Beckhoff CB3053 User manual

Beckhoff Automation GmbH phone: [phone]
Eiserstr. 5 fax: [phone]
33415 Verl email: [email protected]
Germany web: www.beckhoff.de
CB3053
Manual
rev. 1.3

Contents
Beckhoff New Automation Technology CB3053 page 3
Contents
0Document History................................................................................................................................. 6
1Introduction .......................................................................................................................................... 7
1.1 Notes on the Documentation........................................................................................................ 7
1.1.1 Liability Conditions................................................................................................................ 7
1.1.2 Copyright............................................................................................................................... 7
1.2 Safety Instructions ........................................................................................................................ 8
1.2.1 Disclaimer............................................................................................................................. 8
1.2.2 Description of Safety Symbols.............................................................................................. 9
1.3 Essential Safety Measures ......................................................................................................... 10
1.3.1 Operator's Obligation to Exercise Diligence ....................................................................... 10
1.3.2 National Regulations Depending on the Machine Type ..................................................... 10
1.3.3 Operator Requirements...................................................................................................... 10
1.4 Functional Range........................................................................................................................ 11
2Overview............................................................................................................................................ 12
2.1 Features...................................................................................................................................... 12
2.2 Specifications and Documents ................................................................................................... 14
3Detailed Description........................................................................................................................... 15
3.1 Power Supply / UPS ................................................................................................................... 15
3.2 CPU ............................................................................................................................................ 15
3.3 Memory....................................................................................................................................... 15
4Connectors......................................................................................................................................... 16
4.1 Connector Map ........................................................................................................................... 17
4.2 Power Supply.............................................................................................................................. 18
4.3 Power Connector........................................................................................................................ 19
4.4 System........................................................................................................................................ 20
4.5 External CMOS Battery .............................................................................................................. 21
4.6 Memory....................................................................................................................................... 22
4.7 DVI.............................................................................................................................................. 25
4.8 LVDS........................................................................................................................................... 26
4.9 Touch Screen ............................................................................................................................. 28
4.10 USB 1-4 ...................................................................................................................................... 29
4.11 USB 5-8 ...................................................................................................................................... 30
4.12 LAN............................................................................................................................................. 31
4.13 Audio........................................................................................................................................... 32
4.14 IDE Interface............................................................................................................................... 33
4.15 Serial Interfaces COM1 and COM2............................................................................................ 34
4.16 SMB/I2C...................................................................................................................................... 35
4.17 Mini-PCI...................................................................................................................................... 36
4.18 Fan Connector............................................................................................................................ 38
5BIOS Settings..................................................................................................................................... 39
5.1 Remarks for Setup Use .............................................................................................................. 39
5.2 Top Level Menu.......................................................................................................................... 39
5.3 Standard CMOS Features .......................................................................................................... 40
5.3.1 IDE Channel 0 Master/Slave .............................................................................................. 41
5.4 Advanced BIOS Features........................................................................................................... 42
5.4.1 CPU Feature....................................................................................................................... 44

Contents
page 4 Beckhoff New Automation Technology CB3053
5.4.2 Hard Disk Boot Priority ....................................................................................................... 45
5.5 Advanced Chipset Features ....................................................................................................... 46
5.6 Integrated Peripherals ................................................................................................................ 47
5.6.1 OnChip IDE Devices........................................................................................................... 48
5.6.2 Onboard Devices................................................................................................................ 49
5.6.3 SuperIO Devices................................................................................................................. 50
5.6.4 USB Device Setting ............................................................................................................ 51
5.7 Power Management Setup......................................................................................................... 52
5.7.1 HPET Feature..................................................................................................................... 53
5.7.2 Intel DTS Feature ............................................................................................................... 54
5.8 PnP/PCI Configuration................................................................................................................ 55
5.8.1 IRQ Resources ................................................................................................................... 56
5.9 PC Health Status ........................................................................................................................ 57
5.10 Load Fail-Safe Defaults.............................................................................................................. 59
5.11 Load Optimized Defaults ............................................................................................................ 59
5.12 Set Password.............................................................................................................................. 59
5.13 Save & Exit Setup....................................................................................................................... 59
5.14 Exit Without Saving..................................................................................................................... 59
6BIOS update....................................................................................................................................... 60
7Mechanical Drawings......................................................................................................................... 61
7.1 PCB: Mounting Holes ................................................................................................................. 61
7.2 PCB: Pin 1 Dimensions .............................................................................................................. 62
7.3 PCB: Die Center ......................................................................................................................... 63
8Technical Data................................................................................................................................... 64
8.1 Electrical Data............................................................................................................................. 64
8.2 Environmental Conditions........................................................................................................... 64
8.3 Thermal Specifications ............................................................................................................... 65
9Support and Service .......................................................................................................................... 66
9.1 Beckhoff's Branch Offices and Representatives ........................................................................ 66
9.2 Beckhoff Headquarters............................................................................................................... 66
9.2.1 Beckhoff Support ................................................................................................................ 66
9.2.2 Beckhoff Service................................................................................................................. 66
IAnnex: Post-Codes............................................................................................................................ 68
II Annex: Resources.............................................................................................................................. 71
IO Range................................................................................................................................................ 71
Memory Range....................................................................................................................................... 71
Interrupt.................................................................................................................................................. 71
PCI Devices............................................................................................................................................ 72
SMB Devices.......................................................................................................................................... 72

Notes on the Documentation Chapter: Document History
Beckhoff New Automation Technology CB3053 page 5

Chapter: Document History Notes on the Documentation
page 6 Beckhoff New Automation Technology CB3053
0 Document History
Version
Changes
0.1
first pre-release
1.0
added dimensional drawings
1.1
added maximum current on 2x3 connector, no more TTL option for COM, updated
block diagram (ALC885 EOL), minor changes
1.2
improved output quality of dimensional drawings, minor changes
1.3
corrected LAN pinout
NOTE
All company names, brand names, and product names referred to in this manual are registered or
unregistered trademarks of their respective holders and are, as such, protected by national and
international law.

Notes on the Documentation Chapter: Introduction
Beckhoff New Automation Technology CB3053 page 7
1 Introduction
1.1 Notes on the Documentation
This description is only intended for the use of trained specialists in control and automation engineering
who are familiar with the applicable national standards. It is essential that the following notes and
explanations are followed when installing and commissioning these components.
1.1.1 Liability Conditions
The responsible staff must ensure that the application or use of the products described satisfy all the
requirements for safety, including all the relevant laws, regulations, guidelines and standards.
The documentation has been prepared with care. The products described are, however, constantly under
development. For that reason the documentation is not in every case checked for consistency with
performance data, standards or other characteristics. None of the statements of this manual represents a
guarantee (Garantie) in the meaning of § 443 BGB of the German Civil Code or a statement about the
contractually expected fitness for a particular purpose in the meaning of § 434 par. 1 sentence 1 BGB. In
the event that it contains technical or editorial errors, we retain the right to make alterations at any time and
without warning. No claims for the modification of products that have already been supplied may be made
on the basis of the data, diagrams and descriptions in this documentation.
1.1.2 Copyright
© This documentation is copyrighted. Any reproduction or third party use of this publication, whether in
whole or in part, without the written permission of Beckhoff Automation GmbH, is forbidden.

Chapter: Introduction Safety Instructions
page 8 Beckhoff New Automation Technology CB3053
1.2 Safety Instructions
Please consider the following safety instructions and descriptions. Product specific safety instructions are
to be found on the following pages or in the areas mounting, wiring, commissioning etc.
1.2.1 Disclaimer
All the components are supplied in particular hardware and software configurations appropriate for the
application. Modifications to hardware or software configurations other than those described in the
documentation are not permitted, and nullify the liability of Beckhoff Automation GmbH.

Safety Instructions Chapter: Introduction
Beckhoff New Automation Technology CB3053 page 9
1.2.2 Description of Safety Symbols
The following safety symbols are used in this documentation. They are intended to alert the reader to the
associated safety instructions.
ACUTE RISK OF INJURY!
If you do not adhere to the safety advise next to this symbol, there is immediate danger to life and health of
individuals!
RISK OF INJURY!
If you do not adhere to the safety advise next to this symbol, there is danger to life and health of individuals!
HAZARD TO INDIVIDUALS,ENVIRONMENT,DEVICES,OR DATA!
If you do not adhere to the safety advise next to this symbol, there is obvious hazard to individuals, to
environment, to materials, or to data.
NOTE OR POINTER
This symbol indicates information that contributes to better understanding.

Chapter: Introduction Essential Safety Measures
page 10 Beckhoff New Automation Technology CB3053
1.3 Essential Safety Measures
1.3.1 Operator's Obligation to Exercise Diligence
The operator must ensure that
othe product is only used for its intended purpose
othe product is only operated in sound condition and in working order
othe instruction manual is in good condition and complete, and always available for reference at the
location where the products are used
othe product is only used by suitably qualified and authorised personnel
othe personnel is instructed regularly about relevant occupational safety and environmental protection
aspects
othe operating personnel is familiar with the operating manual and in particular the safety notes
contained herein
1.3.2 National Regulations Depending on the Machine Type
Depending on the type of machine and plant in which the product is used, national regulations governing
the controllers of such machines will apply, and must be observed by the operator. These regulations cover,
amongst other things, the intervals between inspections of the controller. The operator must initiate such
inspections in good time.
1.3.3 Operator Requirements
oRead the operating instructions
All users of the product must have read the operating instructions for the system they work with.
oSystem know-how
All users must be familiar with all accessible functions of the product.