Allwin21 AccuThermo AW810M User manual

Allwin21 Corporation
AccuThermo® AW810M
Rapid Thermal Process System
Technical Manual
Allwin21 Corporation
220 Cochrane Circle, Morgan Hill CA 95037
www.allwin21.com

A9-0716-01 rev. C AccuThermo® AW810M Technical Manual
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ALLWIN21
ACCUTHERMO® AW810M
RAPID THERMAL PROCESS SYSTEM
TECHNICAL MANUAL
Allwin21 Corporation
220 Cochrane Circle
Morgan Hill, CA 95037

A9-0716-01 rev. C AccuThermo® AW810M Technical Manual
iii
Document #: A9-0716-01 Rev. C.1
Written by: Rick Forney
September, 2011
SERVICE INFORMATION
Customer technical support is available from Allwin21 Corporation to provide information not included
in this manual. The Customer Support Department is open Monday through Friday, 9:00 a.m. to 6:00
p.m., Pacific Time.
Field service support and parts are available from Allwin21 Corporation. The office is open Monday
through Friday, 9:00 a.m. to 6:00 p.m., Pacific Time.
Allwin21 Corporation
Customer Service
Phone: [phone]
Fax: [phone]
Email: [email protected]
Document Disclaimer
Swagelok is a trademark of Crawford Fitting Company.
VCR is a trademark of Cajon Company.
Pentium® is a registered trademark of the Intel Corporation.
AccuThermo® is a registered trademark of Allwin21 Corporation.
Allwin21 Corporation makes no representations or warranties with respect to this Manual, except as
outlined in the product warranty. Further, Allwin21 reserves the right to make changes in the
specifications of the product described within this Manual at any time without notice and without
obligation to Allwin21 Corporation.
Statement of Confidentiality
The information contained herein is confidential to and the property of Allwin21 Corporation. It may not
be reproduced nor disclosed in whole or in part by any method without the prior written permission of
Allwin21 Corporation. All software is copyrighted and the property of Allwin21 Corporation.
Copyright 2006 – 2011 by Allwin21 Corporation. All rights reserved.

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WARRANTY
Allwin21 Corporation warranty labor, if necessary, will be provided during normal business hours of 9:00
AM to 6:00 PM, Monday through Friday, except certain holidays.
To receive field service or parts replacement during a system warranty period, the customer shall
promptly provide to Allwin21 Corporation details of any product or component thought to be defective
and request a Return Material Authorization (RMA). Within fourteen (14) days after receipt of the RMA
number from Allwin21 Corporation, the customer shall return the defective product or component to
Allwin21 Corporation freight paid. As soon as is practicable after issue of the RMA, Allwin21
Corporation shall repair/replace and return any product/component found to be defective.
Repaired/replaced and returned products and components will be warranted as above for the duration of
the warranty period of the defective product, and shall be comprised of new or re-worked components.
Returned product not subject to warranty shall be disposed of at customer’s cost and subject to customer’s
instructions.
Items not covered under the warranty include, but are not limited to:
Quartzware
Consumable parts
O-rings and gaskets
Fuses
Thermocouples
Susceptor
Mass Flow Meter
Allwin21 Corporation products are normally intended to be used in a semiconductor processing
environment in accordance with the functional, environmental, and operational standards published by
Allwin21 Corporation or generally accepted in the industry. Allwin21 Corporation shall have no warranty
obligation with respect to any product which has been modified or altered, or with respect to data
contained in any product returned to Allwin21 Corporation by the customer without written approval.
Allwin21 Corporation liability to the customer or anyone claiming through or on behalf of the customer
with respect to any claim or loss arising out of the purchase and/or sale of any Allwin21 Corporation
product shall be limited to the original purchase price amount of the product. In no event shall Allwin21
Corporation be liable for consequential damages, losses, or reprocurement costs arising out of the
purchase and/or sale of any Allwin21 Corporation product, and an action to recover the purchase or to
compel such replacement or adjustment shall be customer's sole remedy under the Uniform Commercial
Code or otherwise.

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All claims must be reported to Allwin21 Corporation before the end of the warranty period. Allwin21
Corporation may not honor claims for repair or replacement if reported after the warranty has expired.
Allwin21 Corporation has no means of determining whether repair or replacement was covered by terms
of this warranty. All claims must be reported promptly. The burden of proof will be the responsibility of
the customer or its agent, and all associated costs will be borne by the same.
In order to honor a warranty for any Allwin21 system, the customer is required to perform the
recommended preventive maintenance (PM) on the system. Allwin21 Corporation will perform PM
training during system start-up. PM contracts are available from Allwin21 Corporation at an additional
charge.
Buyer will be granted a personal, non-transferable, non-exclusive perpetual license to use only the
number of copies of the software that are provided by the Seller and only on the equipment on which it
was originally installed, loaded, or mounted by the Seller. Without Seller's consent, Buyer may not copy
the software for any purpose. Buyer may not remove the software or attempt to execute the software on
any other equipment than the equipment on which the software was originally loaded, installed, or
mounted.
Buyer shall not, whether through the use of disassemblers or any other means, attempt to reverse
engineer, decompile, disassemble, or derive any source code from the software. Buyer shall not permit
any third party to do so. Buyer shall not cause the software to be destroyed, disabled, or modified in its
operation. Any attempt to do any of the things defined in this paragraph shall be a material breach of this
Agreement and shall immediately entitle Seller to exercise any remedy herein or available at law or in
equity.
THE FOREGOING IS THE SOLE WARRANTY OFFERED BY ALLWIN21 CORPORATION WITH
RESPECT TO ITS PRODUCTS AND COMPONENTS. ALLWIN21 CORPORATION MAKES NO
OTHER WARRANTY OF ANY KIND WHATSOEVER, EXPRESSED OR IMPLIED. ALL IMPLIED
WARRANTIES OF MERCHANTABILITY AND/OR FITNESS FOR A PARTICULAR PURPOSE
ARE HEREBY DISCLAIMED AND EXCLUDED BY ALLWIN21 CORPORATION.

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PREFACE
INTENDED AUDIENCE
This manual has been written for technicians and process development engineers working with the
AccuThermo® AW810M Rapid Thermal Processing (RTP) System. It provides an overview of the
system operation and maintenance procedures, as well as a troubleshooting guide. Please read this
manual carefully before operating the AccuThermo® RTP System.
DOCUMENT CONVENTIONS
FONT CONVENTIONS
The following font conventions are used in this manual.
Bold
Software screen selections are represented in bold type.
Italic
Screen names are shown in italic type.
First Letter Capitalized
Operating modes are shown in normal type with the first letter capitalized.
For example:
“Select Recipe from the Main Menu screen to enter the Recipe Programming mode.”

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TABLE OF CONTENTS
Service Information .............................................................................................. iii
Warranty.................................................................................................................iv
Preface.....................................................................................................................vi
Table of Contents................................................................................................. vii
List of Figures.......................................................................................................xiv
1.Introduction.....................................................................................................1
1.1System Description...............................................................................................................1
1.2Features ................................................................................................................................2
1.3System Process Specifications .............................................................................................4
2.Safety Precautions ..........................................................................................7
2.1Overview..............................................................................................................................7
2.2Notes, Cautions and Warnings.............................................................................................8
2.3Safety Features .....................................................................................................................9
2.4Utilities Inspection..............................................................................................................10
2.5System Operation ...............................................................................................................11
2.6Maintenance .......................................................................................................................11
2.7Gas Handling......................................................................................................................12
2.8Hazards...............................................................................................................................13
2.8.1Electrical Shock Hazards.....................................................................................13
2.8.2Process Gas Hazards............................................................................................13
2.8.3Process Byproduct Hazards .................................................................................14
2.8.4Oxygen Hazards...................................................................................................14
2.8.5Thermal Hazards..................................................................................................15
3.Installation.....................................................................................................17
3.1Purchaser’s Responsibility .................................................................................................17
3.2Allwin21 Service................................................................................................................17
3.2.1Field Service Installation .....................................................................................17
3.2.2Training................................................................................................................17
3.3Installation Process Overview............................................................................................18
3.3.1Installation Procedures.........................................................................................18
3.3.2Required Tools.....................................................................................................19
3.4Installation Site Requirements............................................................................................20
3.4.1Facility Preparation..............................................................................................20
3.4.2Space Requirements.............................................................................................20
3.4.3Utility Connections..............................................................................................21
3.4.4Adequate Cooling ................................................................................................22
3.4.5Proper Tubing Size ..............................................................................................23
3.4.6Air Conditioning..................................................................................................24

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3.4.7Electrical..............................................................................................................25
3.4.8Cooling Air..........................................................................................................31
3.4.9Chamber Cooling Water......................................................................................33
3.4.10Process Gas........................................................................................................37
3.4.11Process Exhaust .................................................................................................39
3.4.12Pneumatic Air ....................................................................................................40
3.4.13Cabinet Exhaust.................................................................................................41
3.4.14Pyrometer Cooling Water..................................................................................42
3.5Unpacking and Inspecting the System................................................................................45
3.5.1Uncrating .............................................................................................................45
3.5.2System Inspection................................................................................................46
3.5.3Unpacking............................................................................................................46
3.6Installing the Computer......................................................................................................47
3.6.1Overview of the Computer...................................................................................47
3.6.2Interconnection of the Computer Assembly ........................................................48
3.6.3Connecting Computer to AccuThermo® RTP System........................................49
3.7Installing the Quartz Wafer Tray........................................................................................50
3.8Utility Check List...............................................................................................................51
4.Power-Up & Power-Down ...........................................................................57
4.1Overview............................................................................................................................57
4.2Utilities Inspection..............................................................................................................58
4.3Front Control Panel ............................................................................................................60
4.4Full Power-Up and Testing ................................................................................................62
4.4.1Initial Power-Up ..................................................................................................62
4.4.2Gas Setup Procedure............................................................................................65
4.4.3Manual Mode Tests..............................................................................................66
4.5Daily Power-Up..................................................................................................................68
4.6System Operation ...............................................................................................................70
4.7Full Power-Down ...............................................................................................................71
4.8Daily Power-Down.............................................................................................................72
5.Basic Operation.............................................................................................75
5.1Overview............................................................................................................................75
5.2Menu Organization.............................................................................................................77
5.3Using the Menu Screens.....................................................................................................79
5.4Process for Production Screen............................................................................................82
5.5Process for Engineer Screen...............................................................................................84
5.6Start a Process ....................................................................................................................86
5.7Process Finished.................................................................................................................89
5.8Stop Process .......................................................................................................................89
5.9Review the Process Data....................................................................................................90
6.Advanced Operation.....................................................................................93
6.1Selecting a Recipe ..............................................................................................................93
6.2Create and Modify a Recipe...............................................................................................94
6.3Recipe Editor......................................................................................................................96
6.3.1Recipe Header......................................................................................................97
6.3.2Data Entry Area .................................................................................................100
6.3.3Keyboard Short-Cuts .........................................................................................103
6.3.4Recipe Header Screen........................................................................................104

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6.4Optimizing the Temperature Profile.................................................................................106
6.4.1Recipe Parameters..............................................................................................106
6.4.2Recipe Lamp Zone Control................................................................................111
6.4.3Temperature Profile Stages................................................................................113
6.4.4Temperature Profile Optimization.....................................................................115
6.4.5Temperature Curves...........................................................................................120
6.4.6Troubleshooting the Temperature Control.........................................................123
6.4.7Process Control Alarms .....................................................................................127
6.5Troubleshooting the Process Control ...............................................................................129
7.Administration............................................................................................131
7.1File Administration...........................................................................................................131
7.1.1File Extensions...................................................................................................131
7.1.2Suggested ID Names..........................................................................................132
7.2Software Setup .................................................................................................................133
7.2.1Maintenance Menu ............................................................................................133
7.2.2System Setup......................................................................................................134
7.2.3Gas Setup...........................................................................................................138
7.2.4Factory Setup.....................................................................................................140
7.2.5Control Board Selection.....................................................................................143
7.2.6GEM/SECS II Management ..............................................................................144
7.2.7Security..............................................................................................................146
8.Theory of Operation...................................................................................151
8.1Lamps...............................................................................................................................151
8.1.1Lamp Intensity...................................................................................................151
8.1.2Interlocks ...........................................................................................................154
8.2Adequate Tube Size..........................................................................................................156
8.2.1Tube is Too Small..............................................................................................156
8.2.2Tube is Too Long...............................................................................................156
8.3Cooling.............................................................................................................................157
8.3.1Chamber Cooling...............................................................................................157
8.3.2Quartz Isolation Tube Cooling...........................................................................157
8.3.3Wafer Cooling....................................................................................................158
8.3.4Rate of Cooling..................................................................................................158
8.3.5Cooling Control .................................................................................................159
8.4Thermocouple...................................................................................................................160
8.5Pyrometer .........................................................................................................................161
8.5.1Optical Pyrometry..............................................................................................161
8.5.2The Extended Range Pyrometer (ERP) .............................................................161
8.6Temperature......................................................................................................................165
8.6.1What is Temperature?........................................................................................165
8.6.2Measuring Temperature.....................................................................................166
8.6.3Uniformity .........................................................................................................167
8.7LED Temperature Display ...............................................................................................168
8.8Gas Handling Subsystem..................................................................................................169
8.9GaAs, InP and Other Compound Semiconductor Processes............................................171
8.9.1Introduction........................................................................................................171
8.9.2Problems ............................................................................................................171
8.9.3Using the AW Control Software........................................................................172
8.9.4Summary............................................................................................................173

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9.Maintenance & Diagnostics.......................................................................175
9.1Overview..........................................................................................................................175
9.2Preventative Maintenance (PM) Schedule .......................................................................177
9.2.1Daily Maintenance.............................................................................................177
9.2.2Weekly Maintenance .........................................................................................178
9.2.3Monthly Maintenance........................................................................................179
9.2.4Quarterly Maintenance.......................................................................................180
9.3Draining the Cooling Water .............................................................................................181
9.4Removing the Cabinet Cover ...........................................................................................182
9.5Quartzware (Tube and Tray)............................................................................................184
9.5.1Preventative Maintenance..................................................................................184
9.5.2Quartz Isolation Tube Removal and Installation ...............................................184
9.5.3Quartz Wafer Support Tray Removal and Installation ......................................193
9.5.4Quartz Wafer Support Tray Leveling ................................................................195
9.5.5Quartzware Cleaning .........................................................................................198
9.5.6Quartzware Storage............................................................................................201
9.6Susceptor..........................................................................................................................202
9.6.1Introduction........................................................................................................202
9.6.2Using the Susceptor ...........................................................................................203
9.6.3Care and Cleaning..............................................................................................205
9.7Calibration Menu..............................................................................................................206
9.8LED Display Calibration..................................................................................................208
9.9R40 Calibration ................................................................................................................210
9.10Thermocouple...................................................................................................................211
9.10.1Overview..........................................................................................................211
9.10.2Installing the Thermocouple............................................................................214
9.10.3Testing the Thermocouple ...............................................................................216
9.10.4Installing and Testing the TC Wafer................................................................216
9.10.5Thermocouple Calibration...............................................................................217
9.10.6Thermocouple Diagnostics ..............................................................................220
9.11Pyrometer .........................................................................................................................222
9.11.1Overview..........................................................................................................222
9.11.2Pyrometer Calibration......................................................................................223
9.11.3Pyrometer Diagnostics.....................................................................................240
9.11.4Checking the Pyrometer Calibration................................................................242
9.12Lamps...............................................................................................................................243
9.12.1Lamp Zone Control..........................................................................................243
9.12.2Lamp Diagnostics ............................................................................................247
9.12.3Verifying If the Lamps Are In Good Condition ..............................................249
9.12.4Identifying a Bad Lamp...................................................................................249
9.12.5Replacing a lamp .............................................................................................250
9.13Gas Control.......................................................................................................................251
9.13.1MFC Gas Flow Diagnostics.............................................................................251
9.13.2Gas Calibration ................................................................................................253
9.13.3Gas Leak Check Procedure..............................................................................255
9.14Chamber Calibration ........................................................................................................256
9.15Diagnostics & Testing......................................................................................................262
9.15.1Diagnostics Screen...........................................................................................263
9.15.2Manual Control Screen....................................................................................268
9.15.3Board Test Screen............................................................................................269

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10.Troubleshooting..........................................................................................271
10.1Overview..........................................................................................................................271
10.1.1Tips for troubleshooting...................................................................................272
Rules for Equipment Maintenance.................................................................................272
Experiences for Equipment Troubleshooting ................................................................272
10.1.2Testing Fuses ...................................................................................................274
10.1.3PCB Connectors...............................................................................................276
10.1.4LED’s on PCB.................................................................................................277
10.2Alarm Codes.....................................................................................................................279
10.3FAQ..................................................................................................................................290
10.4120 VAC Circuit ..............................................................................................................300
10.524 VAC Circuits...............................................................................................................301
10.6AC Phase Detection..........................................................................................................302
10.7Computer Problems..........................................................................................................303
10.7.1Computer Communication and Chamber Control Test Procedure..................303
10.7.2Computer will not Power Up...........................................................................303
10.7.3No Communication Between the RTP Unit and the Computer.......................303
10.8Contactor..........................................................................................................................304
10.9Contamination ..................................................................................................................305
10.10Cooling CDA (Nitrogen)..................................................................................................306
10.11Cooling Water ..................................................................................................................307
10.11.1Cooling Water Flow Troubleshooting...........................................................308
10.11.2There is No Water Flow.................................................................................309
10.11.3Software Indicates No Water Flow................................................................310
10.11.4Water Flow Rate is Too Low.........................................................................310
10.11.5Water Differential Pressure is Too Great.......................................................311
10.11.6Water Temperature is Too Hot......................................................................311
10.11.7Water Temperature is Too Cold ....................................................................311
10.12DC Power Supply.............................................................................................................312
10.13Fan & Solenoids...............................................................................................................313
10.14Gas Control.......................................................................................................................314
10.14.1Gas Did Not Shut Off After Process Ended...................................................314
10.14.2Gas Flow Rate and Pressure Decreases .........................................................314
10.14.3Gas Feedback Does Not Match Gas Setpoint................................................314
10.14.4Gas Leak Check Failure.................................................................................314
10.15Intensity............................................................................................................................316
10.15.1Intensity varies and spikes greatly when starting a RAMP............................316
10.15.2Intensity went up, but temperature went down..............................................316
10.16Lamp Problems.................................................................................................................317
10.16.1Lamps Do Not Go On....................................................................................317
10.16.2Lamp Contactor .............................................................................................318
10.16.3Lamp Control Interlocks Check.....................................................................320
10.16.4Lamps Flicker. ...............................................................................................321
10.16.5Lamps Go On and Off....................................................................................321
10.16.6Lamps Go On when the Lamp Power Switch is Turned On..........................322
10.16.7Intensity is Higher than Normal.....................................................................323
10.17LED Display.....................................................................................................................324
10.17.1LED Display goes “Crazy”............................................................................324
10.17.2Temperature on the LED Display and Computer Monitor Differ..................324
10.18Main Circuit Breaker Trips ..............................................................................................325

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10.19Main Power ......................................................................................................................326
10.20Overheat ...........................................................................................................................327
10.21Process..............................................................................................................................329
10.21.1Process Results Indicate Different Temperature, Thermocouple ..................330
10.21.2Process Results Indicate Different Temperature, Pyrometer.........................330
10.21.3Process Temperature is Different than before to get same result...................330
10.22Pyrometer Chiller .............................................................................................................331
10.22.1Chiller Will Not Start.....................................................................................331
10.22.2Loss of Cooling Capacity...............................................................................331
10.22.3No External Circulation.................................................................................331
10.23Quartz Isolation Tube Broke............................................................................................332
10.24Samples Slide Off Base Wafer.........................................................................................333
10.25Temperature......................................................................................................................334
10.25.1Temperature Is Not Responding Correctly....................................................334
10.25.2Temperature Reading is Too Low or Jittery..................................................337
10.26Thermocouple...................................................................................................................338
10.26.1Thermocouple (TC) Keeps Breaking.............................................................338
10.27Uniformity........................................................................................................................339
10.27.1Definition.......................................................................................................339
10.27.2Problem..........................................................................................................339
10.27.3Causes............................................................................................................339
10.28Wafer Cooling..................................................................................................................341
10.29Water................................................................................................................................342
10.30“No AW-RTP-900-008 card or card connection not good!”............................................342
11.Schematics ...................................................................................................345
12.Parts Guide..................................................................................................363
12.1Overview..........................................................................................................................363
12.2Outer Panels .....................................................................................................................364
12.3Chassis – Front View........................................................................................................365
12.4Chassis – Rear View.........................................................................................................366
12.5Chassis – Left View..........................................................................................................368
12.6Chassis – Back Wall.........................................................................................................370
12.7Chamber – Assembly .......................................................................................................372
12.8Quartzware .......................................................................................................................377
12.9Thermocouples.................................................................................................................377
12.10Susceptors.........................................................................................................................377
12.11Chamber – Rear View......................................................................................................378
12.12Chamber – Triac Plate (3-Phase)......................................................................................380
12.13Gas Module ......................................................................................................................382
12.14Chiller Assembly..............................................................................................................384
12.15Computer..........................................................................................................................385
12.16Misc..................................................................................................................................385
12.17Spare Parts Kit, Level 1....................................................................................................386
12.18Spare Parts Kit, Level 2....................................................................................................387
12.19Spare Parts Kit, Level 3....................................................................................................388
Appendix..............................................................................................................391
A:DOS Commands at a Glance............................................................................................391
B:Determining the Proper USB Drive Letter.......................................................................395

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C:Copying Process Data.......................................................................................................396
D:Keyboard Shortcuts..........................................................................................................398
E:Updating the Control Software.........................................................................................399
F:Backing Up and Restoring the Software ..........................................................................401
G:Software Startup...............................................................................................................406
H:Selection of the Purity of Gases .......................................................................................407
I:How to Order / Return Equipment ...................................................................................408
J:Maintenance Plans............................................................................................................413
K:Problem Reporting............................................................................................................414
L:Software Critique .............................................................................................................416
M:Manual Revision History..................................................................................................418
Index.....................................................................................................................420

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LIST OF FIGURES
Figure 1-1:AccuThermo AW810M system................................................................................1
Figure 3-1:AW810 Footprint and Elevation.............................................................................20
Figure 3-2:AccuThermo AW810M System Rear Utility Panel Connections..........................21
Figure 3-3:Gas Pressure and Flow Rate Relationship for Different Tube Diameters...............23
Figure 3-1:Recommended AccuThermo® RTP system power Distribution Diagram.............26
Figure 3-2:3-Phase AC Power Connections with Circuit Breaker ...........................................28
Figure 3-4:Japanese (200 VAC) Electrical Connections..........................................................30
Figure 3-5:Recommended Non-Process Nitrogen Supply/CDA Configuration.......................32
Figure 3-6:Optimal Cooling Water Supply Configuration.......................................................35
Figure 3-7:Optimal Process Gas Supply Configuration ...........................................................38
Figure 3-8:Recommended Process Exhaust Configuration......................................................39
Figure 3-9:Recommended Pneumatic Configuration ...............................................................40
Figure 3-10:Recommended Cabinet Exhaust Configuration....................................................41
Figure 3-11:Computer to AccuThermo® RTP System Interconnect Diagram.........................49
Figure 4-1:Rear Utility Panel Connections...............................................................................58
Figure 4-2:Front Control Panel.................................................................................................60
Figure 5-1:Menu Organizational Map......................................................................................77
Figure 5-2:Main Menu..............................................................................................................79
Figure 5-3:Process for Production screen.................................................................................82
Figure 5-4:Process for Engineer screen....................................................................................84
Figure 6-1:Recipe Edit Selection screen...................................................................................93
Figure 6-2:Recipe Editor ..........................................................................................................96
Figure 6-3:Recipe Header screen............................................................................................104
Figure 6-4:Recipe Zone Control screen..................................................................................111
Figure 6-5:Lamp Zone Factors in the Recipe Header screen..................................................111
Figure 6-6:Temperature and Time Profile in a Recipe Cycle.................................................113
Figure 6-7:Temperature Curves..............................................................................................120
Figure 6-8:Oscillations ...........................................................................................................124
Figure 6-9:Overshoot..............................................................................................................125
Figure 6-10:Undershoot..........................................................................................................126
Figure 7-1:Maintenance Menu................................................................................................133
Figure 7-2:System Setup screen .............................................................................................134
Figure 7-3:Gas Setup..............................................................................................................138
Figure 7-4:Factory Setup screen.............................................................................................140
Figure 7-5:Board Configure screen ........................................................................................143
Figure 7-6:GEM/SECS II Management Menu.......................................................................144
Figure 7-7:GEM/SECS II Manager screen.............................................................................145
Figure 7-8:GEM/SECS II Gemstone Setup screen.................................................................145
Figure 7-9:Password Setup.....................................................................................................146
Figure 7-10:Level Setup .........................................................................................................147
Figure 8-1:Sinusoidal Wave ...................................................................................................152
Figure 8-2:Temperature Control Interconnect........................................................................153
Figure 8-3:Gas Pressure and Flow Rate Relationship for Different Tube Diameters.............156
Figure 8-4:ERP Dual Pyrometers Radiation Wavelengths.....................................................162

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Figure 8-5:Extended Range Pyrometer...................................................................................163
Figure 8-6:ERP and Thermocouple Temperature Measurements...........................................164
Figure 8-7:Recipe with preheat step.......................................................................................172
Figure 8-8:Multi-step recipe to check stability.......................................................................173
Figure 9-1:Chamber Unit Cabinet Screw Locations...............................................................182
Figure 9-2:Gas Inlet Fitting Location (Rear of Chamber)......................................................186
Figure 9-3:Front Flange Screw Locations ..............................................................................187
Figure 9-4:Removing the Isolation Tube................................................................................188
Figure 9-5:Flange O-rings ......................................................................................................189
Figure 9-6:Isolation Tube for Extended Range Pyrometer (ERP)..........................................190
Figure 9-7:Wafer Support Tray Removal and Installation .....................................................193
Figure 9-8:Leveling the Wafer Tray.......................................................................................195
Figure 9-9:Leveling Screw Locations (Top View).................................................................196
Figure 9-10:Susceptor Cover and Base...................................................................................202
Figure 9-11:Calibration Menu................................................................................................207
Figure 9-12:LED Display Calibration ....................................................................................208
Figure 9-13:AW-900-058 Main Control Board......................................................................210
Figure 9-14:Cantilever Thermocouple Assembly...................................................................212
Figure 9-15:Thermocouple Wafer Assembly .........................................................................213
Figure 9-16:Thermocouple Placement (showing Cantilever thermocouple)..........................214
Figure 9-17:Thermocouple Calibration screen.......................................................................218
Figure 9-18:Pyrometer Calibration List..................................................................................225
Figure 9-19:Pyrometer Calibration Setup...............................................................................226
Figure 9-20:Pyrometer Calibration Graph..............................................................................230
Figure 9-21:Manual Control screen........................................................................................231
Figure 9-22:900TC.RCP.........................................................................................................233
Figure 9-23:Run of 900TC.RCP.............................................................................................234
Figure 9-24:7911TC.RCP.......................................................................................................234
Figure 9-25:Run of 7911TC.RCP...........................................................................................235
Figure 9-26:7911PY.RCP.......................................................................................................236
Figure 9-27:Run of 7911PY.RCP...........................................................................................237
Figure 9-28:Tube Pyrometer (white line) is bad.....................................................................239
Figure 9-29:Lamp Zone Control screen..................................................................................244
Figure 9-30:Gas Calibration screen........................................................................................253
Figure 9-31:Recipe for Gas Leak Check ................................................................................255
Figure 9-32:Chamber Calibration Menu.................................................................................257
Figure 9-33:Chamber Calibration Setup.................................................................................258
Figure 9-34:Chamber Calibration Curve Graph.....................................................................260
Figure 9-35:Chamber Calibration Curve Graph 2..................................................................261
Figure 9-36:System Diagnostics Screen.................................................................................264
Figure 9-37:Manual Control screen........................................................................................268
Figure 9-38:Board Test screen................................................................................................269
Figure 10-1:Location of Fuses................................................................................................274
Figure 10-2:2100-900-058 Main Control board.....................................................................276
Figure 10-3:2100-900-038 Chamber Control board...............................................................276
Figure 10-4:AW-900-058 LED Indicators..............................................................................277
Figure 10-5:AW-900-038 LED Indicators..............................................................................278
Figure 10-6:Bottom View of Process Chamber......................................................................328

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1. INTRODUCTION
Chapter 1: Chapter 1
Table 1: a
1.1 SYSTEM DESCRIPTION
The AccuThermo AW810M is a rapid thermal processing (RTP) system, which uses high
intensity visible radiation to heat single wafers for short process periods of time at precisely
controlled temperatures. The process periods are typically 1-600 seconds in duration, although
periods of up to 9999 seconds can be selected.
NOTE
Process periods longer than 600 seconds in duration are
normally used only for maintenance testing purposes at low
lamp intensity settings.
These capabilities, combined with the heating chamber's cold-wall design and superior heating
uniformity, provide significant advantages over conventional furnace processing.
Figure 1-1: AccuThermo AW810M system
The AccuThermo® RTP system, figure 1-1, consists of a chamber unit and a computer running
the Allwin21 control software. The wafer to be processed is placed on a quartz tray that slides
into a quartz isolation tube in the chamber. Two banks of lamps, one above the quartz tube and

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one below it, provide the source of energy for heating the wafer. The lamps can be controlled
manually and automatically from the computer.
The control software allows full control and diagnostics of the AccuThermo® RTP system. In
addition, it allows the creation of recipes for automated control of the temperature and,
optionally, process gas flow.
The control software uses a set of operating instructions known as recipes to automatically
control the AccuThermo® RTP system. These recipes are created by the Process Engineer to
monitor and control the parameters of the processing cycle. The Operator then uses the software
to select and run the process parameters (steady state temperature, process time, ramp rates, etc.).
The control software is also used to create, delete, copy, modify and store the recipes and to
execute system diagnostics.
1.2 FEATURES
KEY FEATURES
Closed-loop temperature control with pyrometer or thermocouple temperature sensing.
Precise time-temperature profiles tailored to suit specific process requirements.
Fast heating and cooling rates unobtainable in conventional technologies.
Consistent wafer-to-wafer process cycle repeatability.
Elimination of external contamination.
Energy efficiency.
The watchdog timer shuts down the lamps to prevent run-away heating of the wafer.

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APPLICATIONS
The AccuThermo® RTP system is a versatile tool that is useful for many applications:
Ion Implant Activation
Polysilicon Annealing
Oxide Reflow
Silicide Formation
Contact Alloying
Oxidation and Nitridation
GaAs Processing
HEATING, COOLING, AND TEMPERATURE MEASUREMENT
The following list contains the key features of the AccuThermo® RTP system heating, cooling
and temperature measurement systems:
High-intensity visible radiation heats wafers for short periods of 1 to 9999 seconds at
precisely controlled temperatures in the 400°C to 1200°C range. (1 to 600 second heating
periods are used typically.) The maximum time period depends on the process temperature.
Tungsten halogen lamps and cold heating chamber walls respectively allow fast wafer
heating and cooling rates.
The system delivers time and temperature profiles tailored to suit specific process
requirements.
Pyrometer or thermocouple sensing offers precise closed-loop temperature control.
Cooling N2 flows around the lamps and quartz isolation tube
MFC controlled gases (up to four) flow through the heating chamber for purge and/or process
purposes.

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1.3 SYSTEM PROCESS SPECIFICATIONS
Following are the specifications for the AccuThermo Rapid Thermal Processor (RTP) system.
Wafer handling: Manual loading of wafer into the chamber, single wafer processing.
Wafer sizes: 4", 5", 6" and 8” wafers.
Ramp up rate: Programmable, 10°C to 200°C per second.
Recommended steady state duration: 0-300 seconds per step.
Ramp down rate: Programmable, 10°C to 250°C per second. Ramp down rate is
temperature-and-radiation-dependent and the maximum is 125°C per second.
Recommended steady state temperature range: 150°C - 1150°C
ERP temperature accuracy: ±1°C, when calibrated against an instrumented thermocouple
wafer (ITC).
Thermocouple temperature accuracy: ±0.5°C
Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer. (Repetition
specifications are based on a 100-wafer set.)
Temperature uniformity: ±5°C across a 6" (150 mm) wafer at 1150°C. (This is a one
sigma deviation 100 angstrom oxide.) For a titanium silicide process, no more than 4%
increase in non-uniformity during the first anneal at 650°C to 700°C.
Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30 PSIG and pre-
filtered to 1 micron. Typically, Nitrogen (N2), oxygen (O2), argon (Ar), and/or helium (He)
are used.