Asus AAEON UP Xtreme i12 Edge User manual

Last Updated: February 7, 2023
UP Xtreme i12 Edge
Maker Board System
UPX-EDGE-ADLP
User’s Manual 1st Ed

Preface II
Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
Copyright Notice
This document is copyrighted, 2023. All rights are reserved. The original manufacturer
reserves the right to make improvements to the products described in this manual at
any time without notice.
No part of this manual may be reproduced, copied, translated, or transmitted in any
form or by any means without the prior written permission of the original
manufacturer. Information provided in this manual is intended to be accurate and
reliable. However, the original manufacturer assumes no responsibility for its use, or for
any infringements upon the rights of third parties that may result from its use.
The material in this document is for product information only and is subject to change
without notice. While reasonable efforts have been made in the preparation of this
document to assure its accuracy, AAEON assumes no liabilities resulting from errors or
omissions in this document, or from the use of the information contained herein.
AAEON reserves the right to make changes in the product design without notice to its
users.

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Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
Acknowledgement
All other products’ name or trademarks are properties of their respective owners.
⚫Microsoft® and Windows® are registered trademarks of Microsoft Corp.
⚫Intel®, Pentium®, Iris® and Celeron® are registered trademarks of Intel
Corporation
⚫Intel® Core™ is a trademark of Intel Corporation
⚫Yocto Project® is a trademark of The Linux Foundation.
⚫Linux® is a registered trademark of Linus Torvalds in the U.S. and other
countries.
⚫Ubuntu and Canonical are registered trademarks of Canonical Ltd.
All other product names or trademarks are properties of their respective owners.

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Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
Packing List
Before setting up your product, please make sure the following items have been
shipped:
Item
Quantity
⚫UPX-EDGE-ADLP (UP Xtreme i12 Edge)
1
⚫SATA Cable
1
⚫SATA Power Cable
1
If any of these items are missing or damaged, please contact your distributor or sales
representative immediately.

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Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
About this Document
This User’s Manual contains all the essential information, such as detailed descriptions
and explanations on the product’s hardware and software features (if any), its
specifications, dimensions, jumper/connector settings/definitions, and driver installation
instructions (if any), to facilitate users in setting up their product.
Users may refer to the product page at AAEON.com for the latest version of this
document.

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Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
Safety Precautions
Please read the following safety instructions carefully. It is advised that you keep this
manual for future references
1. All cautions and warnings on the device should be noted.
2. Make sure the power source matches the power rating of the device.
3. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
4. Always completely disconnect the power before working on the system’s
hardware.
5. No connections should be made when the system is powered as a sudden rush
of power may damage sensitive electronic components.
6. If the device is not to be used for a long time, disconnect it from the power
supply to avoid damage by transient over-voltage.
7. Always disconnect this device from any AC supply before cleaning.
8. While cleaning, use a damp cloth instead of liquid or spray detergents.
9. Make sure the device is installed near a power outlet and is easily accessible.
10. Keep this device away from humidity.
11. Place the device on a solid surface during installation to prevent falls
12. Do not cover the openings on the device to ensure optimal heat dissipation.
13. Watch out for high temperatures when the system is running.
14. Do not touch the heat sink or heat spreader when the system is running
15. Never pour any liquid into the openings. This could cause fire or electric shock.
16. As most electronic components are sensitive to static electrical charge, be sure to
ground yourself to prevent static charge when installing the internal components.
Use a grounding wrist strap and contain all electronic components in any
static-shielded containers.

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Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
17. If any of the following situations arises, please the contact our service personnel:
i. Damaged power cord or plug
ii. Liquid intrusion to the device
iii. Exposure to moisture
iv. Device is not working as expected or in a manner as described in
this manual
v. The device is dropped or damaged
vi. Any obvious signs of damage displayed on the device
18. DO NOT LEAVE THIS DEVICE IN AN UNCONTROLLED ENVIRONMENT WITH
TEMPERATURES BEYOND THE DEVICE’S PERMITTED STORAGE TEMPERATURES
(SEE CHAPTER 1) TO PREVENT DAMAGE.

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Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
FCC Statement
This device complies with Part 15 FCC Rules. Operation is
subject to the following two conditions: (1) this device may not
cause harmful interference, and (2) this device must accept any
interference received including interference that may cause
undesired operation.
Caution:
There is a danger of explosion if the battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer. Dispose of used batteries
according to the manufacturer’s instructions and your local government’s recycling or
disposal directives.
Attention:
Il y a un risque d’explosion si la batterie est remplacée de façon incorrecte.
Ne la remplacer qu’avec le même modèle ou équivalent recommandé par le constructeur.
Recycler les batteries usées en accord avec les instructions du fabricant et les directives
gouvernementales de recyclage.

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Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
China RoHS Requirements (CN)
产品中有毒有害物质或元素名称及含量
AAEON System QO4-381 Rev.A0
部件名称
有毒有害物质或元素
铅
(Pb)
汞
(Hg)
镉
(Cd)
六价铬
(Cr(VI))
多溴联苯
(PBB)
多溴二苯醚
(PBDE)
印刷电路板
及其电子组件
×
○
○
○
○
○
外部信号
连接器及线材
×
○
○
○
○
○
外壳
○
○
○
○
○
○
中央处理器
与内存
×
○
○
○
○
○
硬盘
×
○
○
○
○
○
液晶模块
×
○
○
○
○
○
光驱
×
○
○
○
○
○
触控模块
×
○
○
○
○
○
电源
×
○
○
○
○
○
电池
×
○
○
○
○
○
本表格依据 SJ/T 11364 的规定编制。
○ ：表示该有毒有害物质在该部件所有均质材料中的含量均在
GB/T 26572标准规定的限量要求以下。
×：表示该有害物质的某一均质材料超出了GB/T 26572的限量要求，然而该部件
仍符合欧盟指令2011/65/EU 的规范。
备注：
一、此产品所标示之环保使用期限，系指在一般正常使用状况下。
二、上述部件物质中央处理器、内存、硬盘、光驱、电源为选购品。
三、上述部件物质液晶模块、触控模块仅一体机产品适用。

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Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
China RoHS Requirement (EN)
Hazardous and Toxic Materials List
AAEON System QO4-381 Rev.A0
Component
Name
Hazardous or Toxic Materials or Elements
Lead (Pb)
Mercury (Hg)
Cadmium (Cd)
Hexavalent Chromium (Cr(VI))
Polybrominat ed biphenyls (PBBs)
Polybrominat ed diphenyl ethers (PBDEs)
PCB and
Components
X
O
O
O
O
O
Wires &
Connectors for
Ext.Connections
X
O
O
O
O
O
Chassis
O
O
O
O
O
O
CPU & RAM
X
O
O
O
O
O
HDD Drive
X
O
O
O
O
O
LCD Module
X
O
O
O
O
O
Optical Drive
X
O
O
O
O
O
Touch Control
Module
X
O
O
O
O
O
PSU
X
O
O
O
O
O
Battery
X
O
O
O
O
O
This form is prepared in compliance with the provisions of SJ/T 11364.
O: The level of toxic or hazardous materials present in this component and its parts is
below the limit specified by GB/T 26572.
X: The level of toxic of hazardous materials present in the component exceed the
limits specified by GB/T 26572, but is still in compliance with EU Directive 2011/65/EU
(RoHS 2).
Notes:
1. The Environment Friendly Use Period indicated by labelling on this product is
applicable only to use under normal conditions.
2. Individual components including the CPU, RAM/memory, HDD, optical drive, and
PSU are optional.
3. LCD Module and Touch Control Module only applies to certain products which
feature these components.

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Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
Table of Contents
Chapter 1 - Product Specifications.......................................................................................... 1
1.1 Specifications............................................................................................................2
Chapter 2 –Hardware Information ....................................................................................... 5
2.1 Dimensions ............................................................................................................... 6
2.2 Jumpers and Connectors....................................................................................... 7
2.3 List of Jumpers and Connectors........................................................................... 9
2.3.1 Power Button (SW1).................................................................................... 11
2.3.2 RTC (CN1)...................................................................................................... 11
2.3.3 HDMI/DP Port (CN2)..................................................................................12
2.3.4 eDP (CN3) ....................................................................................................13
2.3.5 SATA Power (CN4) ......................................................................................14
2.3.6 SATA Connector (CN5) ..............................................................................14
2.3.7 Dual USB Type A Port (CN6) ....................................................................15
2.3.8 Dual USB Type A Port (CN7) ....................................................................16
2.3.9 USB Type C Port (CN8)..............................................................................16
2.3.10 USB 2.0/UART 1x10P Wafer (CN9) ...........................................................17
2.3.11 M.2 2230 E-Key Slot (CN10)......................................................................18
2.3.12 M.2 2280 M-Key Slot (CN11).....................................................................19
2.3.13 M.2 2280 M-Key Slot (CN12)...................................................................20
2.3.14 M.2 3052 B-Key Slot (CN13) ....................................................................22
2.3.15 Dual LAN Port (CN14)...............................................................................23
2.3.16 Φ3.5mm Audio Jack Audio Jack (CN15)................................................24
2.3.17 RS-232/422/485 1x10P Wafer for COM 3 (CN16)................................24
2.3.18 RS-232/422/485 1x10P Wafer for COM 4 (CN17)................................25
2.3.19 40-Pin HAT Connector (CN18)................................................................25
2.3.20 CPLD and BIOS Update (CN19) ..............................................................26

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Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
2.3.21 Front Panel (CN21).....................................................................................27
2.3.22 DC Jack (CN22) ..........................................................................................27
2.3.23 DC Terminal Block (CN23)........................................................................28
2.3.24 Fan Connector (J1) .....................................................................................28
2.3.25 AT/ATX Mode (JP1).....................................................................................29
2.3.26 Nano SIM Slot (SIM1) ................................................................................29
2.3.27 GPIO Terminal Block..................................................................................30
2.4 Hardware Installation.............................................................................................31
2.4.1 Wi-Fi Module (M.2 2230 E-Key Slot) Installation..................................31
2.4.2 PCIe Module 1 (M.2 2280 M-Key Slot) I/O Side Installation .............35
2.4.3 PCIe Module 2 (M.2 2280 M-Key Slot) CPU Side Installation...........37
2.4.4 5G Module (M.2 3052 B-Key Slot) Installation.....................................42
2.4.5 2.5” SATA Drive Installation......................................................................45
2.4.6 VESA Mount Installation...........................................................................48
Chapter 3 –Software Installation......................................................................................... 50
3.1 Linux Setup ..............................................................................................................51
3.2 Windows Drivers Installation................................................................................51
3.3 Dummy Driver Information .................................................................................52
3.3.1 Dummy Driver Installation.....................................................................52
3.3.2 Uninstalling the Dummy Driver ............................................................56
Appendix A –UP Framework SDK Installation ................................................................... 57
A.1 Introduction ............................................................................................................58
A.2 Installation for Windows 10..................................................................................58
A.3 Installation for Windows IoT Core.......................................................................61
Appendix B –Cables and Connectors ................................................................................ 63
B.1 Cables and Connectors........................................................................................64

Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
Chapter 1
Chapter 1 - Product Specifications

Chapter 1 –Product Specifications 2
Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
1.1 Specifications
System
CPU
12th Gen. Intel® Core™ i7/i5/i3/Celeron® Processors
Core™ i7-1270PE
Core™ i5-1250PE
Core™ i3-1220PE
Celeron® 7305E
Memory
Up to 32GB Onboard LPDDR5 4800MHz, Dual-Channel
Graphics
Intel® Iris® Xe Graphics
Storage
M.2 2280 M-Key x 2 (PCIe Gen 4.0 [x4])
SATA III x 1
Ethernet
Intel i226IT (TSN) x 1
Intel i219 (vPRO) x 1
Wi-Fi/BT
Optional via M.2 2230 E-Key
Expansion Slot
M.2 2230 E-Key x 1
M.2 2280 M-Key x 2 (PCIe Gen 4.0 [x4])
SATA III x 1
M.2 3052 B-Key x 1
Nano SIM Slot x 1
Security
TPM 2.0
OS Support
Windows® 10 Enterprise 2021 LTSC
Ubuntu 22.04
Yocto 4.0

Chapter 1 –Product Specifications 3
Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
I/O
USB
USB 3.2 Gen 2 x 3 (Type-A)
USB 2.0 x 1 (Type-A)
USB 2.0 via 10-pin Wafer x 2
USB 4.0 x 1 (Type-C)
Display Port
HDMI 2.0b x 1
DP 1.4a x 1
DP 1.4b via USB Type-C x 1
eDP 1.4b x 1
Ethernet
RJ-45 x 2 for 1G/2.5GbE LAN
COM
COM x 2 (RS-232/422/485)
Audio
Mic-In x 1
Line-Out x 1
GPIO
16-pin GPIO x 1
Power Requirement
Power Requirement
12~36V DC Input (AT/ATX mode)
Power Supply Type
Lockable
Power Consumption
(Typical)
Intel® Core™ i7-1270PE, LPDDR5 4800MHz 16GB,
5.86A@+12V (Typical)
Intel® Core™ i7-1270PE, LPDDR5 4800MHz 16GB,
8.05A@+12V (Max)
Mechanical
Mounting
VESA Mount/Wall Mount
Dimensions (WxHxD)
5.98” x 4.87” x 2.85” (152mm x 123.8mm x 72.5mm)
Net Weight
2.95 lb. (1.34 Kg)
Gross Weight
3.88 lb. (1.76 Kg)

Chapter 1 –Product Specifications 4
Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
Environment
Operating Temperature
32°F ~ 140°F (0°C ~ 60°) / 0.5 airflow
Storage Temperature
-40˚F ~ 176˚F (-40˚C ~ 80˚C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
MTBF
366,810
Certification
CE/FCC Class A, RoHS Compliant, REACH

Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
Chapter 2
Chapter 2 –Hardware Information

Chapter 2 –Hardware Information 6
Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
2.1 Dimensions

Chapter 2 –Hardware Information 7
Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
2.2 Jumpers and Connectors
Top:

Chapter 2 –Hardware Information 8
Maker Board System UP Xtreme i12 Edge UPX-EDGE-ADLP
Bottom: