDU68 B351)....................................... 33
Figure 4- 4 Internal Structure of PC9910A....................................................................................34
Figure 4- 5 Appearance of BS8906B.............................................................................................35

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Figure 4- 6 Internal Structure of BS8906B....................................................................................36
Figure 4- 7 Appearance of VC9810............................................................................................... 37
Figure 4- 8 Internal Structure of VC9810...................................................................................... 37
Figure 4- 9 Appearance of VC9811............................................................................................... 38
Figure 4- 10 Internal Structure of VC9811.................................................................................... 39
Figure 4- 11 Appearance of VC9182 (with 1 DCPD and 1 V9200)...........................................40
Figure 4- 12 Physical Structure of L-Rack-I1................................................................................41
Figure 4- 13 Physical Structure of H-Rack....................................................................................42
Figure 4- 14 Physical Structure of VC9183.................................................................................. 43
TABLES
Table 2- 1 Board List of V9200....................................................................................................... 10
Table 2- 2 VSWc0 Panel Interfaces...............................................................................................12
Table 2- 3 VSWc2/VSWd1/VSWd2 Panel Interfaces..................................................................13
Table 2- 4 Key Performance Parameters of VSW Boards......................................................... 13
Table 2- 5 VBPc0 Capacity............................................................................................................. 15
Table 2- 6 VBPc0 Panel interfaces................................................................................................ 16
Table 2- 7 VBPc1 Capacity............................................................................................................. 16
Table 2- 8 VBPc1 Panel interfaces................................................................................................ 18
Table 2- 9 VBPc5 Capacity............................................................................................................. 19
Table 2- 10 VBPc5 Panel interfaces.............................................................................................. 19
Table 2- 11 VBPc7 Capacity........................................................................................................... 20
Table 2- 12 VBPc7 Panel interfaces.............................................................................................. 20
Table 2- 13 VBPd0 Capacity...........................................................................................................21
Table 2- 14 VBPd0 Panel interfaces..............................................................................................21
Table 2- 15 VBPd1 Capacity...........................................................................................................22
Table 2- 16 VBPd1 Panel interfaces..............................................................................................23

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Table 2- 17 VBPd2 Capacity...........................................................................................................23
Table 2- 18 VBPd2 Panel interfaces..............................................................................................24
Table 2- 19 VEMc1 Panel Interfaces............................................................................................. 25
Table 2- 20 VEMc2 Panel Interfaces............................................................................................. 25
Table 2- 21 VEMc4 Panel Interfaces............................................................................................. 26
Table 2- 22 VPDc1 Panel Interfaces..............................................................................................27
Table 3- 1 Physical Specification....................................................................................................29
Table 3- 2 Capacity of V9200..........................................................................................................29
Table 3- 3 Power Supply of V9200................................................................................................ 30
Table 3- 4 Power Consumption of V9200 (25°C)........................................................................ 30
Table 3- 5 Working Environment Specification of V9200........................................................... 30
Table 3- 6 Reliability Specifications of V9200.............................................................................. 31
Table 4- 1 Physical Specifications of VC9910A and PC9910A.................................................34
Table 4- 2 Average Power Consumption of VC9910A (25°C)...................................................34
Table 4- 3 Physical Specifications of L-Rack-I1...........................................................................36
Table 4- 4 Average Power Consumption of BS8906B (25°C)................................................... 36
Table 4- 5 Physical Specifications of VC9810..............................................................................38
Table 4- 6 Physical Specifications of VC9811..............................................................................39
Table 4- 7 Physical Specifications of VC9182..............................................................................40
Table 4- 8 Physical Specifications of L-Rack-I1...........................................................................41
Table 4- 9 Physical Specifications of H-Rack...............................................................................42
Table 4- 10 Physical Specifications of VC9183........................................................................... 43

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1 Overview
1.1 Introduction
This document provides a high-level description of the Next Generation Baseband
Processing Unit (NG BBU) – the ZXRAN V9200 (hereinafter referred to as “V9200”),
used in ZTE total wireless solution.
The V9200 is usually connected to RRUs/AAUs, making a distributed solution. It is
responsible for processing the baseband signals. Based on the new generation IT BBU
platform, the V9200 supports GSM, UMTS, LTE, NB-IoT and 5G single modes or
multi-mode by software configuration/upgrade. It enables operators to deploy one unified
radio access network rather than independent GSM, UMTS, LTE, NB-IoT or 5G
networks, which brings simplicity and convenience with low CAPEX and OPEX. Figure
1- 1 shows the position of the V9200 in the typical multi-mode network.
Figure 1- 1 V9200 in the GSM/UMTS/LTE/NB-IoT/5G Multi-mode Network
NOTE: In this document, G is short for GSM, U is short for UMTS, F is short for FDD LTE,
T is short for TDD LTE, I is short for NB-IoT, and N is short for 5G NR. L is short for LTE,
which can be FDD LTE or TDD LTE.

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1.2 Benefits
Smooth Multi-mode Evolution
The V9200 supports multiple radio access modes, including GSM, UMTS, LTE,
NB-IoT and 5G. All RATs share the common controlling and transmission resources.
You can implement a smooth evolution from GSM/UMTS/LTE to 5G by
corresponding boards or software configuration.
Large Capacity
The V9200 with a single rack supports up to 90 2T2R/2T4R/4T4R/8T8R 20MHz
LTE cells or 30 64T64R 100MHz Massive MIMO 5G cells. When the number of
users increases, the V9200’s capacity can be expanded by adding boards to
accommodate the increased users.
Plug-in Design for Shelf, Convenient Deployment
The V9200 is small in size (19-inch wide and 2U high). It can be conveniently
mounted on a wall or inserted in a 19-inch cabinet or an outdoor site-supporting
cabinet, thus saving a lot of installation space and achieving co-site with other
devices easily.
Flexible Networking
The V9200 provides FE/GE/10GE/25GE/100GE Ethernet interfaces and 10G/25G
CPRI interfaces. It supports RRUs/AAUs in various networking topologies, such as
star and chain topology to satisfy the requirements of operators in different network
environments and under different transmission conditions.
1.3 Application Scenarios
The V9200 supports both indoor and outdoor applications. In the indoor scenario, the
V9200 is typically inserted in the indoor L-Rack-I1 or any standard 19-inch cabinet
offered by the operator. In the outdoor scenario, the V9200 is typically put in the
all-in-one outdoor cabinet BS9900A (VC9910A+PC9910A). When multi-BBUs are

ZXRAN V9200 Product Description
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required to be deployed in the central equipment room, the indoor cabinet VC9810 is
recommended. The typical application scenarios of the V9200 are shown in the following
figures.
Figure 1- 2 Indoor Scenario: V9200 and RRUs Integrated in L-Rack-I1
Figure 1- 3 Outdoor Scenario: V9200 in BS9900A Connected to RRUs/AAUs Nearby

ZXRAN V9200 Product Description
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Figure 1- 4 Centralized Deployment Scenario: V9200 in V9810 Connected to
RRUs/AAUs Faraway

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2 Product Architecture
2.1 Physical Structure
The V9200 physical appearance is shown in Figure 2- 1
Figure 2- 1 Appearance of V9200
The V9200 consists of Power Distribution Board (VPD), Baseband Processing Board
(VBP), Environment Monitoring Board (VEM), Switching Board (VSW) and Fan Array
Module (VF), as listed in Table 2-1.
Table 2- 1 Board List of V9200
Board Name
Function Description
VSWc0
Switching Board Type c0 for 2G/3G/4G multi-mode
VSWc2
Switching Board Type c2 for 2G/3G/4G/5G multi-mode
VSWd1
Switching Board Type d1 for 2G/3G/4G /5G multi-mode
VSWd2
Switching Board Type d2 for 2G/3G/4G /5G multi-mode
VBPc0
Baseband Processing Board Type c0 for 2G/3G/4G multi-mode
VBPc1
Baseband Processing Board Type c1 for 2G/3G/4G multi-mode
VBPc5
Baseband Processing Board Type c5 for 5G single-mode
VBPc7
Baseband Processing Board Type c7 for 2G/3G/4G multi-mode
VBPd0
Baseband Processing Board Type d0 for 4G/5G multi-mode
VBPd1
Baseband Processing Board Type d1 for 2G/3G/4G/5G multi-mode

ZXRAN V9200 Product Description
ZTE Confidential & Proprietary 11
VBPd2
Baseband Processing Board Type d2 for 4G/5G multi-mode
VEMc1
Environment Monitoring Board Type c1
VEMc2
Environment Monitoring Board Type c2
VEMc4
Environment Monitoring Board Type c4
VPDc1
Power Distribution Board Type c1
VFC1
Fan Array Module Type C1
Note: Suffix “c0/c1/c2/c4/c5/c7/d0/d1/d2/C1” stands for the board/module type.
2.2 Hardware Structure
The V9200 hardware architecture is shown in Figure 2- 2.
Figure 2- 2 Hardware Architecture of V9200
2.2.1 Switching Board (VSW)
VSW is the switching board, used to control and manage the baseband unit as well as to
provide transmission interfaces and system clock. There are four types of VSW boards:
VSWc0, VSWc2, VSWd1 and VSWd2, illustrated as follows.

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Figure 2- 3 VSWc0 Panel
The panel VSWc0 interfaces are specified in Table 2- 2.
Table 2- 2 VSWc0 Panel Interfaces
Interface
Description
ETH1 – ETH2
1GE/10GE optical interface, used for backhaul transmission
ETH3
1GE electrical interface for backhaul transmission
DBG/LMT
10M/100M/1000M Ethernet interface for local
maintenance/debugging
CLK
1PPS+TOD clock signal input/output interface
GNSS
SMA interface for GNSS antenna
USB
USB Type-C interface for base station commissioning/software
upgrading
Figure 2- 4 VSWc2 Panel
Figure 2- 5 VSWd1 Panel
Figure 2- 6 VSWd2 Panel
The VSWc2/VSWd1/VSWd2 panel interfaces are specified in Table 2- 3.

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Table 2- 3 VSWc2/VSWd1/VSWd2 Panel Interfaces
Interface
Description
ETH1 – ETH2
10GE/25GE optical interface, used for backhaul transmission
ETH3 – ETH4
100GE optical interface, used for backhaul transmission (reserved)
ETH5
1GE electrical interface for backhaul transmission
DBG/LMT
10M/100M/1000M Ethernet interface for local
maintenance/debugging
CLK
1PPS+TOD clock signal input/output interface
GNSS
SMA interface for GNSS antenna
USB
USB Type-C interface for base station commissioning/software
upgrading
Their key performance parameters are specified in Table 2- 4.
Table 2- 4 Key Performance Parameters of VSW Boards
VSW Type
VSWc0
VSWc2
VSWd1
VSWd2
Mode
2G/3G/4G
multi-mode
2G/3G/4G/5G
multi-mode
2G/3G/4G/5G
multi-mode
2G/3G/4G/5G
multi-mode
GSM
Processing
Capability
216 TRXs
216 TRXs
216 TRXs
216 TRXs
UMTS
Processing
Capability
48 CSs
48 CSs
48 CSs
48 CSs
LTE
Processing
Capability
90 20M cells,
DL 7.2 Gbps/UL
3.6 Gbps
90 20M cells, DL
9 Gbps/UL 4.5
Gbps
90 20M cells, DL
12 Gbps/UL 6
Gbps
90 20M cells,
DL 14.4
Gbps/UL 7.2
Gbps
5G NR
Processing
Capability
N/A
15 100M 64T64R
cells, DL 12.5
Gbps/UL 2.5
Gbps
15 100M 64T64R
cells, DL 15
Gbps/UL 3 Gbps
30 100M
64T64R cells,
DL 20 Gbps/UL
4 Gbps
Note: 1. The above table describes the maximum hardware capability. The actual capability is up to
the licenses configured. 2. LTE can be FDD LTE or TDD LTE, where FDD LTE supports
2T2R/2T4R/4T4R and TDD LTE supports 2T2R/4T4R/8T8R.

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The main functions of VSW are:
Processes Abis/Iub/S1/X2 interface protocols.
VSWc2/VSWd1/VSWd2 accomplishes LTE control plane and service plane
protocols processing and 5G transmission transferring, including S1AP, X2AP,
RRC, PDCP etc. or accomplishes 5G control plane and service plane protocols
processing and 5G transmission transferring.
VSWc0 accomplishes LTE control plane and service plane protocols processing,
including S1AP, X2AP, RRC, PDCP etc.
Supports Ethernet switching function and implements data switching for service and
control flow within the system.
Supports software management and local/remote BBU software upgrading.
Supervises the running status of each board within the system.
Provides LMT interface for local O&M.
Provides GPS interface and GPS receiver management.
Supports synchronization to various clock sources, including GNSS, IEEE1588,
1PPS+TOD, and SyncE. It can select one according to the actual configuration.
Provides a real-time clock for system operation and maintenance and calibrates the
real-time clock.
Manages hardware management information, including that of racks, slots, boards,
software versions and board function configurations.
Provides a USB interface for software upgrading and base station commissioning.
2.2.2 Baseband Processing Board (VBP)
VBP is the baseband processing board, which processes the physical layer protocols
and frame protocol specified by 3GPP. There are seven types of BP boards: VBPc0,
VBPc1, VBPc5, VBPc7, VBPd0, VBPd1 and VBPd2.

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2.2.2.1 VBPc0
VBPc0 is a baseband processing board for 2G/3G/4G multi-mode, whose capacity is
specified in Table 2- 5.
Table 2- 5 VBPc0 Capacity
Mode
Capacity
GSM
72 TRXs
UMTS
24 CSs (1536 CEs)
LTE
12 20MHz Cells, DL 1.8 Gbps/UL 900 Mbps
GU dual-mode
36 GSM TRXs + 12 UMTS CSs(768 CEs),
Or 12 GSM TRXs + 18 UMTS CSs(1280 CEs),
Or 24 GSM TRXs + 12 UMTS CSs(1024 CEs)
GF dual-mode
36 GSM TRXs + 6 FDD LTE Cells,
Or 12 GSM TRXs + 9 FDD LTE Cells
UF dual-mode
12 UMTS CSs (768 CEs) + 6 FDD LTE Cells,
Or 6 UMTS CSs (384 CEs) + 9 FDD LTE Cells,
FI dual-mode
12 FDD LTE Cells + 6 NB-IoT Carriers
FT dual-mode
6 FDD LTE Cells + 6 TDD LTE Cells
GUF multi-mode
12 GSM TRXs + 6 UMTS CSs (512 CEs) +6 FDD LTE Cells,
Or 12 GSM TRXs + 12 UMTS CSs (768 CEs) +3 FDD LTE Cells
GFI multi-mdoe
18 GSM TRXs + 6 FDD LTE Cells + 6 NB-IoT Carriers,
Or 12 GSM TRXs + 9 FDD LTE Cells + 3 NB-IoT Carriers
UFI multi-mode
12 UMTS CSs (768 CEs) + 6 FDD LTE Cells+ 3 NB-IoT Carriers
GUI multi-mode
36 GSM TRXs + 6 UMTS CSs (384 CEs) + 6 NB-IoT Carriers
FTI multi-mode
6 FDD LTE Cells + 6 TDD LTE Cells + 3 NB-IoT Carriers
GUFI
multi-mode
18 GSM TRXs + 6 UMTS CSs (384 CEs) + 6 FDD LTE Cells + 3
NB-IoT Carriers,
Or 12 GSM TRXs + 6 UMTS CSs (512 CEs) + 6 FDD LTE Cells +
3 NB-IoT Carriers
Note: 1. The above table describes the maximum hardware capability. The actual capability is up to
the licenses configured. 2. LTE can be FDD LTE or TDD LTE, where FDD LTE supports

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2T2R/2T4R/4T4R and TDD LTE supports 2T2R/4T4R/8T8R. 3. NB-IoT supports
2T2R/2T4R/4T4R.
VBPc0 panel is shown in Figure 2- 7.
Figure 2- 7 VBPc0 Panel
The panel interfaces are specified in Table 2- 6.
Table 2- 6 VBPc0 Panel interfaces
Interface
Description
OF1 – OF6
10 Gbps SFP+ interface, used for connecting to RRUs/AAUs
The main functions of VBPc0 are:
Processes physical layer protocols.
Processes MAC, RLC and PDCP protocols.
Provides IQ data mesh network between all baseband boards.
Provides CPRI interfaces.
2.2.2.2 VBPc1
VBPc1 is a baseband processing board for 2G/3G/4G multi-mode, whose capacity is
specified in Table 2- 7.
Table 2- 7 VBPc1 Capacity
Mode
Capacity
LTE
18 20MHz Cells, DL 2.7 Gbps/UL 1.35 Gbps,
GU dual-mode
36 GSM TRXs + 24 UMTS CSs (1536 CEs)
GF dual-mode
36 GSM TRXs + 12 FDD LTE Cells

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Mode
Capacity
UF dual-mode
12 UMTS CSs (768 CEs) + 12 FDD LTE Cells
FI dual-mode
12 FDD LTE Cells + 12 NB-IoT Carriers
FT dual-mode
12 FDD LTE Cells + 6 TDD LTE Cells,
Or 6 FDD LTE Cells + 12 TDD LTE Cells
GUF multi-mode
36 GSM TRXs + 12 UMTS CSs (768 CEs) + 6 FDD LTE Cells,
Or 12 GSM TRXs + 12 UMTS CSs (768 CEs) + 9 FDD LTE Cells,
Or 18 GSM TRXs + 18 UMTS CSs (1152 CEs) + 6 FDD LTE Cells,
Or 12 GSM TRXs + 6 UMTS CSs (512 CEs) + 12 FDD LTE Cells,
GUI multi-mode
18 GSM TRXs + 24 UMTS CSs (1536 CEs) + 6 NB-IoT Carriers
UFI multi-mode
12 UMTS CSs (768 CEs) + 12 FDD LTE Cells + 6 NB-IoT Carriers
GFI multi-mode
36 GSM TRXs + 12 FDD LTE Cells + 6 NB-IoT Carriers
GFT multi-mode
12 GSM TRXs + 9 FDD LTE Cells + 6 TDD LTE Cells
FTI multi-mode
12 FDD LTE Cells + 6 TDD LTE Cells + 6 NB-IoT Carriers
GUFI
multi-mode
12 GSM TRXs + 6 UMTS CSs (512 CEs) + 12 FDD LTE Cells +
6 NB-IoT Carriers,
Or 12 GSM TRXs + 12 UMTS CSs (768 CEs) + 9 FDD LTE Cells
+ 3 NB-IoT Carriers,
Or 18 GSM TRXs + 6 UMTS CSs (384 CEs) + 12 FDD LTE Cells +
6 NB-IoT Carriers,
Or 24 GSM TRXs + 12 UMTS CSs (1024 CEs) + 6 FDD LTE
Cells + 3 NB-IoT Carriers
GUFT
multi-mode
12 GSM TRXs + 6 UMTS CSs (512 CEs) + 6 FDD LTE Cells + 6
TDD LTE Cells,
Or 18 GSM TRXs + 6 UMTS CSs (384 CEs) + 6 FDD LTE Cells +
6 TDD LTE Cells
GFTI multi-mode
12 GSM TRXs + 9 FDD LTE Cells + 6 TDD LTE Cells + 3 NB-IoT
Carriers
GUFTI
multi-mode
18 GSM TRXs + 6 UMTS CSs (384 CEs) + 6 FDD LTE Cells + 6
TDD LTE Cells + 3 NB-IoT Carriers
FDD LTE MM
3 32T32R 20MHz Massive MIMO Cells
Note: 1. The above table describes the maximum hardware capability. The actual capability is up to
the licenses configured. 2. LTE can be FDD LTE or TDD LTE, where FDD LTE supports

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2T2R/2T4R/4T4R and TDD LTE supports 2T2R/4T4R/8T8R. 3. NB-IoT supports
2T2R/2T4R/4T4R.
VBPc1 panel is shown in Figure 2- 8.
Figure 2- 8 VBPc1 Panel
The panel interfaces are specified in Table 2- 8.
Table 2- 8 VBPc1 Panel interfaces
Interface
Description
EOF
100 Gbps QSFP28 interface (reserved)
OF1 – OF6
10/25 Gbps SFP+/SFP28 interface, used for connecting to RRUs/AAUs
OF7 – OF9
10 Gbps SFP+ interface, used for connecting to RRUs/AAUs
Note: Table 2-6 describes the maximum hardware capability. The real interface configuration is up
to the software version.
The main functions of VBPc1 are:
Processes physical layer protocols.
Processes MAC, RLC and PDCP protocols.
Provides IQ data mesh network between all baseband boards.
Provides CPRI interfaces.
2.2.2.3 VBPc5
VBPc5 is a baseband processing board for 5G single-mode, whose capacity is specified
in Table 2- 9.