Beckhoff CB3064 Series User manual

Beckhoff Automation GmbH & Co. KG phone: [phone]
Eiserstr. 5 fax: [phone]
33415 Verl email: [email protected]
Germany web: www.beckhoff.de
CB3064-xxxx
Manual
Rev. 1.0
Kabylake

Contents
Beckhoff New Automation Technology CB3064-xxxx page 3
Contents
0Document History................................................................................................................................. 6
1Introduction .......................................................................................................................................... 7
1.1 Notes on the Documentation........................................................................................................ 7
1.1.1 Disclaimer............................................................................................................................. 7
1.1.2 Trademarks........................................................................................................................... 7
1.1.3 Patent Pending ..................................................................................................................... 7
1.1.4 Copyright............................................................................................................................... 7
1.2 Safety Instructions ........................................................................................................................ 8
1.2.1 Disclaimer............................................................................................................................. 8
1.2.2 Description of Safety Symbols.............................................................................................. 9
1.3 FCC Approvals for the United States of America......................................................................... 9
1.4 FCC Approval for Canada ............................................................................................................ 9
1.5 Essential Safety Measures ......................................................................................................... 10
1.5.1 Operator's Obligation to Exercise Diligence ....................................................................... 10
1.5.2 National Regulations Depending on the Machine Type ..................................................... 10
1.5.3 Operator Requirements...................................................................................................... 10
1.6 Functional Range........................................................................................................................ 11
2Overview............................................................................................................................................ 12
2.1 Features...................................................................................................................................... 12
2.2 Feature List................................................................................................................................. 13
2.3 Specifications and Documents ................................................................................................... 14
3Detailed Description........................................................................................................................... 15
3.1 Power Input................................................................................................................................. 15
3.2 SUPS.......................................................................................................................................... 15
3.3 CPU ............................................................................................................................................ 15
3.4 Memory....................................................................................................................................... 15
4Connectors......................................................................................................................................... 16
4.1 Connector Map ........................................................................................................................... 17
4.2 Power Input................................................................................................................................. 18
4.3 Memory....................................................................................................................................... 19
4.4 DVI.............................................................................................................................................. 22
4.5 DVI/HDMI/DisplayPort and USB3.0............................................................................................ 23
4.6 USB 3-6 ...................................................................................................................................... 25
4.7 USB2.0 (internal) ........................................................................................................................ 26
4.8 LAN............................................................................................................................................. 28
4.9 SATA Interfaces.......................................................................................................................... 29
4.10 Serial Interface COM1................................................................................................................ 30
4.11 PCI-Express................................................................................................................................ 31
4.12 GPIO........................................................................................................................................... 33
4.13 Fan Connectors .......................................................................................................................... 34
4.14 System........................................................................................................................................ 35
5State LEDs......................................................................................................................................... 36
5.1 RGB LED.................................................................................................................................... 36
6BIOS Settings..................................................................................................................................... 37
6.1 General Remarks........................................................................................................................ 37
6.2 Main............................................................................................................................................ 38

Contents
page 4 Beckhoff New Automation Technology CB3064-xxxx
6.3 Advanced.................................................................................................................................... 40
6.3.1 Platform Misc Configuration Configuration......................................................................... 42
6.3.2 CPU Configuration.............................................................................................................. 46
6.3.3 Intel(R) I210 Gigabit Network Connection.......................................................................... 51
6.3.4 Intel(R) Ethernet Connection I219-LM................................................................................ 53
6.3.5 Driver Health....................................................................................................................... 54
6.3.6 Trusted Computing ............................................................................................................. 57
6.3.7 ACPI Settings...................................................................................................................... 58
6.3.8 H/W Monitor........................................................................................................................ 59
6.3.9 Serial Port Console Redirection.......................................................................................... 61
6.3.10 PCI Subsystem Settings..................................................................................................... 62
6.3.11 Network Stack Configuration.............................................................................................. 64
6.3.12 Power Controller Options.................................................................................................... 65
6.3.13 Compatibility Support Module Configuration ...................................................................... 67
6.3.14 NVMe Controller and Drive Information.............................................................................. 68
6.3.15 USB Configuration.............................................................................................................. 69
6.3.16SATA and RST Configuration............................................................................................. 70
6.3.17 AMT Configuration.............................................................................................................. 74
6.4 Chipset........................................................................................................................................ 80
6.4.1 System Agent (SA) Configuration....................................................................................... 81
6.4.2 PCH-IO Configuration......................................................................................................... 86
6.5 Security..................................................................................................................................... 104
6.5.1 Secure Boot Menu............................................................................................................ 105
6.6 Boot........................................................................................................................................... 107
6.6.1 Fixed Boot Order Priority.................................................................................................. 109
6.7 Save & Exit ............................................................................................................................... 110
6.8 BIOS Update............................................................................................................................. 111
7Mechanical Drawings....................................................................................................................... 112
7.1 PCB: Mounting Holes ............................................................................................................... 112
7.2 PCB: Pin 1 Dimensions ............................................................................................................ 113
7.3 PCB: DIE Center....................................................................................................................... 114
7.4 PCB: Outlines ........................................................................................................................... 115
8Technical Data................................................................................................................................. 116
8.1 Electrical Data........................................................................................................................... 116
8.2 Environmental Conditions......................................................................................................... 116
8.3 Thermal Specifications ............................................................................................................. 117
9Support and Service ........................................................................................................................ 118
9.1 Beckhoff's Branch Offices and Representatives ...................................................................... 118
9.2 Beckhoff Support ...................................................................................................................... 118
9.3 Beckhoff Service....................................................................................................................... 118
9.4 Beckhoff Headquarters............................................................................................................. 118
IAnnex: Post-Codes.......................................................................................................................... 120
II Annex: Resources............................................................................................................................ 121
Interrupt................................................................................................................................................ 121
PCI Devices.......................................................................................................................................... 121
Resources: SMB-Devices .................................................................................................................... 122

Notes on the Documentation Chapter: Document History
Beckhoff New Automation Technology CB3064-xxxx page 5

Chapter: Document History Notes on the Documentation
page 6 Beckhoff New Automation Technology CB3064-xxxx
0 Document History
Version
Changes
0.1
first pre-release
1.0
First released version
All company names, brand names, and product names referred to in this manual are registered or
unregistered trademarks of their respective holders and are, as such, protected by national and
international law.

Notes on the Documentation Chapter: Introduction
Beckhoff New Automation Technology CB3064-xxxx page 7
1 Introduction
1.1 Notes on the Documentation
This description is only intended for the use of trained specialists in control and automation engineering
who are familiar with the applicable national standards.
It is essential that the documentation and the following notes and explanations are followed when
installing and commissioning the components.
It is the duty of the technical personnel to use the documentation published at the respective time of each
installation and commissioning.
The responsible staff must ensure that the application or use of the products described satisfy all the
requirements for safety, including all the relevant laws, regulations, guidelines and standards.
1.1.1 Disclaimer
The documentation has been prepared with care. The products described are, however, constantly under
development.
For that reason the documentation is not in every case checked for consistency with performance data,
standards or other characteristics.
None of the statements of this manual represents a guarantee (Garantie) in the meaning of § 443 BGB of
the German Civil Code or a statement about the contractually expected fitness for a particular purpose in
the meaning of § 434 par. 1 sentence 1 BGB.
In the event that it contains technical or editorial errors, we retain the right to make alterations at any time
and without warning.
No claims for the modification of products that have already been supplied may be made on the basis of
the data, diagrams and descriptions in this documentation.
1.1.2 Trademarks
Beckhoff®, TwinCAT®, EtherCAT®, Safety over EtherCAT®, TwinSAFE®, XFC® and XTS® are
registered trademarks and licensed by Beckhoff Automation GmbH.
Other designations used in this publication may be trademarks whose use by third parties for their own
purposes could violate the rights of the owners.
1.1.3 Patent Pending
The EtherCAT Technology is covered, including but not limited to the following patent applications and
patents:
EP1590927, EP1789857, DE 102004044764, DE 102007017835
with corresponding applications or registrations in various other countries.
The TwinCAT Technology is covered, including but not limited to the following patent applications and
patents:
EP0851348, US6167425 with corresponding applications or registrations in various other countries..
EtherCAT® is registered trademark and patented technology, licensed by Beckhoff Automation GmbH,
Germany.
1.1.4 Copyright
© Beckhoff Automation GmbH & Co. KG, Germany.
The reproduction, distribution and utilization of this document as well as the communication of its contents
to others without express authorization are prohibited.
Offenders will be held liable for the payment of damages. All rights reserved in the event of the grant of a
patent, utility model or design.

Chapter: Introduction Safety Instructions
page 8 Beckhoff New Automation Technology CB3064-xxxx
1.2 Safety Instructions
Consider the following safety instructions and descriptions!
Product specific safety instructions are to be found on the following pages or in the areas mounting,
wiring, commissioning etc.
1.2.1 Disclaimer
All the components are supplied in particular hardware and software configurations appropriate for the
application. Modifications to hardware or software configurations other than those described in the
documentation are not permitted, and nullify the liability of Beckhoff Automation GmbH & Co. KG.

FCC Approvals for the United States of America Chapter: Introduction
Beckhoff New Automation Technology CB3064-xxxx page 9
1.2.2 Description of Safety Symbols
The following safety symbols are used in this documentation. You have to read the safety symbols
carefully and adhere them strictly!
DANGER
Acute risk of injury!
If you do not adhere the safety advise adjoining this symbol, there is immediate
danger to life and health of individuals!
WARNING
Risk of injury!
If you do not adhere the safety advise adjoining this symbol, there is danger to life
and health of individuals!
CAUTION
Hazard to devices and environment
If you do not adhere the safety advise adjoining this symbol, there is obvious
hazard to individuals!
Attention
Hazard to devices and environment
If you do not adhere the notice adjoining this symbol, there is obvious hazard to
materials and environment.
Notice
Note or pointer
This symbol indicates information that contributes to better understanding.
1.3 FCC Approvals for the United States of America
FCC: Federal Communications Commission Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
1.4 FCC Approval for Canada
FCC: Canadian Notice
This equipment does not exceed the Class A limits for radiated emissions as described in the Radio
Interference Regulations of the Canadian Department of Communications.

Chapter: Introduction Essential Safety Measures
page 10 Beckhoff New Automation Technology CB3064-xxxx
1.5 Essential Safety Measures
1.5.1 Operator's Obligation to Exercise Diligence
The operator must ensure that
othe product is only used for its intended purpose
othe product is only operated in sound condition and in working order
othe instruction manual is in good condition and complete, and always available for reference at the
location where the products are used
othe product is only used by suitably qualified and authorised personnel
othe personnel is instructed regularly about relevant occupational safety and environmental protection
aspects
othe operating personnel is familiar with the operating manual and in particular the safety notes
contained herein
1.5.2 National Regulations Depending on the Machine Type
Depending on the type of machine and plant in which the product is used, national regulations governing
the controllers of such machines will apply, and must be observed by the operator. These regulations
cover, amongst other things, the intervals between inspections of the controller. The operator must initiate
such inspections in good time.
1.5.3 Operator Requirements
oRead the operating instructions
All users of the product must have read the operating instructions for the system they work with.
oSystem know-how
All users must be familiar with all accessible functions of the product.

Functional Range Chapter: Introduction
Beckhoff New Automation Technology CB3064-xxxx page 11
1.6 Functional Range
The descriptions contained in the present documentation represent a detailed and extensive product
description. As far as the described motherboard was acquired as an integral component of an Industrial
PC from Beckhoff Automation GmbH & Co. KG, this product description shall be applied only in limited
scope. Only the contractually agreed specifications of the corresponding Industrial PC from Beckhoff
Automation GmbH & Co. KG shall be relevant. Due to several models of Industrial PCs, variations in the
component placement of the motherboards are possible. Support and service benefits for the built-in
motherboard will be rendered by Beckhoff Automation GmbH & Co. KG exclusively as specified in the
product description (inclusive operation system) of the particular Industrial PC.

Chapter: Overview Features
page 12 Beckhoff New Automation Technology CB3064-xxxx
2 Overview
2.1 Features
The CB3064 is a highly complex 3,5-inch board which incorporates complete motherboard functionality.
The motherboard is based on Intel®'s Q170 chipset and equipped with an Intel® Core™, Pentium™ or
Celeron™ processor of the Skylake-S family.
Such processors are optimized for real-time systems with a low power consumption, while at the same
time providing state-of-the-art computing performance and a huge I/O flexibilty.
Modern low voltage DDR4 technology provides top-notch memory performance, accomodating up to 32
GByte of RAM (DDR4-2133) via SO-DIMM260. It also provides a PCI-Express bus (via a 2x40-pin
custom connector, configurable as one x4 or four x1) and additional peripheral devices such as a serial
interface, two Gigabit Ethernet interfaces (LAN), four SATA channels (offering up to 6Gb/s), eleven USB
channels, DVI/HDMI, and DisplayPort available on a 30-pin I-PEX connector.
MEMORY
Power VCCCore; VTT;
DDRVTT, GFXVCC
1,05V; 1,5V; 1,8V; 3,3V
BIOS
4x SATA
USB9-14
Intel®
Core™ i7-6700TE,
Core™ i5-6500TE,
Core™ i3-6100TE,
Pentium® G4400TE,
Celeron® G3900TE
FDI
1.5/3/6 Gb/s
DMI
SPI
8x GPIO
SMBus PCA9518PW
PHY
Intel® i219
LAN1
MAC/PHY
Intel® i210
PCIe
LAN2
PCIe
(4 x1 oder 1 x4)
NCT7491MNTXG
I2C
COM1
FAN 1-3
SMBus
DVI/HDMI
DVI/HDMI/DP (I-PEX)
Trusted
Platform
Module
USB 3.0
USB1-4
SPI
Watchdog
USB 3.0
USB11 (I-PEX)
USB 2.0
Intel® Q170-PCH
2x SO-DIMM260
DDR4-2133
(dual channel)
PEG/PCIe

Feature List Chapter: Overview
Beckhoff New Automation Technology CB3064-xxxx page 13
2.2 Feature List
CB3064
3,5"-Board
CPU
Intel® Core™ i7-6700TE (8M, 4 Cores, 35W TDP)
Intel® Core™ i5-6500TE (6M, 4 Cores, 35W TDP)
Intel® Core™ i3-6100TE (3M, 2 Cores, 35W TDP)
Intel® Pentium™ G4400TE (3M, 2 Cores, 35W TDP)
Intel® Celeron™ G3900TE (2M, 2 Cores, 35W TDP)
Chipset
Intel® Q170
Memory
2 sockets, each with DDR4@2133MHz à 16GB, SODIMM260
I/O
External
1x DVI-D (DVI or HDMI 1.4)
4x USB3.0
2x GBit-LAN, Intel® i219 and i210
1x COM
Internal
1x I-PEX (HDMI1.4 or DP1.2 and USB3.0)
4x SATA 3.0, RAID 0/1/5/10
1x PCIe Gen3 (1x PCIe x4 or 4x PCIe x1)
6x USB2.0
8x GPIO
Graphics
HDMI / DP: 3840 x 2160
DVI: 1920 x 1200
RTC
external CMOS battery
BIOS
AMI® Aptio V
Power Supply
5V / S5V / 3,3V / 12V
Format
102 mm x 147 mm
Notice
The feature list specifies all suitable CPUs. Their actual availability is
manufacturer-specific.

Chapter: Overview Specifications and Documents
page 14 Beckhoff New Automation Technology CB3064-xxxx
2.3 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
PCI specification
Version 2.3 bzw. 3.0
www.pcisig.com
PCI Express® Base Specification
Version 2.0
www.pcisig.com
ACPI specification
Version 3.0
www.acpi.info
ATA/ATAPI specification
Version 7 Rev. 1
www.t13.org
USB specification
www.usb.org
SM-Bus specification
Version 2.0
www.smbus.org
Intel® chip description
Intel® Atom™ Processor E3800 Product Family datasheet
www.intel.com
Intel® chip description
i210 datasheet
www.intel.com
NCT7491MNTXG
NCT7491 chip description
www.onsemi.com
American Megatrends®
Aptio™ Text Setup Environment (TSE) User Manual
www.ami.com
American Megatrends®
Aptio™ 5.x Status Codes
www.ami.com

Power Input Chapter: Detailed Description
Beckhoff New Automation Technology CB3064-xxxx page 15
3 Detailed Description
3.1 Power Input
The connector for power supply is a 2x10-pin connector.
The 12V voltage supply is needed for employment of PCI-Express cards and FAN connectors. COM RXD
and TXD also can be used for PSU, e.g. the UPS functionality.
Communication is carried out via SMBus signaling (SMB_CLK/SMB_DAT).
Attention
Only for use with Beckhoff-certified PSU!
The CB3064 is designated for use with the Beckhoff PSU CA2000-0021 only.
3.2 SUPS
Optionally the CB3064 can be equipped with a plug-in SUPS, which can keep the board alive over a short
period of time in case of power failure or voltage fluctuation. The exact amount of time is hard to predict
as it also depends on factors such as the SUPS' capacitors and the boards' power consumption etc. The
capacitors size is only limited by the required space.
Caution
Do not use accumulator and S-UPS simultaneously!
The CB3064 can be used either with an accumulator or with an S-UPS module.
To avoid loss of data in case of a power fail, both components may not be used
simultaneously!
3.3 CPU
The motherboard is based on Intel®'s Q170 chipset and employs an Intel® Core™, Pentium™ or
Celeron™ processor of the Skylake-S family.
Such processors are optimized for real-time systems with a low power consumption, while at the same
time providing state-of-the-art computing performance and a huge I/O flexibilty. The CPUs feature a very
low power consumption and, depending on the variant, up to 2.7GHz processor base frequency. They
also offer many features known from the desktop range such as SSE4.1/4.2, loadable microcode etc.
The employed Intel®-CPUs operate in an extended range of thermal conditions and therefore are capable
for use in industrial systems.
3.4 Memory
Conventional SO-DIMM260 memory modules, as familiar from notebook computers, are used to equip
the board with memory. For technical and mechanical reasons it is possible that particular memory
modules cannot be employed. Please ask your distributor for recommended memory modules.
With currently available SO-DIMM260 modules a memory extension up to 32 GByte is possible
(DDR4-2133).
If both memory sockets are in use, notice that you must use identical memory modules.
All timing parameters for different memory modules are automatically set by BIOS.
Notice
Driver Compatibility
For optimal driver compatibility we recommend the use of a Microsoft®
Windows® 8 operating system.

Chapter: Connectors Memory
page 16 Beckhoff New Automation Technology CB3064-xxxx
4 Connectors
This section describes all the connectors found on the CB3064.
Notice
Please consider the requirements on the cabling!
For most interfaces, the cables must meet certain requirements. For instance,
USB 2.0 requires twisted and shielded cables to reliably maintain full speed data
rates. Restrictions on maximum cable length are also in place for many high
speed interfaces and for power supply. Please refer to the respective
specifications and use suitable cables at all times.

Connector Map Chapter: Connectors
Beckhoff New Automation Technology CB3064-xxxx page 17
4.1 Connector Map
Please use the connector map below for quick reference. Only connectors on the component side are
shown. For more information on each connector refer to the table below.
Ref.-No.
Function
Page
P500/1/2/3
"SATA Interfaces"
p. 29
P504
"GPIO"
p. 33
P700/800
"LAN"
p. 28
P900
"DVI"
p. 22
P901
"DVI/HDMI/DisplayPort and USB3.0"
p. 23
P1000
"Fan Connectors"
p. 34
P1001
"PCI-Express",
p. 31
P1002
"System"
p. 35
P1100
"Serial Interface COM1"
p. 30
P1101/3
"USB 3-6"
p. 25
P1102/4
"USB2.0 (internal)"
p. 26
P1200
"Power Input"
p. 15

Chapter: Connectors Power Input
page 18 Beckhoff New Automation Technology CB3064-xxxx
4.2 Power Input
The connector for power supply is a 2x10-pin connector.
The 12V voltage supply is needed for employment of PCI-Express cards and FAN connectors. COM RXD
and TXD also can be used for PSU, e.g. the UPS functionality.
Communication is carried out via SMBus signaling (SMB_CLK/SMB_DAT).
Manufacturer
Description
Mating Connector
Molex
43045-2019
z.B. 43025-2000
Description
Name
Pin
Name
Description
SMBus clock signal/
COM transmit data
SMB_CLK/
COM.TXD
1
11
SMB_DAT/
COM.RXD
SMBus data /
COM receive data
'Power Supply On'-
enables/disables the output
voltages:
Ground = voltages ON
Open Drain = voltages OFF
PS_ON
2
12
ATXPWRGOOD
'ATX Powergood':
Low(0V) = voltage not ok
Open Drain = voltage ok
Powerbutton output to turn
on/off the connected
computer
ATXPWRBTN#
3
13
SVCC
S5V / 5A
12V / 8A
12V
4
14
12V
12V / 8A
ground
GND
5
15
GND
ground
ground
GND
6
16
GND
ground
5V / 17A
VCC
7
17
VCC
5V / 17A
5V / 17A
VCC
8
18
VCC
5V / 17A
SUSV activity:
Low (0V) = SUPS inactive
High (3.3V) = SUPS active
SUSV
9
19
GND
ground
3.3V / 10A
3.3V
10
20
3.3V
3.3V / 10A

Memory Chapter: Connectors
Beckhoff New Automation Technology CB3064-xxxx page 19
4.3 Memory
The CB3064 is equipped with two SO-DIMM260 sockets for DDR4-2133-RAM. For technical and
mechanical reasons it is possible that particular memory modules cannot be employed. Please ask your
distributor for recommended memory modules
With currently available memory modules a memory extension up to 32 GByte is possible.
All timing parameters for different memory modules are automatically set by BIOS.
Description
Name
Pin
Name
Description
Ground
GND
1
2
GND
Ground
Data lane 5
DQ5
3
4
DQ4
Data lane 4
Ground
GND
5
6
GND
Ground
Data lane 1
DQ1
7
8
DQ0
Data lane 0
Ground
GND
9
10
GND
Ground
Data Strobe 0 -
DQS0_c
11
12
NC
Reserved
Data Strobe 0 +
DQS0_t
13
14
GND
Ground
Ground
GND
15
16
DQ6
Data lane 6
Data lane 7
DQ7
17
18
GND
Ground
Ground
GND
19
20
DQ2
Data lane 2
Data lane 3
DQ3
21
22
GND
Ground
Ground
GND
23
24
DQ12
Data lane 12
Data lane 13
DQ13
25
26
GND
Ground
Ground
GND
27
28
DQ8
Data lane 8
Data lane 9
DQ9
29
30
GND
Ground
Ground
GND
31
32
DQS1_c
Data Strobe 1 -
Reserved
NC
33
34
DQS1_t
Data Strobe 1 +
Ground
GND
35
36
GND
Ground
Data lane 15
DQ15
37
38
DQ14
Data lane 14
Ground
GND
39
40
GND
Ground
Data lane 10
DQ10
41
42
DQ11
Data lane 11
Ground
GND
43
44
GND
Ground
Data lane 21
DQ21
45
46
DQ20
Data lane 20
Ground
GND
47
48
GND
Ground
Data lane 17
DQ17
49
50
DQ16
Data lane 16
Ground
GND
51
52
GND
Ground

Chapter: Connectors Memory
page 20 Beckhoff New Automation Technology CB3064-xxxx
Description
Name
Pin
Name
Description
Data Strobe 2 -
DQS2_c
53
54
NC
Reserved
Data Strobe 2 +
DQS2_t
55
56
GND
Ground
Ground
GND
57
58
DQ22
Data lane 22
Data lane 23
DQ23
59
60
GND
Ground
Ground
GND
61
62
DQ18
Data lane 18
Data lane 19
DQ19
63
64
GND
Ground
Ground
GND
65
66
DQ28
Data lane 28
Data lane 29
DQ29
67
68
GND
Ground
Ground
GND
69
70
DQ24
Data lane 24
Data lane 25
DQ25
71
72
GND
Ground
Ground
GND
73
74
DQS3_c
Data Strobe 3 -
Reserved
NC
75
76
DQS3_t
Data Strobe 3 +
Ground
GND
77
78
GND
Ground
Data lane 30
DQ30
79
80
DQ31
Data lane 31
Ground
GND
81
82
GND
Ground
Data lane 26
DQ26
83
84
DQ27
Data lane 27
Ground
GND
85
86
GND
Ground
Reserved
NC
87
88
NC
Reserved
Ground
GND
89
90
GND
Ground
Reserved
NC
91
92
NC
Reserved
Ground
GND
93
94
GND
Ground
Data Strobe 8 -
DQS8_c
95
96
NC
Reserved
Data Strobe 8 +
DQS8_t
97
98
GND
Ground
Ground
GND
99
100
NC
Reserved
Reserved
NC
101
102
GND
Ground
Ground
GND
103
104
NC
Reserved
Reserved
NC
105
106
GND
Ground
Ground
GND
107
108
RESET_n
Reset
Clock Enable 0
CKE0
109
110
CKE1
Clock Enable 1
Power supply 1,2V
VCC
111
112
VCC
Power supply 1,2V
Bank Group Input 1
BG1
113
114
ACT_n
Activation Command Input
Bank Group Input 0
BG0
115
116
ALERT_n
Alert
Power supply 1,2V
VCC
117
118
VCC
Power supply 1,2V
Address lane 12
A12
119
120
A11
Address lane 11
Address lane 9
A9
121
122
A7
Address lane 7
Power supply 1,2V
VCC
123
124
VCC
Power supply 1,2V
Address lane 8
A8
125
126
A5
Address lane 5
Address lane 6
A6
127
128
A4
Address lane 4
Power supply 1,2V
VCC
129
130
VCC
Power supply 1,2V
Address lane3
A3
131
132
A2
Address lane 2
Address lane 1
A1
133
134
EVENT_n
Event
Power supply 1,2V
VCC
135
136
VCC
Power supply 1,2V
Clock-Signal 0 +
CK0_t
137
138
CK1_t
Clock 1 +
Clock-Signal 0 -
CK0_c
139
140
CK1_c
Clock 1 -
Power supply 1,2V
VCC
141
142
VCC
Power supply 1,2V
Even parity check
Parity
143
144
A0
Address lane 0
SDRAM Bank 2
BA1
145
146
A10/AP
Address lane
10/Autoprecharge
Power supply 1,2V
VCC
147
148
VCC
Power supply 1,2V
Chip Select 0
CS0_n
149
150
BA0
Bank Adress 0
Address lane 14/Write
Enable
A14/WE_n
151
152
A16/RAS_n
Address lane 16/Row
Address Strobe
Power supply 1,2V
VCC
153
154
VCC
Power supply 1,2V
On Die Termination 0
ODT0
155
156
A15/CAS_n
Address lane 15/Column
Address Strobe