BCM Advanced Research IN440EX User manual

BCM Advanced Research 1
Advanced Pentium II
Motherboard
IN440EX
USER’S MANUAL
Copyright 1998 GVC CORPORATION. ALL RIGHTS RESERVED

BCM Advanced Research 2
NOTICE
Rights:
No part of this manual, including but not limited to the products and software described in it, may be
reproduced, transmitted, transcribes, stored in a retrieval system, or translated in any form or by any means
without the expressed written permission of GVC “Corporation or BCM Advanced Research, Inc.
Products and corporate names appearing in this manual may or may not be registered trademarks or copyrights of
their respective companies and are used only for identification or explanation purposes without intent to infringe.
¨Intel, MMX and Pentium are registered trademarks of Intel.
¨IBM and OS/2 are registered trademarks of IBM.
¨AWARD is a registered trademark of American Megatrends Inc.
¨Winbond is a registered trademark of Winbond Electronics Inc.
Responsibility:
This manual is provided “As is” with no warranties of any kind, either expressed or implied, including, but not limited
to the implied warranties or conditions of this product’s fitness for any particular purpose. In no event shall we be
liable for any loss of profits, loss of business, loss of data, interruption of business, or indirect, special, incidental, or
consequential damages of any kind, even the possibility of such damages arising from any defect or error in this
manual or product. We reserve the right to modify and update the user manual without prior notice.

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COMPLIANCE & CERTIFICATE
ISO 9001 Certificate:
This device was produced in our plant with advanced quality system certified by DNV QA Ltd. in
according to ISO 9001. This Certificate is valid for:
DESIGN & MANUFACTURE OF MOTHER BOARDS AND PERSONAL COMPUTERS.
CE Declaration:
CE marking is a visible declaration by the manufacturer or his authorized representatives that the
electrical equipment to which it relates satisfies all the provisions of the 1994 Regulations.
FCC Compliance:
FCC stands for Federal Communications Commission.
This product complies with FCC Rules Part 15 and has been tested, and complied with the EMI rules by
a certified body. In normal operation, there shall be no harmful interference caused by this device nor
shall this devise accept any interference received, including interference that may cause undesired
operation of this product.
Microsoft Windows Compliance:
Microsoft, Windows NT, Windows, and the Windows Logo are registered trademarks of Microsoft Corporation.

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EASY INSTALLATION
The following “Easy Installation” steps are for users accustomed to the assembly of a
computer system. For those individuals requiring more specific information please
refer to the more detailed descriptions located within the latter chapters of this
manual. Note: You must keep your power cable unplugged until the following
installation steps are completed.
Getting Start:
Touch a grounded metal surface to release static electricity stored in your body
before unpacking your motherboard. For details please refer to Precaution section in Chapter 3.
Install the CPU by correctly aligning the CPU with the Slot 1
as noted in the motherboard diagram. Once aligned, press
down on the CPU gently but firmly. Next, install either the
3.3 volt unbuffered EDO or SDRAM into the 168 pin
DIMMs. See Sec. 3.2 & Sec. 3.3.
After completing the above steps, install any expansion
cards into the appropriate PCI, ISA or AGP slots and screw
them tight to the chassis. See Sec. 3.4.
Plug in all cables included in the package except for the
power cord. Please see Sec. 3.5.
Please recheck all steps to ensure no mistakes
have been made and then plug in the power cord
and turn on the power to enter the BIOS setup, Chapter 4.
Release
Static Electricity
Couple
Connectors Of
HDD, FDD…
Install All
Expansion Slots
Insert CPU &
RAM

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CONTENTS
FEATURES: 9
1 11
INTRODUCTION 11
Overview 11
Processor Subsystem 11
Cache Subsystem 11
Memory Subsystem 12
Data Integrity Subsystem 12
A.G.P. Interface 12
Embedded PCI Devices 13
PCI Bus Master IDE 13
PCI Add-in Cards 13
Embedded A.G.P. Devices 13
Embedded I/O Subsystem 13
System Management Subsystem 13
Advanced Configuration and Power Interface “ACPI” 13
2 34
FUNCTIONAL ARCHITECTURE 34
Processor Subsystem 34
SLOT-1 Processor Socket Pinout 34
Processor Upgrade 34
Processor Heat Sink 34
Memory Subsystem 34
DRAM Subsystem 34
DRAM (DIMM) Sockets 35
System BIOS 35
L2 Cache Subsystem 35
Cacheable and Non-Cacheable Regions 35
Address Maps 36
Memory Map 36
I/O Address Map 36
Interrupt Allocation 36
DMA Channels 36
Video Subsystem 36

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FEATURES 37
3D Accelerator 37
Video Accelerator/Video Capture 37
2D Accelerator 38
General Features 38
Video Modes 39
Video Memory 40
Video (Monitor) Connector 41
Sound Subsystem 42
Sound Features 42
Line Out Connector 42
Microphone In Connector 42
Line In Connector 42
3D Sound 43
CD-IN Connector (Audio) 43
Modem-In Connector 43
PCI/ISA Expansion Slots 43
ISA Interface 43
ISA/PCI Expansion Slots 43
ISA Bus Speed 44
AT Bus Refresh 44
Storage Subsystem 44
IDE Hard Disk Drive Interface 44
Floppy Disk Drive Interface 44
I/O Subsystem 45
Serial Ports 45
Parallel Port 46
Keyboard Interface 47
Mouse Interface 47
Universal Serial Bus Connectors 48
Real-Time Clock 49
Non-volatile CMOS Memory Battery 49
IR (Infra-Red) Support 50
IRDA Header (J19) 50
Miscellaneous Connectors 50
PC Speaker Connector 50
CPU Fan Connector 50
Hard Drive LED Connector 50
Suspend (Sleep) Connector (J27) 51
Power Button Switch (J29) 51
Green/Power-on LED Connector 51
Reset Button Connector (J30) 51
3 52
CONFIGURATION 52
Product Configuration 52

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Processor Speed Select Jumper 52
DRAM Subsystem Configurations 52
4 53
BIOS 53
The Main Menu 55
Main Menu Selection 56
Standard CMOS Setup 58
Bios Feature Setup 60
Power Management Setup 62
Load BIOS Defaults 63
Integrated Peripherals 64
Supervisor Password 65
User password 65
Save & Exit Setup 65
5 66
ELECTRICAL AND MECHANICAL SPECIFICATIONS 66
Absolute Maximum Ratings 66
Electrical 66
DC Specifications for 5V and 3.3V Signals 67
Power Supply 67
Power Supply Connectors 67
Input Power Budget 67
Mechanical 68
System Interfaces 68
User-Accessible Sockets 68
Back-Panel Interfaces 68
Manufacturability/Serviceability 69
Regulatory 69

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Photo Of the Motherboard
Drawing of Motherboard I/O Back Plane
Line Line Mic
Out In In
VGA
Parallel
SerialUSB
PS/2 Key/Mouse
Key/Mopuse
GAME

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FEATURES:
Processor/Cache:
Processor Intel “Deschutes”, “Klamath”, Celeron” Pentium II 233 ~ 333 MHz Operation with
FSB (Front Side Bus) 66 MHz
Upgrades Slot 1
Cache CPU Cartridge Integrated; Write Back and Write Through, direct mapped
organization “BSB” Cache
Size 0KB or 512KB
System Memory
Memory Size 8MB Min up to 256MB with Un-buffered SDRAM
Memory Sites 2 DIMM Sockets. SDRAM. Auto-detect w/Table Free Configuration Double
Density DIMMs.
ECC/EC Non-ECC support.
DIMM Type 8, 16, 32, 64 and 128MB. 64-bit non-ECC
Memory Speed SDRAM 66Mhz parameter for synchronous memory.
Chipset 82440EX AGP/PCI/ISA Chipset
ISA/PCI Bus PCI Level 2.1. 33 MHz Zero Wait State
Graphics Support
“AGP” ATI 3D Rage Pro Turbo 2X or Rage IIC, 66MHz AGP with sidebands and
pipelining 64-bit PCI Graphics Accelerator.
Video Memory SGRAM @ 66MHz (128Kx32 or 256Kx32x2)
Memory Capacity 2MB or 4MB on the motherboard,
Integrated I/O
I/O Controller Winbond W83977TF (Plug & Play Compliant) Serial Ports One 9 pin connectors for
dual asynchronous serial ports. High speed 16C550 compatible serial ports.
Infrared Interface Infrared port with FIR, IrDA and ASKIR
Parallel Port One 25 pin supporting EPP, ECP and Centronics Interface
Hard Disk Controller PCI Bus Mastering IDE. Native and Compatible Mode Support. IDE Transfer with
Scatter Gather. “Ultra 33” Synchronous DMA. Enhanced IDE PIO mode 4
(16MB/s) Independent IDE timing. FIFOs for PCI Burst Transfers.
Swap-Bay Support. Integrated 8x32-bit buffer for IDE PCI Burst Transfers
Hard Disk Connector 2 PCI IDE Connectors for 4 Drives Support
Floppy Controller 720 KB, 1.2, 1.44 and 2.88 MB support in non-FIR mode
Keyboard Port PS/2 (Integrated in the FDC37C77X)
Mouse Port PS/2 (Integrated in the FDC37C77X)
Real Time Clock Integrated in the PIIX4 (DS1287 Compatible)
System Monitor Winbond W83781D; Voltage/Temperature/Fan Speed/Chassis Intrusion
External Communication Ports
Serial Bus Universal Serial Bus (USB), integrated with Core Logic

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Integrated Sound
Sound Chip ESS Solo –1 Business Audio
CODEC 16-bit Stereo
FM Synthesis ESFM™ Music Synthesiser
Sound Effects 3D stereo effects
System BIOS
BIOS Type Winbond based 2Mbit Flash
Hard Disk Driver IDE, Auto-configuring
Plug&Play Support Steerable DMA Channels and Interrupts. ISA Plug&Play
Special Features PC-98 ready. Multi-Boot. PCI Add-In cardauto- config.
Green Features
Power Management APM 1.2,
Advanced Features ACPI (Advanced Configuration and Power Interface) compliant hardware for use
with APM & PNP-BIOS APIs
Jumpers and Front Panel Connectors
Connectors Reset switch. Suspend/Resume Button. Speaker. HD & PWR LED. Power Button.
IR. (Jumpers CPU Speed Multiplier. Password/CMOS Clear.
Headers and Rear Panel Connectors
Connectors Video. Parallel and Serial 1 Ports. Keyboard. Mouse. Line-Out. Mic., Line-In,
game/midi USB 1&2
Headers Serial 2. CPU Fan.
Headers and Connectors
Connectors None
Headers Floppy. IDE 1&2. CD-Audio In. Modem Audio. Aux-In. Reset switch. Speaker.
Suspend/Resume Button. HDD & Power LED. Chassis Fan.
Mechanical
Board Style MicroATX Form Factor
Board Size/Type 9.6” x 9.0”, Four Layer Board
Expansion Slots
Description Two PCI Expansion connectors and two ISA Expansion connectors.

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1 Introduction
This section provides an overview for the MicroATX Pentium II based PCI/ISA Printed Wiring Assembly
(PWA) code-named "IN440EX". It describes functional blocks and their relationship. The following diagram
shows the functional blocks
Overview
The IN440EX is an implementation of BCM Advanced Research for a High-Volume MicroATX motherboard featuring
these subsystems:
•Intel Pentium™ II MMX Processor cartridge support through the SLOT 1 connector
•Intel 82440EX PCIset: 82443EX (“PAC” PCI A.G.P. Controller) and 82371SB (“PIIX4” PCI-ISA-IDE
Xcelerator)
•Accelerated Graphics Port “AGP” connector
•PCI IDE Bus Master interface
•Embedded advanced I/O support
•System Management Logic
•Advanced multiple Audio interface
•USB (Universal Serial Bus)
•System Monitoring Hardware
•MicroATX form-factor motherboard
The targeted Operating Systems for the IN440EX are: Windows 95, Windows 98 and Windows NT.
Processor Subsystem
The IN440EX has provisions to support the following processors: Intel Pentium™ II Processor with MMX™
technology (Deschutes) operating at 333/66, 300/66, 266/66 and 233/66 MHz. The Processor speeds are selectable
with a four, (4) jumper block combination for the bus-to-core frequency ratio and CPU bus speed. The bus-to-core
ratio is either 2/7, 1/4, 2/9 or 1/5 yielding the bus/core frequency; 66/233, 66/266, 66/300 or 66/333 MHz respectively.
High-performance features, including pipelined 32-bit addressing, 64-bit data, 16KB/16KB Instruction/Data Write-
back or Write-through 2-way set associative primary cache. 0KB/512KB Write-back direct mapped secondary cache on
the CPU Cartridge using a Back-Side-Bus (BSB). Two (2) Memory DIMM for support of SDRAM.
Two onboard DC/DC converters supply the +2.5 Volts for the CPU I/O voltage and the +1.5 Volts GTL+ bus voltage
(VTT). An on-board switching power converter supplies the CPU core voltage (VCORE), the switcher supports the
PentiumII Voltage-ID pins for auto-voltage programming of the switcher supply.
Cache Subsystem
The cache and control functions are part of the PentiumII Processor. The cache SRAM interface is through the
processor’s Back-Side-Bus (BSB) and is included within the CPU cartridge.
The IN440EX can accept either the PentiumII cartridge with 512KB of second level (L2) Pipelined Burst SRAM
cache. The PentiumII second level cache supports a direct mapped organization with a write-back policy, providing
all necessary snoop functions and inquire cycles. Cacheability of the entire memory space in the first level cache is
supported. For the second level cache only the first 512MB of main memory is cacheable, and only main memory
controlled by the PAC DRAM interface will be cached, PCI and ISA memory is not cached.

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Memory Subsystem
The IN440EX DRAM controller supports a 64-bit memory data interface, optionally supporting 64-bit wide DIMM
modules, without ECC/EC. The DRAM types supported are Synchronous DRAM (SDRAM). SDRAM is supported at
66 MHz using symmetrical addressing.
The IN440EX Main Memory interface provides two (2) 168-pin DIMM socket (DIMM0 and DIMM1) sites, allowing
system memory from 8MB to 256MB of SDRAM.
The DIMM sockets support either single or double-sided ‘Unbuffered DIMM’ modules. The installed DRAM type
can be 8MB, 16MB, 32MB, 64MB or 128MB DIMMs. The DRAM Controller uses the JEDEC standard Serial
Presence Detect (SPD) Mechanism to detect memory and array configurations, there is no jumper settings required for
the memory size. Memory is automatically detected by the system BIOS.
Rules for Populating the DIMM memory array
•DIMM sockets can be populated in any order.
•The DRAM Timing register, which provides the DRAM speed grade control for the entire
memory array, will be programmed to use the timings of the slowest DRAMs installed.
Data Integrity Subsystem
Several data integrity features are included in the system. These are 64-bit DRAM interface for EX chipset,
parity generation and checking on the PCI Bus and A.G.P. (for PCI transactions).
PCI Bus.
The system implements parity generation/checking as defined by the PCI specification.
A.G.P. Bus.
For the operations on the A.G.P. interface using PCI protocol, the system supports Parity generation/checking as
defined by the PCI specification.
Main Memory DRAM Protection Modes.
The system supports three modes of data protection of the DRAM array:
•Non-ECC with Byte-Wise Write Support (Default mode, in this mode there is no provision for
protecting the integrity of data in the DRAM array.)
A.G.P. Interface
The A.G.P. is a high performance, component level interconnect targeted at 3D graphics applications and is based
on a set of performance enhancements to PCI. The IN440EX is designed to support the A.G.P. Interface.
The A.G.P. implementation is compatible with the Accelerated Graphics Port Specification. The system supports
only a synchronous A.G.P. interface coupling to the host bus frequency. The actual bandwidth will be limited by
the capability of the system’s memory, reaching the highest performance with fast SDRAM. The A.G.P. Interface
supports PCI operations as defined by the PCI specification. Electrically, only 66MHz PCI operations are
supported.

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For the definition of A.G.P. Interface functionality (protocols, rules and signalling mechanisms, as well as the
platform aspect of A.G.P. functionality), refer to the latest A.G.P. Interface Specification. This document focuses
only on the Controller specifics of the A.G.P. interface functionality.
Embedded PCI Devices
The PCI bus contains 1 embedded PCI device: PCI bus mastering IDE interface. The arbiter within the PAC
performs arbitration for PCI bus masters.
PCI Bus Master IDE
PIIX-4 provides an integrated Bus Mastering IDE controller with two high performance IDE interfaces for up to
four devices, such as Hard Drives and CD-ROM.
PCI Add-in Cards
High Performance PCI I/O cards can be used in the IN440EX through the PCI connector slots. The PCI bus is
specified to support 10 loads. Each embedded controller or bridge (Video, PCI to ISA Bridge) count as 1 load,
each PCI expansion slot used counts as 2 loads. To support multiple PCI devices in a single slot, add an
expansion board containing PCI to PCI Bridge to a secondary PCI segment.
Embedded A.G.P. Devices
The AGP bus contains 1 embedded device: The ATI 3D Rage Pro Turbo 1X Graphics Accelerator. The 3D Rage
Pro is a highly integrated graphics controller, integrating the 2D, 3D and video accelerators, palette DAC and
quadruple clock synthesiser.
Embedded I/O Subsystem
The Winbond Plug and Play Ultra I/O controller “W83977TF” represents the newest technology in functionality
and integration. While providing the standard PC I/O requirements the Ultra I/O complies with the ISA Plug-and-
Play standard version 1.0a, and provides for the recommended functionality to support Windows 95. The Ultra
I/O qualifies 16-bit address to allow relocation of 480 different addresses, with 13 IRQ options and 3 DMA
channels available for each logical device.
Other features of the Ultra I/O are: 8042 keyboard controller. An Infrared interface for Fast IR (FIR), IrDA and
ASKIR. Floppy interface. Two serial ports with 16-byte FIFOs. One EPP/ECP supported bi-directional parallel
port.
System Management Subsystem
The IN440EX support the System Monitor services using Winbond’s W83781D System Management chip. The
W83781D is used to monitor Voltage, Temperature, Fan Speed and Open Case Intrusion. The combination of the
System Monitor and the Wake On LAN (WOL) functionality achieves the Management Level 3.
Advanced Configuration and Power Interface “ACPI”

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The IN440EX supports the ACPI specification and its key elements; The Operating System Directed Power
Management (OSPM). ACPI evolves the existing collection of power management BIOS code, APM APIs, PNP
BIOS APIs, and so on into a well-specified power management and configuration mechanism. It provides support
for an orderly transition from existing (legacy) hardware to ACPI hardware, and it allows for both mechanisms to
exist in a single machine and be used as needed. ACPI evolves the existing motherboard configuration interfaces
to support these advanced architectures in a more robust, and potentially more efficient manner.
OSPM provides a new appliance interface to customers. In particular, it provides for a sleep button. This sleep
button is a “soft” button, which does not turn the machine physically off but signals the OS to go into a ‘soft off’
or sleeping state. ACPI defines two types of these “soft” buttons: one for putting the machine into sleep mode and
one for putting the machine into ‘soft off’ mode.
This gives the OEM two different ways to implement machines: A one or a two-button model. The button on the
one-button model can be used as a power button or a sleep button as determined by user settings. The two-button
model has an easily accessible sleep button and a separate power button. In either model, an override feature that
forces the machine to turn off or to reset without OS consent is also needed to deal with various rare, but
problematic, situations.
ACPI is neither a software nor a hardware specification, although it addresses both software and hardware and
how they must behave. ACPI is actually an interface specification.

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Functional Architecture
Processor Subsystem
The PentiumII processor connects with the system through a 242-pin connector type socket on the circuit board
labelled SLOT-1. The 242-pin configuration corresponds to a standard pinout that can accommodate the following
processors:
Intel Pentium™ II Processor with MMX (Celeron)
Intel Pentium™ II Processor with MMX (Klamath)
Intel Pentium™ II Processor with MMX (Deschutes)
SLOT-1 Processor Socket Pinout
The 242-pin connector is provided to allow for easy configuration at the time of manufacture or as a field upgrade
of the microprocessor.
Reference: SLOT-1
Connector Type: Female, 242 pin Dimm
Connector Part Number: Molex 71796-0001 (Or equivalent)
Processor Upgrade
The Pentium™ II processor maybe removed and replaced to accommodate Kamath or “Deschutes”. Changes to
the VCORE (Core Voltage Selection) are automatically adjusted.
Processor Heat Sink
The IN440EX M/B provides 12V power for the cooling fan through a 3-pin header with Fan-On control and Fan
Speed detection.
Memory Subsystem
DRAM Subsystem
The IN440EX has two 64-bit (168-pin) DIMM sockets (DIMM0 and DIMM1) allowing system memory from 8
MB to 256MB of main DRAM. There are no jumpers settings required for the memory size, which is
automatically detected by the system BIOS.
The DIMMs are rated 66 MHz (Klamath) or 100 MHz (Deschutes) SDRAM (Synchronous DRAM). DIMM
modules must be ‘Unbuffered’ and operate at 3.3V. All the allowable memory size configurations are described
on table 2.1 (Refer to Table 3.6 in the “Configuration” section for the different combinations and sizes of
DIMMs).
Table 2.2. DRAM memory configurations in Megabytes.
8 16 24 32 40 48
64 72 80 96 128 136
144 176 192 256

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DRAM (DIMM) Sockets
Connection to the main system DRAM can be done via two (2) DIMM connectors on
the system PWA.
Reference: DIMM0, DIMM1
Connector Type: female, 168 pin DIMM, in-line connector
Connector Part Number: Berg. 91145-60024 (Or equivalent)
System BIOS
The system and video BIOS are stored in a 2M-bit (256Kx8) Flash Memory device. The
system BIOS is always shadowed and cached.
L2 Cache Subsystem
The PentiumII processor cartridge provides an unified 0KB or 512KB second level (L2)
cache to complement the level one data and instruction (L1) internal caches. The L2 cache
is Direct-Mapped non-sectored, supporting the Write Back policy architecture.
Table 2.4. L2 Cache latency with Burst SRAM
Cycle Type Clock Count
Burst Read X-1-1-1
Burst Write (Write-back) X-1-1-1
Single Read X
Single Write X
Pipelined Back-to-Back Burst Reads X-1-1-1,1-1-1-11
1: The back-to-back cycles do not account for CPU idle clocks between cycles
Cacheable and Non-Cacheable Regions
The system caches the following regions:
•All system memory, including 0 to 640 KB and all memory present above 1
MB up to 1GB.
•System and integrated video controller BIOS.
The system does not cache the following regions:
•The video memory block from A0000 to BFFFF.

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•PCI memory space on top of main memory.
•Any access to the PCI or AT bus.
Address Maps
Memory Map
The following table describes the breakdown of the IN440EX memory areas and how
they are assigned.
Table 2.5. Memory Map
LOCATION SIZE TO DESCRIPTION
0FFFFFFF-FFFFFFFF 256MB 4GB BIOS ROM
000E0000-000FFFFF 128KB 1MB System BIOS (Shadowed in DRAM)
000C8000-000DFFFF 96KB 896KB Expansion region (Shadowed in DRAM)
000C0000-000C7FFF 32KB 800KB Video BIOS (Shadowed in DRAM)
000A0000-000BFFFF 128KB 768KB Video Buffer (SMM space Non-Cacheable)
00080000-0009FFFF 128KB 640KB Optional memory space gap (DOS Apps)
00000000-0007FFFF 512KB 512KB DOS applications (No read/write protect)
(Always cacheable)
Video Subsystem
3D RAGE PRO Graphics Controller is a highly integrated graphics controller.
Incorporated within this single chip are the 2D, 3D and video accelerators, palette DAC,
and quadruple clock synthesiser. This multi-function integrated controller delivers superior
3D performance, TV-quality scaled video optimized for MPEG playback, industry-leading
Mach64 2D performance, and video expansion capability suited for video conferencing,
cable TV viewing, and hardware MPEG decoding.
The availability of ATI BIOS, drivers, utilities, and application software developed for the
entire chip family is a major strength for the 3D RAGE PRO. Being register-compatible
with all other controllers in the Mach64 accelerator series means immediate compatibility
with a wide range of application drivers. Since this controller is also pin-compatible with
ATI's family of other mach64 integrated controllers, it provides to the OEM a low-cost
upgrade path to additional features and performance.
This controller uses active power management techniques to monitor activity levels within
its’ self and to perform real-time power reductions such as dynamic clock control and
graphics engine shutdown. Because full-speed operation can be restored without delay,
these techniques do not impact performance. Major advances have been included in this
chip to boost performance in the area of a new bus interface, Accelerated Graphics Port

BCM Advanced Research 37
(AGP). With AGP data the throughput between host and 3D RAGE PRO has greatly
increased. The result is even faster 2D and 3D performance and enhancements to motion
video support (e.g. MPEG-2 motion compensation).
FEATURES
3D Accelerator
•Complete 3D primitive support: points, lines, triangles, lists, strips and
Quadrilaterals
•Triangle Setup Engine with floating point to integer parameter conversion
•4K on-chip Texture Cache
•Destination Alpha
•Gouraud shading
•Alpha blending and alpha interpolation
•16-bit Z buffer
•Fogging and fog interpolation
•Dithering support in 16 bpp for near 24 bpp quality
•Perspectively correct mip-mapped texture mapping hardware, supporting:
•Palletized CI4 and CI8 texture expansion
•Texture filtering models including tri-linear mip mapping
•Texture lighting modes
•Ability to use YUV format textures
•Alpha in texture map
•Texture maps up to 1024 x 1024
•Non square texture maps
Software driver support for Direct 3D, QuickDraw 3D RAVE and OpenGL interfaces,
as well as others.
Video Accelerator/Video Capture
•Back end scaling
•Color interpolation during scaling for improved high resolution video quality
•Integrated 768 pixel wide dual video line buffers support filtered video scaling
•4 tap horizontal and 2 tap vertical scalers for high-quality, full-screen video
playback with MPEG-2 (720x480) sources
•YUV to ROB color space conversion with support for both packed and planar
YUV formats as follows:
•YUV422, YUV410 (YUV9), YUV420 (YUV12)
•RGB32, RGB16/15
•Built-in continuous brightness and gamma correction to correct 'dark' images
•Chroma keying for effective overlay of video on graphics
•Overlay true color video regardless of the current graphics mode
•New buffer and frame synchronization modes to reduce display tearing

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•Ability to turn off graphics data access behind video, hence reducing bandwidth
•Support for CCIR 656 video standard
•Ability to capture VBI and Intercast data
•Mirror video capture to support video conference
2D Accelerator
•Hardware acceleration - Rectangle Fill, Line Draw, BitBlt, Polygon
Fill,Panning/Scrolling, Bit Masking, Monochrome Expansion, Scissoring, and full
ROP support
•PCI bus master support for GUI programming
•8x8x8 SRC Brush support
•Quick engine setup with alias registers
•Improved FIFO management to memory controller
•Increased command FIFO to 128 DWORDs
•Hardware cursor up to 64x64x2
•Acceleration provided in 8/l6/24/32bpp modes. Packed pixel support (24bpp)
enables true color in 1MB configurations
•Game acceleration for Microsoft's DirectDraw—Double Buffering, Virtual Sprites,
Transparent Blit and Masked Blit
•Increased display FIFO to 32 DWORDs. Additional 64 entry FIFO for Bus
mastering
•True 24-bit, true-color palette DAC:
•Pixel clock rates up to 200MHz, with 230MHz option, for up to 1600x1200
screen resolution at 85Hz vertical
•Pixel depth of 32 bit at 1600x1200 screen resolution with WRAM and
external RAMDAC at 240 MHz
•Gamma correction for true WYSIWYG
•Full 24-bit palette
General Features
•Integrated 3D, 2D, and Video accelerators with palette DAC and quad-clock
synthesiser in a single chip
•Comprehensive AGP support, including 66 MHz and 133 MHz pipeline operation
with sideband addressing
•PCI revision 2.1 bus for Plug-and-Play ease of use
•Bi-endian support for compliance on a variety of processor platforms
•128-level command FIFO assures fast response to host command transfers for
maximum CPU/host bus/controller efficiency and concurrent operation
•Additional 64 entry FIFO dedicated to Bus mastering
•Programmable flat or paged memory model with enhanced host access to a linear
frame buffer

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•32-bit wide read/writeable memory mapped registers with optimized organization,
reduces instruction overhead and raises performance
•DDC1 and DDC2B+ Plug-and-Play monitor support
•Power management for full VESA Display Power Management Signalling(DPMS)
and EPA Energy Star compliance. Also, register support for controller power
reduction and DAC power down
•Built-in CRC, chip diagnostics and manufacturing SCAN to ensure quality
components
Video Modes
The following video modes are supported on the system board by the ATI-3D Rage
Pro Graphics and Video Controller
Table 2.9. Video Modes
Display
Screen
Resolution
Re-fresh
Rate Hor. Scan
(kHz)
Pixel
Clock
(MHz)
Colors (Bits per Pixel)
1 MB DRAM 2 MB DRAM 4 MB DRAM
4 8 16 24 32 4 8 16 24 32 4 8 16 24 32
640x480 60 31.4 25.2 √√√√-√√√√√√√√√√
640x480 72 37.7 31.2 √√√√-√√√√√√√√√√
640x480 75 37.5 31.5 √√√√-√√√√√√√√√√
640x480 90 47.9 39.9 √√√- - √√√√√√√√√√
640x480 100 52.9 44.9 √√√- - √√√- - √√√√√
640x480 120 63.7 55.0 √----√√√- - √√√√√
800x600 48 33.8 36.0 √√√- - √√√√-√√√√√
800x600 56 35.1 36.0 √√√---√√√-√√√√√
800x600 60 37.8 40.0 √√√- - √√√√-√√√√√
800x600 70 44.5 44.9 √√√- - √√√√-√√√√√
800x600 72 48.0 50.0 √√√- - √√√- - √√√√√
800x600 75 46.8 49.5 √√√- - √√√- - √√√√√
800x600 90 57.0 56.6 √ √ ---√ √ ---√√√√√
800x600 100 62.5 67.5 √ √ ---√ √ ---√√√√√
800x600 120 76.0 81.0 √----√ √ ---√√√√√
1024x768 43 35.5 44.9 √ √ ---√√√- - √√√√√
1024x768 60 48.3 65.0 √ √ ---√√√- - √√√√√
1024x768 70 56.4 75.0 √ √ ---√√√- - √√√√√
1024x768 72 58.2 75.0 √ √ ---√√√- - √√√√√
1024x768 75 60.0 78.8 √ √ ---√√√- - √√√√√
1024x768 90 76.2 100 -----√ √ ---√√√√√
1024x768 100 79.0 110 -----√ √ ---√√√√-
1024x768 120 96.7 130 -----√ √ ---√√√√-
1152x864 43 45.9 65.0 √ √ ---√√√- - √√√√√