Advantech MIC-5602 User manual

User Manual
MIC-5602
Advanced Mezzanine Card
Processor AMC

MIC-5602 User Manual ii
Copyright
The documentation and the software included with this product are copyrighted 2009
by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right
to make improvements in the products described in this manual at any time without
notice. No part of this manual may be reproduced, copied, translated or transmitted
in any form or by any means without the prior written permission of Advantech Co.,
Ltd. Information provided in this manual is intended to be accurate and reliable. How-
ever, Advantech Co., Ltd. assumes no responsibility for its use, nor for any infringe-
ments of the rights of third parties, which may result from its use.
Acknowledgements
All other product names or trademarks are properties of their respective owners.
Product Warranty (2 years)
Advantech warrants to you, the original purchaser, that each of its products will be
free from defects in materials and workmanship for two years from the date of pur-
chase.
This warranty does not apply to any products which have been repaired or altered by
persons other than repair personnel authorized by Advantech, or which have been
subject to misuse, abuse, accident or improper installation. Advantech assumes no
liability under the terms of this warranty as a consequence of such events.
Because of Advantech’s high quality-control standards and rigorous testing, most of
our customers never need to use our repair service. If an Advantech product is defec-
tive, it will be repaired or replaced at no charge during the warranty period. For out-
of-warranty repairs, you will be billed according to the cost of replacement materials,
service time and freight. Please consult your dealer for more details.
If you think you have a defective product, follow these steps:
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages you get when the problem
occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any helpful information readily available.
3. If your product is diagnosed as defective, obtain an RMA (return merchandise
authorization) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a fully-completed Repair and Replacement
Order Card and a photocopy proof of purchase date (such as your sales receipt)
in a shippable container. A product returned without proof of the purchase date
is not eligible for warranty service.
5. Write the RMA number visibly on the outside of the package and ship it prepaid
to your dealer.
Part No. 2002560200 Edition 1
Printed in Taiwan February 2009

iii MIC-5602 User Manual
Declaration of Conformity
CE
This product has passed the CE test for environmental specifications when shielded
cables are used for external wiring. We recommend the use of shielded cables.
FCC Class B
Note: This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Opera-
tion of this equipment in a residential area is likely to cause harmful interference in
which case the user will be required to correct the interference at his own expense.
FM
This equipment has passed the FM certification. According to the National Fire Pro-
tection Association, work sites are classified into different classes, divisions and
groups, based on hazard considerations. This equipment is compliant with the speci-
fications of Class I, Division 2, Groups A, B, C and D indoor hazards.
Technical Support and Assistance
1. Visit the Advantech web site at www.advantech.com/support where you can find
the latest information about the product.
2. Contact your distributor, sales representative, or Advantech's customer service
center for technical support if you need additional assistance. Please have the
following information ready before you call:
–Product name and serial number
–Description of your peripheral attachments
–Description of your software (operating system, version, application software,
etc.)
–A complete description of the problem
–The exact wording of any error messages

MIC-5602 User Manual iv
Warnings, Cautions and Notes
Document Feedback
To assist us in making improvements to this manual, we would welcome comments
and constructive criticism. Please send all such - in writing - to: support@advan-
tech.com
Packing List
!MIC-5602 Processor Advanced Mezzanine Card
!User manual (PDF file) CD-ROM disc x1
!Warranty certificate document x1
If any of these items are missing or damaged, contact your distributor or sales repre-
sentative immediately.
Warning! Warnings indicate conditions, which if not observed can cause personal
injury!
Caution! Cautions are included to help you avoid damaging hardware or losing
data. e.g.
There is a danger of a new battery exploding if it is incorrectly installed.
Do not attempt to recharge, force open, or heat the battery. Replace the
battery only with the same or equivalent type recommended by the man-
ufacturer. Discard used batteries according to the manufacturer's
instructions.
Note! Notes provide optional additional information.

v MIC-5602 User Manual
Safety Instructions
1. Read these safety instructions carefully.
2. Keep this User Manual for later reference.
3. Disconnect this equipment from any AC outlet before cleaning. Use a damp
cloth. Do not use liquid or spray detergents for cleaning.
4. For plug-in equipment, the power outlet socket must be located near the equip-
ment and must be easily accessible.
5. Keep this equipment away from humidity.
6. Put this equipment on a reliable surface during installation. Dropping it or letting
it fall may cause damage.
7. The openings on the enclosure are for air convection. Protect the equipment
from overheating. DO NOT COVER THE OPENINGS.
8. Make sure the voltage of the power source is correct before connecting the
equipment to the power outlet.
9. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
10. All cautions and warnings on the equipment should be noted.
11. If the equipment is not used for a long time, disconnect it from the power source
to avoid damage by transient overvoltage.
12. Never pour any liquid into an opening. This may cause fire or electrical shock.
13. Never open the equipment. For safety reasons, the equipment should be
opened only by qualified service personnel.
14. If one of the following situations arises, get the equipment checked by service
personnel:
–The power cord or plug is damaged.
–Liquid has penetrated into the equipment.
–The equipment has been exposed to moisture.
–The equipment does not work well, or you cannot get it to work according to
the user's manual.
–The equipment has been dropped and damaged.
–The equipment has obvious signs of breakage.
15. DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT WHERE THE
STORAGE TEMPERATURE MAY GO BELOW -20° C (-4° F) OR ABOVE 60° C
(140° F). THIS COULD DAMAGE THE EQUIPMENT. THE EQUIPMENT
SHOULD BE IN A CONTROLLED ENVIRONMENT.
16. CAUTION: DANGER OF EXPLOSION IF BATTERY IS INCORRECTLY
REPLACED. REPLACE ONLY WITH THE SAME OR EQUIVALENT TYPE
RECOMMENDED BY THE MANUFACTURER, DISCARD USED BATTERIES
ACCORDING TO THE MANUFACTURER'S INSTRUCTIONS.
17. The sound pressure level at the operator's position according to IEC 704-1:1982
is no more than 70 dB (A).
DISCLAIMER: This set of instructions is given according to IEC 704-1. Advantech
disclaims all responsibility for the accuracy of any statements contained herein.

MIC-5602 User Manual vi
Safety Precaution - Static Electricity
Follow these simple precautions to protect yourself from harm and the products from
damage.
!To avoid electrical shock, always disconnect the power from your PC chassis
before you work on it. Don't touch any components on the CPU card or other
cards while the PC is on.
!Disconnect power before making any configuration changes. The sudden rush
of power as you connect a jumper or install a card may damage sensitive elec-
tronic components.
Product Configurations
We Appreciate Your Input
Please let us know of any aspect of this product, including the manual, which could
use improvement or correction. We appreciate your valuable input in helping make
our products better.
Model Number On-Board Option
CPU Memory
MIC-5602A-M1E Core2 Duo LV 1.5 GHz (L7400) 1 GB DDR2 with ECC
MIC-5602A-M2E Core2 Duo LV 1.5 GHz (L7400) 2 GB DDR2 with ECC
MIC-5602B-M1E Core2 Duo ULV 1.06 GHz (U7500) 1 GB DDR2 with ECC
MIC-5602B-M2E Core2 Duo ULV 1.06 GHz (U7500) 2 GB DDR2 with ECC
Note! 1. TPM support is available as an option.
2. CF module is available as an option.
3. Full size front panel design will be available upon request.

vii MIC-5602 User Manual
Glossary
AMC Advanced Mezzanine Card
ATCA Advanced Telecommunications Computing Architecture
BMC Baseboard Management Controller
CMC Carrier Management Controller
EHCI Enhanced Host Controller Interface
GbE Gigabit Ethernet
HPM Hardware Platform Management
IPMC Intelligent Platform Management Controller
IPMI Intelligent Platform Management Interface
LSB Least Significant Byte
MCH MicroTCA Carrier Hub
MMC Module Management Controller
OOS Out Of Service
PATA Parallel Advanced Technology Attachment
PCIe PCI Express
PICMG PCI Industrial Computer Manufacturers Group
PXE Pre-boot Execution Environment
RX Receive
SAS Serial Attached SCSI
SATA Serial Advanced Technology Attachment
SBC Single Board Computer
SCSI Small Computer System Interface
SDR Sensor Data Record
SerDes Serializer/Deserializer
SIW Serial I/O and Watchdog Timer
SSD Solid State Drive
TPM Trusted Platform Module
TX Transmit

MIC-5602 User Manual viii

ix MIC-5602 User Manual
Contents
Chapter 1 Product Overview ................................1
1.1 Introduction ............................................................................................... 2
1.2 Application................................................................................................. 2
1.3 Functional Block Diagram ......................................................................... 3
Figure 1.1 MIC-5602 Block Diagram ........................................... 3
Chapter 2 Board Specification.............................5
2.1 Technical Data .......................................................................................... 6
Table 2.1: Advantech MIC-5602 Processor AMC Tech Data ...... 6
2.2 Product Features....................................................................................... 7
2.2.1 CPU .............................................................................................. 7
Table 2.2: Intel Processor Selection for the MIC-5602................ 7
2.2.2 BIOS ............................................................................................. 7
2.2.3 Chipset.......................................................................................... 8
Figure 2.1 Intel 3100 Chipset....................................................... 8
2.2.4 Memory ......................................................................................... 8
2.2.5 Ethernet Controller........................................................................ 8
2.2.6 SATA Interface.............................................................................. 9
2.2.7 USB Host Interface ....................................................................... 9
2.2.8 MMC ............................................................................................. 9
Table 2.3: Sensor Data Record ................................................. 11
Table 2.4: FRU Structure........................................................... 12
2.2.9 Chipset Watchdog Interface........................................................ 12
2.2.10 RS-232 Ports .............................................................................. 12
2.2.11 Clock Generator.......................................................................... 12
2.2.12 Legacy USB Support .................................................................. 13
2.2.13 E-Keying ..................................................................................... 13
Table 2.5: E-Keying Match ........................................................ 13
Table 2.6: E-Keying Mis-Match ................................................. 13
2.2.14 On-board Storage Chip............................................................... 14
2.2.15 Compact Flash Expansion Module (Optional) ............................ 14
2.2.16 Trusted Platform Module (Optional)............................................ 14
2.2.17 Handle Switch ............................................................................. 14
2.2.18 Front Panel Ports and Indicators ................................................ 14
Figure 2.2 MIC-5602 Front Panel .............................................. 14
Table 2.7: LAN LEDs................................................................. 15
Table 2.8: Front Panel LEDs ..................................................... 15
2.2.19 Jumper Settings .......................................................................... 16
Figure 2.3 Jumper Locations ..................................................... 16
Table 2.9: CN8 BIOS Recovery Image...................................... 16
Table 2.10: CN9 Clear CMOS ..................................................... 16
Chapter 3 Console Terminal Setup ...................17
3.1 USB to UART Bridge............................................................................... 18
3.2 Terminal Emulator................................................................................... 18
3.3 PuTTY Configuration............................................................................... 18
Figure 3.1 PuTTY configuration................................................. 19
Figure 3.2 PuTTY screen........................................................... 19
Figure 3.3 MIC-5602 BIOS POST shown on PuTTY screen ..... 20

MIC-5602 User Manual x
Chapter 4 AMI BIOS Setup................................. 21
4.1 Introduction ............................................................................................. 22
Figure 4.1 Setup program initial screen..................................... 22
4.2 Entering Setup ........................................................................................ 23
Figure 4.2 Press <DEL> to run setup ........................................ 23
4.3 Main Setup.............................................................................................. 24
Figure 4.3 Main Setup Screen................................................... 24
4.3.1 System Time and System Date .................................................. 24
Figure 4.4 Main Setup Showing BIOS Image 01....................... 25
4.4 Advanced BIOS Feature Setup............................................................... 25
Figure 4.5 Advanced BIOS Features Setup Screen.................. 25
4.4.1 CPU Configuration...................................................................... 26
Figure 4.6 CPU configuration .................................................... 26
4.4.2 ACPI Configuration ..................................................................... 27
Figure 4.7 ACPI Configuration................................................... 27
4.4.3 MPS Configuration...................................................................... 28
Figure 4.8 MPS Configuration ................................................... 28
4.4.4 PCI-Express Configuration ......................................................... 28
Figure 4.9 PCI-Express Configuration....................................... 28
4.4.5 System Console Configuration ................................................... 29
Figure 4.10System Console Configuration................................. 29
4.4.6 Trusted Computing ..................................................................... 30
Figure 4.11Trusted Computing Configuration ............................ 30
4.5 Boot Setup .............................................................................................. 31
Figure 4.12Boot Setup................................................................ 31
Figure 4.13Hard Disk Drives ...................................................... 32
Figure 4.14Removable Drives .................................................... 32
4.5.1 Boot Settings Configuration ........................................................ 33
Figure 4.15Boot Settings Configuration...................................... 33
4.5.2 Boot Device Priority .................................................................... 34
Figure 4.16Boot Device Priority.................................................. 34
4.6 Security ................................................................................................... 35
Figure 4.17Security .................................................................... 35
4.6.1 Supervisor and User Passwords ................................................ 35
4.6.2 Other Security Settings............................................................... 36
4.7 Exit Options............................................................................................. 37
Figure 4.18Exit Options .............................................................. 37
Chapter 5 MMC Firmware Operation ................ 39
5.1 Module Management Controller (MMC).................................................. 40
5.1.1 BIOS Image Selection by MMC .................................................. 40
Table 5.1: Command Assignment ............................................. 40
Table 5.2: Request Data ........................................................... 40
Table 5.3: Response Data......................................................... 40
Table 5.4: Command Assignment ............................................. 41
Table 5.5: Request Data ........................................................... 41
Table 5.6: Response Data......................................................... 41
5.1.2 BIOS Firmware Hub (FWH) Write Protection by MMC ............... 42
Table 5.7: Command Assignment ............................................. 42
Table 5.8: Request Data ........................................................... 42
Table 5.9: Response Data......................................................... 42
Table 5.10:Command Assignment ............................................. 43
Table 5.11:Request Data ........................................................... 43
Table 5.12:Response Data......................................................... 43
5.1.3 MIC-5602 MAC Addresses Mirroring.......................................... 44
Table 5.13:Command Assignment ............................................. 44
Table 5.14:Request Data ........................................................... 44

xi MIC-5602 User Manual
Table 5.15: Response Data......................................................... 44
5.2 MMC Firmware Update ........................................................................... 45
5.2.1 MIC-5602 Field Upgradeable Components ................................ 45
5.2.2 HPM.1 Upgrade Process ............................................................ 46
5.2.3 HPM.1 Upgrade with ipmitool ..................................................... 46
5.3 Serial-over-LAN (SoL)............................................................................. 48
5.3.1 Overview ..................................................................................... 48
5.3.2 Accessing the MIC-5602 MMC with ipmitool .............................. 48
5.3.3 SoL Configuration with ipmitool .................................................. 50
5.3.4 SoL Session Establishment with ipmitool ................................... 53
Chapter 6 Overview of Supported Features and
Known Limitations ............................55
6.1 Supported Features ................................................................................ 56
Table 6.1: Current Supported and Unsupported Features ........ 56
6.2 Known Limitations: .................................................................................. 56
Chapter 7 Replacing and Installing the AMC....57
7.1 Extracting a MIC-5602 ............................................................................ 58
7.2 Installing a MIC-5602 .............................................................................. 58
Appendix A IPMI/PICMG Command Subset
Supported by MMC............................59
A.1 IPMI/PICMG Command Subset Supported by MMC .............................. 60

MIC-5602 User Manual xii

Chapter 1
1Product Overview
This chapter describes briefly the
product technology of the MIC-
5602.

MIC-5602 User Manual 2
1.1 Introduction
The MIC-5602 is a highly integrated single-width, mid-size, and economical proces-
sor AMC. Its design is based on the low-power, high-performance Intel Celeron M
ULV or Pentium M LV processor combined with the high-performance Intel 3100
chipset. The board includes 1 or 2 GB of soldered DDR2 400 MHz memory with ECC
for higher MTBF and optimum cooling. To facilitate development, test and integration
while offering typical network connectivity once deployed, the front panel provides a
gigabit Ethernet connector, a serial port and a USB 2.0 host port.
The MIC-5602 maximizes AMC edge connector connectivity for the best design flexi-
bility. When redundancy or two separate interconnects are required, the board can
be configured with two PCI Express x4 ports or with a single PCI Express x8 port
when throughput is essential. Two gigabit Ethernet ports provide AMC.2 compliance
and offer control and data plane connectivity to facilitate the migration of existing
applications. Both ports connect to the 3100 chipset via PCI Express for maximum
data throughput. Dual SATA interfaces provide AMC.3 compliant storage and two
USB ports offer further connectivity opportunities.
A dedicated Module Management Controller (MMC) monitors onboard conditions
and manages hot swap operation for field upgrades or module replacement without
the need to power down the underlying system.
1.2 Application
It is designed to allow communication equipment manufacturers to add modular and
upgradeable computing functionality to their AdvancedTCA or MicroTCA proprietary
baseboards and provide the localized capability necessary for applications such as
protocol processing, packet processing, data management and I/O management.
This AMC module is hot-swappable, which allows it to be replaced by operators or
service organizations in the field without bringing down an entire AdvancedTCA
blade or system.

3 MIC-5602 User Manual
Chapter 1 Product Overview
1.3 Functional Block Diagram
The hardware concept can be illustrated by the following functional block diagram.
Refer to table 2.1 for the product's detailed technical specification.
Figure 1.1 MIC-5602 Block Diagram

MIC-5602 User Manual 4

Chapter 2
2Board Specification
This chapter describes the hard-
ware features of the MIC-5602.

MIC-5602 User Manual 6
2.1 Technical Data
Table 2.1: Advantech MIC-5602 Processor AMC Tech Data
Processor System
CPU Intel Core 2 Duo ULV (U7500) or Core2 Duo LV
(L7400) up to 1.5 GHz
Chipset Intel 3100
BIOS
AMI (1. Dual images with update rollback, 2. CMOS
settings can be changed over IPMI, and 3. CMOS
backup works without battery)
Bus
Front Side Bus 400/533 MHz
PCI Express PCI Express rev1.0a: configurable one x8 or two x4
routed to AMC connector
Memory Technology DDR2 400 with ECC
Max. Capacity 2 GB
Ethernet
Controller Intel 82571EB dual-port Gigabit Ethernet controller
(support 802.3d compliant link aggregation)
Interface
One GbE accessible on front panel via RJ-45 and
two SerDes links to AMC common options region
ports 0 and 1
Mass Storage
CompactFlash Optional expansion board with CF type-1 B socket
On-board
1GB industrial grade internal NAND flash disk (used
as NV storage, emergency boot disk or diagnostics
boot media)
SATA Interface
AMC Edge Con-
nector Two SATA interfaces to common ports region 2-3
Other One SATA routed to CF daughter board
Serial Interface I/O Routed to front panel as USB Slave interface
through onboard USB to Serial converter
USB Interface
I/O One USB 2.0 compliant host port (standard USB
Connector) on front panel
AMC Edge
Connector
Two USB 2.0 ports connect to rear AMC edge con-
nector
Watchdog Timer AMC compliant watchdog
Hardware Monitor Controller IPMI v1.5 compatible MMC
Firmware Source Code Pigeon Point Systems-based
Update Standard HPM.1 compliant
Operating System Compatibility Carrier Grade Linux (Wind River Platform for Net-
work Equipment, Linux Edition 2.0)
Form Factor AMC Mid-size, single width
Interface AMC.0 compliant
Miscellaneous LEDs x1 blue for hot swap, x1 red for failure and OOS, x1
green for general purpose
Power
Requirement
Configuration Core 2 Duo L7400 + 3100 + 1 GB on-board DDR2
SDRAM
Consumption 35.2 watts
Physical Dimensions 180.6 mm x 73.5 mm

7 MIC-5602 User Manual
Chapter 2 Board Specification
2.2 Product Features
2.2.1 CPU
The MIC-5602 supports the low wattage Intel Core 2 Duo LV and Core 2 Duo ULV
processors on 65 nm technology with core frequencies up to 1.5 GHz and 667 MHz
Front Side Bus (FSB). These processors are validated with the integrated Intel
server-class 3100 chipset. This chipset provides greater flexibility for developers of
embedded applications by integrating the memory and I/O control functions into a
single component, addressing the needs for high-performance, high-reliability, and
low-power consumption within a small form factor such as the MIC-5602. Current
supported processors are listed in the table below. The Intel Core 2 Duo L7400 pro-
cessor delivers 1.5 GHz of core frequency and 4 MB of L2 cache. It inherits a low
thermal design power of 17 W. And, the Intel Core 2 Duo U7500 processor offering
1.06 GHz of core frequency and 2 MB of L2 cache comes with ultra low maximum
heat dissipation of 10 W.
2.2.2 BIOS
An 8 Mbit Firmware Hub (FWH) contains a board-specific BIOS (from AMI) designed
to meet telecom and embedded system requirements. The device shall implement
boot sector protection and dual images to support BIOS update failure recovery. The
BIOS boot sector contains the early start-up code. Two BIOS images stored in the
non volatile memory are the "User" image (Default: Image 0) and the "Recovery"
image (Image 1). The program code in the boot sector will checksum the User image
and start the User BIOS if it has a valid checksum, otherwise it will boot the Recovery
BIOS image. The AMC Module also has a jumper (CN8) for forcing the BIOS into the
recovery mode (see Section 2.2.19).
Environment
Operating Non-operating
Temperature -5 ~ 55 °C (23 ~ 122 °F) -40 ~ 70 °C (-40 ~ 140 °F)
Humidity IEC60068-2-78 (95%RH @ 40 °C)
Vibration
(5 ~ 500Hz) IEC60068-2-6 (0.002 G2/Hz, 1 Grms)
Shock IEC60068-2-27 (10 G, 11 ms)
Altitude Sea level to 4,000 m
above sea level 10,000 above sea level
Regulatory Conformance UL94V0, FCC Class B, CE, RoHS & WEEE Ready
NEBS Level 3 Designed for GR-63-CORE and GR-1089-CORE
Compliance Standards PICMG AMC.0, AMC.1, AMC.2, AMC.3, IPMI v1.5,
HPM.1
Table 2.1: Advantech MIC-5602 Processor AMC Tech Data
Table 2.2: Intel Processor Selection for the MIC-5602
Model Core Speed FSB Speed L2 Cache TDP Package
Intel Core 2 Duo LV (L7400) 1.5 GHz 667 MHz 4 MB 17 W uFCBGA
Intel Core 2 Duo ULV (U7500) 1.06 GHz 533 MHz 2 MB 10 W uFCBGA

MIC-5602 User Manual 8
2.2.3 Chipset
Combining the memory and I/O controller functions into a single component, the
3100 chipset includes a four-channel Enhanced Direct Memory Access (EDMA) con-
troller, offering low-latency and high throughput data transfer capability with no CPU
intervention for higher overall system performance. It also integrates I/O controller
features such as Serial ATA, PCI, UART, and USB, saving board real-estate and
power by removing the need for a separate, legacy I/O bridge chip. For demanding I/
O and networking applications, the PCIe interfaces from the chipset provide through-
put speeds of up to 4 GB/s on the x8 interface, and up to 2 GB/s on the x4 interfaces.
Refer to the following figure for the chipsets I/O interfaces.
Figure 2.1 Intel 3100 Chipset
2.2.4 Memory
The Intel 3100 provides an integrated memory controller for direct connection to one
channel of DDR2-400 registered memory devices with ECC. The memory controller
is located behind the Bus 0 as Device 0, Function 0. The DRAM Controller Error
Reporting Registers are located in Function 1 of the Device 0. The Intel 3100 mem-
ory interface supports 512 Mbit, 1 Gbit and 2 Gbit memory technologies. However, as
product options, the MIC-5602 uses 9 pieces of either 1 Gbit (128 Mb x 8) or 2 Gbit
(256 Mb x 8) SDRAM.
2.2.5 Ethernet Controller
The MIC-5602 uses one Intel 82571EB LAN controller, connected to the 3100 chipset
through a PCIe x4 interface, to provide one GbE connection (PHY mode) accessible
on the AMC front panel via a RJ-45 port and two SerDes links routed to the AMC
common options region (port 0 and port 1). However, the PHY mode and the SerDes
link on port 1 can not be accessed simultaneously (mutually exclusive). They are
switchable through a BIOS setup item.