Asus AAEON COM-TGHB6 User manual

Last Updated: September 1, 2022
COM-TGHB6
COM Express Module
User’s Manual 1st Ed

Preface II
COM Express Module COM-TGHB6
Copyright Notice
This document is copyrighted, 2022. All rights are reserved. The original manufacturer
reserves the right to make improvements to the products described in this manual at
any time without notice.
No part of this manual may be reproduced, copied, translated, or transmitted in any
form or by any means without the prior written permission of the original
manufacturer. Information provided in this manual is intended to be accurate and
reliable. However, the original manufacturer assumes no responsibility for its use, or for
any infringements upon the rights of third parties that may result from its use.
The material in this document is for product information only and is subject to change
without notice. While reasonable efforts have been made in the preparation of this
document to assure its accuracy, AAEON assumes no liabilities resulting from errors or
omissions in this document, or from the use of the information contained herein.
AAEON reserves the right to make changes in the product design without notice to its
users.

Preface III
COM Express Module COM-TGHB6
Acknowledgements
All other products’ name or trademarks are properties of their respective owners.
⚫Microsoft Windows is a registered trademark of Microsoft Corp.
⚫Intel® and Celeron® are registered trademarks of Intel Corporation
⚫Intel Core™is a trademark of Intel Corporation
⚫IBM, PC/AT, PS/2, and VGA are trademarks of International Business Machines
Corporation.
All other product names or trademarks are properties of their respective owners.
Omission from this list does not imply any claim of ownership by the publisher of this
document.

Preface IV
COM Express Module COM-TGHB6
Packing List
Before setting up your product, please make sure the following items have been
shipped:
Item
Quantity
⚫COM-TGHB6
1
If any of these items are missing or damaged, please contact your distributor or sales
representative immediately.

Preface V
COM Express Module COM-TGHB6
About this Document
This User’s Manual contains all the essential information, such as detailed descriptions
and explanations on the product’s hardware and software features (if any), its
specifications, dimensions, jumper/connector settings/definitions, and driver installation
instructions (if any), to facilitate users in setting up their product.
Users may refer to the product page at AAEON.com for the latest version of this
document.

Preface VI
COM Express Module COM-TGHB6
Safety Precautions
Please read the following safety instructions carefully. It is advised that you keep this
manual for future references
1. All cautions and warnings on the device should be noted.
2. Make sure the power source matches the power rating of the device.
3. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
4. Always completely disconnect the power before working on the system’s
hardware.
5. No connections should be made when the system is powered as a sudden rush
of power may damage sensitive electronic components.
6. If the device is not to be used for a long time, disconnect it from the power
supply to avoid damage by transient over-voltage.
7. Always disconnect this device from any AC supply before cleaning.
8. While cleaning, use a damp cloth instead of liquid or spray detergents.
9. Make sure the device is installed near a power outlet and is easily accessible.
10. Keep this device away from humidity.
11. Place the device on a solid surface during installation to prevent falls
12. Do not cover the openings on the device to ensure optimal heat dissipation.
13. Watch out for high temperatures when the system is running.
14. Do not touch the heat sink or heat spreader when the system is running
15. Never pour any liquid into the openings. This could cause fire or electric shock.
16. As most electronic components are sensitive to static electrical charge, be sure to
ground yourself to prevent static charge when installing the internal components.
Use a grounding wrist strap and contain all electronic components in any
static-shielded containers.

Preface VII
COM Express Module COM-TGHB6
17. If any of the following situations arises, please the contact our service personnel:
i. Damaged power cord or plug
ii. Liquid intrusion to the device
iii. Exposure to moisture
iv. Device is not working as expected or in a manner as described in
this manual
v. The device is dropped or damaged
vi. Any obvious signs of damage displayed on the device
18. DO NOT LEAVE THIS DEVICE IN AN UNCONTROLLED ENVIRONMENT WITH
TEMPERATURES BEYOND THE DEVICE’S PERMITTED STORAGE TEMPERATURES
(SEE CHAPTER 1) TO PREVENT DAMAGE.

Preface VIII
COM Express Module COM-TGHB6
FCC Statement
This device complies with Part 15 FCC Rules. Operation is
subject to the following two conditions: (1) this device may not
cause harmful interference, and (2) this device must accept any
interference received including interference that may cause
undesired operation.
Caution:
There is a danger of explosion if the battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer. Dispose of used batteries
according to the manufacturer’s instructions and your local government’s recycling or
disposal directives.
Attention:
Il y a un risque d’explosion si la batterie est remplacée de façon incorrecte.
Ne la remplacer qu’avec le même modèle ou équivalent recommandé par le constructeur.
Recycler les batteries usées en accord avec les instructions du fabricant et les directives
gouvernementales de recyclage.

Preface IX
COM Express Module COM-TGHB6
China RoHS Requirements (CN)
产品中有毒有害物质或元素名称及含量
AAEON Main Board/ Daughter Board/ Backplane
部件名称
有毒有害物质或元素
铅
(Pb)
汞
(Hg)
镉
(Cd)
六价铬
(Cr(VI))
多溴联苯
(PBB)
多溴二苯醚
(PBDE)
印刷电路板
及其电子组件
○
○
○
○
○
○
外部信号
连接器及线材
○
○
○
○
○
○
O：表示该有毒有害物质在该部件所有均质材料中的含量均在
SJ/T 11363-2006 标准规定的限量要求以下。
X：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出
SJ/T 11363-2006 标准规定的限量要求。
备注：此产品所标示之环保使用期限，系指在一般正常使用状况下。

Preface X
COM Express Module COM-TGHB6
China RoHS Requirement (EN)
Poisonous or Hazardous Substances or Elements in Products
AAEON Main Board/ Daughter Board/ Backplane
Component
Poisonous or Hazardous Substances or Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(Cr(VI))
Polybrominated
Biphenyls
(PBB)
Polybrominated
Diphenyl Ethers
(PBDE)
PCB & Other
Components
O
O
O
O
O
○
Wires &
Connectors
for External
Connections
O
O
O
O
O
O
O：The quantity of poisonous or hazardous substances or elements found in each of the
component's parts is below the SJ/T 11363-2006-stipulated requirement.
X: The quantity of poisonous or hazardous substances or elements found in at least one of the
component's parts is beyond the SJ/T 11363-2006-stipulated requirement.
Note: The Environment Friendly Use Period as labeled on this product is applicable under normal
usage only

Preface XI
COM Express Module COM-TGHB6
Table of Contents
Chapter 1 - Product Specifications.......................................................................................... 1
1.1 Specifications............................................................................................................2
Chapter 2 –Hardware Information ....................................................................................... 4
2.1 Dimensions ............................................................................................................... 5
2.2 Jumpers and Connectors....................................................................................... 7
2.3 List of Connectors.................................................................................................... 8
2.3.1 COM Express ROW A/B Connector (COMAB1).....................................8
2.3.2 COM Express ROW C/D Connector (COMCD1)...................................13
2.4 Function Block Diagram........................................................................................18
Chapter 3 - AMI BIOS Setup .................................................................................................19
3.1 System Test and Initialization ..............................................................................20
3.2 AMI BIOS Setup ......................................................................................................21
3.3 Setup Submenu: Main..........................................................................................22
3.4 Setup Submenu: Advanced.................................................................................23
3.4.1 Graphics Configuration ............................................................................24
3.4.1.1 LVDS Panel Configuration.............................................................25
3.4.2 CPU Configuration ....................................................................................27
3.4.3 Memory Configuration.............................................................................28
3.4.4 On-Module H/W Monitor........................................................................29
3.4.4.1 Smart Fan Mode Configuration...................................................30
3.4.5 PCH-FW Configuration.............................................................................33
3.4.5.1 Firmware Update Configuration..................................................34
3.4.6 On-Module Configuration.......................................................................35
3.4.7 Power Management..................................................................................36
3.4.8 AAEON BIOS Robot..................................................................................37
3.5 Setup Submenu: Chipset .....................................................................................39

Preface XII
COM Express Module COM-TGHB6
3.5.1 PCI Express Configuration........................................................................40
3.5.2 Storage Configuration ..............................................................................44
3.5.3 NMVe Configuration .................................................................................46
3.5.4 VMD Setup Menu......................................................................................47
3.5.5 HD Audio Configuration ..........................................................................48
3.5.6 Digital IO Port Configuration ..................................................................49
3.5.7 Legacy Logical Devices Configuration ..................................................50
3.5.7.1 Serial Port 1 Configuration.............................................................51
3.5.7.2 Serial Port 2 Configuration ...........................................................52
3.5.8 Serial Port Console Redirection ..............................................................53
3.6 Setup Submenu: Security.....................................................................................54
3.6.1 Secure Boot.................................................................................................55
3.6.1.1 Key Management............................................................................56
3.6.2 Trusted Computing....................................................................................57
3.7 Setup Submenu: Boot ..........................................................................................59
3.8 Setup Submenu: Save & Exit...............................................................................60
Chapter 4 –Drivers Installation.............................................................................................61
4.1 Drivers Download and Installation.....................................................................62
Appendix A - I/O Information.............................................................................................. 64
A.1 I/O Address Map ...................................................................................................65
A.2 Memory Address Map .........................................................................................66
A.3 Large Memory Address Map..............................................................................67
A.4 IRQ Mapping Chart...............................................................................................68

COM Express Module COM-TGHB6
Chapter 1
Chapter 1 - Product Specifications

Chapter 1 –Product Specifications 2
COM Express Module COM-TGHB6
1.1 Specifications
System
Form Factor
COM Express Basic Size, Type 6
CPU
11th Generation Intel® Xeon/Core™ Processor
CPU Frequency
Up to 2.6 GHz, 8 Core, W-11865MRE/
I7-11850HE
Chipset
Intel 500 series PCH QM580E/RM590E
Memory Type
SODIMM DDR4 3200MHz Socket x 2
Max. Memory Capacity
Up to 64 GB (ECC Support by SKU)
BIOS
AMI BIOS (UEFI)
Wake on LAN
Yes
Watchdog Timer
255 Levels
Power Requirement
+12V and +5VSB for ATX,+12V for AT
Power Supply Type
AT/ATX
Power Consumption (Typical)
5.17A@12V,W-11865MRE
Dimensions (L x W)
4.92" x 3.75" (125mm x 95mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40°F ~ 185°F (-40°C ~ 85°C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
MTBF (Hours)
487,159
Certification
CE / FCC Class A

Chapter 1 –Product Specifications 3
COM Express Module COM-TGHB6
Display
VGA/LCD Controller
Intel® UHD Graphics,18/24b 2CH LVDS, or 4
lane eDP
Video Output
DDI x 3
LVDS or eDP x 1 (Default: LVDS)
VGA x 1
I/O
Ethernet
Intel® i225/i226LM/IT GbE x 1
Audio
High Definition Audio Interface
USB Port
USB 2.0 x 8, USB 3.2 Gen 2 x 4
Serial Port
2-Wire UART (TX/RX) x 2
HDD Interface
SATA III x 4
Expansion
PCIe 4.0 [x16] x 1, PCIe 3.0 [x1] x 8
LPC x 1
SMBus x 1
I2C x 1
GPIO
8-bit
Onboard Storage
N/A
TPM
TPM 2.0

COM Express Module COM-TGHB6
Chapter 2
Chapter 2 –Hardware Information

Chapter 2 –Hardware Information 5
COM Express Module COM-TGHB6
2.1 Dimensions

Chapter 2 –Hardware Information 6
COM Express Module COM-TGHB6
With Active Cooler (Part No: COM-TGHB6-FAN01)
With Heat Spreader and Active Cooler (Part No: COM- TGHB6-HSP01 and
COM-FAN02)

Chapter 2 –Hardware Information 7
COM Express Module COM-TGHB6
2.2 Jumpers and Connectors
Top Side
Bottom Side

Chapter 2 –Hardware Information 8
COM Express Module COM-TGHB6
2.3 List of Connectors
Please refer to the table below for all of the board’s connectors that you can configure
for your application
Label
Function
CN8
DDR4 SO-DIMM / CHA Slot0
CN17
DDR4 SO-DIMM / CHA Slot1
COMAB1
Express ROW A/B Connector
COMCD1
Express ROW C/D Connector
SPI1
SPI Flash Programming Connector
CN26
RTC Battery Connector
2.3.1 COM Express ROW A/B Connector (COMAB1)
Row A
Row B
Pin
Signal
Pin
Signal
A1
GND (FIXED)
B1
GND (FIXED)
A2
GBE0_MDI3-
B2
GBE0_ACT#
A3
GBE0_MDI3+
B3
LPC_FRAME#
A4
GBE0_LINK100#
B4
LPC_AD0
A5
GBE0_LINK1000#
B5
LPC_AD1
A6
GBE0_MDI2-
B6
LPC_AD2
A7
GBE0_MDI2+
B7
LPC_AD3
A8
GBE0_LINK
B8
LPC_DRQ0# (NC)
A9
GBE0_MDI1-
B9
LPC_DRQ1# (NC)
A10
GBE0_MDI1+
B10
LPC_CLK
A11
GND (FIXED)
B11
GND (FIXED)
A12
GBE0_MDI0-
B12
PWRBTN#