Bailey Infi 90 IMDSM05 User manual

®
®
Process Control and
Automation Solutions
from Elsag Bailey Group
E96-309
Digital I/O Slave Module
(IMDSM05)

WARNING notices as used in this instruction apply to hazards or unsafe practices that could result in
personal injury or death.
CAUTION notices apply to hazards or unsafe practices that could result in property damage.
NOTES highlight procedures and contain information that assists the operator in understanding the
information contained in this instruction.
WARNING
INSTRUCTION MANUALS
DO NOT INSTALL, MAINTAIN, OR OPERATE THIS EQUIPMENT WITHOUT READING, UNDERSTANDING,
AND FOLLOWING THE PROPER Elsag Bailey INSTRUCTIONS AND MANUALS; OTHERWISE, INJURY OR
DAMAGE MAY RESULT.
RADIO FREQUENCY INTERFERENCE
MOST ELECTRONIC EQUIPMENT IS INFLUENCED BY RADIO FREQUENCY INTERFERENCE (RFI). CAU-
TION SHOULD BE EXERCISED WITH REGARD TO THE USE OF PORTABLE COMMUNICATIONS EQUIP-
MENT IN THE AREA AROUND SUCH EQUIPMENT. PRUDENT PRACTICE DICTATES THAT SIGNS
SHOULD BE POSTED IN THE VICINITY OF THE EQUIPMENT CAUTIONING AGAINST THE USE OF POR-
TABLE COMMUNICATIONS EQUIPMENT.
POSSIBLE PROCESS UPSETS
MAINTENANCE MUST BE PERFORMED ONLY BY QUALIFIED PERSONNEL AND ONLY AFTER SECURING
EQUIPMENT CONTROLLED BY THIS PRODUCT. ADJUSTING OR REMOVING THIS PRODUCT WHILE IT IS
IN THE SYSTEM MAY UPSET THE PROCESS BEING CONTROLLED. SOME PROCESS UPSETS MAY
CAUSE INJURY OR DAMAGE.
AVERTISSEMENT
MANUELS D’OPÉRATION
NE PAS METTRE EN PLACE, RÉPARER OU FAIRE FONCTIONNER L’ÉQUIPEMENT SANS AVOIR LU,
COMPRIS ET SUIVI LES INSTRUCTIONS RÉGLEMENTAIRES DE Elsag Bailey. TOUTE NÉGLIGENCE À
CET ÉGARD POURRAIT ÊTRE UNE CAUSE D’ACCIDENT OU DE DÉFAILLANCE DU MATÉRIEL.
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RIEL DE COMMUNICATION PORTATIF. LA PRUDENCE EXIGE QUE LES PRÉCAUTIONS À PRENDRE
DANS CE CAS SOIENT SIGNALÉES AUX ENDROITS VOULUS DANS VOTRE USINE.
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INSÉRÉ DANS UNE SYSTÈME ACTIF. CES À-COUPS PEUVENT ÉGALEMENT OCCASIONNER DES
BLESSURES OU DES DOMMAGES MATÉREILS.
NOTICE
The information contained in this document is subject to change without notice.
Elsag Bailey, its affiliates, employees, and agents, and the authors and contributors to this publication specif-
ically disclaim all liabilities and warranties, express and implied (including warranties of merchantability and
fitness for a particular purpose), for the accuracy, currency, completeness, and/or reliability of the information
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or equipment selected in whole or part with the user of/or in reliance upon information contained herein.
Selection of materials and/or equipment is at the sole risk of the user of this publication.
This document contains proprietary information of Elsag Bailey, Elsag Bailey Process Automation, and
is issued in strict confidence. Its use, or reproduction for use, for the reverse engineering, development
or manufacture of hardware or software described herein is prohibited. No part of this document may be
photocopied or reproduced without the prior written consent of Elsag Bailey.

I-E96-309A
Preface
The Digital Slave Module (IMDSM05) is an interface for up to
sixteen digital I/O field signals to the Infi 90 Process Manage-
ment System. These digital inputs and outputs are used by
master modules to monitor and control a process.
The DSM slave module is used with the Multi-Function Proces-
sor (MFP) and Logic Master Module (LMM). The input/output
circuitry on the DSM allows it to handle signals between Infi 90
MFPs/LMMs and digital devices in the process system. The
DSM also handles signals between MFPs/LMMs and Digital
Logic Stations (NDLS02).
This modular flexibility suits the DSM to a wide range of appli-
cations. The advanced electronic design of the DSM gives the
module the capability to handle the increasing throughput
demands of process control systems.
This instruction explains the slave module features, specifica-
tions and operation. It details the procedures you must follow
to set up and install an IMDSM05 module, and explains status
indicators that help in system test and diagnosis.
The system engineer or technician should read and under-
stand this instruction before installing and operating the slave
module. A complete understanding of the Infi 90 system is ben-
eficial to the user.

I-E96-309A
®
List of Effective Pages
Total number of pages in this manual is 43, consisting of the following:
Page No. Change Date
Preface Original
List of Effective Pages Original
iii through vii Original
1-1 through 1-6 Original
2-1 through 2-4 Original
3-1 through 3-10 Original
4-1 Original
5-1 through 5-2 Original
6-1 Original
7-1 Original
8-1 Original
A-1 through A-5 Original
B-1 through B-2 Original
C-1 Original
D-1 through D-2 Original
When an update is received, insert the latest changed pages and dispose of the super-
seded pages.
NOTE: On an update page, the changed text or table is indicated by a vertical bar in the outer mar-
gin of the page adjacent to the changed area. A changed figure is indicated by a vertical bar in the
outer margin next to the figure caption. The date the update was prepared will appear beside the
page number.

vi I-E96-309A
Safety Summary
®
GENERAL
WARNINGS Equipment Environment
All components, whether in transportation, operation, or storage
must be in a noncorrosive environment.
Electrical Shock Hazard During Maintenance
Disconnect power or take precautions to ensure that contact with
energized parts is avoided when servicing.
Special Handling
This module uses Electrostatic Sensitive Devices (ESD).
SPECIFIC
WARNINGS Disconnect power before installing dipshunts for slave modules on
the MMU backplane (slave expander bus). Failure to do so could
result in severe or fatal shock. (p. 3-9)
SPECIFIC
CAUTIONS Improper dipshunt configuration can short 24 Volts to ground.
(p. B-1)

I-E96-309A vii
Sommaire de Sécurité
AVERTISSEMENTS
D’ORDRE
GÉNÉRAL
Environment de l'equipement
Ne pas soumettre les composants a une atmosphere corrosive lors
du transport, de l'entreposage ou de l'utilisation.
Risques de chocs electriques lor de l'entretien
S'assurer de debrancher l'alimentation ou de prendre les precau-
tions necessaires a eviter tout conatact avec des composants sours
tension lors de l'entretien.
Precautions de Manutention
Ce module contient des composantes sensibles aux decharges
electro-statiques.
AVERTISSEMENTS
D’ORDRE
SPÉCIFIQUE
Couper l'alimentation avant d'installer les dipshunts sur la plaque
arriere du chassis de montage de modules (MMU). Toute negli-
gence a cet egard constitue un risque de choc pouvant entrainer
des blessures graves, voire moretlles. (p. 3-9)
ATTENTIONS
D’ORDRE
SPÉCIFIQUE
La configuration inadequate des dipshunts peur court-circuiter l'ali-
mentation de 24 volts a la terre. (p. B-1)

Table of Contents
Page
I-E96-309A iii
SECTION 1 - INTRODUCTION....................................................................................................1-1
OVERVIEW ..................................................................................................................1-1
INTENDED USER.........................................................................................................1-1
MODULE DESCRIPTION ..............................................................................................1-1
FEATURES...................................................................................................................1-2
INSTRUCTION CONTENT .............................................................................................1-3
HOW TO USE THIS MANUAL .......................................................................................1-3
GLOSSARY OF TERMS AND ABBREVIATIONS .............................................................1-4
REFERENCE DOCUMENTS..........................................................................................1-5
NOMENCLATURE ........................................................................................................1-5
SPECIFICATIONS.........................................................................................................1-5
SECTION 2 - DESCRIPTION AND OPERATION........................................................................2-1
INTRODUCTION...........................................................................................................2-1
INPUTS AND OUTPUTS ................................................................................................2-1
Input Circuit..........................................................................................................2-2
Input Circuit Description .......................................................................................2-2
Output Circuit Description.....................................................................................2-2
Input Circuit Connections......................................................................................2-2
CONTROL LOGIC .........................................................................................................2-3
Point Data Byte For MFP/LMM ..............................................................................2-3
Status Byte............................................................................................................2-3
LOGIC POWER.............................................................................................................2-4
SLAVE EXPANDER BUS...............................................................................................2-4
UNIVERSAL SLAVE EXPANDER BUS INTERFACE........................................................2-4
SECTION 3 - INSTALLATION.....................................................................................................3-1
INTRODUCTION...........................................................................................................3-1
SPECIAL HANDLING ....................................................................................................3-1
UNPACKING AND INSPECTION ....................................................................................3-1
SETUP .........................................................................................................................3-2
Enable Switch (MFP/LMM).....................................................................................3-3
Slave Address Selection Switch (MFP/LMM) ...........................................................3-3
Module Configuration Switch .................................................................................3-5
Default Value Switch .............................................................................................3-6
Digital Input/Output Jumpers...............................................................................3-6
Master Selection Jumpers......................................................................................3-8
Termination Unit/Module Configuration ................................................................3-8
Physical Installation...............................................................................................3-9
WIRING CONNECTIONS AND CABLING .......................................................................3-9
Wiring....................................................................................................................3-9
Cable Connections ...............................................................................................3-10
FUSING......................................................................................................................3-10
PRE-OPERATING ADJUSTMENTS ..............................................................................3-10

iv I-E96-309A
Table of Contents (continued)
Page
®
SECTION 4 - OPERATING PROCEDURES................................................................................4-1
INTRODUCTION .......................................................................................................... 4-1
OPERATOR/INTERFACE ............................................................................................. 4-1
START-UP.................................................................................................................... 4-1
SECTION 5 - TROUBLESHOOTING...........................................................................................5-1
INTRODUCTION .......................................................................................................... 5-1
ERROR MESSAGES AND CORRECTIVE ACTION ......................................................... 5-1
MASTER MODULE ERRORS ........................................................................................ 5-1
MODULE PIN CONNECTIONS ...................................................................................... 5-2
SECTION 6 - MAINTENANCE.....................................................................................................6-1
INTRODUCTION .......................................................................................................... 6-1
MAINTENANCE SCHEDULE ........................................................................................ 6-1
SECTION 7 - REPAIR/REPLACEMENT PROCEDURES...........................................................7-1
INTRODUCTION .......................................................................................................... 7-1
MODULE REPAIR/REPLACEMENT.............................................................................. 7-1
SECTION 8 - SUPPORT SERVICES...........................................................................................8-1
INTRODUCTION .......................................................................................................... 8-1
REPLACEMENT PARTS AND ORDERING INFORMATION ............................................. 8-1
TRAINING.................................................................................................................... 8-1
TECHNICAL DOCUMENTATION................................................................................... 8-1
APPENDIX A - NTDI01 TERMINATION UNIT CONFIGURATION ............................................A-1
INTRODUCTION ..........................................................................................................A-1
CONFIGURING NTDI01................................................................................................A-1
PREPARING DIPSHUNT XU17......................................................................................A-3
APPENDIX B - NTDO02 TERMINATION UNIT CONFIGURATION ..........................................B-1
INTRODUCTION ..........................................................................................................B-1
INSTALLATION ............................................................................................................B-1
APPENDIX C - NTLS01 TERMINATION UNIT CONFIGURATION ...........................................C-1
INTRODUCTION ..........................................................................................................C-1
INSTALLATION ............................................................................................................C-1
APPENDIX D - NIDI01 TERMINATION UNIT CONFIGURATION ............................................. D-1
INTRODUCTION ..........................................................................................................D-1
INSTALLATION ............................................................................................................D-1

List of Figures
No. Title Page
I-E96-309A v
1-1. Infi 90 Communication Levels ................................................................................1-2
2-1. DSM Block Diagram...............................................................................................2-1
2-2. I/O Circuit.............................................................................................................2-3
3-1. Switches and Jumpers...........................................................................................3-2
3-2. Address and Enable Switches ................................................................................3-3
3-3. Module Configuration Switch .................................................................................3-5
3-4. Default Value Switches ..........................................................................................3-7
3-5. Module Jumper Locations ......................................................................................3-7
4-1. DSM Front Panel ...................................................................................................4-1
A-1. Dipshunts and Terminal Blocks ............................................................................ A-1
A-2. Dipshunt, Terminal Block, and I/O Point Relationship .......................................... A-2
A-3. Dipshunt XU17..................................................................................................... A-3
A-4. Dipshunt Configurations....................................................................................... A-4
A-5. Terminal Assignment for NTDI01 .......................................................................... A-4
A-6. Cable Connections for NTDI01 .............................................................................. A-5
B-1. Cable Connections For NTDO02 ............................................................................ B-2
B-2. Terminal Assignments for NTDO02 ....................................................................... B-2
C-1. Cable Connections For NTLS01 ............................................................................. C-1
D-1. Cable Connections For NIDIO1.............................................................................. D-1
D-2. Terminal Assignments NIDIO1 .............................................................................. D-2
List of Tables
No. Title Page
3-1. Address Switch Settings (MFP/LMM)......................................................................3-4
3-2. Jumper Summary..................................................................................................3-8
3-3. Cable Connections ...............................................................................................3-10
5-1. P1 Power Pin Connections......................................................................................5-2
5-2. P2 Slave Expander Bus Connections ......................................................................5-2
5-3. P3 I/O Signal Pin Connections ...............................................................................5-2
6-1. Maintenance Schedule ...........................................................................................6-1
A-1. NTDI01 Configuration Summary ........................................................................... A-2
B-1. Configuration Summary........................................................................................ B-1
D-1. NIDI01 Configuration Summary ............................................................................ D-1

OVERVIEW
I-E96-309A 1 - 1
SECTION 1 - INTRODUCTION
OVERVIEW
The Digital Slave Module (IMDSM05) interfaces process field
inputs/outputs with the Multi-Function Processor and Logic
Master Module in the Infi 90 Process Management System.
There are sixteen I/O circuits on the DSM. These circuits may
be input or outputs. The DSM brings in sixteen separate digital
signals through the DSM I/O circuits to the master modules
for processing and monitoring. The DSM sends sixteen sepa-
rate digital signals through the DSM I/O circuits to process
control devices in the field. Digital control devices may be
relays, lamps, etc. A contact closure, switch or solenoid is an
example of a device that supplies a digital signal. Master mod-
ules provide the control functions; slave modules provide I/O
to the master modules. The DSM also works with the
Multi-Function Controller (MFC) master module.
This manual explains the purpose, operation and maintenance
of the Digital Slave Module (DSM). It addresses handling pre-
cautions and installation procedures. Figure 1-1 illustrates the
Infi 90 communication levels and the position of the DSM
within these levels.
INTENDED USER
System engineers and technicians should read this manual
before installing and operating the DSM. A module SHOULD
NOT be put into operation until this instruction is read and
understood. You can refer to the Table of Contents to find spe-
cific information after the module is operating.
MODULE DESCRIPTION
The DSM consists of a single printed circuit board that occu-
pies one slot in a Module Mounting Unit (MMU). It monitors
eight digital inputs and eight digital outputs. Twelve I/O cir-
cuits are isolated from each other; the remaining two pairs
share common positive input lines.
Two captive screws on the module faceplate secure it to the
MMU. Sixteen front panel LED status indicators (group A and
group B) display the input and output status.
The slave module has three card edge connectors for external
signals and power (P1, P2 and P3). P1 connects to common
(ground) and +5 VDC power (refer to Table 5-1). P2 connects
the module to the slave expander bus to communicate with an
MFP/LMM master module (refer to Table 5-2). Connector P3

INTRODUCTION
FEATURES
1 - 2 I-E96-309A
®
carries digital signals to a Termination Unit (TU) (refer to Table
5-3). The terminal blocks (physical connection points) for field
wiring are on the TU.
FEATURES
The modular design of the DSM, as with all Infi 90 modules,
allows for flexibility when you are creating a process manage-
ment system strategy. It is capable of bringing sixteen separate
digital signals (24 VDC) into/out of the system.
Multi-Function Processor and Logic Master Module interface to
the IMDSM05 on the slave expander bus. The DSM is a high
power slave. You can use up to 20 high power slaves on any
master (MFP/LMM) slave expander bus.
Individual jumpers on the DSM module configure each of the
I/O circuits as inputs/outputs for non-isolated operation with
Figure 1-1. Infi 90 Communication Levels
COMMUNICATION HIGHWAY (INFI-NET)
CONTROLWAY
MFP
DSM DSM
TU/TM TLS DLS
DIGITAL I/O
OTHER MODULES
OTHER SLAVES
SLAVE EXPANDER BUS
COMMUNICATION
MODULES
TP35718A

INTRODUCTION
INSTRUCTION CONTENT
I-E96-309A 1 - 3
read-back capabilities, or two-wire isolated outputs without
read-back capabilities.
The front panel LED status indicators provide a visual indication
of the input states to aid in system test and diagnosis. A DSM
can be removed or installed without powering the system down.
INSTRUCTION CONTENT
This manual consists of eight sections.
Introduction Is an overview of the DSM: Features, description and
specifications.
Description and
Operation Explains the module operation and describes the input
circuitry.
Installation Describes precautions to observe when handling DSMs and
setup procedures required before module operation. This sec-
tion also discusses switch and jumper settings, and installa-
tion procedures.
Operating Procedures Explains the front panel indicators and start-up of the slave
module.
Troubleshooting Describes the error indications and corrective actions to take.
Maintenance Has a maintenance schedule for the slave module.
Repair/Replacement
Procedures Explains how to replace the slave module.
Support Services Provides replacement part ordering information. It explains
other areas of support that Bailey Controls provides.
HOW TO USE THIS MANUAL
Read this manual before handling the DSM module. Refer to
the sections in this list as needed for more information.
1. Read Section 4 before you connect the IMDSM05.
2. Read and do the steps in Section 3.
3. Refer to Section 5 for what to do if a problem occurs.
4. Refer to Section 6n for the scheduled steps needed to main-
tain the DSM.
5. Refer to Section 7 for how to replace a module.
6. Use Section 8 for how to order parts. This section also tells
you some services Bailey offers.

INTRODUCTION
GLOSSARY OF TERMS AND ABBREVIATIONS
1 - 4 I-E96-309A
®
GLOSSARY OF TERMS AND ABBREVIATIONS
Term Definition
Configuration A control strategy with function blocks.
Controlway A redundant peer-to-peer communication path for point data transfer between intelli-
gent modules within a process control unit.
Digital A discrete input signal having only two states: on or off.
Dipshunt Dual in-line package with shorting bars.
Dipswitch A dual in-line package that contains single pole switches.
EWS Engineering Work Station; an integrated hardware and software personal computer
system for configuring and monitoring Infi 90 modules and systems.
Function Code An algorithm that defines specific functions. These functions link together to form the
control strategy.
LED Light Emitting Diode; the module front panel indicator that shows status and error
messages.
LSB Least Significant Bit; the bit of a binary number that carries the least numerical
weight.
Master Module One of a series of controller modules designed to direct field processes through a
slave module. The multi-function processor is an example.
MFP Multi-Function Processor Module; a multiple-loop controller with data acquisition and
information processing capabilities.
MMU Module Mounting Unit; a card cage that provides electrical and communication sup-
port for Infi 90 modules.
MSB Most Significant Bit; the bit of a binary number that carries the most numerical weight.
OIS Operator Interface Station; integrated operator console with data acquisition and
reporting capabilities. It provides a window into the process for flexible control and
monitoring.
PCU Process Control Unit; rack type industrial cabinet that contains master, slave and
communication modules, and their communication paths.
Slave Expander Bus Parallel address/data bus between the master module and the slave.
TM Termination Module: Provides input/output connection between plant equipment and
the Infi 90 process modules. The termination module slides into a slot in the termina-
tion mounting unit.
TU Termination Unit: Provides input/output connection between plant equipment and the
Infi 90 process modules. The termination unit is a flat circuit board for panel
mounting.

INTRODUCTION
REFERENCE DOCUMENTS
I-E96-309A 1 - 5
REFERENCE DOCUMENTS
NOMENCLATURE
The following modules and equipment can be used with a
DSM:
SPECIFICATIONS
I-E96-201
I-E96-202
I-E96-209
I-E93-911
I-E96-110
I-E93-916
I-E92-501-2
I-E93-900-20
Multi-Function Processor (IMMFP01)
Multi-Function Processor (IMMFP02)
Logic Master Module (IMLMM02)
Termination Unit Manual
Operator Interface Station
Engineering Work Station
Configuration and Tuning Terminal
Function Code Application Manual
IMMFP01/02
IMLMM02
NDLS02
NIDI01
NTDI0
NTDO02
NTLS01
NKTM01
NKTU02
NKTU01
Multi-Function Processor Module
Logic Master Module
Digital Logic Station
Termination Module,
Digital Inputs\Outputs
Termination Unit,
Digital Inputs\Outputs
Termination Unit, Digital Outputs
Termination Unit, Digital Logic Station
Cable, Termination Module
Cable, Termination Module
Cable, Termination Unit
Power Supply
Current Consumption
Dissipation
± 5 VDC Logic Supply ±5%
±24 VDC I/O Supply 21.6 VDC to 27.0 VDC
5 VDC: 757 mA typical
867 mA maximum
4.6 Watts (logic)
5.0 Watts (I/O)
Inputs
24 V Logic
High Level Input Voltage
24 V Logic
Low Level Input Voltage
24 V Logic
Low Level Input Current
V I/O 4.0 Volts minimum
V I/O 16.5 Volts maximum
-11.8 mA maximum

INTRODUCTION
SPECIFICATIONS (continued)
1 - 6 I-E96-309A
®
SPECIFICATIONS
(continued)
Outputs
24 V Logic
Low Level Output Voltage
24 V Logic
High Level Output Current
24 V maximum
Sink Current
10 V typical (sink current = 120 mA)
2.0 V maximum
100 µA maximum
120 mA
Propagation Delay Times
Input
Output
Low to high 50 µsec. typical
High to low 25 µsec. typical
Low to high 25 µsec. typical
High to low 100 µsec. typical
Isolation Voltage 150 V RMS Channel to channel
150 V RMS Channel to logic
Surge Withstand Meets requirements of IEEE Capability
Standard 472-1974, on input and output channels.
Maximum Wire Sizes 12 AWG from field wiring to NTDI01
Environmental Specifications
Ambient Temperature
Relative Humidity
Atmospheric Pressure
Air Quality
0oto 70oC (32oto 158oF)
0% to 95% up to 55oC (131oF) (non-condensing)
0% to 45% at 70oC (158oF) (non-condensing)
Sea level to 3 km. (1.86 miles)
Noncorrosive
Mounting Uses 1 slot in Infi 90 Module Mounting Unit.
Certification CSA certified for use as process control equipment
in an ordinary (non-hazardous) location.
Specifications subject to change without notice.

INTRODUCTION
I-E96-309A 2 - 1
SECTION 2 - DESCRIPTION AND OPERATION
INTRODUCTION
This section explains the input and output circuitry, control
logic, power and connections for the Digital Slave Module
(DSM). The DSM is a digital input/output interface to a
Multi-Function Processor (MFP) module or Logic Master Mod-
ule (LMM). The MFP/LMM support up to 20 DSMs. These mod-
ules provide the control functions. The master module
communicates with its slave module on a 12-line slave
expander bus as shown in Figure 1-1. Each slave on the slave
expander bus has a unique address set by the slave address
dipswitch (S1) (see Figure 2-1).
The DSM has two identical but independent I/O groups. Each
group of eight I/O points (circuits) can operate as inputs or outputs.
All points in the group are the same; all are inputs or all are out-
puts. Each point in the group handles one input or output signal .
INPUTS AND OUTPUTS
Digital field inputs are 24 VDC. This voltage indicates an ener-
gized (ON) field device; a 0 VDC input indicates a de-energized
(OFF) field device. Jumpers on the DSM select the outputs for
non-isolated or isolated two-wire configuration. Section 3
explains the jumper connections.
NOTE: Due to the number of pins on the P3 connector, twelve
inputs/outputs are separate while the remaining two pairs share ter-
minals. The positive (common) side of Point 5 and 6 are tied
together in each group and Point 7 and 8 are tied together in each
group (refer to Table 5-3). These points must use the same contact
voltage (24 VDC). They are not isolated from each other.
Figure 2-1. DSM Block Diagram
LOGIC
POWER
FIELD
INPUT/
OUTPUT
INPUT OR
OUTPUT
READBACK
CONTROL
LOGIC
ADDRESS
SWITCH
MODULE
STATUS
GROUP A
LEDs
GROUP B
LEDs
SLAVE EXPANDER
BUS INTERFACE
GROUP A
GROUP B
SLAVE
EXPANDER
BUS
P1
P3
P2
TP23054A
S1
1
OPEN
8
OUTPUT
ISOLATED
DRIVERS

DESCRIPTION AND OPERATION
INPUTS AND OUTPUTS
2 - 2 I-E96-309A
®
Input Circuit
Figure 2-1 shows the DSM block diagram and signal flow
through the module. The input isolation block consists of cur-
rent limiters and optocouplers to isolate the sixteen field inputs
(or outputs) from the module circuitry. The input circuits pro-
vide 150 VDC isolation between input and logic circuits, and
other input channels.
The isolated outputs are sent to a read buffer in the control
logic block. If an input is energized, it also causes a corre-
sponding input status LED on the front panel to light.
The control logic block consists of buffers that hold the input
and status byte values. The slave expander bus interface
allows the master module to read these bytes.
Input Circuit Description
When the DSM uses an I/O point as an input, a signal from the
controlling master controls the logic level of the circuit's signal
line.This external signal may set the line to logic common (0 VDC)
or to logic high (24 VDC). When the input signal is low, current
flows through the input circuit. Other circuitry in the DSM senses
the current flow, lights the front panel LED that corresponds to
the I/O point, and passes a logic 1 to the module. When a signal
is high, no current flows through the input circuit. The front
panel does not light and a logic 0 passes into the module.
Output Circuit Description
When the DSM uses an I/O point as an output, the module
controls the logic level of the signal with a transistor. The tran-
sistor energizes to switch the signal line low. The front panel
light associated with the I/O point lights and the module out-
puts a logic 1. When the transistor is not energized, the cir-
cuitry sets the signal line high. The front panel LED for the I/O
point does not light and the outputs a logic 0.
NOTE: During a power on reset of the DSM such as during installa-
tion, before reconfiguration, or after a power outage, the module
latches all outputs off if the configuration switch is set to hold values
on default. The outputs remain off until a master re-establishes com-
munication with the DSM. The outputs go to preprogrammed default
states if both the master module is active and the configuration
switch is set to go to the preprogrammed state on default.
Figure 2-2 shows a typical I/O circuit.
Input Circuit Connections
The contact input signals connect to the 30-pin card edge con-
nector P3 (shown in Figure 2-1), using a termination cable
from a termination unit or module.

DESCRIPTION AND OPERATION
CONTROL LOGIC
I-E96-309A 2 - 3
CONTROL LOGIC
Function Code (FC) 84 in the master module configuration
accesses the DSM on the slave expander bus. It also allows the
master module to automatically read point (input) data or sta-
tus data from the DSM. This data is output by the buffer cir-
cuits (control logic) to the slave expander bus interface (see
Figure 2-1). The slave address in FC 84 must be the same as
the address set on the slave address dipswitch (S1).
Point Data Byte For MFP/LMM
The DSM transfers two 8-bit bytes of point data at once to the
master module. Each byte corresponds to group A or group B
inputs. Each bit of data represents one input. The bit value
reflects the state of that input, either open (logic 1) or closed
(logic 0). The DSM transfers two 8-bit status bytes at once to
the master. One byte for group A and one byte for group B. The
MFP or LMM reads the status bytes associated with that group
to determine if it will read the data in the point groups set as
inputs or write data to the groups set as outputs.
Status Byte
The status byte ensures module integrity and tells the master if
the data in the 8-bit data byte is from an input group or an
output group. It makes sure slave expander bus communica-
tion and master module configuration are correct. The master
Figure 2-2. I/O Circuit
+5 VDC
+5VDC
+24 VDC
5.36 K
1.5 K220 K
10 K 3.52 K
123
INPUT CIRCUIT
OUTPUT CIRCUIT
TP35714A

DESCRIPTION AND OPERATION
LOGIC POWER
2 - 4 I-E96-309A
®
module reads the status byte and compares it to an expected
value. If a mismatch occurs, it flags the error and marks the
point as bad quality.
LOGIC POWER
Logic power (+5 VDC) drives the DSM circuits. It connects
through the top 12-pin card edge connector (P1) shown in Fig-
ure 2-1.
SLAVE EXPANDER BUS
The Infi 90 slave expander bus is a high speed synchronous
parallel bus. It provides a communication path between MFP
or LMM master modules and slave modules. The master mod-
ule provides the control functions and the DSM module pro-
vides inputs/outputs to the master module. The P2 card edge
connector of the DSM and master module connect to the bus.
The slave expander bus is twelve parallel signal lines located
on the Module Mounting Unit (MMU) backplane. A 12-position
dipshunt placed in a connection socket on the MMU backplane
connects the bus between the master and slave modules. Cable
assemblies can extend the bus to six MMUs.
A master module and its slaves form an individual subsystem
within a Process Control Unit (PCU). The slave expander bus
between master/slave subsystems must be separated. Leaving
a dipshunt socket empty or not connecting the MMUs with
cables separates them.
UNIVERSAL SLAVE EXPANDER BUS INTERFACE
The DSM uses a semi-custom gate array to perform the slave
expander bus interface function. All the control logic and com-
munication protocol are built into an integrated circuit (IC).
This IC provides the following functions:
•Address comparison and detection.
•Function code latching and decoding.
•Read strobe generation.
•Data line filtering of bus signals.
•On-board bus drivers.
NOTE: Address information (a single 6-bit module address from the
master) enters the DSM through the slave expander bus interface
only if the addresses match. Refer to the Installation section for
more information.

INTRODUCTION
I-E96-309A 3 - 1
SECTION 3 - INSTALLATION
INTRODUCTION
This section explains what you must do before you put the Dig-
ital Slave Module (IMDSM05) into operation. DO NOT PRO-
CEED with operation until you read, understand and do the
steps in the order in which they appear.
NOTE: Refer to Product Instruction I-E93-911 for termination device
wiring instructions.
SPECIAL HANDLING
NOTE: Always use Bailey's Field Static Kit (P/N 1948385A2 - con-
sists of wrist strap, ground cord assembly, alligator clip) when work-
ing with modules. The kit is designed to connect a technician and
the static dissipative work surface to the same ground point to pre-
vent damage to the modules by electrostatic discharge.
The Digital Slave Module (DSM) uses electrostatic sensitive
devices. Follow Steps 1 through 4 when handling:
1. Keep the module in its special anti-static bag until you are
ready to install it in the system. Save the bag for future use.
2. Ground the anti-static bag before opening.
3. Verify that all devices connected to the module are properly
grounded before using them.
4. Avoid touching the circuitry when handling the module.
UNPACKING AND INSPECTION
1. Examine the hardware immediately to verify it has not been
damaged in transit.
2. Notify the nearest Bailey Controls Sales Office of any dam-
age.
3. File a claim for any damage with the transportation com-
pany that handled the shipment.
4. Use the original packing material and container to store the
hardware.
5. Store the hardware in an environment of good air quality,
free from temperature and moisture extremes.