Beckhoff CB3051 User manual

Beckhoff AutomationGmbH phone: [phone]
Eiserstr.5 fax: [phone]
33415Verl email: [e-mail]
Germany web: www.beckhoff.de
CB3051
Manual
rev. 1.2

Contents
Beckhoff NewAutomation Technology CB3051 page 3
Contents
0DocumentHistory...........................................................................................................................5
1Introduction.....................................................................................................................................6
1.1 Noteson the Documentation..................................................................................................6
1.1.1 LiabilityConditions.............................................................................................................6
1.1.2 Copyright...........................................................................................................................6
1.2 SafetyInstructions..................................................................................................................7
1.2.1 Disclaimer..........................................................................................................................7
1.2.2 Description of SafetySymbols............................................................................................7
1.3 EssentialSafetyMeasures.....................................................................................................8
1.3.1 Operator'sObligation toExerciseDiligence........................................................................8
1.3.2 National RegulationsDepending on the Machine Type.......................................................8
1.3.3 OperatorRequirements......................................................................................................8
1.4 FunctionalRange...................................................................................................................9
2Overview......................................................................................................................................10
2.1 Features...............................................................................................................................10
2.2 Specificationsand Documents..............................................................................................12
3DetailedDescription......................................................................................................................13
3.1 PowerSupply.......................................................................................................................13
3.2 CPU.....................................................................................................................................13
3.3 Memory................................................................................................................................13
4Connectors...................................................................................................................................14
4.1 ConnectorMap.....................................................................................................................14
4.2 PowerSupply.......................................................................................................................15
4.3 System.................................................................................................................................16
4.4 External CMOSBattery........................................................................................................17
4.5 Memory................................................................................................................................18
4.6 VGA/DVI..............................................................................................................................21
4.7 LVDS...................................................................................................................................22
4.8 TouchScreen.......................................................................................................................24
4.9 USB 1-4...............................................................................................................................25
4.10 USB 5-8...............................................................................................................................26
4.11 LAN1....................................................................................................................................27
4.12 LAN2....................................................................................................................................28
4.13 Audio....................................................................................................................................29
4.14 SATAInterfaces...................................................................................................................30
4.15 IDEInterface........................................................................................................................31
4.16 Serial InterfaceCOM1..........................................................................................................33
4.17 Serial PortsCOM2through COM4........................................................................................34
4.18 SMB/I2C...............................................................................................................................35
4.19 Mini-PCI...............................................................................................................................36
4.20 GPIO....................................................................................................................................38
4.21 Fan Connectors....................................................................................................................39
5BIOSSettings...............................................................................................................................40
5.1 RemarksforSetup Use........................................................................................................40
5.2 Top LevelMenu....................................................................................................................40
5.3 StandardCMOSFeatures....................................................................................................41

Contents
page 4 Beckhoff NewAutomation Technology CB3051
5.3.1 IDEChannel0Master/Slave............................................................................................42
5.4 Advanced BIOSFeatures.....................................................................................................43
5.4.1 CPUFeature....................................................................................................................45
5.4.2 HardDiskBoot Priority.....................................................................................................46
5.5 Advanced Chipset Features..................................................................................................47
5.5.1 PCI Express Root PortFunction.......................................................................................49
5.6 Integrated Peripherals..........................................................................................................50
5.6.1 OnChipIDEDevices........................................................................................................51
5.6.2 OnboardDevices.............................................................................................................52
5.6.3 SuperIO Devices..............................................................................................................53
5.7 PowerManagement Setup...................................................................................................54
5.8 PnP/PCIConfiguration..........................................................................................................56
5.8.1 IRQ Resources.................................................................................................................57
5.9 PCHealthStatus..................................................................................................................58
5.10 Frequency/Voltage Control...................................................................................................60
5.11 Load Fail-SafeDefaults........................................................................................................61
5.12 Load Optimized Defaults......................................................................................................61
5.13 Set Password.......................................................................................................................61
5.14 Save&Exit Setup................................................................................................................61
5.15 ExitWithout Saving..............................................................................................................61
6BIOSupdate.................................................................................................................................62
7Mechanical Drawing......................................................................................................................63
7.1 PCB: Mounting Holes...........................................................................................................63
7.2 PCB: Pin1Dimensions........................................................................................................64
7.3 PCB: HeatSpreader.............................................................................................................65
8TechnicalData..............................................................................................................................66
8.1 ElectricalData......................................................................................................................66
8.2 EnvironmentalConditions.....................................................................................................66
8.3 Thermal Specifications.........................................................................................................67
9Support and Service.....................................................................................................................68
9.1 Beckhoff'sBranchOfficesand Representatives....................................................................68
9.2 Beckhoff Headquarters.........................................................................................................68
9.2.1 Beckhoff Support..............................................................................................................68
9.2.2 Beckhoff Service..............................................................................................................68
IAnnex:Post-Codes.......................................................................................................................69
II Annex:Resources........................................................................................................................72
AIO Range..................................................................................................................................72
BMemoryRange.........................................................................................................................72
CInterrupt....................................................................................................................................72
DPCI Devices..............................................................................................................................73
ESMB Devices............................................................................................................................73

Noteson the Documentation Chapter: DocumentHistory
Beckhoff NewAutomation Technology CB3051 page 5
0DocumentHistory
Version Changes
0.1 first pre-release
0.2 added SMB devicesand PCIdevicestoresourcessection, updated block diagram,
severalminorchanges
1.0 updated block diagramand featurelist, minorchanges
1.1 updated contact details,minorchanges
1.2 added connectormap,updated COM4description,minorchanges
NOTE
Allcompanynames, brand names, and product namesreferredtointhismanual areregistered or
unregistered trademarksof theirrespectiveholdersand are, assuch, protected bynationaland
internationallaw.

Chapter: Introduction Noteson the Documentation
page 6 Beckhoff NewAutomation Technology CB3051
1Introduction
1.1Notes ontheDocumentation
Thisdescription isonlyintended forthe useof trained specialistsincontroland automation engineering
who arefamiliarwiththe applicablenational standards.Itisessentialthat the following notesand
explanationsarefollowed when installing and commissioning thesecomponents.
1.1.1LiabilityConditions
The responsiblestaff must ensurethat the applicationoruseofthe productsdescribed satisfyallthe
requirementsforsafety, including all the relevantlaws, regulations, guidelinesand standards.
The documentation hasbeen prepared withcare.The productsdescribed are, however,constantlyunder
development.Forthat reason the documentation isnotineverycasechecked forconsistency with
performancedata, standardsorothercharacteristics. None of the statementsofthismanual representsa
guarantee (Garantie)inthe meaning of§443 BGBof the German Civil Code orastatementabout the
contractuallyexpected fitness foraparticularpurposein the meaning of §434 par.1sentence1BGB.In
the event thatitcontainstechnical oreditorial errors, weretainthe righttomakealterationsat anytime
and without warning. No claimsforthe modification of productsthat havealreadybeen supplied maybe
made on the basisof the data, diagramsand descriptionsinthisdocumentation.
1.1.2Copyright
©Thisdocumentationiscopyrighted.Anyreproduction orthirdpartyuseofthispublication, whetherin
wholeorinpart, withoutthe written permission ofBeckhoff Automation GmbH,isforbidden.

SafetyInstructions Chapter: Introduction
Beckhoff NewAutomation Technology CB3051 page 7
1.2SafetyInstructions
Pleaseconsiderthe following safetyinstructionsand descriptions. Productspecificsafetyinstructionsare
tobe found on thefollowing pagesorinthe areasmounting,wiring,commissioning etc.
1.2.1Disclaimer
Allthe componentsaresupplied inparticularhardwareand softwareconfigurationsappropriateforthe
application.Modificationstohardwareorsoftwareconfigurationsotherthan thosedescribed inthe
documentation arenotpermitted, and nullifythe liabilityofBeckhoff Automation GmbH.
1.2.2DescriptionofSafetySymbols
The following safetysymbolsareused inthisdocumentation.Theyareintended toalertthe readertothe
associated safetyinstructions.
ACUTERISKOFINJURY!
Ifyoudo not adheretothe safetyadvisenext tothissymbol,thereisimmediatedangertolifeand health
of individuals!
RISKOFINJURY!
Ifyoudo not adheretothe safetyadvisenext tothissymbol,thereisdangertolifeand healthof
individuals!
HAZARD TOINDIVIDUALS,ENVIRONMENT,DEVICES,ORDATA!
Ifyoudo not adheretothe safetyadvisenext tothissymbol,thereisobvioushazardtoindividuals,to
environment,tomaterials, ortodata.
NOTEORPOINTER
Thissymbolindicatesinformationthatcontributestobetterunderstanding.

Chapter: Introduction EssentialSafetyMeasures
page 8 Beckhoff NewAutomation Technology CB3051
1.3Essential SafetyMeasures
1.3.1Operator'sObligationtoExerciseDiligence
The operatormust ensurethat
othe productisonlyused foritsintended purpose
othe productisonlyoperated insound condition and inworking order
othe instruction manual isingood condition and complete, and alwaysavailableforreferenceatthe
location wherethe productsareused
othe productisonlyused bysuitablyqualified and authorised personnel
othe personnelisinstructed regularlyabout relevant occupationalsafetyand environmentalprotection
aspects
othe operating personnelisfamiliarwiththe operating manualand inparticularthe safetynotes
contained herein
1.3.2National RegulationsDependingontheMachineType
Depending on the type ofmachine and plant inwhichthe product isused, national regulationsgoverning
the controllersofsuchmachineswillapply,and must beobserved bythe operator.Theseregulations
cover, amongst otherthings, the intervalsbetween inspectionsofthe controller.The operatormustinitiate
suchinspectionsingood time.
1.3.3OperatorRequirements
oRead the operating instructions
Allusersofthe productmust haveread the operating instructionsforthe systemtheywork with.
oSystemknow-how
Allusersmust be familiarwithallaccessiblefunctionsof the product.

FunctionalRange Chapter: Introduction
Beckhoff NewAutomation Technology CB3051 page 9
1.4Functional Range
NOTE
The descriptionscontained inthe present documentation represent adetailed and extensiveproduct
description.Asfarasthe described motherboardwasacquired asan integralcomponent of an Industrial
PCfromBeckhoff Automation GmbH,thisproduct description shallbe applied onlyinlimited scope. Only
the contractuallyagreed specificationsof the corresponding IndustrialPCfromBeckhoff Automation
GmbH shallbe relevant.Due toseveralmodelsofIndustrialPCs,variationsinthe componentplacement
of the motherboardsarepossible. Support and servicebenefitsforthe built-inmotherboardwillbe
rendered byBeckhoffAutomation GmbH exclusivelyasspecified inthe product description (inclusive
operation system)of theparticularIndustrialPC.

Chapter: Overview Features
page 10 Beckhoff NewAutomation Technology CB3051
2Overview
2.1Features
The CB3051 isahighlycomplex3,5-inchboardwiththefunctionalitiesofamotherboard. Itisequipped
withan Intel®Celeron®M, an IntelCore™Duo, oranIntel®Core™2Duo processor, withup to4GByte
DDR2-667-RAM viaSoDIMM200,withaMini-PCI-busand withadditionalperiphery suchasfourserial
busses, twoLAN-connectors, sound input and output, eight USBchannels, CRTand TFTconnectors,
one IDEand twoSATAchannels. Furthermore, atouchscreen can be connected tothe board.
ICH7
Intel®82801GB
Winbond®
W83627GF
LPC PCI
Winbond®
W83627GF Intel®
82573L(E)
(10/100/1000)
2x
SoDIMM200
DDR2-667
MEMORY(DUALCH.)
Power
VCCCore;VTT;DDRVTT
1,5V;1,8V;2,5V; 3,3V
Clock
IDTCV111PAG
BIOS
MS
RealTek®
ALC655 MIC
LINE
OUT
ACLink
KB
USB1
USB2
USB3
LAN2
USB4
COM1 COM2
Watchdog
Intel® Core™2Duo,Core™
Duo,Pentium®M
HOST
CRT
LCD LVDS18
GMCH
Intel®945GM(E)
DMI
USB 2.0
SPDIFi
SPDIFo
Mini-PCI
COM3
(PWR)
COM4
(Touch)
Intel®
82562EZ
(10/100)
USB5
USB6
LAN1
COACh3®
Touch
Controller
Touch-
Screen
FAN1 FAN2
DVI
16x GPIO
PATA
SATA1
SATA2
USB7
(USB8)
SMBus
USB8
PCIe x1
(COM4)
I2C
oProcessorIntel®Celeron®M,Intel®Core™Duo,Intel®Core™2Duo
oChipset Intel 945GMand IntelICH7
o2SoDIMM200 socketsforup to4GByteDDR2-667
oFourserial interfacesCOM1up toCOM4
o1xEthernet 10/100 (Base-T), 1xEthernet10/100/1000 (Base-T)
oIDEinterface
oTwoSATAconnectors(up toSATA2,3GByte/sec)
oPS/2keyboard/mouseinterface
oEight USB 2.0interfaces
oAWARD®BIOS6.10
oCRT connection
oDVI connection
oTFT connection, LVDS18 bit

Features Chapter: Overview
Beckhoff NewAutomation Technology CB3051 page 11
oAC97 compatiblesound controllerwithSPDIFinand out
oRTCwithexternalCMOSbattery
o5Vsinglesupplyvoltage
oMini-PCIinterface
oTouchscreen interface
oSize102 mm x147 mm

Chapter: Overview Specificationsand Documents
page 12 Beckhoff NewAutomation Technology CB3051
2.2SpecificationsandDocuments
Inmaking thismanualand forfurtherreading of technicaldocumentation the following documents,
specificationsand web-pageswereused and arerecommended.
§PCI specification
Version 2.3resp. 3.0
www.pcisig.com
§Mini-PCIspecification
Version 1.0
www.pcisig.com
§ACPI specification
Version 3.0
www.acpi.info
§ATA/ATAPI specification
Version 7Rev. 1
www.t13.org
§USB specifications
www.usb.org
§SM-Busspecification
Version 2.0
www.smbus.org
§Intel chipset description
MobileIntel945 Express Chipset FamilyDatasheet
www.intel.com
§Intel chipset description
ICH7 Datasheet
www.intel.com
§Intel chipdescriptions
Celeron M,CoreDuo/Solo, Core2 Duo
www.intel.com
§Winbond chipdescription
W83627HGDatasheet
www.winbond-usa.com or www.winbond.com.tw
§Intel chipdescription
82562EZ/GZDatasheet
www.intel.com
§Intel chipdescription
82573L(E) Datasheet
www.intel.com
§IDT chipdescription
IDTCV111i Datasheet
www.idt.com
§Chrontelchipdescription
Chrontel7307C
www.chrontel.com
§EloTouchSystemschipdescription
COACh3
www.elotouch.de
(NDArequired)

PowerSupply Chapter: Detailed Description
Beckhoff NewAutomation Technology CB3051 page 13
3DetailedDescription
3.1PowerSupply
The powersupplyofthe hardwaremoduleiseffected viathe powerconnector. The boardrequiresan
operating voltage of5volt ±5%.The twofan connectors can be attached to12 volt ifrequired.
3.2CPU
The boardcan be ordered withone of the following processorsemployed:Intel®Celeron®M,Intel®
Core™Duo, and Intel®Core™2Duo.The package type allowsamaximumdietemperatureof100
degreesCelsiusand accordshighest possiblesecurityeven inrough environment.
The processorincludesasecond level cache of up to4MByte, depending on whichmodelisused.
Furthermorethe processorsoffermanyfeaturesknownfromthe desktop range suchasMMX2, serial
number,loadablemicrocode etc.
3.3Memory
Thereisone conventionalSO-DIMM200 socket availabletoequipthe boardwithmemory.For
mechanical reasonsitispossiblethat particularmemorymodulescannot be employed. Pleaseaskyour
salesrepresentativeforrecommended memorymodules.
WithcurrentlyavailableSO-DIMM200 modulesamemory extension up to4GByteispossible(DDR2-
667).

Chapter: Connectors ConnectorMap
page 14 Beckhoff NewAutomation Technology CB3051
4Connectors
4.1ConnectorMap
Pleaseusethe connectormap belowforquick reference. Onlyconnectorson the component side are
shown. Formoreinformation on eachconnectorrefertothe tablebelow.
Ref-No. Function Page
P501/4 "SATAInterfaces" p. 30
P503/J500 "IDEInterface" p. 31
U600/1 "Memory" p. 18
P800 "GPIO" p. 38
P900 "LAN1" p. 27
P1000 "LAN2" p. 28
P1200 "LVDS" p. 22
P1201 "Mini-PCI" p. 36
P1202 "VGA/DVI" p. 21
P1300/J1300 "TouchScreen" p. 24
P1301 "SMB/I2C" p. 35
P1302 "Audio" p. 29
P1303 "System" p. 16
P1400 "Serial InterfaceCOM1" p. 33
P1401/4 "USB 1-4" p. 25
P1403/8 "Serial PortsCOM2through COM4" p. 34
P1406/10 "USB 5-8" p. 26
P1407/9 "Fan Connectors" p. 39
P1500 "ExternalCMOSBattery" p. 17
P1600 "PowerSupply" p. 15

PowerSupply Chapter: Connectors
Beckhoff NewAutomation Technology CB3051 page 15
4.2PowerSupply
The powersupplyofthe hardwaremoduleiseffected viaa2x8-pinconnector(MolexPS43045-16xx,
mating connector:MolexPS 43025-16xx).The pinsfor12 volthavethe solepurposeof supplying one or
bothfanswiththe necessary current. Thus, when no fanisinstalled,thesepinshaveno function. COM3
RXDand TXDcan alsobe usedforconnecting asecond powersupplyunit,e.g.forUPS. Asan ordering
option SMBussignalsSCL/SDAcan be provided (replacing COM3TXD/RXD).
Description Name Pin Name Description
COM3transmit data TXD 1 9 RXD COM3receivedata
PSUon PS-ON 2 10 RESET# PSUreset
powerbutton PSU PWRBTN# 3 11 SVCC standby-supply5V
12 voltsupply 12V 4 12 12V 12 voltsupply
ground GND 5 13 GND ground
ground GND 6 14 GND ground
5voltsupply VCC 7 15 VCC 5 voltsupply
5voltsupply VCC 8 16 VCC 5 voltsupply

Chapter: Connectors System
page 16 Beckhoff NewAutomation Technology CB3051
4.3System
Sometypicalsignalsforsystemcontrolareprovided through a2x9pinconnector(JST B18B-PHDSS,
mating connector: PHDR-18VS).Thisconnectorcombinessignalsforpowerbutton, reset, keyboard,
speaker, and several LEDssuchasharddiskLED, touchscreen LED, suspend LED, and three additional
LEDswhicharedrivenbyGPIOs.Ofthesethree GPIO-LEDs, LED1 and LED2 arealreadyprovided with
aseriesresistor. Ascan be seen fromthe pinouttablebelow, corresponding signalsareoften placed vis-
à-visoratleast neartoeachother.
Description Name Pin Name Description
ground GND 1 10 PWRBTN# on/suspend button
ground GND 2 11 RESET# reset toground
LEDtouchscreen TOUCHLED3 12 3.3V 3.3volt supply
LEDsuspend / ACPI S-LED 4 13 S3.3V standbysupply3.3volt
LEDharddisk HDLED 5 14 3.3V 3.3volt supply
LEDGPIOdevice LED1 6 15 3.3V 3.3volt supply
LEDGPIOdevice LED2 7 16 LED3 LEDGPIOdevice
speakerto5volt SPEAKER 8 17 KDAT keyboarddata
standbysupply5volt (S)VCC 9 18 KCLK keyboardclock

External CMOSBattery Chapter: Connectors
Beckhoff NewAutomation Technology CB3051 page 17
4.4External CMOSBattery
Forkeeping the internal clock aliveeven if the rest of theboardisswitched off, an external batterycan be
attached viaa2pinconnector(JST B2B-EH-A, mating connector: EHR-2).
Pin Name Description
1 BATT battery 3.3volt
2 GND ground

Chapter: Connectors Memory
page 18 Beckhoff NewAutomation Technology CB3051
4.5Memory
ConventionalSO-DIMM200 memorymodules, asfamiliarfromnotebookcomputers, areused toequip
the boardwithmemory.Formechanical reasonsit ispossiblethatparticularmemorymodulescannot be
employed. Pleaseaskyourdistributorforrecommended memory modules.
WithcurrentlyavailableSO-DIMM200 modulesamemory extension up to4GByteispossible(DDR2-
667).
Alltiming parametersfordifferent memorymodulesareautomaticallyset byBIOS.
Description Name Pin Name Description
memoryreferencecurrent REF 1 2 GND ground
ground GND 3 4 DQ4 data4
data0 DQ0 5 6 DQ5 data5
data1 DQ1 7 8 GND ground
ground GND 9 10 DQM0 datamask0
datastrobe 0- DQS0# 11 12 GND ground
datastrobe 0+ DQS0 13 14 DQ6 data6
ground GND 15 16 DQ7 data7
data2 DQ2 17 18 GND ground
data3 DQ3 19 20 DQ12 data12
ground GND 21 22 DQ13 data13
data8 DQ8 23 24 GND ground
data9 DQ9 25 26 DQM1 datamask1
ground GND 27 28 GND ground
datastrobe 1- DQS1# 29 30 CK0 clock0+
datastrobe 1+ DQS1 31 32 CK0# clock0-
ground GND 33 34 GND ground
data10 DQ10 35 36 DQ14 data14
data11 DQ11 37 38 DQ15 data15
ground GND 39 40 GND ground
ground GND 41 42 GND ground
data16 DQ16 43 44 DQ20 data20
data17 DQ17 45 46 DQ21 data21
ground GND 47 48 GND ground
datastrobe 2- DQS2# 49 50 N/C reserved

Memory Chapter: Connectors
Beckhoff NewAutomation Technology CB3051 page 19
Description Name Pin Name Description
datastrobe 2+ DQS2 51 52 DQM2 datamask2
ground GND 53 54 GND ground
data18 DQ18 55 56 DQ22 data22
data19 DQ19 57 58 DQ23 data23
ground GND 59 60 GND ground
data24 DQ24 61 62 DQ28 data28
data25 DQ25 63 64 DQ29 data29
ground GND 65 66 GND ground
datamask3 DQM3 67 68 DQS3# datastrobe 3-
reserved N/C 69 70 DQS3 datastrobe 3+
ground GND 71 72 GND ground
data26 DQ26 73 74 DQ30 data30
data27 DQ27 75 76 DQ31 data31
ground GND 77 78 GND ground
clockenables0 CKE0 79 80 CKE1 clockenables1
1.8volt supply 1.8V 81 82 1.8V 1.8volt supply
reserved N/C 83 84 N/C reserved
SDRAM bank2 BA2 85 86 N/C reserved
1.8volt supply 1.8V 87 88 1.8V 1.8volt supply
address12 A12 89 90 A11 address11
address9 A9 91 92 A7 address7
address8 A8 93 94 A6 address6
1.8volt supply 1.8V 95 96 1.8V 1.8volt supply
address5 A5 97 98 A4 address4
address3 A3 99 100 A12 address2
address1 A1 101 102 A0 address0
1.8volt supply 1.8V 103 104 1.8V 1.8volt supply
address10 A10 105 106 BA1 SDRAM bank1
SDRAM bank0 BA0 107 108 RAS# rowaddressstrobe
writeenable WE# 109 110 S0# chipselect0
1.8volt supply 1.8V 111 112 1.8V 1.8volt supply
columnaddress strobe CAS# 113 114 ODT0 on dietermination 0
chipselect1 S1# 115 116 A13 address13
1.8volt supply 1.8V 117 118 1.8V 1.8volt supply
on dietermination 1 ODT1 119 120 N/C reserved
ground GND 121 122 GND ground
data32 DQ32 123 124 DQ36 data36
data33 DQ33 125 126 DQ37 data37
ground GND 127 128 GND ground
datastrobe 4- DQS4# 129 130 DQM4 datamask4
datastrobe 4+ DQS4 131 132 GND ground
ground GND 133 134 DQ38 data38
data34 DQ34 135 136 DQ39 data39
data35 DQ35 137 138 GND ground
ground GND 139 140 DQ44 data44
data40 DQ40 141 142 DQ45 data45
data41 DQ41 143 144 GND ground
ground GND 145 146 DQS5# datastrobe 5-
datamask5 DQM5 147 148 DQS5 datastrobe 5+
ground GND 149 150 GND ground
data42 DQ42 151 152 DQ46 data46
data43 DQ43 153 154 DQ47 data47
ground GND 155 156 GND ground
data48 DQ48 157 158 DQ52 data52
data49 DQ49 159 160 DQ53 data53

Chapter: Connectors Memory
page 20 Beckhoff NewAutomation Technology CB3051
Description Name Pin Name Description
ground GND 161 162 GND ground
test TEST 163 164 CK1 clock1+
ground GND 165 166 CK1# clock1-
datastrobe 6- DQS6# 167 168 GND ground
datastrobe 6 DQS6 169 170 DQM6 datamask6
ground GND 171 172 GND ground
data50 DQ50 173 174 DQ54 data54
data51 DQ51 175 176 DQ55 data55
ground GND 177 178 GND ground
data56 DQ56 179 180 DQ60 data60
data57 DQ57 181 182 DQ61 data61
ground GND 183 184 GND ground
datamask7 DQM7 185 186 DQS7# datastrobe 7-
ground GND 187 188 DQS7 datastrobe 7+
data58 DQ58 189 190 GND ground
data59 DQ59 191 192 DQ62 data62
ground GND 193 194 DQ63 data63
SMBusdata SDA 195 196 GND ground
SMBusclock SCL 197 198 SA0 SPDaddress
3.3volt supply 3.3V 199 200 SA1 SPDaddress