Boser BBS-3001 User manual

BBS-3001
High Speed, Fanless PC
with Slim CD-ROM, 12V DC Adapter

Copyright Disclaimers
The accuracy of contents in this manual has passed thorough checking and review before
publishing. BOSER Technology Co., Ltd., the manufacturer and publisher, is not liable for
any infringements of patents or other rights resulting from its use. The manufacturer will
not be responsible for any direct, indirect, special, incidental or consequential
damages arising from the use of this product or documentation, even if advised of
the possibility of such damage(s).
This manual is copyrighted and BOSER Technology Co., Ltd. reserves all
documentation rights. Unauthorized reproduction, transmission, translation, and
storage of any form and means (i.e., electronic, mechanical, photocopying, recording)
of this document, in whole or partly, is prohibited, unless granted permission by BOSER
Technology Co., Ltd.
BOSER Technology Co., Ltd. reserves the right to change or improve the contents of
this document without due notice. BOSER Technology Co., Ltd. assumes no
responsibility for any errors or omissions that may appear in this manual, nor does
it make any commitment to update the information contained herein.
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BOSER is a registered trademark of BOSER Technology Co., Ltd.
ISB is a registered trademark of BOSER Technology Co., Ltd.
Intel is a registered trademark of Intel Corporation.
Award is a registered trademark of Award Software, Inc.
AMI is a registered trademark of AMI Software, Inc.
All other trademarks, products and or product names mentioned herein are
mentioned for identification purposes only, and may be trademarks and/or
registered trademarks of their respective companies or owners.
© Copyright 2008 BOSER Technology Co., Ltd.
All Rights Reserved.
Edition 1.3, March 30, 2010

Table of Contents
Chapter 1 General Description ..................................1
1.1 Major Features....................................................................... 2
1.2 Specifications ........................................................................ 2
1.3 Dimensions ............................................................................ 6
Chapter 2 Unpacking ..................................................7
2.1 Opening the Delivery Package............................................. 7
2.2 Inspection............................................................................... 7
Chapter 3 Hardward Installation ..............................9
3.1 Hardware Installation............................................................ 9

Declaration of Conformity -- CE Mark
BOSER Technology hereby acknowledges that compliance testing in
accordance with applicable standards of the EU’s EMC Directive,
89/336/EEC, was successfully completed on a sample of the equipment
identified below:
Equipment Class: Information Technology Equipment
Product Model Series: BBS-3001
This Product Complies With: EN55022: Class A for Radiated emissions
EN50082-2: Heavy Industrial EMC Immunity
We, the undersigned, hereby declare that the equipment specified above
conforms to the above directives and standards.
Manufacturer:
BOSER TECHNOLOGY CO., LTD.

Safety Instructions
The safety recommendations outlined in this section are to be read,
understood and followed before operating the product. Keep this
information in a safe place for future reference. Failure to comply with any
of the following safety procedures could result in serious hazard.
 Do not operate product for any purposes other than its intended use
 This product is intended for indoor use only
 Do not operate product if power cord is damaged in anyway
 Do not insert objects into openings
 Do not immerse product in water or permit liquids to spill inside
 Turn off power when unattended or not in use. Unplug product before
moving it or when it is not in use for an extended period of time. The
socket-outlet shall be installed near the equipment and shall be easily
accessible
 Do not alter or extend electric plug. Plug is configured for appropriate
electrical supply
 Do not overload electrical outlets beyond their capacity as this can result in a
fire
NOTE: DO NOT TOUCH THE PRODUCT OR ANY OTHER SENSITIVE
COMPONENTS WITHOUT ALL NECESSARY ANTI-STATIC
PROTECTIONS.

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1
Chapter 1
General Description
The BBS-3001 series is an industrial Fanless PC. The rear design of
BBS-3001 series enhanced the disassembly process when required. It
also supports various mounting solution for different application.
This model can accommodate BOSER’s mini ITX board. The
BBS-3001 series provides HDMI, DVI/CRT, RJ-45, wireless LAN,
parallel, audio, COM, USB and KB/MS ports.
The BBS-3001 series is IBM PC/AT compatible and can draw from a
large body of hardware and software resources worldwide.
The user can select the operating system he wants to use just like an
ordinary personal computer. An operating system such as an MS-DOS,
Windows can be selected to suit the application.
You can select from a broad range of variations to arrive at the
optimum configuration for your application and budget.

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1.1 Major Features
The BBS-3001 series comes with the following features:
 Heat pipe, fanless PC design
 Built-in 12V DC adapter
 BBS-3001-J w/HS-1746, provides Intel® P-M/C-M processor, 2 x COM,
6 x USB2.0, parallel
 BBS-3001-N w/HS-1748, provides Intel® P-M/C-M processor，2 x COM,
6 x USB2.0, DVI display
 BBS-3001-O w/HS-1755-NF93, provides Intel® 45nm Penryn Mobile
processors, 3 x COM, 6 x USB2.0, DVI display
 BBS-3001-Q w/HS-1750, provides Intel® CoreTM Duo T2050 processor,
4 x COM, 6 x USB2.0, DVI display
 1 x 2.5” HDD space, 1 x slim CD-ROM space
 Operating Temperature: 0~+60 degrees C
 Option for Wireless LAN module, +10~+30V DC in solution
1.2 Specifications
 Mechanical
 Thermal System
Heat pipe
 Dimensions (LxHxW)
27.5 x 8.3 x 18.22 cm
 Operation/Storage Temperature
0~+45 degrees C/-20~+70 degrees C
0~+60 degrees C (only BBS-3001-J)
 EMC
FCC/CE
 Power Adapter
12V DC in 84W adapter
 System
BBS-3001-J
 SBC Model
HS-1746
 CPU
Intel® Pentium® M processor 1.6/1.8GHz or
Intel® Celeron® M processor 1.5GHz (option)
 BIOS
Award PnP Flash BIOS

3
 System Chipset
Intel® 855GME/ICH4
 System Memory
1 x 184-pin DIMM socket up to 1GB DDR SDRAM
 Display Chipset
Intel® 855GME
 Ethernet Chipset
Dual Intel® 82541 10/100/1000 Mbps LAN
 Drive Bay
1 x 2.5” HDD space
1 x Slim CD-ROM space
 Watchdog Timer
Software programmable time-out intervals from 1~255 sec.
 MTBF
60,000 hrs. under 50 degrees C without HDD
 External I/O
2 x COM, PS/2 MS, PS/2 KB, Parallel, VGA, 2 x LAN, 6 x USB2.0
 Rear I/O
01. COM 2 06. COM 1
02. DC Adapter In 07. VGA
03. MS 08. LAN + USBB2.0 * 2
04. KB 09. LAN + USBB2.0 * 2
05. Parallel
BBS-3001-N
 SBC Model
HS-1748
 CPU
Intel® Pentium® M/Celeron® M processor in the u-FCPGA 478
package (option)
 BIOS
Award BIOS with 4Mb Flash EEPROM
 System Chipset
Intel® 915GME/ICH6-M

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 System Memory
2 x 240-pin DIMM sockets up to 2GB DDR2 SDRAM
 Display Chipset
CRT: Intel® 915GME
DVI: Chrontel CH7307
 Audio Chipset
RealTek ALC655 5.1CH audio codec
 Ethernet Chipset
Triple Marvell 88E8053 10/100/1000 Mbps LAN
 Drive Bay
1 x 2.5” HDD space
1 x Slim CD-ROM space
 Watchdog Timer
Reset: 1 sec.~255 min. and 1 sec. or 1 min./step
 External I/O
6 x USB2.0, DVI, PS/2 MS, PS/2 KB, 2 x COM, VGA, Line In, Line Out,
MIC In, 3 x LAN
 Rear I/O
01. DC Adapter In 06. COM 1 11. LAN + USBB2.0 * 2
02. USB2.0 * 2 07. VGA 12. LAN * 2
03. DVI 08. Line In 13. COM 2
04. MS 09. Line Out
05. KB 10. MIC In
BBS-3001-O
 SBC Model
HS-1755-NF93
 CPU
Supports Intel® 45nm Penryn Mobile processors
Front Side Bus 1066MHz
 BIOS
Award 8Mb DIP Flash ROM
 System Chipset
Intel® GM45/ICH9-ME
 System Memory
2 x Dual Channel SO-DIMM sockets for unbuffered DDR2 800/667
SDRAM up to 4GB

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 Display Chipset
CRT: Intel® GM45
DVI: Intel® GM45
 Audio Chipset
RealTek ALC888 6-Channel HD audio codec
 Ethernet Chipset
Dual RTL8111C PCI-E 10/100/1000 Mbps LAN
Provides Wireless LAN module (option)
 Drive Bay
1 x 2.5” HDD space
1 x Slim CD-ROM space
 External I/O
3 x COM, HDMI, DVI, VGA, 2 x LAN, 6 x USB2.0, Line In, Line Out, MIC
In
 Rear I/O
01. WLAN ANT
(option)
06. VGA 11. Line In
02. DC Adapter In 07. LAN + USBB2.0 * 2 12. Line Out
03. COM 3 08. LAN + USBB2.0 * 2 13. MIC In
04. HDMI 09. COM 1
05. DVI 10. COM 2
BBS-3001-Q
 SBC Model
HS-1750
 CPU
Intel® CoreTM Duo T2050 processor (option)
 BIOS
Award BIOS with 4Mb Flash EEPROM
 System Chipset
Intel® 945GME/ICH7-M
 System Memory
2 x 200-pin SO-DIMM sockets up to 4GB DDR2 SDRAM
 Display Chipset
CRT: Intel® 945GME
DVI: Chrontel CH7307
 Audio Chipset
RealTek ALC655 5.1CH audio codec

6
 Ethernet Chipset
Dual Marvell 88E8053 10/100/1000 Mbps LAN
 Drive Bay
1 x 2.5” HDD space
1 x Slim CD-ROM space
 Watchdog Timer
Reset: 1 sec.~255 min. and 1 sec. or 1 min./step
 External I/O
4 x COM, PS/2 MS, PS/2 KB, VGA, DVI, 2 x LAN, 6 x USB2.0, Line In,
Line Out, MIC In
 Rear I/O
01. COM 3 05. VGA 09. LAN + USBB2.0 * 2
02. DC Adapter In 06. DVI 10. LAN + USBB2.0 * 2
03. MS 07. COM 2 11. Audio
04. KB 08. COM 1 12 COM 4
1.3 Dimensions

7
Chapter 2
Unpacking
2.1 Opening the Delivery Package
The BBS-3001 series is packed in an anti-static bag. The board has
components that are easily damaged by static electricity. Do not
remove the anti-static wrapping until proper precautions have been
taken. Safety instructions in front of this manual describe anti-static
precautions and procedures.
2.2 Inspection
After unpacking the Panel PC, place it on a raised surface and carefully
inspect the board for any damage that might have occurred during
shipment. Ground the board and exercise extreme care to prevent
damage to the board from static electricity.
Integrated circuits will sometimes come out of their sockets during
shipment. Examine all integrated circuits, particularly the BIOS,
processor, memory modules, ROM-Disk, and keyboard controller chip
to ensure that they are firmly seated. The BBS-3001 series delivery
package contains the following items:
 BBS-3001 x 1
 Power Cable x 1
 Drive CD Disk including, System Board User’s Manual x 1, BBS-4005
User’s Manual x 1
It is recommended that you keep all the parts of the delivery package
intact and store them in a safe/dry place for any unforeseen event
requiring the return shipment of the product. In case you discover any
missing and/or damaged items from the list of items, please contact
your dealer immediately.

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9
Chapter 3
Hardware Installation
This chapter tells how to install components into the fanless PC
system. External interface please refers to system board’s manual.
3.1 Hardware Installation
1. Remove 4 screws (NO.1~4) to open the top cover.

10
2. Remove 4 screws (NO.5~8) to open the base cover.
3. Remove 2 screws (NO.9~10) to loosen the CD-ROM Cut-out
cover, and install the slim CD-ROM.
4. Use 4 screws to install the 2.5” HDD (NO.11~14) on to the
base plate.

11
5. Complete the HDD and slim CD-ROM installation (as shown in
the picture).
6. Install the CPU and Memory Module onto the board.

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7. Put the GR-Hm 15*15*1mm thermal tape on the NO.17 area,
and the GR-Hm 35*40*0.5mm thermal tape on the NO.18
area.
NOTE: Please make sure to remove the paper sticker on top of the
thermal adhesive.
8. Match the heat sink holes on to the Board, and use 4 special
screws to tie the heat sink up from the base side.
9. Install the IDE HDD cable and power cable through the cut-out
area.

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10. Plug in the IDE cable 40P(2.54*2)-44P(2.0)-45cm into the
board.
11. Plug in the USB cable in the red square area.
12. Plug in the IDE cable 40P(2.54*2)-44P(2.0)-45cm in to the
slim CD-ROM and 2.5” HDD.

14
13. Install the board with 4 screws in the red circle area, and plug
in the heat pipe into the heat sink in the red square area with
the thermal compound.
14. Put the thermal compound onto the heat pipe holder kit.
15. Mount the heat pipe holder kit to tie up the heat pipe in the red
circle area, and plug in ATX power cable & USB cable in the
square area.