
Table of Contents
CHAPTER 1. INTRODUCTION..........................................................................................1–1
1.1 Introduction.........................................................................................................................1–1
1.2 Description...........................................................................................................................1–2
1.3 Dimensional Envelope ........................................................................................................1–5
CHAPTER 2. CONNECTOR PINOUTS.............................................................................2-1
2.1 External Connectors .....................................................................................................2-1
2.1.1 System Comm Connector, J1..........................................................................................2-2
2.1.2 SSPA Comm 1 or 2 Connector, J2, J3, or J4 (J4 only for 1:2 systems) .........................2-3
2.1.3 SSPA SW Out, J5 ...........................................................................................................2-4
2.1.4 RF Input Switch, J6.........................................................................................................2-5
2.1.5 RF IN 1, J7......................................................................................................................2-5
2.1.6 RF IN 2, J8......................................................................................................................2-5
2.1.7 SSPA Out 1, J9 ...............................................................................................................2-5
2.1.8 SSPA Out 2, J10 .............................................................................................................2-5
2.1.9 Notes:..............................................................................................................................2-6
CHAPTER 3. THEORY OF OPERATION .........................................................................3-1
3.1 Introduction..........................................................................................................................3-1
3.2 Phase and Gain Equalization..............................................................................................3-2
3.3 System Attenuation..............................................................................................................3-2
3.4 Soft Fail Protection..............................................................................................................3-2
CHAPTER 4. ALIGNMENT PROCEDURES...................................................................4-1
4.1 Introduction..........................................................................................................................4-1