AMD Hudson D1 User manual

TECHNICAL M A NUAL
Of
AMD Hudson D1 Chipset
Based
for AMD Brazos APU Mini-ITX M/B
NO. G03-NL240ITX-F
Revision: 1.0
Release date: 2015-05-11
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION .......................................................................................iv
ITEM CHECKLIST .....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION .........................................................................................................2
1-3 LAYOUT DIAGRAM ....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING .....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................11
2-2-1 CONNECTORS .............................................................................................11
2-2-2 HEADERS .....................................................................................................15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP .....................................................................................................21
3-2 BIOS MENU SCREEN ................................................................................................22
3-3 FUNCTION KEYS .......................................................................................................22
3-4 GETTING HELP ..........................................................................................................23
3-5 MEMU BARS...............................................................................................................23
3-6 MAIN MENU ................................................................................................................24
3-7 ADVANCED MENU.....................................................................................................25
3-8 CHIPSET MENU..........................................................................................................30
3-9 BOOT MENU...............................................................................................................33
3-10 SECURITY MENU .......................................................................................................35
3-11 SAVE & EXIT MENU...................................................................................................36
TABLE OF CONTENT

iii
Environmental Safety Instruction
 Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
 0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
 Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
 The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
 Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition May 11th, 2015
Item Checklist
 Motherboard
 DVD for motherboard utilities
 User’s Manual
 Cable(s)
 I/O Back panel shield

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
 AMD Hudson D1 Chipset and AMD E240 1.5GHz APU, low power consumption
but high performance
 Support DirectX 11 3D Graphics Acceleration
 Support 1 * 1066MHz DDRIII SO-DIMM, max up to 4GB
 Onboard 1* full-size Mini-SATA connector
 Onboard 1* half-size Mini-PCIE connector
 Support CPU Smart FAN
 Support Watchdog Timer Technology
 Support 1 * SIM card socket for 3G/LTE communication module expansion
 Support Windows8 OS

2
1-2 Specification
Spec Description
Design  Mini-ITX form factor ;
 PCB size: 17.0 x 17.0 cm
Embedded CPU
 AMD Brazos E-240 1.5GHz APU
Chipset  Hudson D1 Chipset
Memory Slot  1* DDRIII SO-DIMM slot
 Support DDRIII 1066MHz DDRIII SO-DIMM; Max up to 4GB
Expansion Slot
 1 * full-size Mini-SATAII slot
 1 * halt-size Mini-PCIE slot
 1* SIM card slot
LAN Chip
 Integrated with Realtek RTL8111G PCI-E Gigabit LAN
chip
 Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Audio Chip  Realtek ALC887 HD Audio Codec integrated
 Audio driver and utility included
BIOS  16M Flash ROM
Multi I/O
Rear Panel I/O:
 2* 12V DC power out jack
 1* PS/2 keyboard & mouse Combo port
 4* USB 2.0/1.1 port
 1 * Parallel port
 1* Mini-DIN UART-TX port
 1* RJ-11 port
 1 * COM1 serial port
 1 * VGA port
 1* RJ-45 port
 1* Line-in connector
 1* Line-out connector
 1* MIC connector

3
Internal I/O Connectors& Headers:
 1 *24-pin main power connector
 1 *4-pin ATX12V internal power connector
 1 *4-pin SATA power-out connector
 2* SATA II 3G/s Connector
 1 * Front panel audio header
 2 * 9-Pin USB 2.0/1.1 header for 4* USB 2.0/1.1 ports
 1 * COM2 serial port header
 1 * Front panel header
 1 * Power LED header & 1* Speaker header
 1* GPIO header
 1 *12-pin VGA header
 1 * LVDS header
 1* LVDS inverter header
 1*CPU fan header & 1*System fan header
1-3 Layout Diagram
Rear IO Diagram
Parallel
Port
Line-in Port
Line-out Port
MIC Port
RJ-45 LAN Port
USB 2.0 Ports
VGA Port
COM1 Port
RJ-
11 Port
Mini-DIN UART-TX
Port
PS/2 KB & MS Port
USB 2.0
Ports
DC 12V Power-out Jack
(DC_JACK2) DC 12V Power-out Jack
(DC_JACK1)

4
Motherboard Internal Diagram—Front Side
ATX12V
Power connector
DDRIII SODIMM Slot
AMD CPU
AMD Hudson D1 Chipset
SYSFAN1 Header
Front Panel
Audio Header
Front Panel Header
Full-size
Mini-SATA Slot
COM2
Serial Port Header
SATAII Port
(SATA1/2)
SATA Hard Disk
Power-Out Connector
USB 2.0 Headers
Half-size
Mini-PCIE Slot
VGA Port Header
LVDS Header
GPIO
Header
ATX Power
Connector
LVDS Inverter
Power LED Header
Speaker Header
Rear I/O
(Refer to
Page-3)
CPUFAN1 Header

5
Motherboard Internal Diagram—Back Side
SIM Card Slot