Atmel AT24C16C User manual

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
Standard Features
Low-voltage and Standard-voltage Operation
VCC = 1.7V to 5.5V
Internally Organized as 2,048 x 8 (16K)
I2C-compatible (2-wire) Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
1MHz (2.5V, 2.7V, 5V), 400kHz (1.7V) Compatibility
Write Protect Pin for Hardware Data Protection
16-byte Page Write Mode
Partial Page Writes Allowed
Self-timed Write Cycle (5ms Max)
High-reliability
Endurance: 1,000,000 Write Cycles
Data Retention: 100 Years
Green Package Options (Pb/Halide-free/RoHS Compliant)
8-lead PDIP, 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN,
5-lead SOT23, and 8-ball VFBGA
Die Options: Wafer Form and Tape and Reel
Description
The Atmel®AT24C16C provides 16,384 bits of Serial Electrically Erasable and
Programmable Read-Only Memory (EEPROM) organized as 2,048 words of 8 bits
each. The device is optimized for use in many industrial and commercial
applications where low-power and low-voltage operation are essential.
AT24C16C is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead
TSSOP, 8-pad UDFN,8-pad XDFN, 5-lead SOT23, and 8-ball VFBGA packages
and is accessed via a 2-wire serial interface.
AT24C16C
I2C-Compatible, (2-Wire) Serial EEPROM
16-Kbit (2048 x 8)
DATASHEET

AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
2
1. Pin Configurations and Pinouts
Table 1. Pin Configuration
2. Absolute Maximum Ratings
Pin Name Function
NC No Connect
SDA Serial Data
SCL Serial Clock Input
WP Write Protect
GND Ground
VCC Power Supply
1
2
3
4
8
7
6
5
NC
NC
NC
GND
VCC
WP
SCL
SDA
8-lead PDIP
1
2
3
5
4
SCL
GND
SDA
WP
VCC
5-lead SOT23
VCC
WP
SCL
SDA
NC
NC
NC
GND
1
2
3
4
8
7
6
5
8-ball VFBGA
Bottom View
Note: Drawings are not to scale.
8-pad UDFN/XDFN
Bottom View
Top ViewTop View
Top View
Top View
VCC
WP
SCL
SDA
NC
NC
NC
GND
1
2
3
4
8
7
6
5
8-lead TSSOP
1
2
3
4
8
7
6
5
NC
NC
NC
GND
VCC
WP
SCL
SDA
8-lead SOIC
NC
NC
NC
GND
VCC
WP
SCL
SDA
1
2
3
4
8
7
6
5
Operating Temperature . . . . . . . . . . .-55C to +125C
Storage Temperature . . . . . . . . . . . . .-65C to +150C
Voltage on any pin
with respect to ground . . . . . . . . . . . . . -1.0V to +7.0V
Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . .5.0mA
*Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.

3
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
3. Block Diagram
4. Pin Description
Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative
edge clock data out of each device.
Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may
be wire-ORed with any number of other open-drain or open-collector devices.
Device/Page Addresses: The AT24C16C does not use the device address pins, which limits the number of
devices on a single bus to one (see Section 7. “Device Addressing” on page 9).
Write Protect (WP): AT24C16C has a Write Protect pin that provides hardware data protection. The Write
Protect pin allows normal Read/Write operations when connected to Ground (GND). When the Write Protect pin
is connected to VCC, the Write Protection feature is enabled and operates as shown in Table 4-1.
Table 4-1. Write Protect
Start
Stop
Logic
Data Word
ADDR/Counter
Row Decoder
Device
Address
Comparator
Data Latches
D
OUT
/ ACK
Logic
Column
Decoder
EEPROM
Array
Serial
Control
Logic
High Voltage
Pump & Timing
Serial MUX
Read/Write
Enable
COMP Load
INC
V
CC
GND
WP
SCL
SDA
D
OUT
D
IN
A
2
A
1
WP Pin Status Part of the Array Protected
At VCC Full Array
At GND Normal Read/Write Operations

AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
4
5. Memory Organization
AT24C16C, 16K Serial EEPROM: Internally organized with 128 pages of 16 bytes each, the 16K requires a
11-bit data word address for random word addressing.
5.1 Pin Capacitance
Table 5-1. Pin Capacitance(1)
Note: 1. This parameter is characterized and is not 100% tested.
5.2 DC Characteristics
Table 5-2. DC Characteristics
Note: 1. VIL min and VIH max are reference only and are not tested.
Applicable over recommended operating range from TA= 25°C, f = 1.0MHz, VCC = 5.5V.
Symbol Test Condition Max Units Conditions
CI/O Input/Output capacitance (SDA) 8 pF VI/O = 0V
CIN Input capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = 1.7V to 5.5V (unless otherwise noted).
Symbol Parameter Test Condition Min Typ Max Units
VCC1 Supply Voltage 1.7 5.5 V
ICC Supply Current VCC = 5.0V Read at 100kHz 0.4 1.0 mA
ICC Supply Current VCC = 5.0V Write at 100kHz 2.0 3.0 mA
ISB1 Standby Current VCC = 1.7V VIN = VCC or VSS 1.0 μA
ISB2 Standby Current VCC = 5.5V VIN = VCC or VSS 6.0 μA
ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 μA
ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 μA
VIL Input Low Level(1) –0.6 VCC x 0.3 V
VIH Input High Level(1) VCC x 0.7 VCC + 0.5 V
VOL2 Output Low Level VCC = 3.0V IOL = 2.1mA 0.4 V
VOL1 Output Low Level VCC = 1.7V IOL = 0.15mA 0.2 V

5
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
5.3 AC Characteristics
Table 5-3. AC Characteristics
Note: 1. This parameter is ensured by characterization only.
Applicable over recommended operating range from TAI = -40C to 85C, VCC = +1.7V to 5.5V, CL = 1TTL Gate and 100pF
(unless otherwise noted).
Symbol Parameter
1.7V 2.5V, 2.7V, 5.0V
UnitsMin Max Min Max
fSCL Clock Frequency, SCL 400 1000 kHz
tLOW Clock Pulse Width Low 1.2 0.4 μs
tHIGH Clock Pulse Width High 0.6 0.4 μs
tINoise Suppression Time 100 50 ns
tAA Clock Low to Data Out Valid 0.1 0.9 0.05 0.55 μs
tBUF
Time the bus must be free before a new
transmission can start. 1.2 0.5 μs
tHD.STA Start Condition Hold Time 0.6 0.25 μs
tSU.STA Start Condition Setup Time 0.6 0.25 μs
tHD.DAT Data In Hold Time 0 0 μs
tSU.DAT Data In Setup Time 100 100 ns
tRInputs Rise Time(1) 0.3 0.3 μs
tFInputs Fall Time(1) 300 100 ns
tSU.STO Stop Condition Setup Time 0.6 .25 μs
tDH Data Out Hold Time 50 50 ns
tWR Write Cycle Time 5 5 ms
Endurance(1) 3.3V, 25C, Page Mode 1,000,000 Write Cycles

AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
6
6. Device Operation
Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin
may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or
Stop Condition as defined below.
Figure 6-1. Data Validity
Start Condition: A high-to-low transition of SDA with SCL high is a Start Condition which must precede any
other command.
Stop Condition: A low-to-high transition of SDA with SCL high is a Stop Condition. After a read sequence, the
Stop Condition command will place the EEPROM in a standby power mode.
Figure 6-2. Start Condition and Stop Condition Definition
SDA
SCL
Data Stable Data Stable
Data
Change
SDA
SCL
Start
Condition
Stop
Condition

7
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in eight bit
words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the
ninth clock cycle.
Figure 6-3. Output Acknowledge
Standby Mode: The AT24C16C features a low-power standby mode which is enabled:
Upon power-up.
After the receipt of the Stop Condition and the completion of any internal operations.
2-wire Software Reset: After an interruption in protocol, power loss or system reset, any 2-wire part can be
reset by following these steps:
1. Create a Start Condition (if possible).
2. Clock nine cycles.
3. Create another Start Condition followed by Stop Condition as shown below.
The device should be ready for the next communication after above steps have been completed. In the event
that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset
the device.
Figure 6-4. Software Reset
SCL
DATA IN
DATA OUT
Start
Condition
Acknowledge
9
8
1
SCL 9
Start
Condition Start
Condition
Stop
Condition
8321
SDA
Dummy Clock Cycles

AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
8
Figure 6-5. Bus Timing
SCL: Serial Clock, SDA: Serial Data I/O
Figure 6-6. Write Cycle Timing
SCL: Serial Clock, SDA: Serial Data I/O
Note: 1. The write cycle time tWR is the time from a valid Stop Condition of a Write sequence to the end of the internal
clear/write cycle.
SCL
SDA IN
SDA OUT
tF
tHIGH
tLOW tLOW
tR
tAA tDH tBUF
tSU.STO tSU.DAT tHD.DAT tHD.STA tSU.STA
tWR
(1)
Stop
Condition
Start
Condition
WORDn
ACK
8th bit
SCL
SDA

9
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
7. Device Addressing
Standard EEPROM Access: The 16K EEPROM device requires an 8-bit device address word following a Start
Condition to enable the chip for a Read or Write operation. The device address word consists of a mandatory
“1010” (Ah) sequence for the first four Most Significant Bits (MSB) as shown in Figure 10. on page 12. This is
common to all the EEPROM devices.
The next three bits used for memory page addressing are the most significant bits of the data word address
which follows.
The eighth bit of the device address is the Read/Write operation select bit. A Read operation is initiated if this bit
is high and a Write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will
return to a standby state.
Figure 7-1. Device Address
8. Write Operations
Byte Write: A Write operation requires an 8-bit data word address following the device address word and
acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in
the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the
addressing device, such as a microcontroller, must terminate the Write sequence with a Stop Condition. At this
time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled
during this write cycle and the EEPROM will not respond until the Write is complete.
Figure 8-1. Byte Write
Page Write: The 16K EEPROM devices are capable of a 16-byte Page Write.
A Page Write is initiated in the same way as a Byte Write, but the microcontroller does not send a Stop
Condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first
data word, the microcontroller can transmit up to fifteen more data words. The EEPROM will respond with a
zero after each data word received. The microcontroller must terminate the Page Write sequence with a Stop
Condition (see Figure 8-2).
Density Access Area Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
16K EEPROM 1 0 1 0 P2 P1 P0 R/W
MSB LSB
SDA Line
S
T
A
R
T
W
R
I
T
E
S
T
O
P
Device
Address Word Address Data
M
S
B
A
C
K
A
C
K
A
C
K
R
/
W

AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
10
The data word address lower four bits are internally incremented following the receipt of each data word. The
higher data word address bits are not incremented, retaining the memory page row location. When the word
address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the
same page. If more than eight data words are transmitted to the EEPROM, the data word address will roll-over
and previous data will be overwritten.
Figure 8-2. Page Write
Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled,
Acknowledge Polling can be initiated. This involves sending a Start Condition followed by the device address
word. The Read/Write bit is representative of the operation desired. Only if the internal write cycle has
completed will the EEPROM respond with a zero allowing the Read or Write sequence to continue.
9. Read Operations
Read operations are initiated in the same way as Write operations with the exception that the Read/Write select
bit in the device address word is set to one. There are three read operations:
Current Address Read
Random Address Read
Sequential Read.
Current Address Read: The internal data word address counter maintains the last address accessed during
the last Read or Write operation, incremented by one. This address stays valid between operations as long as
the chip power is maintained. The address roll-over during Read is from the last byte of the last memory page to
the first byte of the first page. The address roll-over during Write is from the last byte of the current page to the
first byte of the same page.
Once the device address with the Read/Write select bit set to one is clocked in and acknowledged by the
EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an
input zero but does generate a following Stop Condition (see Figure 9-1).
Figure 9-1. Current Address Read
SDA Line
S
T
A
R
T
W
R
I
T
E
S
T
O
P
Device
Address
Word
Address (n) Data (n) Data (n + 1) Data (n + x)
M
S
B
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
R
/
W
SDA Line
S
T
A
R
T
R
E
A
D
S
T
O
P
Device
Address Data
M
S
B
A
C
K
N
O
A
C
K
R
/
W

11
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
Random Read: A Random Read requires a Dummy Byte Write sequence to load in the data word address.
Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another Start Condition. The microcontroller now initiates a Current Address
Read by sending a device address with the Read/Write select bit high. The EEPROM acknowledges the device
address and serially clocks out the data word. The microcontroller does not respond with a zero but does
generate a following Stop Condition.
Figure 9-2. Random Read
Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Address
Read. After the microcontroller receives a data word, it responds with an Acknowledge. As long as the
EEPROM receives an Acknowledge, it will continue to increment the data word address and serially clock out
sequential data words. When the memory address limit is reached, the data word address will roll-over and the
Sequential Read will continue. The Sequential Read operation is terminated when the microcontroller does not
respond with a zero but does generate a following Stop Condition.
Figure 9-3. Sequential Read
SDA Line
S
T
A
R
T
S
T
A
R
T
R
E
A
D
W
R
I
T
E
S
T
O
P
Device
Address
Device
Address
Word
Address (n) Data (n)
M
S
B
A
C
K
A
C
K
A
C
K
N
O
A
C
K
R
/
W
Dummy Write
SDA Line
R
E
A
D
S
T
O
P
Device
Address Data (n) Data (n + 1) Data (n + 2) Data (n + x)
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
R
/
W

AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
12
10. Ordering Code Detail
Atmel Designator
Product Family
Device Density
Device Revision
Shipping Carrier Option
Operating Voltage
16 = 16K
24C = Standard
Serial EEPROM
B = Bulk (Tubes)
T = Tape and Reel, Standard Quantity Option
E = Tape and Reel, Expanded Quantity Option
M = 1.7V to 5.5V
Package Device Grade or
Wafer/Die Thickness
H = Green, NiPdAu Lead Finish,
Industrial Temperature Range
(-40˚C to +85˚C)
U = Green, Matte Sn Lead Finish,
Industrial Temperature Range
(-40˚C to +85˚C)
11 = 11mil Wafer Thickness
Package Option
P = PDIP
SS = JEDEC SOIC
X = TSSOP
MA = UDFN
ME = XDFN
ST = SOT23
C = VFBGA
WWU = Wafer Unsawn
AT24C16C-SSHM-B

13
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
11. Product Markings
DRAWING NO. REV.TITLE
24C16CSM E
12/6/16
24C16CSM, AT24C16C Package Marking Information
Package Mark Contact:
[email protected]
AAAAAAAA
###% @
ATMLHYWW
8-lead SOIC 8-lead TSSOP
AAAAAAA
###% @
ATHYWW
1.5 x 2.0 mm Body
8-ball VFBGA
PIN 1
###U
YMXX
###
YXX
8-pad XDFN
1.8 x 2.2 mm Body
8-pad UDFN
###
H%@
YXX
2.0 x 3.0 mm Body
Note 2: Package drawings are not to scale
Note 1: designates pin 1
AT24C16C: Package Marking Information
Catalog Number Truncation
AT24C16C Truncation Code ###: 16C / ##: AC
Date Codes Voltages
Y = Year M = Month WW = Work Week of Assembly % = Minimum Voltage
6: 2016 0: 2020 A: January 02: Week 2 M: 1.7V min
7: 2017 1: 2021 B: February 04: Week 4
8: 2018 2: 2022 ... ...
9: 2019 3: 2023 L: December 52: Week 52
Country of Assembly Lot Number Grade/Lead Finish Material
@ = Country of Assembly AAA...A = Atmel Wafer Lot Number H: Industrial/NiPdAu
U: Industrial/Matte Tin/SnAgCu
Trace Code Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code) AT: Atmel
Example: AA, AB.... YZ, ZZ ATM: Atmel
ATML: Atmel
5-lead SOT-23
AAAAAAAA
###% @
ATMLUYWW
8-lead PDIP
##@%U
YMXX
Note 3: For SOT23 package with date codes before 7B, the bottom line (YMXX) is marked on the bottom side and there is no Country of Assembly ( @ ) mark on the top line.

AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
14
12. Ordering Information
Note: 1. For Wafer sales, please contact Atmel Sales.
Atmel Ordering Code Lead Finish Package
Delivery Information Operation
Range
Form Quantity
AT24C16C-SSHM-B
NiPdAu
(Lead-free/Halogen-free)
8S1
Bulk (Tubes) 100 per Tube
Industrial
Temperature
(-40C to 85C)
AT24C16C-SSHM-T Tape and Reel 4,000 per Reel
AT24C16C-XHM-B
8X
Bulk (Tubes) 100 per Tube
AT24C16C-XHM-T Tape and Reel 5,000 per Reel
AT24C16C-MAHM-T
8MA2
Tape and Reel 5,000 per Reel
AT24C16C-MAHM-E Tape and Reel 15,000 per Reel
AT24C16C-PUM
Matte Sn
(Lead-free/Halogen-free)
8P3 Bulk (Tubes) 50 per Tube
AT24C16C-STUM-T 5TS1 Tape and Reel 5,000 per Reel
AT24C16C-CUM-T SnAgCu
(Lead-free/Halogen-free) 8U3-1 Tape and Reel 5,000 per Reel
AT24C16C-MEHM-T N/A 8ME1 Tape and Reel 5,000 per Reel
AT24C16C-WWU11M(1) N/A Wafer Sale Note 1
Package Type
8P3 8-lead, 0.300" wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8X 8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
8MA2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Plastic Ultra Thin Dual Flat No Lead (UDFN)
8ME1 8-lead, 1.80mm x 2.20mm body, 0.40mm pitch, Extra Thin Dual Flat No Lead (XDFN)
5TS1 5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)
8U3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Die Ball Grid Array (VFBGA)

15
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
13. Packaging Information
13.1 8P3 — 8-lead PDIP
DRAWING NO. REV.TITLE GPC
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
A - - 5.334 2
A1 0.381 - -
A2 2.921 3.302 4.953
b 0.356 0.457 0.559 5
b2 1.143 1.524 1.778 6
b3 0.762 0.991 1.143 6
c 0.203 0.254 0.356
D 9.017 9.271 10.160 3
D1 0.127 0.000 0.000 3
E 7.620 7.874 8.255 4
E1 6.096 6.350 7.112 3
e 2.540 BSC
eA 7.620 BSC 4
L 2.921 3.302 3.810 2
Top View
Side View
End View
Package Drawing Contact:
[email protected]
A1
Gage Plane
.381
8P3 E
07/31/14
8P3, 8-lead, 0.300” Wide Body, Plastic Dual
In-line Package (PDIP) PTC
v0.254 mC

AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
16
13.2 8S1 — 8-lead JEDEC SOIC
DRAWING NO. REV.TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A1 0.10 – 0.25
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.05
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
Ø
Ø
0° – 8°
Ø
E
1
N
TOP VIEW
C
E1
END VIEW
A
b
L
A1
e
D
SIDE VIEW
Package Drawing Contact:
[email protected]
8S1 G
6/22/11
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC) SWB

17
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
13.3 8X — 8-lead TSSOP
DRAWING NO. REV.TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A - - 1.20
A1 0.05 - 0.15
A2 0.80 1.00 1.05
D 2.90 3.00 3.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
b 0.19 0.25 0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
C 0.09 - 0.20
Side View
End View
Top View
A2
A
L
L1
D
1
E1
N
b
Pin 1 indicator
this corner
E
e
Notes: 1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
Package Drawing Contact:
[email protected]
8X E
2/27/14
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP) TNR
C
A1

AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
18
13.4 8MA2 — 8-pad UDFN
DRAWING NO. REV.TITLE GPC
8MA2 G
11/26/14
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
YNZ
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A 0.50 0.55 0.60
A1 0.0 0.02 0.05
A2 - - 0.55
D 1.90 2.00 2.10
D2 1.40 1.50 1.60
E 2.90 3.00 3.10
E2 1.20 1.30 1.40
b 0.18 0.25 0.30 3
C 1.52 REF
L 0.30 0.35 0.40
e 0.50 BSC
K 0.20 - -
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Package Drawing Contact:
[email protected]
C
E
Pin 1 ID
D
8
7
6
5
1
2
3
4
A
A1
A2
D2
E2
e (6x)
L (8x)
b (8x)
Pin#1 ID
K
1
2
3
4
8
7
6
5
Notes: 1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.

19
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
13.5 8ME1 — 8-pad XDFN
Package Drawing Contact:
[email protected]
GPC DRAWING NO.
REV.TITLE
COMMON DIMENSIONS
(Unit of Measure = mm)
DTP
SYMBOL MIN NOM MAX NOTE
–
0.00
1.70
2.10
0.15
0.26
A
A1
D
E
b
e
e1
L
–
–
1.80
2.20
0.20
0.40 TYP
1.20 REF
0.30
0.40
0.05
1.90
2.30
0.25
0.35
End View
8ME1 B
9/10/2012
8ME1, 8-pad (1.80mm x 2.20mm body)
Extra Thin DFN (XDFN)
Top View
657
4
3
E
D
8
12
PIN #1 ID
0.10
0.15
b
L
b
e
PIN #1 ID
e1
A1
A
Side View

AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
20
13.6 5TS1 — 5-lead SOT23
DRAWING NO. REV.TITLE GPC
Package Drawing Contact:
[email protected]
5TS1 D
5/31/12
5TS1, 5-lead 1.60mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT) TSZ
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A - - 1.00
A1 0.00 - 0.10
A2 0.70 0.90 1.00
c 0.08 - 0.20 3
D 2.90 BSC 1,2
E 2.80 BSC 1,2
E1 1.60 BSC 1,2
L1 0.60 REF
e 0.95 BSC
e1 1.90 BSC
b 0.30 - 0.50 3,4
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.
54
2
L1
L
C
END VIEW
C
A
A2
A1
b
e
PLANE
SEATING
D
SIDE VIEW
E
e1
E1
3
1
TOP VIEW