Beckhoff CB3063 User manual

Beckhoff Automation GmbH phone: [phone]
Eiserstr. 5 fax: [phone]
33415 Verl email: [email protected]
Germany web: www.beckhoff.de
CB3052
Manual
rev. 1.3

Contents
Beckhoff New Automation Technology CB3052 page 3
Contents
0Document History................................................................................................................................. 6
1Introduction .......................................................................................................................................... 7
1.1 Notes on the Documentation........................................................................................................ 7
1.1.1 Liability Conditions................................................................................................................ 7
1.1.2 Copyright............................................................................................................................... 7
1.2 Safety Instructions ........................................................................................................................ 8
1.2.1 Disclaimer............................................................................................................................. 8
1.2.2 Description of Safety Symbols.............................................................................................. 9
1.3 Essential Safety Measures ......................................................................................................... 10
1.3.1 Operator's Obligation to Exercise Diligence ....................................................................... 10
1.3.2 National Regulations Depending on the Machine Type ..................................................... 10
1.3.3 Operator Requirements...................................................................................................... 10
1.4 Functional Range........................................................................................................................ 11
2Overview............................................................................................................................................ 12
2.1 Features...................................................................................................................................... 12
2.2 Specifications and Documents ................................................................................................... 14
3Connectors......................................................................................................................................... 16
3.1 Connector Map ........................................................................................................................... 17
3.2 Power Supply.............................................................................................................................. 19
3.3 System........................................................................................................................................ 20
3.4 External CMOS Battery .............................................................................................................. 21
3.5 Memory....................................................................................................................................... 22
3.6 VGA/DVI ..................................................................................................................................... 25
3.7 DVI/HDMI.................................................................................................................................... 27
3.8 Touch Screen ............................................................................................................................. 28
3.9 USB 1-4 ...................................................................................................................................... 29
3.10 USB 5-8 ...................................................................................................................................... 30
3.11 LAN1........................................................................................................................................... 31
3.12 LAN2........................................................................................................................................... 32
3.13 Audio........................................................................................................................................... 33
3.14 SATA Interfaces.......................................................................................................................... 34
3.15 IDE Interface............................................................................................................................... 35
3.16 Serial Interface COM1................................................................................................................ 36
3.17 Serial Ports COM2 through COM4............................................................................................. 37
3.18 SMB/I2C...................................................................................................................................... 38
3.19 PCI-Express................................................................................................................................ 39
3.20 Mini-PCI...................................................................................................................................... 41
3.21 GPIO........................................................................................................................................... 43
3.22 Fan Connectors .......................................................................................................................... 44
4BIOS Settings..................................................................................................................................... 45
4.1 Remarks for Setup Use .............................................................................................................. 45
4.2 Top Level Menu.......................................................................................................................... 45
4.3 Standard CMOS Features .......................................................................................................... 46
4.3.1 SATA channels................................................................................................................... 47
4.3.2 PATA channel..................................................................................................................... 48
4.4 Advanced BIOS Features........................................................................................................... 49

Contents
page 4 Beckhoff New Automation Technology CB3052
4.4.1 CPU Feature....................................................................................................................... 51
4.4.2 Hard Disk Boot Priority ....................................................................................................... 52
4.5 Advanced Chipset Features ....................................................................................................... 53
4.5.1 PCI Express Root Port Function......................................................................................... 54
4.6 Integrated Peripherals ................................................................................................................ 55
4.6.1 OnChip IDE Devices........................................................................................................... 56
4.6.2 Onboard Devices................................................................................................................ 58
4.6.3 SuperIO Devices................................................................................................................. 59
4.6.4 USB Device Setting ............................................................................................................ 60
4.7 Power Management Setup......................................................................................................... 61
4.7.1 PCI Express PM Function................................................................................................... 63
4.7.2 Intel DTS Feature ............................................................................................................... 64
4.8 PnP/PCI Configuration................................................................................................................ 65
4.8.1 IRQ Resources ................................................................................................................... 67
4.9 PC Health Status ........................................................................................................................ 68
4.10 Frequency/Voltage Control......................................................................................................... 69
4.11 Load Fail-Safe Defaults.............................................................................................................. 70
4.12 Load Optimized Defaults ............................................................................................................ 70
4.13 Set Password.............................................................................................................................. 70
4.14 Save & Exit Setup....................................................................................................................... 70
4.15 Exit Without Saving..................................................................................................................... 70
5BIOS update....................................................................................................................................... 71
6Mechanical Drawings......................................................................................................................... 72
6.1 PCB: Mounting Holes ................................................................................................................. 72
6.2 PCB: Pin 1 Dimensions .............................................................................................................. 73
6.3 PCB: Heat Sink........................................................................................................................... 74
7Technical Data................................................................................................................................... 75
7.1 Electrical Data............................................................................................................................. 75
7.2 Environmental Conditions........................................................................................................... 75
7.3 Thermal Specifications ............................................................................................................... 76
8Support and Service .......................................................................................................................... 77
8.1 Beckhoff's Branch Offices and Representatives ........................................................................ 77
8.2 Beckhoff Headquarters............................................................................................................... 77
8.2.1 Beckhoff Support ................................................................................................................ 77
8.2.2 Beckhoff Service................................................................................................................. 77
IAnnex: Post-Codes............................................................................................................................ 79
II Annex: Resources.............................................................................................................................. 82
IO Range................................................................................................................................................ 82
Memory Range....................................................................................................................................... 82
Interrupt.................................................................................................................................................. 82
PCI Devices............................................................................................................................................ 83
SMB Devices.......................................................................................................................................... 83

Notes on the Documentation Chapter: Document History
Beckhoff New Automation Technology CB3052 page 5

Chapter: Document History Notes on the Documentation
page 6 Beckhoff New Automation Technology CB3052
0 Document History
Version
Changes
0.1
first pre-release
1.0
first complete version
1.1
- added recommendation for PCIe adapter cards
- corrected pin-orientation for P700 and P1403
- updated annex (memory map & SMB device map)
- added note regarding cables
- minor changes
1.2
improved output quality of dimensional drawings, minor changes
1.3
corrected LAN pinout
NOTE
All company names, brand names, and product names referred to in this manual are registered or
unregistered trademarks of their respective holders and are, as such, protected by national and
international law.

Notes on the Documentation Chapter: Introduction
Beckhoff New Automation Technology CB3052 page 7
1 Introduction
1.1 Notes on the Documentation
This description is only intended for the use of trained specialists in control and automation engineering
who are familiar with the applicable national standards. It is essential that the following notes and
explanations are followed when installing and commissioning these components.
1.1.1 Liability Conditions
The responsible staff must ensure that the application or use of the products described satisfy all the
requirements for safety, including all the relevant laws, regulations, guidelines and standards.
The documentation has been prepared with care. The products described are, however, constantly under
development. For that reason the documentation is not in every case checked for consistency with
performance data, standards or other characteristics. None of the statements of this manual represents a
guarantee (Garantie) in the meaning of § 443 BGB of the German Civil Code or a statement about the
contractually expected fitness for a particular purpose in the meaning of § 434 par. 1 sentence 1 BGB. In
the event that it contains technical or editorial errors, we retain the right to make alterations at any time and
without warning. No claims for the modification of products that have already been supplied may be made
on the basis of the data, diagrams and descriptions in this documentation.
1.1.2 Copyright
© This documentation is copyrighted. Any reproduction or third party use of this publication, whether in
whole or in part, without the written permission of Beckhoff Automation GmbH, is forbidden.

Chapter: Introduction Safety Instructions
page 8 Beckhoff New Automation Technology CB3052
1.2 Safety Instructions
Please consider the following safety instructions and descriptions. Product specific safety instructions are
to be found on the following pages or in the areas mounting, wiring, commissioning etc.
1.2.1 Disclaimer
All the components are supplied in particular hardware and software configurations appropriate for the
application. Modifications to hardware or software configurations other than those described in the
documentation are not permitted, and nullify the liability of Beckhoff Automation GmbH.

Safety Instructions Chapter: Introduction
Beckhoff New Automation Technology CB3052 page 9
1.2.2 Description of Safety Symbols
The following safety symbols are used in this documentation. They are intended to alert the reader to the
associated safety instructions.
ACUTE RISK OF INJURY!
If you do not adhere to the safety advise next to this symbol, there is immediate danger to life and health of
individuals!
RISK OF INJURY!
If you do not adhere to the safety advise next to this symbol, there is danger to life and health of individuals!
HAZARD TO INDIVIDUALS,ENVIRONMENT,DEVICES,OR DATA!
If you do not adhere to the safety advise next to this symbol, there is obvious hazard to individuals, to
environment, to materials, or to data.
NOTE OR POINTER
This symbol indicates information that contributes to better understanding.

Chapter: Introduction Essential Safety Measures
page 10 Beckhoff New Automation Technology CB3052
1.3 Essential Safety Measures
1.3.1 Operator's Obligation to Exercise Diligence
The operator must ensure that
othe product is only used for its intended purpose
othe product is only operated in sound condition and in working order
othe instruction manual is in good condition and complete, and always available for reference at the
location where the products are used
othe product is only used by suitably qualified and authorised personnel
othe personnel is instructed regularly about relevant occupational safety and environmental protection
aspects
othe operating personnel is familiar with the operating manual and in particular the safety notes
contained herein
1.3.2 National Regulations Depending on the Machine Type
Depending on the type of machine and plant in which the product is used, national regulations governing
the controllers of such machines will apply, and must be observed by the operator. These regulations cover,
amongst other things, the intervals between inspections of the controller. The operator must initiate such
inspections in good time.
1.3.3 Operator Requirements
oRead the operating instructions
All users of the product must have read the operating instructions for the system they work with.
oSystem know-how
All users must be familiar with all accessible functions of the product.

Functional Range Chapter: Introduction
Beckhoff New Automation Technology CB3052 page 11
1.4 Functional Range
NOTE
The descriptions contained in the present documentation represent a detailed and extensive product
description. As far as the described motherboard was acquired as an integral component of an Industrial
PC from Beckhoff Automation GmbH, this product description shall be applied only in limited scope. Only
the contractually agreed specifications of the corresponding Industrial PC from Beckhoff Automation GmbH
shall be relevant. Due to several models of Industrial PCs, variations in the component placement of the
motherboards are possible. Support and service benefits for the built-in motherboard will be rendered by
Beckhoff Automation GmbH exclusively as specified in the product description (inclusive operation system)
of the particular Industrial PC.

Chapter: Overview Features
page 12 Beckhoff New Automation Technology CB3052
2 Overview
2.1 Features
The CB3052 is a highly complex 3,5-inch board which incorporates complete motherboard functionality. It's
based on Intel®'s GS45 chipset combined with the ICH9M-E chip (SFF). Several CPUs are available for
this board, all from Intel®'s Core™2 Duo and Celeron® M series. Modern DDR3 technology provides
top-notch memory performance, accomodating up to 8 GByte of RAM (DDR3-1066) via SO-DIMM204. It
also provides a PCI bus (via mPCI connector), a PCI-Express bus (via a 2x40 pin custom connector) and
additional peripheral devices such as four serial interfaces, two Gigabit Ethernet interfaces (LAN), two
SATA channels, an IDE interface, an audio interface (HDA 5.1), eight USB channels, two DVI/HDMI
connectors, and, in some variants, a touchscreen connector.
oProcessor Intel® Core™2 Duo or Celeron® M
oChipset Intel® GS45 with integrated graphics and ICH9M-E (SFF)
oTwo SO-DIMM204 sockets for up to 8 GByte DDR3-1066 RAM
oPCI bus via mPCI connector
oPCI-Express bus (four x1 or one x4) via 2x40pin custom connector
oFour serial interfaces COM1 to COM4 (COM4 occupied by Touch if present)
oTwo LAN interfaces Ethernet 10/100/1000 (Base-T)
oTwo SATA channels
oIDE interface
oPS2 keyboard / mouse interface
oEight USB 2.0 interfaces
oAWARD BIOS 6.10
oCRT connection
oTwo DVI/HDMI connectors
ICH9M-E
Intel® 82801IUX
SMSC®
SCH3114
LPC
PCI
Intel®
82574L
2x
SoDIMM204
DDR3-1066
MEMORY
Power
VCCCore; VTT; DDRVTT
1,5V; 1,8V; 2,5V; 3,3V
Clock
ICS9LPRS501
BIOS
MS
SATA1
RealTek®
ALC885/889
HDA Link
KB
USB1
USB2
USB3
mPCI
LAN2
USB4
COM3 COM1
Intel® Core™2 Duo,
Celeron® M
HOST
CRT
DVI/HDMI GMCH
Intel® GS45
DMI
USB 2.0
SPDIF i
SPDIF o
USB5
USB6
USB7
USB8 Intel®
82567
LAN1SATA2
PCIe (x1 / x4)
SMBus
PCIe
JMicron®
JMB363-LG
COM2
Elotouch®
COACh3
COM4
Touch
2x Fan
2x
Chrontel®
CH7318C
DVI/HDMI
MIC
LINE
OUT
SPI
PCIe
IDE

Features Chapter: Overview
Beckhoff New Automation Technology CB3052 page 13
oAC97/HDA compatible sound controller with SPDIF in and out
oRTC with external CMOS battery
o5V supply
oTouchscreen connection (in some variants)
oFormat: 102 mm x 147 mm

Chapter: Overview Specifications and Documents
page 14 Beckhoff New Automation Technology CB3052
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
PCI specification
Version 2.3 resp. 3.0
www.pcisig.com
Mini-PCI specification
Version 1.0
www.pcisig.com
ACPI specification
Version 3.0
www.acpi.info
ATA/ATAPI specification
Version 7 Rev. 1
www.t13.org
USB specifications
www.usb.org
SM-Bus specification
Version 2.0
www.smbus.org
Intel®-Chip Description
Celeron® M, Core™ 2 Duo
www.intel.com
Intel® Chipset Description
Intel® 4 Series Express Chipset Family datasheet
www.intel.com
Intel® Chip Description
Intel® ICH9 Datasheet
www.intel.com
Intel® Chip Description
82574L Datasheet
www.intel.com
Intel® Chip Description
82567 Datasheet
www.intel.com
Realtek® Chip Description
ALC885/889 Datasheet
www.realtek.com.tw
SMSC® Chip Description
SCH3114 Datasheet
www.smsc.com
(NDA required)
IDT® Chip Description
ICS9LPRS501SKLF Datasheet
www.idt.com
Chrontel® Chip Description
Chrontel 7318C Datasheet
www.chrontel.com

Specifications and Documents Chapter: Overview
Beckhoff New Automation Technology CB3052 page 15
JMicron® Chip Description
JMB363 Datasheet
www.jmicron.com
(NDA required)
Elo® TouchSystems Chip Description
COACh3 Datasheet
www.elotouch.de
(NDA required)

Chapter: Connectors Specifications and Documents
page 16 Beckhoff New Automation Technology CB3052
3 Connectors
This section describes all the connectors found on the CB3052.
CAUTION
For most interfaces, the cables must meet certain requirements. For instance, USB 2.0 requires twisted and
shielded cables to reliably maintain full speed data rates. Restrictions on maximum cable length are also in
place for many high speed interfaces and for power supply. Please refer to the respective specifications and
use suitable cables at all times.

Connector Map Chapter: Connectors
Beckhoff New Automation Technology CB3052 page 17
3.1 Connector Map
Please use the connector map below for quick reference. Only connectors on the component side are
shown. For more information on each connector refer to the table below.
Ref-No.
Function
Page
P501/2
"SATA Interfaces"
p. 34
U600/1
"Memory"
p. 22
P700
"GPIO"
p. 43
P800
"PCI-Express"
p. 39
P802
"Mini-PCI"
p. 41
P900
"LAN1"
p. 31
P1000
"LAN2"
p. 32
P1100
"IDE Interface"
p. 35
P1303
"VGA/DVI"
p. 25
P1304
"DVI/HDMI"
p. 27
P1400/J1400
"Touch Screen"
p. 28
P1401
"SMB/I2C"
p. 38
P1402
"Audio"
p. 33
P1403
"System"
p. 20
P1500
"Serial Interface COM1"
p. 36
P1502/8
"Serial Ports COM2 through COM4"
p. 37
P1501/3
"USB 1-4"
p. 29
P1505/7
"USB 5-8"
p. 30
P1509
"Fan Connectors"
p. 44
P1600
"External CMOS Battery"
p. 21

Chapter: Connectors Connector Map
page 18 Beckhoff New Automation Technology CB3052
Ref-No.
Function
Page
P1700
"Power Supply"
p. 19

Power Supply Chapter: Connectors
Beckhoff New Automation Technology CB3052 page 19
3.2 Power Supply
The power supply of the hardware module is realized via a 2x8-pin connector (Molex PS 43045-1619,
mating connector: Molex PS 43025-16xx). The 12 volt supply is needed for PCI-Express cards and for the
fan connector. COM3 RXD and TXD can also be used for connecting a second power supply unit, e. g. for
UPS. As an ordering option SMBus signals SCL/SDA can be provided (replacing COM3 TXD/RXD).
Description
Name
Pin
Name
Description
COM3 transmit data
TXD
1
9
RXD
COM3 receive data
PSU on
PS-ON
2
10
PWRGD
Powergood
powerbutton PSU
PWRBTN#
3
11
SVCC
standby-supply 5V
12 volt supply
12V
4
12
12V
12 volt supply
ground
GND
5
13
GND
ground
ground
GND
6
14
GND
ground
5 volt supply
VCC
7
15
VCC
5 volt supply
5 volt supply
VCC
8
16
VCC
5 volt supply

Chapter: Connectors System
page 20 Beckhoff New Automation Technology CB3052
3.3 System
Some typical signals for system control are provided through a 2x9 pin connector (JST B18B-PHDSS,
mating connector: PHDR-18VS). This connector combines signals for power button, reset, keyboard,
speaker, and several LEDs such as harddisk LED, touch screen LED, suspend LED, and three additional
LEDs which are driven by GPIOs. Of these three GPIO-LEDs, LED1 and LED2 are already provided with a
series resistor. As can be seen from the pinout table below, corresponding signals are often placed vis-à-vis
or at least near to each other.
Description
Name
Pin
Name
Description
ground
GND
1
10
PWRBTN#
on/suspend button
ground
GND
2
11
RESET#
reset to ground
LED touch screen
TOUCHLED
3
12
3.3V
3.3 volt supply
LED suspend / ACPI
S-LED
4
13
S3.3V
standby supply 3.3 volt
LED harddisk
HDLED
5
14
3.3V
3.3 volt supply
LED GPIO device
LED1
6
15
3.3V
3.3 volt supply
LED GPIO device
LED2
7
16
LED3
LED GPIO device
speaker to 5 volt
SPEAKER
8
17
KDAT
keyboard data
standby supply 5 volt
(S)VCC
9
18
KCLK
keyboard clock