Amtech TEMPRESS User manual

Process Manual
Tempress®Systems, Inc.
Process manual
M220.383.02 January 2004

TABLE OF CONTENTS
PROCESS MANUAL I
Preface ..................................................................................... V
Tempress documentation set.................................................................V
User Definition ......................................................................................VI
Notes, Cautions and Warnings ............................................................VII
Contents description ...........................................................................VIII
Revision History..................................................................................VIII
1. Introduction .......................................................................1-1
1.1 General..................................................................................... 1-1
1.2 Process engineer area description............................................ 1-2
2. Safety .................................................................................2-2
2.1 Emergency Off (EMO) .............................................................. 2-2
2.2 Alarm Signals............................................................................ 2-2
2.2.1 Buzzer / LED ............................................................. 2-2
2.2.2 Touchscreen.............................................................. 2-2
2.2.3 Light tower................................................................. 2-3
2.2.4 TSC Alarm menu....................................................... 2-3
2.3 Light tower signal description.................................................... 2-3
2.4 Toxic Material ........................................................................... 2-5
2.5 Safety measures....................................................................... 2-5
3. Process setup and acceptance.....................................2.5-1
3.1 Process recipe setup procedure ............................................ 3.1-1
3.1.1 Introduction............................................................. 3.1-1
3.1.2 6 steps to a process recipe..................................... 3.1-1
3.1.3 Recommended command sequence...................... 3.1-2
3.1.4 Modifying the default Tempress recipe................... 3.1-3
3.2 Process recipe startup and fine-tuning................................... 3.2-1
3.2.1 Introduction............................................................. 3.2-1
3.2.2 Prerequisites........................................................... 3.2-1
3.2.3 Initial settings.......................................................... 3.2-1

TABLE OF CONTENTS
PROCESS MANUAL II
3.2.4 Further fine-tuning .................................................. 3.2-2
3.3 Alarm handling with Branch and Abort commands ................ 3.3-1
3.3.1 Introduction............................................................. 3.3-1
3.3.2 Do nothing with an alarms...................................... 3.3-1
3.3.3 Handling alarms with the Branch command ........... 3.3-1
3.3.4 Handling alarms with the Abort command.............. 3.3-2
3.3.5 Recipe example: LPCVD Nitride abort recipe......... 3.3-3
3.4 Process acceptance conditions ............................................. 3.4-1
3.4.1 Introduction............................................................. 3.4-1
3.4.2 Default process test conditions............................... 3.4-4
4. Process description..........................................................4-1
4.1 Nitride from NH3and SiH2Cl2................................................. 4.1-1
4.1.1 Basic configuration ................................................. 4.1-1
4.1.2 Description.............................................................. 4.1-1
4.1.3 Process result indication......................................... 4.1-2
4.1.4 Startup parameters for processing.......................... 4.1-2
4.1.5 Recommended cleaning interval ............................ 4.1-3
4.1.6 Gas schematic example: LPCVD siliconnitride....... 4.1-4
4.1.7 Recipe example: LPCVD siliconnitride from SiH2Cl2and
NH34.1-5
4.1.8 Troubleshooting a standard-nitride process............ 4.1-8
4.1.9 NH4Cl vapor pressure curve................................... 4.1-9
4.2 Flat Polycrystalline Si from SiH4............................................. 4.2-1
4.2.1 Basic configuration ................................................. 4.2-1
4.2.2 Description.............................................................. 4.2-1
4.2.3 Process result indication......................................... 4.2-2
4.2.4 Startup parameters for processing.......................... 4.2-2
4.2.5 Recommended cleaning interval ............................ 4.2-2
4.2.6 Gas schematic example: LPCVD Flat poly............. 4.2-4
4.2.7 Recipe example: LPCVD Flat poly-silicon from SiH44.2-
5
4.2.8 Troubleshooting a flat poly process........................ 4.2-8

TABLE OF CONTENTS
PROCESS MANUAL III
4.3 Silicondioxide (LTO SiO2) from SiH4and O2.......................... 4.3-1
4.3.1 Basic configuration ................................................. 4.3-1
4.3.2 Description.............................................................. 4.3-1
4.3.3 Startup parameters for processing.......................... 4.3-2
4.3.4 Recommended cleaning interval ............................ 4.3-2
4.3.5 Process result indication......................................... 4.3-3
4.3.6 Gas schematic example: LPCVD LTO.................... 4.3-4
4.3.7 Recipe example: LPCVD silicondioxide from LTO SiH4
and O24.3-5
4.3.8 Troubleshooting an LTO process ........................... 4.3-8
5. Operation Instructions...................................................4.3-1
5.1 Load or Unload process wafers............................................. 5.1-1
5.1.1 Load process wafers............................................... 5.1-1
5.1.2 Unload wafers......................................................... 5.1-1
5.2 Login TSC-2........................................................................... 5.2-1
5.2.1 TSC-2..................................................................... 5.2-1
5.3 Selecting a new process recipe ............................................. 5.3-1
5.3.1 Touchscreen........................................................... 5.3-1
5.3.2 TSC-2..................................................................... 5.3-3
5.4 Start/Continue a new process recipe..................................... 5.4-1
5.4.1 Touchscreen........................................................... 5.4-1
5.4.2 TSC-2..................................................................... 5.4-2
5.5 Stop a running process recipe ............................................... 5.5-1
5.5.1 Touchscreen........................................................... 5.5-1
5.5.2 TSC-2..................................................................... 5.5-2
5.6 Abort a running process recipe.............................................. 5.6-1
5.6.1 Touchscreen........................................................... 5.6-1
5.6.2 TSC-2..................................................................... 5.6-2
5.7 Edit ‘Variable Process Command’.......................................... 5.7-1
5.7.1 Touchscreen........................................................... 5.7-1
5.7.2 TSC-2..................................................................... 5.7-3

TABLE OF CONTENTS
PROCESS MANUAL I
V
5.8 Clear Alarms.......................................................................... 5.8-2
5.8.1 Required action....................................................... 5.8-2
5.8.2 Touchscreen........................................................... 5.8-2
5.8.3 TSC-2..................................................................... 5.8-3
5.9 Write/Edit process recipe....................................................... 5.9-2
5.9.1 Touchscreen........................................................... 5.9-2
5.9.2 TSC-2..................................................................... 5.9-3
5.10 Edit graphical image............................................. 5.10-2
5.10.1 Touchscreen......................................................... 5.10-2
5.10.2 TSC-2................................................................... 5.10-2
5.11 Logging process data ........................................... 5.11-2
5.11.1 TSC-2 (only) ......................................................... 5.11-2

PREFACE
PROCESS MANUAL
V
Preface
This set of manuals explains how to operate and maintain a Horizontal Diffusion/LPCVD
furnace.
Refer to the Touchscreen reference manual (M440.00) or the TSC-2 reference manual
(M450.00) for a full description of all operating screens.
For information about maintenance, refer to the maintenance manual (M230.00).
The Tempress Horizontal Diffusion Furnaces are fully described in the reference manuals
(M300.00).
Tempress documentation set
The complete Tempress documentation set includes:
• Safety manual
• Operator manual
• Reference manuals
1. Loadstation
2. Furnace
3. Gas cabinet
4. Main Power cabinet
5. DPC (Digital Process Controller)
6. DTC (Digital Temperature Controller)
7. ETC (Excess Temperature Controller)
8. Touchscreen
9. TSC-2 (+ SECS/GEM)
• Vendor documentation
1. Digital pressure switch
2. Mass Flow Controllers
3. External torch controller (if used)

PREFACE
PROCESS MANUAL
V
I
User Definition
It is strongly recommended that all users first read this manual before starting any procedure.
To produce an accessible manual suiting on various responsibilities, Tempress defines the
following users:
Operator
The operator is handling the process from loading until unloading of the wafers. Therefore
the operator needs to select a recipe, put the wafers on the boat, fill in Lot ID, Start the
process and monitor the progress using the Touchscreen and/or TSC-II.
Process engineer
The process engineer is a qualified chemical engineer, who is responsible for the process
recipes and their results. The process engineer writes, tests and releases new process recipes.
Service or Maintenance engineer
The maintenance engineer is a qualified electrician or mechanic, who is responsible for a
proper functioning system in accordance to its designated purpose. A Tempress qualified
service engineer will perform the first installation.

PREFACE
PROCESS MANUAL
Notes, Cautions and Warnings
Notes, Cautions and Warnings appear throughout this manual, where extra attention is
required to a particular (safety) item. Three levels can be distinguished:
)
NOTE
Notes alert to pay attention to items or procedures of special importance.
CAUTION
Cautions alert for a potentially hazardous situation that may result in minor
or moderate injuries.
Cautions can also alert for potential equipment and/or product damage.
WARNING
Warnings alert for conditions that may result in permanent and/or lethal
injuries.
V
II

PREFACE
PROCESS MANUAL
V
III
Contents description
This manual is divided into the following sections and appendices:
Section 1 Introduction
Provides an overview of the Tempress Systems Inc.
Horizontal furnace, what it is and what it can do.
Section 2 Safety
Describes the safety components and functions. It describes all measures
that are required to provide a safe way of working.
Section 3 Process setup and acceptance
Describes the basis of how to setup a process recipe and how to handle
alarms that are generated during the process. Finally all minimal process
requirements for acceptable process results are defined in process
acceptance.
Section 4 Process description
Contains specific process information including chemicals used, start-up
parameters and a basic recipe layout.
Section 5 Operation Instruction
Describes all procedures that are required for the process engineer.
Revision History
This manual is revision 0 of the Process Manual and is intended to explain the required
procedures. The function and screens it describes are based on the following software
releases:
• TSC 2 version 6.0 (17-02-2003)
• DPC 2.I.03 (17-02-2003)
• DTC 2.F.02 (17-02-2003)
• Touchscreen 2.I.05 (17-02-2003)
For minor software and hardware changes, addendum to this manual will be available. For
major changes, a new revision will be available. For price information or other questions
please contact Tempress Systems Inc.