Congatec COM Express conga-TS370 User manual

COM Express™ conga-TS370
8th Generation Intel® Core™ i7, i5, i3 and Xeon processor with either QM370, HM370, or CM246 Chipset
User’s Guide
Revision 1.7

Copyright © 2018 congatec GmbH TSCOm17 2/75
Revision History
Revision Date (yyyy-mm-dd) Author Changes
0.1 2018-08-16 AEM •Preliminary release
0.2 2018-10-12 AEM •Added note about recommended boot mode in section 2.2 “Supported Operating Systems”
•Added note about default USB 3.1 BIOS setting in section 6.1.7 “USB”
1.0 2018-12-17 AEM •Updated table 5 “Power Consumption Tables”
•Updated the information about handling electrostatic sensitive devices in preface section
•Official release
1.1 2019-01-16 AEM •Changed the minimum VCC_RTC input voltage to 2.5 V in section 2.4.1 “Electrical Characteristics”
•Updated the note about USB Gen 2 design considerations in section 6.1.7 “USB”
1.2 2019-07-26 AEM •Added variants that feature Coffee Lake-H Refresh CPUs to section 1.2 “Options Information”
•Changed maximum memory capacity to 64 GB in table 3 “Feature Summary”
•Corrected HDMI resolutions in table 7 “Display Combinations and Resolution”
•Updated sections 4 .1 “CSA Dimensions”, 4.2 “CSP Dimensions”, 4.3 “HSP Dimensions”
•Updated the PWR_OK input circuitry diagram in section 6.1.14 “Power Control”
•Corrected the designation of USB_x_x_OC# pins as strap pins in tables 21 “USB 2.0 Signal Description” and 36
“Bootstrap Signal Description”
•Added note to section 11.4 “Supported Flash Devices”
1.3 2019-10-30 AEM •Deleted obsolete Coffee Lake-H Refresh variant with PN:049103
•Corrected the AMI Aptio UEFI firmware version and added note about Intel AMT support in section 2.1 “Feature List”
•Added the link configurations that are possible with customized BIOS in section 6.1.1 “PCI Express”
•Added note about the required PD resistor on the carrier board for the pins that are reclaimed from the VCC_12V pool in
tables 28 , 30 and 34
•Added note about the minimum pulse width required for proper button detection in table 30 “Power and System
Management Signal Descriptions”
1.4 2020-07-15 AEM •Updated table 5 “Power Consumption Values”
•Updated the link for standard 12 V power supply implementation guidelines in section 6.1.14 “Power Control”
•Added information about congatec MLF file to section 11 “BIOS Setup Description”
•Deleted section 12 “Industry Specifications”
1.5 2021-04-19 AEM •Updated table 2 “conga-TS370 Variants, table 3 “Feature Summary”, table 8 “Display Combinations and Resolutions”
and table 16 “TMDS Signal Descriptions”
•Updated section 3 “Block Diagram” and section 6.1.3 “Display Interfaces
•Deleted section 6.1.3.1 “HDMI” and section 6.1.3.2“DVI”
•Added note to table 16 “TMDS Signal Descriptions”
1.6 2021-08-02 AEM •Added Software License Information
•Changed congatec AG to congatec GmbH
•Updated the Power Supply Implementation Guidelines in section 6.1.12 “Power Control”
•Updated section 7.3 “congatec Battery Management Interface”
1.7 2021-11-16 AEM •Deleted HDMI references from section 1.2 “Options Information”, section 2.1 “Feature List”, section 3 “Block Diagram
and section 5.1.3 “Display Interfaces”

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Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TS370. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™Design Guide
COM Express™Specification
The links to these documents can be found on the congatec GmbH website at www.congatec.com
Software Licenses
Notice Regarding Open Source Software
The congatec products contain Open Source software that has been released by programmers under specific licensing requirements such as
the “General Public License“ (GPL) Version 2 or 3, the “Lesser General Public License“ (LGPL), the “ApacheLicense“ or similar licenses.
You can find the specific details at https://www.congatec.com/en/licenses/. Search for the revision of the BIOS/UEFI or Board Controller
Software (as shown in the POST screen or BIOS setup) to get the complete product related license information. To the extent that any
accompanying material such as instruction manuals, handbooks etc. contain copyright notices, conditions of use or licensing requirements that
contradict any applicable Open Source license, these conditions are inapplicable.
The use and distribution of any Open Source software contained in the product is exclusively governed by the respective Open Source
license. The Open Source software is provided by its programmers without ANY WARRANTY, whether implied or expressed, of any fitness for
a particular purpose, and the programmers DECLINE ALL LIABILITY for damages, direct or indirect, that result from the use of this software.
OEM/ CGUTL BIOS
BIOS/UEFI modified by customer via the congatec System Utility (CGUTL) is subject to the same license as the BIOS/UEFI it is based on. You
can find the specific details at https://www.congatec.com/en/licenses/.

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Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec GmbH provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec GmbH assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec GmbH be liable for any incidental, consequential,
special, or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other
information contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec GmbH designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec GmbH products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec GmbH Limited Warranty.

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Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2018, congatec GmbH. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec GmbH.
congatec GmbH has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH, our products, or our website.

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Warranty
congatec GmbH makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec GmbH may in its sole discretion modify its Limited Warranty at any time
and from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec GmbH represents that
the products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship
or due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec GmbH prior to returning the non conforming product
freight prepaid. congatec GmbH will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec GmbH shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise
be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec GmbH is certified to DIN EN ISO 9001 standard.
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Technical Support
congatec GmbH technicians and engineers are committed to providing the best possible technical support for our customers so that our
products can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation,
utilities and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our
technical support department by email at [email protected]
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mbit Megabit
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
PCH Platform Controller Hub
eDP Embedded DisplayPort
DDI Digital Display Interface
HDA High Definition Audio
S5e Enhanced Soft-Off State
N.C Not connected
N.A Not available
TBD To be determined

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Contents
1 Introduction ............................................................................. 11
1.1 COM Express™ Concept......................................................... 11
1.2 Options Information................................................................. 12
2 Specifications........................................................................... 14
2.1 Feature List .............................................................................. 14
2.2 Supported Operating Systems ................................................ 15
2.3 Mechanical Dimensions ........................................................... 15
2.4 Supply Voltage Standard Power .............................................. 16
2.4.1 Electrical Characteristics .......................................................... 16
2.4.2 Rise Time ................................................................................. 17
2.5 Power Consumption ................................................................ 17
2.6 Supply Voltage Battery Power ................................................. 18
2.7 Environmental Specifications................................................... 19
3 Block Diagram.......................................................................... 20
4 Cooling Solutions..................................................................... 21
4.1 CSA Dimensions ...................................................................... 22
4.2 CSP Dimensions....................................................................... 23
4.3 HSP Dimensions....................................................................... 24
4.4 Heatspreader Thermal Imagery ............................................... 25
5 Onboard Temperature Sensors................................................ 26
6 Connector Rows....................................................................... 28
6.1 Primary and Secondary Connector Rows................................. 28
6.1.1 PCI Express™........................................................................... 28
6.1.2 PCI Express Graphics (PEG) ..................................................... 28
6.1.3 Display Interface ...................................................................... 30
6.1.3.1 DisplayPort (DP) ....................................................................... 31
6.1.3.2 LVDS/eDP................................................................................. 31
6.1.3.3 VGA.......................................................................................... 32
6.1.4 SATA™..................................................................................... 32
6.1.5 USB .......................................................................................... 32
6.1.6 Gigabit Ethernet ..................................................................... 33
6.1.7 High Definition Audio (HDA) ................................................... 33
6.1.8 LPC Bus.................................................................................... 33
6.1.9 I²C Bus ..................................................................................... 33
6.1.10 General Purpose Serial Interface ............................................. 33
6.1.11 GPIOs....................................................................................... 34
6.1.12 Power Control .......................................................................... 34
6.1.13 Power Management................................................................. 37
7 Additional Features.................................................................. 38
7.1 congatec Board Controller (cBC) ............................................. 38
7.1.1 Board Information.................................................................... 38
7.1.2 General Purpose Input/Output................................................ 38
7.1.3 Watchdog ................................................................................ 38
7.1.4 I2C Bus...................................................................................... 38
7.1.5 Power Loss Control.................................................................. 39
7.1.6 Fan Control .............................................................................. 39
7.1.7 Enhanced Soft-Off State .......................................................... 39
7.2 OEM BIOS Customization........................................................ 40
7.2.1 OEM Default Settings .............................................................. 40
7.2.2 OEM Boot Logo....................................................................... 40
7.2.3 OEM POST Logo ..................................................................... 40
7.2.4 OEM BIOS Code/Data............................................................. 41
7.2.5 OEM DXE Driver...................................................................... 41
7.3 congatec Battery Management Interface ................................ 41
7.4 API Support (CGOS) ................................................................ 42
7.5 Security Features...................................................................... 42
7.6 Suspend to Ram....................................................................... 42
8 conga Tech Notes .................................................................... 43
8.1 Adaptive Thermal Monitor and Catastrophic Thermal Protection
43
8.2 Processor Performance Control ............................................... 44
8.2.1 Intel®SpeedStep®Technology (EIST) ...................................... 44
8.2.2 Intel®Turbo Boost Technology ................................................ 44
8.3 Intel®Virtualization Technology ............................................... 45
8.4 Thermal Management ............................................................. 45

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8.5 ACPI Suspend Modes and Resume Events.............................. 46
9 Signal Descriptions and Pinout Tables..................................... 47
9.1 Connector Signal Descriptions ................................................ 48
9.2 Bootstrap Signals..................................................................... 70
10 System Resources .................................................................... 71
10.1 I/O Address Assignment.......................................................... 71
10.1.1 LPC Bus.................................................................................... 71
10.2 PCI Configuration Space Map ................................................. 72
10.3 I2C............................................................................................ 73
10.4 SM Bus..................................................................................... 73
11 BIOS Setup Description........................................................... 74
11.1 Navigating the BIOS Setup Menu ........................................... 74
11.2 BIOS Versions........................................................................... 74
11.3 Updating the BIOS................................................................... 75
11.3.1 Updating from External Flash .................................................. 75
11.4 Supported Flash Devices ......................................................... 75

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List of Tables
Table 1 COM Express™ 3.0 Pinout Types ............................................ 11
Table 2 conga-TS370 Variants .............................................................. 12
Table 3 Feature Summary..................................................................... 14
Table 4 Measurement Description........................................................ 17
Table 5 Power Consumption Values ..................................................... 18
Table 6 CMOS Battery Power Consumption ........................................ 18
Table 7 Cooling Solution Variants......................................................... 21
Table 8 Display Combinations and Resolution..................................... 30
Table 9 Wake Events............................................................................. 46
Table 10 Signal Tables Terminology Descriptions .................................. 47
Table 11 Connector A-B Pinout.............................................................. 48
Table 12 Connector C-D Pinout ............................................................. 50
Table 13 PCI Express Signal Descriptions (general purpose) ................. 52
Table 14 PCI Express Signal Descriptions (x16 Graphics)....................... 53
Table 15 DDI Signal Description............................................................. 55
Table 16 TMDS Signal Descriptions ....................................................... 56
Table 17 DisplayPort (DP) Signal Descriptions ....................................... 58
Table 18 Embedded DisplayPort Signal Descriptions............................ 59
Table 19 CRT Signal Descriptions........................................................... 60
Table 20 LVDS Signal Descriptions......................................................... 60
Table 21 Serial ATA Signal Descriptions ................................................. 61
Table 22 USB 2. 0 Signal Descriptions.................................................... 61
Table 23 USB 3.0 Signal Descriptions..................................................... 62
Table 24 Gigabit Ethernet Signal Descriptions....................................... 63
Table 25 High Definition Audio Link Signals Descriptions ..................... 63
Table 26 LPC Signal Descriptions........................................................... 64
Table 27 SPI BIOS Flash Interface Signal Descriptions........................... 65
Table 28 Miscellaneous Signal Descriptions........................................... 65
Table 29 General Purpose I/O Signal Descriptions ................................ 66
Table 30 Power and System Management Signal Descriptions ............. 66
Table 31 Rapid Shutdown Signal Descriptions....................................... 67
Table 32 Thermal Protection Signal Descriptions................................... 67
Table 33 SMBus Signal Description........................................................ 67
Table 34 General Purpose Serial Interface Signal Descriptions.............. 68
Table 35 Module Type Definition Signal Description ............................. 68
Table 36 Power and GND Signal Descriptions....................................... 69
Table 37 Bootstrap Signal Descriptions.................................................. 70
Table 38 PCI Configuration Space Map ................................................. 72

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1 Introduction
1.1 COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84 mm x 55 mm
•Compact 95 mm x 95 mm
•Basic 125 mm x 95 mm
•Extended 155 mm x 110 mm
Table 1 COM Express™ 3.0 Pinout Types
Types Connector
Rows
PCIe Lanes PEG SATA Ports LAN ports USB 2.0/
SuperSpeed USB
Display Interfaces
Type 6 A-B C-D Up to 24 1 Up to 4 1 Up to 8 / 4 1VGA,LVDS/eDP, PEG, 3x DDI
Type 7 A-B C-D Up to 32 - Up to 2 5 (1x 1 Gb, 4x 10 Gb) Up to 4 / 4
Type 10 A-B Up to 4 - Up to 2 1 Up to 8 / 2 1LVDS/eDP, 1xDDI
1. The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Up to 4 of the USB 2.0 ports can support SuperSpeed USB.
The conga-TS370 modules use the Type 6 pinout definition and comply with COM Express 3.0 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.

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1.2 Options Information
The conga-TS370 is currently available in 13 variants. The table below shows the different configurations available.
Table 2 conga-TS370 Variants
Part-No. 049000 049001 049002 049003
Processor Intel®Core™ i7-8850H
2.6 GHz 6 Cores
Intel®Core™ i5-8400H
2.5 GHz 4 Cores
Intel®Xeon®E-2176M
2.7 GHz 6 Cores
Intel®Core™ i3-8100H
3.0 GHz 4 Cores
Intel®Smart Cache 9 MB 8 MB 12 MB 6 MB
Max. Turbo Frequency 4.3 GHz 4.2 GHz 4.4 GHz N.A
Chipset Intel® QM370 Intel® QM370 Intel® CM246 Intel® HM370
Processor Graphics Intel®UHD Graphics 630 (GT2) Intel®UHD Graphics 630 (GT2) Intel®UHD Graphics P630 (GT2) Intel®UHD Graphics P630 (GT2)
GFX Base/Max. Dynamic Freq. 350 MHz / 1.15 GHz 350 MHz / 1.1 GHz 350 MHz / 1.2 GHz 350 MHz / 1.0 GHz
DDR4 Memory
(ECC or Non-ECC)
2666 MT/s dual channel
Non-ECC
2666 MT/s dual channel
Non-ECC
2666 MT/s dual channel
ECC or Non-ECC
2666 MT/s dual channel
Non-ECC
PCIe Lanes 8 Gen 3 8 Gen 3 8 Gen 3 8 Gen 3
USB Ports 8 USB 2.0 (4 USB 3.1) 8 USB 2.0 (4 USB 3.1) 8 USB 2.0 (4 USB 3.1) 8 USB 2.0 (4 USB 3.1)
SATA (6 Gbps) 4 4 4 4
LVDS Yes Yes Yes Yes
DP++ Yes Yes Yes Yes
Processor TDP (cTDP down) 45 W (35 W) 45 W (35 W) 45 W (35 W) 45 W (35 W)
Part-No. 049100 049101 049102 049104
Processor Intel®Xeon®E-2276ME
2.8 GHz 6 Cores
Intel®Xeon®E-2254ME
2.6 GHz 4 Cores
Intel®Core™ i7-9850HE
2.7 GHz 6 Cores
Intel®Celeron®G4930E
2.4 GHz 2 Cores
Intel®Smart Cache 12 MB 8 MB 9 MB 2 MB
Max. Turbo Frequency 4.5 GHz 3.8 GHz 4.4 GHz N.A
Chipset Intel® CM246 Intel® CM246 Intel® QM370 Intel® HM370
Processor Graphics Intel®UHD Graphics P630 (GT2) Intel®UHD Graphics P630 (GT2) Intel®UHD Graphics 630 (GT2) Intel®UHD Graphics 610 (GT1)
GFX Base/Max. Dynamic Freq. 350 MHz / 1.15 GHz 350 MHz / 1.10 GHz 350 MHz / 1.15 GHz 350 MHz / 1.05 GHz
DDR4 Memory
(ECC or Non-ECC)
2666 MT/s dual channel
ECC or non-ECC
2666 MT/s dual channel
ECC or non-ECC
2666 MT/s dual channel
Non-ECC
2400 MT/s dual channel
Non-ECC
PCIe Lanes 8 Gen 3 8 Gen 3 8 Gen 3 8 Gen 3
USB Ports 8 USB 2.0 (4 USB 3.1) 8 USB 2.0 (4 USB 3.1) 8 USB 2.0 (4 USB 3.1) 8 USB 2.0 (4 USB 3.1)
SATA (6 Gbps) 4 4 4 4
LVDS Yes Yes Yes Yes
DP++ Yes Yes Yes Yes
Processor TDP (cTDP down) 45 W (35 W) 45 W (35 W) 45 W (35 W) 35 W (N.A)

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Part-No. 049110 049111 049112 049113
Processor Intel®Xeon®E-2276ML
2.0 GHz 6 Cores
Intel®Xeon®E-2254ML
1.7 GHz 4 Cores
Intel®Core™ i7-9850HL
1.9 GHz 6 Cores
Intel®Core™ i3-9100HL
1.6 GHz 4 Cores
Intel®Smart Cache 12 MB 8 MB 9 MB 6 MB
Max. Turbo Frequency 4.2 GHz 3.5 GHz 4.1 GHz 2.9 GHz
Chipset Intel® CM246 Intel® CM246 Intel® QM370 Intel® HM370
Processor Graphics Intel®UHD Graphics P630 (GT2) Intel®UHD Graphics P630 (GT2) Intel®UHD Graphics 630 (GT2) Intel®UHD Graphics 630 (GT2)
GFX Base/Max. Dynamic Freq. 350 MHz / 1.15 GHz 350 MHz / 1.1 GHz 350 MHz / 1.15 GHz 350 MHz / 1.10 GHz
DDR4 Memory
(ECC or Non-ECC)
2666 MT/s dual channel
ECC or non-ECC
2666 MT/s dual channel
ECC or non-ECC
2666 MT/s dual channel
Non-ECC
2666 MT/s dual channel
Non-ECC
PCIe Lanes 8 Gen 3 8 Gen 3 8 Gen 3 8 Gen 3
USB Ports 8 USB 2.0 (4 USB 3.1) 8 USB 2.0 (4 USB 3.1) 8 USB 2.0 (4 USB 3.1) 8 USB 2.0 (4 USB 3.1)
SATA (6 Gbps) 4 4 4 4
LVDS Yes Yes Yes Yes
DP++ Yes Yes Yes Yes
Processor TDP (cTDP down) 25 W (N.A) 25 W (N.A) 25 W (N.A) 25 W (N.A)
Part-No. 049114
Processor Intel®Celeron®G4932E
1.9 GHz 2 Cores
Intel®Smart Cache 2 MB
Max. Turbo Frequency N.A
Chipset Intel® HM370
Processor Graphics Intel®UHD Graphics 610 (GT1)
GFX Base/Max. Dynamic Freq. 350 MHz / 1.05 GHz
DDR4 Memory
(ECC or Non-ECC)
2400 MT/s dual channel
Non-ECC
PCIe Lanes 8 Gen 3
USB Ports 8 USB 2.0 (4 USB 3.1)
SATA (6 Gbps) 4
LVDS Yes
DP++ Yes
Processor TDP (cTDP down) 25 W (N.A)

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2 Specifications
2.1 Feature List
Table 3 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 3.0 (Basic size: 125 mm x 95 mm)
Processor 8th Generation Intel®Core i7,i5,i3 and Xeon mobile processors
Memory Two memory sockets (located on the top and bottom side of the conga-TS370). Supports
-SO-DIMM non-ECC 1DDR4 modules
-Data rates up to 2666 MT/s
-Maximum 64 GB capacity (32 GB each)
NOTE: Only variants that feature the Intel CM246 chipset support ECC memory
Chipset Mobile Intel®300 Series Chipset QM370, HM370 and CM246 PCH
Audio High definition audio interface with support for multiple codecs
Ethernet Gigabit Ethernet (Intel®i219-LM/V controller) with AMT 212.0 support
Graphics Options Intel® UHD Gen. 9 (630/P630). Supports:
-API (DirectX 12, Direct3D 2015, OpenGL 4.5, OpenCL 2.1)
-Intel®QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-Up to three independent displays (see table 7 “Display Combinations and Resolutions”)
3x DP++
1 PEG Gen 3 port (x16 lanes)
1x LVDS/eDP 1.4
1 VGA 3
Resolutions up to 4K @ 30 Hz
NOTE:
The conga-TS370 does not natively support TMDS. A DP++ to TMDS converter
(e.g. PTN3360D) needs to be implemented.
Peripheral
Interfaces
8x USB 2.0 (4 USB 3.1)
4x SATA®6 Gbps (with RAID 0/1/5/10 support)
8x PCI Express®Gen. 3 lanes
2x UART (16C550 compatible)
GPIOs/SDIO
LPC/eSPI 4
I²C (fast mode, multi-master)
SMB
SPI
BIOS AMI Aptio®V UEFI 2.6 firmware
32 MB serial SPI flash with congatec Embedded BIOS features
Power
Management
ACPI 4.0a compliant with battery support.
S5e mode (see section 7.1.7 “Enhanced Soft-Off State”)
Deep Sx and Suspend to RAM (S3)
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I²C
bus, power loss control
Security Discrete SPI Trusted Platform Module (Infineon SLB9670_VQ2.0); AES Instructions

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Note
1. Only variants that feature the Intel CM246 support ECC memory
2. Intel AMT support requires customized BIOS firmware
3. DDI3 supports only TMDS if VGA is enabled in the BIOS setup menu
4. The conga-TS370 does not currently support eSPI interface
2.2 Supported Operating Systems
The conga-TS370 supports the following operating systems.
•Microsoft®Windows® 10
•Linux
Note
1. The processor supports only 64-bit operating systems.
2. The CSM (Compatibility Support Module) is disabled in the BIOS setup menu by default because we recommend to operate the system
in native UEFI mode.
2.3 Mechanical Dimensions
•125.0 mm x 95.0 mm
•Height approximately 18 or 21 mm (including heatspreader) depending on the carrier board connector that is used. If the 5 mm (height)
carrier board connector is used, then approximate overall height is 18 mm. If the 8 mm (height) carrier board connector is used, then
approximate overall height is 21 mm.
Heatspreader
All dimensions in millimeter
Module PCB
Carrier Board PCB
13.00
4.00
5.00
4.50
2.00±10%
7.00 18.00

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2.4 Supply Voltage Standard Power
•12V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin
Current Capability
(Ampere)
Nominal
Input
(Volts)
Input
Range
(Volts)
Derated
Input
(Volts)
Max. Input Ripple
(10 Hz to 20 MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.5-3.3 +/- 20
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

Copyright © 2018 congatec GmbH TSCOm17 17/75
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250 V/s. The smooth turn-on requires that, during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
2.5 Power Consumption
The power consumption values were measured with the following setup:
•conga-TS370 COM
•modified congatec carrier board
•conga-TS370 cooling solution
•Microsoft Windows 10 (64 bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool
Table 4 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during desktop idle
S0: Maximum value Highest frequency mode (HFM/Turbo Boost) The CPU was stressed to its maximum frequency
S0: Peak current Highest current spike during the measurement of “S0: Maximum value”. This
state shows the peak value during runtime
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios
S3 COM is powered by VCC_5V_SBY
S5 COM is powered by VCC_5V_SBY
S5e COM is powered by VCC_5V_SBY
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

Copyright © 2018 congatec GmbH TSCOm17 18/75
Table 5 Power Consumption Values
The table below provides additional information about the conga-TS370 power consumption. The values are recorded at various operating
mode.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
CPU Current (A)
Variant Cores Freq /Max Turbo (GHz) S0: Min S0: Max S0: Peak S3 S5 S5e
049000 2 x 4 GB A.0 BQCOR110 Intel®Core™ i7-8850H 6 2.6 / 4.3 0.46 7.02 9.67 0.11 0.09 0.001
049001 2 x 4 GB A.0 BQCOR110 Intel®Core™ i5-8400H 4 2.5 / 4.2 0.38 6.50 7.87 0.11 0.09 0.001
049002 2 x 4 GB A.0 BQCOR110 Intel®Xeon®E-2176M 6 2.7 / 4.4 0.42 7.23 9.59 0.13 0.08 0.001
049003 2 x 4 GB A.1 BQCOR110 Intel®Core™ i3-8100H 4 3.0 / N.A 0.43 3.49 3.84 0.13 0.09 0.001
049100 2 x 4 GB A.1 BQCOR023 Intel®Xeon®E-2276ME 6 2.8 / 4.5 0.25 8.44 10.31 0.09 0.06 0.001
049101 2 x 4 GB A.1 BQCOR023 Intel®Xeon®E-2254ME 4 2.6 / 3.8 0.27 6.32 7.68 0.09 0.07 0.001
049102 2 x 4 GB A.1 BQCOR023 Intel®Core™ i7-9850HE 6 2.7 / 4.4 0.25 7.57 9.91 0.09 0.06 0.001
049104 2 x 4 GB A.1 BHCOR023 Intel®Celeron®G4930E 2 2.4 / N.A 0.27 1.25 1.48 0.09 0.06 0.001
049110 2 x 4 GB A.1 BQCOR023 Intel®Xeon®E-2276ML 6 2.0 / 4.2 0.24 3.43 3.69 0.09 0.06 0.001
049111 2 x 4 GB A.1 BQCOR023 Intel®Xeon®E-2254ML 4 1.7 / 3.5 0.25 3.45 4.02 0.09 0.07 0.001
049112 2 x 4 GB A.1 BQCOR012 Intel®Core™ i7-9850HL 6 1.9 / 4.1 0.28 3.48 3.87 0.09 0.06 0.001
049113 2 x 4 GB A.1 BQCOR110 Intel®Core™ i3-9100HL 4 1.6 / 2.9 0.20 2.36 2.40 0.13 0.13 0.001
049114 2 x 4 GB A.1 BHCOR023 Intel®Celeron®G4932E 2 1.9 / N.A 0.26 1.07 1.87 0.09 0.07 0.001
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 6 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 1.62 µA
20oC 3V DC 1.87 µA
70oC 3V DC 3.80 µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption of your application in worst case conditions (for example, during high temperature and
high battery voltage).

Copyright © 2018 congatec GmbH TSCOm17 19/75
3. Consider the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec GmbH website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-TS370.
2.7 Environmental Specifications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

Copyright © 2018 congatec GmbH TSCOm17 20/75
3 Block Diagram
PECI
8x PCIe Gen. 3
DDR4 Channel A
DDR4 Channel B
DDI B
DDI C
eDP
SM Bus
LPC
3x SATA 6G
eMMC
PCIe
HDA
SPI0
SDIO
MGMNT
8th Gen. Intel®Core™
“Whiskey Lake”
SOC ULT Processor
4x USB 3.1 Gen 2
8x USB 2.0
conga-TC370 COM Express Rev. 3.0, Compact Size, Type 6 Pinout
XDP
SPI Flash 0 TPM
Ethernet 10/100/1000
Intel i219LM/V
eDP to LVDS
MUX MUX
MUX
DP to VGA
eMMC
PCIe lane 4 - 5
Optional - Not available by default
congatec
Board
Controller
5
th
Generation
LPC
GPIO
SMB
UART
I2C
LID/SLEEP/FAN
2x DDR4 2400
SO-DIMM
up to 32GB each
Ethernet
HD Audio
SM Bus
SPI
VGA
LVDS/eDP
LPC
I2C Bus
USB 2.0 Lanes 0 - 7
SATA Port 0 - 2
SER0/1
CAN
GPIO/SDIO
LID# / SLEEP# / FAN
PCIe lane 0 - 7
PEG Port x2
USB 3.0 Lanes 0 - 3
DP++
DP++
CAN Controller