Belden GRASS VALLEY IPG-3901 Instruction Manual

IPG-3901
High Density SDI/IP Gateway
Guide to Installation and Operation
M3036-9900-132
2016-08-18

GUIDE TO INSTALLATION AND OPERATION
IPG-3901
Document History
Document Number Date of Publication Notes
3036-99M00-100 2015-10-06 Initial Release
3036-99M00-110 2016-02-23 Support for external reference added
3036-99M00-120 2016-04-27 Support for Aggregation mode added
3036-99M00-132 2016-08-18 Support for 4K/TICO added
Copyright and Trademark Notice
Copyright © 2015-2016, Grass Valley Canada. All rights reserved.
Belden, Belden Sending All The Right Signals, and the Belden logo are trademarks or registered trademarks of
Belden Inc. or its affiliated companies in the United States and other jurisdictions. Grass Valley, Miranda, IPG-3901,
iControl, and Densité are trademarks or registered trademarks of Grass Valley Canada. Belden Inc., Grass Valley
Canada, and other parties may also have trademark rights in other terms used herein.
Terms and Conditions
Please read the following terms and conditions carefully. By using IPG-3901 documentation, you agree to the
following terms and conditions.
Grass Valley hereby grants permission and license to owners of IPG-3901 to use their product manuals for their own
internal business use. Manuals for Grass Valley products may not be reproduced or transmitted in any form or by any
means, electronic or mechanical, including photocopying and recording, for any purpose unless specifically authorized
in writing by Grass Valley.
A Grass Valley manual may have been revised to reflect changes made to the product during its manufacturing life.
Thus, different versions of a manual may exist for any given product. Care should be taken to ensure that one obtains
the proper manual version for a specific product serial number.
Information in this document is subject to change without notice and does not represent a commitment on the part of
Grass Valley.
Warranty information is available in the Support section of the Grass Valley Web site (www.grassvalley.com).
Electrostatic Discharge (ESD) Protection
Electrostatic discharge occurs when electronic components are improperly handled and can result in
intermittent failure or complete damage adversely affecting an electrical circuit. When you remove and
replace any card from a frame always follow ESD-prevention procedures:
•Ensure that the frame is electrically connected to earth ground through the power cord or any other means if
available.
•Wear an ESD wrist strap ensuring that it makes good skin contact. Connect the grounding clip to an unpainted
surface of the chassis frame to safely ground unwanted ESD voltages. If no wrist strap is available, ground
yourself by touching the unpainted metal part of the chassis.
•For safety, periodically check the resistance value of the antistatic strap, which should be between 1 and
10 megohms.
•When temporarily storing a card make sure it is placed in an ESD bag.
•Cards in an earth grounded metal frame or casing do not require any special ESD protection.

GUIDE TO INSTALLATION AND OPERATION
IPG-3901
Recycling
Visit www.grassvalley.com for recycling information.
Certification and Compliance
Safety of Laser Modules
This equipment incorporates modules containing Class 1 lasers. These modules are certified by the
manufacturer to comply with:
•IEC/EN 60825-1 Safety of laser products
•IEC 60950-1 Safety of information technology equipment
Restriction on Hazardous Substances (RoHS)
IPG-3901
部件名称 Part name
有毒有害物质或元素 (Toxic or Hazardous Substances and Elements)
铅(Pb) 汞(Hg) 镉(Cd) 六价铬
(Cr6) 多溴联苯 (PBB) 多溴二苯
(PBDE)
电缆及电缆组件 Cables and Cable Assemblies O O O O O O
电路模块 Circuit Modules X O O O O O
组装风扇 Fan Assemblies X O O O O O
IPG-3901-3DRP, IPG-3901-3TRP
部件名称 Part name
有毒有害物质或元素 (Toxic or Hazardous Substances and Elements)
铅(Pb) 汞(Hg) 镉(Cd) 六价铬
(Cr6) 多溴联苯 (PBB) 多溴二苯
(PBDE)
电路模块 Circuit Modules X O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T 11363-2006规定的限量要求以下。
O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit
requirement in SJ/T11363-2006.
X: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T 11363-2006规定的限量要求。
X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials for this part is above
the limit requirement in SJ/T11363-2006.
技术条款解释：
此声明所依据之数据由Grass Valley环境管理部门向我们的部件供应商获取。Grass Valley 公司相信此信息的正确性，但由于数据
来源于公司外部，我们无法保证它的完整和准确。所有这些特性可能在未获通知的情况下更改。
Technical explanations:
This statement is based on the information provided by our suppliers of components and collected through Grass Valley’s
environmental management system. Grass Valley believes this environmental information to be correct but cannot guarantee its
completeness or accuracy as it is based on data received from sources outside our company. All specifications are subject to
change without notice.

GUIDE TO INSTALLATION AND OPERATION
IPG-3901
Electromagnetic Compatibility
This equipment has been tested for verification of compliance with FCC Part 15, Subpart B requirements for
Class A digital devices.
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at his own expense.
This equipment has been tested and found to comply with the requirements of the EMC directive
2004/108/CE:
•EN 55022 Class A radiated and conducted emissions
•EN 61000-3-2 Harmonic current emission limits
•EN 61000-3-3 Voltage fluctuations and flicker limitations
•EN 61000-4-2 Electrostatic discharge immunity
•EN 61000-4-3 Radiated electromagnetic field immunity – RF
•EN 61000-4-4 EFT immunity
•EN 61000-4-5 Surge immunity
•EN 61000-4-6 Conducted immunity
•EN 61000-4-8 EMP immunity
•EN 61000-4-11 Voltage-dips, short-interruption and voltage variation immunity

GUIDE TO INSTALLATION AND OPERATION
IPG-3901
Table of Contents
1IPG-3901 High Density SDI/IP Gateway for Densité 3 Platform.............................................1
1.1 Introduction ......................................................................................................................................... 1
1.2 Features.............................................................................................................................................. 1
1.3 Functional Block Diagram................................................................................................................... 2
1.4 Front Card-edge Interface................................................................................................................... 3
2Installation................................................................................................................................4
2.1 Installation of Rear Connector Panels ................................................................................................ 4
2.2 IPG-3901 Card Installation.................................................................................................................. 4
2.3 Rear Panels and Connectors.............................................................................................................. 5
2.3.1 Images of Rear Panel Connectors......................................................................................... 5
2.3.2 Summary of rear panel connections...................................................................................... 5
2.3.3 Details of rear panel connections .......................................................................................... 6
3User Interface...........................................................................................................................7
3.1 Control options.................................................................................................................................... 7
3.2 Card-Edge Status LED ....................................................................................................................... 7
4Local control using the Densité frame control panel ............................................................8
5Remote control using iControl................................................................................................9
5.1 The iControl graphic interface window................................................................................................ 9
5.2 Gateway Config panel....................................................................................................................... 12
5.2.1 Gateway Config panel – System tab ................................................................................... 12
5.2.2 Gateway Config panel – Gateways tab ............................................................................... 13
5.3 Network Config panel........................................................................................................................ 16
5.3.1 Network Config panel – Settings tab ................................................................................... 16
5.3.2 Network Config panel – Status tab ...................................................................................... 17
5.3.3 Network Config panel – Statistics tab.................................................................................. 17
5.4 Gateway Status panel....................................................................................................................... 18
5.5 TICO Panel ....................................................................................................................................... 18
5.5.1 Advanced tab....................................................................................................................... 19
5.5.2 Config tab............................................................................................................................. 20
5.5.3 TICO Encoder monitoring .................................................................................................... 22
5.5.4 Metadata (including audio) when TICO is in use................................................................. 22
5.6 Reference Panel ............................................................................................................................... 23
5.7 Test panel ......................................................................................................................................... 24
5.8 Options Panel.................................................................................................................................... 25
5.9 Factory/Presets Panel....................................................................................................................... 25
5.9.1 Factory................................................................................................................................. 26
5.9.2 Profiles ................................................................................................................................. 26
5.10 Alarm Config Panel........................................................................................................................... 29
5.11 Info Panel.......................................................................................................................................... 31
5.11.1 Info Panel – Info tab............................................................................................................. 31
5.11.2 Info Panel – Technical Support tab...................................................................................... 33
6Specifications.........................................................................................................................34

GUIDE TO INSTALLATION AND OPERATION
IPG-3901
7Contact Us..............................................................................................................................35
Grass Valley Technical Support.................................................................................................................35
Corporate Head Office................................................................................................................................35
ANNEX 1 – Local Menu ...............................................................................................................36
ANNEX 2 – Firmware upgrading.................................................................................................39
ANNEX 3 – Block Diagrams of TICO Models .............................................................................41

GUIDE TO INSTALLATION AND OPERATION
IPG-3901 | 1
1 IPG-3901 High Density SDI/IP Gateway for Densité 3 Platform
1.1 Introduction
The Densité IP Gateway (IPG-3901) plug-and-play module from Grass Valley, a Belden Brand, is a 3 RU module for
the Densité 3 frame that offers bidirectional IP/SDI conversion. The Gateway operates with 10 GigE SMPTE 2022-6
video-over-IP, supporting 4K UHD/3G/HD/SD-SDI formats.
With the addition of intoPIX TICO mezzanine encoding and decoding option on the gateway, customers have a
convenient way to add 4K to their workflow and move 4K across the production facility. TICO mezzanine compression
is visually lossless 4:1 compression, which is lightweight and fast, perfectly suitable for live production. The IPG-3901
with purchasable TICO option provides either two (2) encodes OR two (2) decodes OR one (1) encode and one (1)
decode per card.
The gateways support any mix of 3G/HD/SD-SDI production workflows over IP networks. With bidirectional I/O in
combinations of 5 in/6 out or 6 in/5 out, the cards offer full redundancy in either unicast or multicast workflows to
ensure uninterrupted service.
In addition, you also have the choice to use the second ethernet port for aggregation instead of redundancy, providing
20 GigE of bidirectional bandwidth over two 10 GigE ports, increasing the capability to transport 6 in/5 out or 5 in/6 out
3G signals per IPG card. It also lets you transport more HD/SD signals in one direction taking advantage of the
bidirectional configuration of 7 BNC I/O, providing up to 9 in/2 out or 2 in/9 out. Based on the proven Densité modular
framework of over 100 functional cards, the flexible, space-efficient IPG-3901 cards accommodate a gradual adoption
of IP production elements into broadcasting workflows, while protecting operational methods and investment in
installed equipment. With flexibility to configure up to 6 IPG-3901 modules per Densité 3 frame and with each IPG-
3901 module carrying 11 HD or 6 3G gateways, the Densité 3 platform scales to a density of 66 HD or 36 3G
gateways in a 3 RU frame. In the new Densité 3+ FR4 frame, up to12 IPG-3901 modules can be installed giving a
density of 132 HD or 72 3G gateways in a 4 RU frame. This means space- and cost-efficient scaling – today and
tomorrow.
The Densité IP Gateway can be controlled by the advanced GV Convergent SDN platform, offering unified control
across COTS IP switches and SDI routing/processing infrastructures, as well as by the proven iControl systems.
1.2 Features
•High density configuration:
- Up to 11 gateways per card/66 HD/33 3G gateways per RU in redundancy mode
- Up to 66 3G gateways per RU in aggregation mode
•De-encapsulate full bandwidth uncompressed SMPTE 2022-6 to SDI
•Encapsulate SDI into full bandwidth uncompressed SMPTE 2022-6 IP
•Bidirectional transport of SD/HD/3G-SDI video signal over 10 GigE link
•Full 1+1 stream redundancy with automatic change-over link to avoid service interruption
•New aggregation mode that provides a total IP bandwidth of 20 GigE, providing higher 3G transmission
capability per IPG card such as the transfer of 4K UHD uncompressed over a 4K link on a single IPG
•Bidirectional I/O for 2 inputs, 2 outputs and 7 bidirectional I/Os for up to 11 streams
•Flexible SD/URS reference input
•Compatible with Densité 3, 3+ and GV Node platforms
•Integrates with iControl and GV Convergent SDN control frameworks
•IGMPv3 support for IP inputs
•Supports unicast and multicast signals
•Features dual-network interfaces supporting 10 GigE SFP+:
- Short range multi-mode optical.
- Long range single-mode optical.

GUIDE TO INSTALLATION AND OPERATION
2| IPG-3901
•TICO 4K 1-wire option:
- IPG-3901-OPT-TICO — this is a purchasable option that adds dual TICO codec option for 4K 1-wire support
- 2-Sample Interleave/Quad Split (2SI/SDQS) 4K link I/O support
- Simultaneous 3G/HD/SD and 4K
- TICO is intoPIX Profile 1 with visually lossless 4:1 low-latency compression
- Flexible configuration of 2 encoders or 2 decoders or 1 encoder and 1 decoder
- 3G monitoring of 4K UHD signals
1.3 Functional Block Diagram
Figure 1-1 IPG-3901 Functional Block Diagram

GUIDE TO INSTALLATION AND OPERATION
IPG-3901 | 3
1.4 Front Card-edge Interface
The front card-edge of the IPG-3901 incorporates
two elements:
•Status LED (see section 3.2)
•Select Button (see section 4)
Figure 1-2 Front card-edge layout
Select Button
IRD-3802
Status LED
Status
Select
IPG-3901

GUIDE TO INSTALLATION AND OPERATION
4| IPG-3901
2 Installation
2.1 Installation of Rear Connector Panels
Grass Valley Densité-series cards are each associated with a rear connector panel, which must be installed in the
Densité frame before the card can be inserted.
The IPG-3901 card is designed to fit into Grass Valley’s Densité-3 and Densité 3+ frames. Two different rear
connector panels are available:
•IPG-3901-3TRP Triple-slot-width panel for Densité-3
•IPG-3901-3+DRP Double-slot-width panel for Densité-3+FR1 and Densité-3+FR4
See section 2.3 for details of the signal connections available on these panels.
All cards and rear panels can be installed with the frame power on. The card has connectors that plug into a mid-
frame mother board for distribution of power and for connection to the controller card, and a second connector that
plugs directly into the rear connector panel for input and output.
The rear connector panel must be installed with the card out of the frame.
•To remove an existing card from the slot, tilt the swivel handle on the front of the card to lever the
connectors apart, then use the handle to pull the card straight out of the slot.
To install the connector panel:
1. If a card is installed in the slot whose rear panel is being changed, remove it as described above.
2. Remove the existing panel (either blank or belonging to an existing card that is being changed) by releasing the
captive screw(s) at the bottom (Densité 3 or Densité 3+ FR4) or side (Densité 3+ FR1) of the panel.
3. Position the new panel and secure it in place with the captive screw(s) at the bottom or side.
2.2 IPG-3901 Card Installation
Once a matching rear connector panel is in place, install the IPG-3901 card as follows:
1. Open the front panel of the frame.
2. Slide the IPG-3901 card into the slot and push gently on the handle to seat the connectors.
•When using a triple-slot-width rear panel in a Densité-3 frame, the card should be inserted into the
rightmost of the three slots.
•When using a double-slot-width rear panel in a Densité-3+ FR1 frame, the card should be inserted into the
lower of the two slots.
•When using a double-slot-width rear panel in a Densité-3+ FR4 frame, the card should be inserted into the
rightmost of the two slots.
Inserting the card into the wrong slot will not damage the card, and will be flagged by the on-card status LED
flashing red to indicate that there is no connection to the rear panel.
3. Close the front door of the frame.