ADLINK Technology MCN-2610T User manual

Leading EDGE COMPUTING
MCN-2610T
Intel® Xeon® Scalable Processors CPU Sled
User’s Manual
Manual Revision: 1.0
Revision Date: April 3, 2019
Part No.: 50-1Z259-1000

2
MCN-2610T
Preface
Copyright © 2019 ADLINK Technology, Inc.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or other
means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve
reliability, design, and function and does not represent a commitment on the part of the
manufacturer. In no event will the manufacturer be liable for direct, indirect, special,
incidental, or consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global
environmental preservation through compliance with the European
Union's Restriction of Hazardous Substances (RoHS) directive and
Waste Electrical and Electronic Equipment (WEEE) directive.
Environmental protection is a top priority for ADLINK. We have enforced
measures to ensure that our products, manufacturing processes,
components, and raw materials have as little impact on the environment
as possible. When products are at their end of life, our customers are
encouraged to dispose of them in accordance with the product disposal and/or recovery
programs prescribed by their nation or company.
Battery Labels (for products with battery)
廢電池請回收
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide,
arsenic, benzene, cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-
Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials,
which are known to the State of California to cause cancer, and acrylamide, benzene,
cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and vinyl
materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be
trademarks and/or registered trademarks of their respective companies.

3
MCN-2610T
Revision History
Revision Release Date Description of Change(s)
1.0 2019-04-03 Initial release

4
MCN-2610T
Table of Contents
Preface .................................................................................................................................. 2
1Overview .......................................................................................................................... 6
1.1 Introduction ............................................................................................................................. 6
1.2 Specifications.......................................................................................................................... 7
1.2.1 CPU Sled Specifications....................................................................................................................7
1.2.2 CPU Sled Layout ...............................................................................................................................9
1.2.3 DPDK Support .................................................................................................................................10
2Getting Started................................................................................................................11
2.1 Preparing the CPU Sled.........................................................................................................11
2.1.1 Installing the CPUs ..........................................................................................................................11
2.1.2 Installing Memory.............................................................................................................................15
2.1.3 Installing a SATA Drive ....................................................................................................................16
2.1.4 Installing an M.2 SSD Module .........................................................................................................17
2.2 CPU Sled Front Panel........................................................................................................... 18
2.3 Inserting and Removing the CPU Sled ................................................................................. 18
3Powering Up the CPU Sled........................................................................................... 19
3.1 Power-Up Behavior...............................................................................................................19
3.2 Health/Status Indicators........................................................................................................19
4Using the CPU Sled....................................................................................................... 20
4.1 Hot-Swapping the CPU Sled................................................................................................. 20
4.2 Using Serial Console ............................................................................................................21
4.3 Serial Over LAN via BMC ..................................................................................................... 23
4.3.1 Configuring the BMC IP Address.....................................................................................................23
4.3.2 Configuring BIOS for SOL ...............................................................................................................24
4.3.3 Configuring OS for SOL...................................................................................................................24
4.3.4 Establishing SOL .............................................................................................................................24
4.4 Firmware Upgrade ................................................................................................................25
4.4.1 Updating the BIOS...........................................................................................................................25
4.4.2 Updating the BMC ...........................................................................................................................25
5BIOS Setup..................................................................................................................... 27
5.1 Entering BIOS Setup.............................................................................................................27
5.2 Setup Menu........................................................................................................................... 28
5.3 Navigation............................................................................................................................. 29
5.4 Main Setup............................................................................................................................ 32
5.4.1 BIOS Information .............................................................................................................................33
5.4.2 System Information..........................................................................................................................33
5.4.3 System Date/System Time ..............................................................................................................34
5.5 Advanced Menu.................................................................................................................... 35
5.5.1 Network Stack Configuration ...........................................................................................................36
5.5.2 Serial Port Console Redirection ......................................................................................................37
5.5.3 Console Redirection Settings ..........................................................................................................38
5.5.4 Trusted Computing ..........................................................................................................................40
5.5.5 Intel© I210 Gigabit Network Connection .........................................................................................42
5.5.6 NIC Configuration ............................................................................................................................43
5.6 Chipset Menu........................................................................................................................ 44
5.6.1 CPU Configuration...........................................................................................................................46
5.6.2 Memory Configuration .....................................................................................................................47
5.6.3 Memory Topology ............................................................................................................................49
5.6.4 UPI Configuration ............................................................................................................................50

5
MCN-2610T
5.6.5 UPI Status........................................................................................................................................52
5.6.6 Memory Error Enabling....................................................................................................................53
5.6.7 PCIe Error Enabling.........................................................................................................................55
5.6.8 Server Mgmt ....................................................................................................................................57
5.7 Security Menu....................................................................................................................... 59
5.7.1 Secure Boot.....................................................................................................................................60
5.7.2 Key Management ............................................................................................................................61
5.8 Boot Menu............................................................................................................................. 62
5.9 Save & Exit Menu ................................................................................................................. 64
Safety Instructions.............................................................................................................65
Consignes de Sécurité Importantes ................................................................................. 67
Getting Service................................................................................................................... 69

6
MCN-2610T
1 Overview
1.1 Introduction
The ADLINK MCN-2610T is a high-performance CPU sled featuring dual Intel® Xeon®
Scalable Processors, interconnected by dual redundant switch modules when installed in the
CSA-7400 Network Appliance. It is ideally suited for building next generation high-
performance firewalls and virtualized telecom elements.
The main features of the MCN-2610T are summarized as follows:
•Maximum of four MCN-2610T CPU sleds are supported in the CSA-7400
•Dual redundant switch modules provide up to 2x50G data plane links to each MCN-
2610T in the CSA-7400
•Independent 1G control plane links that connect four MCN-2610T, two switch
management CPUs (implemented by COMe module) and two Chassis Management
Modules (CMM).
•Supports IPMI 2.0 specification, provides web-based intelligent system management
via CMM on switch sleds, and supports SOL on compute nodes
•Optionally integrates Wind River® Titanium Server or OPNFV software to provide
carrier grade NFV service

7
MCN-2610T
1.2 Specifications
1.2.1 CPU Sled Specifications
Core System
CPU
(2 per sled) Intel® Xeon® Silver 4110 Processor 2.10Hz (8C/16T)
Intel® Xeon® Silver 4114 Processor 2.20 GHz (10C/20T)
Intel® Xeon® Gold 5120T Processor 2.20 GHz (14C/28T)
Intel® Xeon® Gold 6130 Processor 2.10 GHz (16C/32T)
Intel® Xeon® Gold 6138 Processor 2.00 GHz (20C/40T)
L2 Cache 13.75MB/19.25MB/22MB/27.5MB dependent on CPU
Chipset Intel® C621 Chipset
Memory 12x DDR4-2133/2400/2666 DIMM sockets, ECC, up to 384GB
BIOS AMI BIOS on SPI flash memory
Operating
Systems Window 7 64-bit, Wiindows 10 64-bit, Windows Server 2016, Linux
Kernel 2.6 or above
I/O Interfaces
Ethernet 2x RJ-45 10/100/1000BASE-T Ethernet ports on front panel
2 x 1G Ethernet ports to two switch boards via mid-plane
Console 1x RJ-45 serial port
USB 2x USB 3.0 Type A ports
Graphics 1x VGA connector
Storage 2x 2.5’’ SATA drive bays (internal)
1x M.2 SSD (internal)
Backplane 2x PCIe x8 Gen3 to switch nodes
Control Buttons and LEDs
Power 1x power button (front)
Reset 1x reset button (front)
LEDs Status (SYS), Custom (APP), Drive Activity (HDD)

8
MCN-2610T
Mechanical
Form Factor 211.3mmx 40.5mm x 444.3mm (W x H x D)
Operating Temp. 0°C to +40°C
Storage Temp. -40°C to +70°C
Humidity 10% to 80%, non-condensing
RoHS RoHS compliant

9
MCN-2610T
1.2.2 CPU Sled Layout
2x 2.5 Drive Bays
M.2 SSD
Memory DIMM
Slots
Intel® Xeon® E5
CPU
Backplane High Speed Connector
Intel® Xeon® E5
CPU
Memory DIMM
Slots
Dimensions in mm

10
MCN-2610T
1.2.3 DPDK Support
The Data Plane Development Kit (DPDK) is a set of libraries and drivers for fast packet
processing, and it can improve packet processing performance by up to ten times. The MCN-
2610T CPU sled is fully validated with DPDK and can provide a high throughput for data
plane packet processing.

11
MCN-2610T
2 Getting Started
2.1 Preparing the CPU Sled
The MCN-2610T is a single-system dual Intel® Xeon® Scalable Processor compute node.
2.1.1 Installing the CPUs
1. Remove the protective covers from the sockets.

12
MCN-2610T
2. Install the CPU to the CPU carrier by aligning the triangle on the CPU with the triangle
on bracket.
3. Insert the CPU into the carrier so that the tabs are aligned as shown. You may need to
flex the carrier to complete the installation.
Note: Before continuing, record the information on the back of the CPU for warranty
purposes,

13
MCN-2610T
4. Install the heatsink onto the CPU carrier assembly by aligning the holes and tabs on
the heatsink and bracket as marked in red and blue.

14
MCN-2610T
5. Install the CPU/heatsink assembly by aligning the triangle on the CPU carrier with the
triangle and beveled edge of the socket, and carefully installing the CPU/heatsink
assembly. Secure it by tightening the captive screws in the order shown. Use a T30
torx screwdriver and tighten to the torque value marked on the heatsink.
For a video of the CPU installation, go to:
https://www.intel.com/content/www/us/en/support/articles/000023869/processors/intel-
xeon-processors.html
1
2
34
CPU1
CPU0

15
MCN-2610T
2.1.2 Installing Memory
1. Open the locking levers on both sides of each socket.
2. Align the memory module with the keys in the socket and press down firmly until both
locking levers click into place.
Step 1
Step 2

16
MCN-2610T
2.1.3 Installing a SATA Drive
1. Uninstall the drive bay by removing the four screws as shown below.
2. Insert two 2.5” SATA drives into the drive tray and secure them with 4 screws as
shown.
3. Re-install the drive bay by securing the four screws removed in step 1 above.

17
MCN-2610T
2.1.4 Installing an M.2 SSD Module
1. Insert the M.2 SSD module into the slot at a 15 degree angle to the board.
2. Gently press down on the module.
3. Use an M2.5 screw to secure the module to the board.
Step 1
Step 2
Step 3

18
MCN-2610T
2.2 CPU Sled Front Panel
The MCN-2610T provides I/O connections from the front panel. There are two 1GbE RJ-45
LAN ports, two USB 3.0 Type A ports, one VGA connector, and one RJ-45 console port as
shown below.
I/O port Description
1 Two 10/100/1000BASE-T Ethernet ports
Top: Host; Bottom: Host & BMC
2 Two USB 3.0 Type A ports
3 VGA connector
4 RJ-45 console port
5 Power button
2.3 Inserting and Removing the CPU Sled
Refer to the chapter "Assembling and Powering Up the CSA-7400” in the “CSA-7400 User’s
Manual” for instructions on inserting and removing the CPU Sled.
1
2
3
4
5

19
MCN-2610T
3 Powering Up the CPU Sled
3.1 Power-Up Behavior
When power is supplied to the CSA-7400, all components will power up automatically. The
behavior of the system when powered up is described below.
1. Cooling fans start speeding up as soon as power is applied to the system.
2. Power LEDs of both CPU and switch nodes turn ON (green).
3. CPU nodes start booting up: The status LED turns ON (red), indicating BIOS POST
status. After BIOS POST is completed, the status LED changes from red to green,
Indicating system status
Note: The BMC Watchdog timeout will turn off the status LED. If the BMC watchdog
is not enabled, the green status LED will stay on.
4. After a few seconds, the switch node A/S LED turns ON (steady or blinking)
indicating CM Active/Standby status.
Note: See 4.1 Hot-Swapping the CPU Sled for instructions on how to power down the CPU
sled.
3.2 Health/Status Indicators
This section covers all of the LEDs on MCN-2600T, as show below.
See the table below for LED descriptions.
LED # Description
1 Status LED
•Red: BIOS POST
•Green: POST completed
2 APP LED (dependent on customer design)
SATA drive activity LED
Drive Status LED (Green)
Read/Write Blinking
Idle On
3
Not Present Off
1
2
3

20
MCN-2610T
4 Using the CPU Sled
4.1 Hot-Swapping the CPU Sled
Before swapping the CPU Sled, the user must first shutdown the OS by executing a
command from the OS or holding down the power button more than 4 seconds.