Congatec COM Express conga-TS87 Series User manual

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Copyright © 2014 congatec AG TS87m13 1/124
COM Express™ conga-TS87
4th Generation Intel®Core™ i7, i5, i3 processor with QM87 or HM86 PCH
User’s Guide
Revision 1.3

Copyright © 2014 congatec AG TS87m13 2/124
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2013.06.03 AEM •Preliminary release for Internal use
0.2 2013.09.30 AEM •Updated section 2.5.1
•Updated section 5 “Onboard Temperature Sensors”
•Updated section 10 “System Resources”
0.3 2013.11.05 AEM •Updated section 2.1 “Feature List”
•Updated section 4.1 with Flat pipe heatspreader. Deleted section 4.2 ‘Heatspreader thermal Imagery
•Updated table 2 in section 6.2.3 “Digital Display Interface”
•Added UART support for rev. B.0 and later in sections 2.1 “Feature List”, 6.1.11 “General Purpose Serial Interface” and
table 18
1.0 2014.03.26 AEM •Updated COM Express concept in section 1 “Introduction”
•Deleted the variant with PN:046809 from sections 1 “Introduction”, 2 ”Feature List” and 2.5 “Power Consumption”. This
variant is not on congatec’s roadmap. Added additional two variants with part numbers 046810 and 046811
•Updated section 2.5 “Power Consumption”
•Updated section 3 “Block Diagram”
•Corrected pins D63 and D64 in section 9.4 “C-D Connector Pinout”
•Added section 11 “BIOS Setup Description”
•Official release
1.1 2014.07.09 AEM •Updated section 2.5 “Power Consumption”
•Updated section 11 “BIOS Setup Description”
1.2 2014.10.24 AEM •Added note about the ULP mode in section 6.1.4 “Gigabit Ethernet”
•Updated section 7.3 “Watchdog”
•Updated section 8.2.5 “Intel Virtualization Technology”
•Updated section 11 “BIOS Setup Description”
1.3 2016.15.07 AEM •Corrected the BIOS Aptio UEFI version in section 2.1 “Feature List”
•Added section 4 “Cooling Solution”
•Added Windows 10 to section 2.2 “Supported Operating Systems”
•Updated section 6.1.10 “LVDS/eDP”
•Update section 7.7 “congatec Battery Management Interface”
•Updated section 10.3 “PCI Interrupt Routing Map”
•Deleted the comment “not supported” for SUS_S4# signal in table 17 “Power and System Management Signal
Descriptions”. Corrected also the description of PWRBTN# signal
•Deleted sections 12.3 “BIOS Security Features” and 12.4 “Hard Disk Security Features” due to duplication

Copyright © 2014 congatec AG TS87m13 3/124
Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TS87. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™ Design Guide
COM Express™ Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatec AG products near strong electrostatic, electromagnetic,
magnetic, or radioactive fields unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2014 congatec AG TS87m13 4/124
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2014, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

Copyright © 2014 congatec AG TS87m13 5/124
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product
freight prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
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Copyright © 2014 congatec AG TS87m13 6/124
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
GB Gigabyte (1,073,741,824 bytes)
GHz Gigahertz (one billion hertz)
kB Kilobyte (1024 bytes)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
kHz Kilohertz (one thousand hertz)
MHz Megahertz (one million hertz)
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
PCH Platform Controller Hub
eDP Embedded DisplayPort
T.O.M. Top of memory = max. DRAM installed
HDA High Definition Audio
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2014 congatec AG TS87m13 7/124
Contents
1 Introduction ............................................................................. 11
1.1 COM Express™ Concept......................................................... 11
1.2 Options Information................................................................. 12
2 Specifications........................................................................... 13
2.1 Feature List .............................................................................. 13
2.2 Supported Operating Systems ................................................ 14
2.3 Mechanical Dimensions ........................................................... 14
2.4 Supply Voltage Standard Power .............................................. 15
2.4.1 Electrical Characteristics .......................................................... 15
2.4.2 Rise Time ................................................................................. 15
2.5 Power Consumption ................................................................ 16
2.5.1 Intel®Core™ i7-4700EQ 2.4 GHz Quad Core™ 6MB Cache . 17
2.5.2 Intel®Core™ i5-4402E 1.6 GHz Dual Core™ 3MB Cache ..... 17
2.5.3 Intel®Core™ i5-4400E 2.7 GHz Dual Core™ 3MB Cache ..... 18
2.5.4 Intel®Core™ i3-4102E 1.6 GHz Dual Core™ 3MB Cache ..... 18
2.5.5 Intel®Core™ i3-4100E 2.4 GHz Dual Core™ 3MB Cache ..... 18
2.5.6 Intel®Celeron®2000E 2.2 GHz Dual Core™ 2MB Cache ....... 19
2.5.7 Intel®Celeron®2002E 1.5 GHz Dual Core™ 2MB Cache ....... 19
2.6 Supply Voltage Battery Power ................................................. 19
2.6.1 CMOS Battery Power Consumption ........................................ 20
2.7 Environmental Specifications................................................... 20
3 Block Diagram.......................................................................... 21
4 Cooling Solution ...................................................................... 22
4.1 CSA Dimensions ...................................................................... 22
4.2 CSP Dimensions....................................................................... 23
4.3 Heatspreader ........................................................................... 24
5 Onboard Temperature Sensors................................................ 26
6 Connector Subsystems Rows A, B, C, D.................................. 28
6.1 Primary Connector Rows A and B............................................ 29
6.1.1 Serial ATA™ (SATA).................................................................. 29
6.1.2 USB 2.0 .................................................................................... 29
6.1.3 High Definition Audio (HDA) Interface .................................... 29
6.1.4 Gigabit Ethernet ..................................................................... 29
6.1.5 LPC Bus.................................................................................... 30
6.1.6 I²C Bus Fast Mode ................................................................... 30
6.1.7 PCI Express™........................................................................... 30
6.1.8 ExpressCard™ ......................................................................... 31
6.1.9 Graphics Output (VGA/CRT).................................................... 31
6.1.10 LVDS/eDP................................................................................. 31
6.1.11 General Purpose Serial Interface ............................................. 31
6.1.12 Power Control .......................................................................... 32
6.1.13 Power Management................................................................. 34
6.2 Secondary Connector Rows C and D....................................... 35
6.2.1 PCI Express™........................................................................... 35
6.2.2 PCI Express Graphics (PEG) ..................................................... 35
6.2.3 Digital Display Interface........................................................... 36
6.2.3.1 HDMI........................................................................................ 37
6.2.3.2 DVI ........................................................................................... 37
6.2.3.3 DisplayPort (DP) ....................................................................... 37
6.2.4 USB 3.0 .................................................................................... 38
7 Additional Features.................................................................. 39
7.1 congatec Board Controller (cBC) ............................................. 39
7.2 Board Information.................................................................... 39
7.3 Watchdog ................................................................................ 39
7.4 I2C Bus...................................................................................... 39
7.5 Power Loss Control.................................................................. 39
7.6 OEM BIOS Customization........................................................ 40
7.6.1 OEM Default Settings .............................................................. 40
7.6.2 OEM Boot Logo....................................................................... 40
7.6.3 OEM POST Logo ..................................................................... 40
7.6.4 OEM BIOS Code/Data............................................................. 40
7.6.5 OEM DXE Driver...................................................................... 41
7.7 congatec Battery Management Interface ................................ 41
7.8 API Support (CGOS) ................................................................ 41
7.9 Security Features...................................................................... 42
7.10 Suspend to Ram....................................................................... 42

Copyright © 2014 congatec AG TS87m13 8/124
8 conga Tech Notes .................................................................... 43
8.1 Intel®PCH Features ................................................................. 43
8.1.1 Intel®Rapid Storage Technology ............................................ 43
8.1.1.1 AHCI ........................................................................................ 43
8.1.1.2 RAID......................................................................................... 43
8.1.2 Intel®Smart Response Technology ......................................... 43
8.1.3 Intel®Rapid Start Technology .................................................. 44
8.2 Intel®Processor Features ......................................................... 44
8.2.1 Intel®Turbo Boost Technology ................................................ 44
8.2.2 Thermal Monitor and Catastrophic Thermal Protection .......... 45
8.2.3 Processor Performance Control ............................................... 45
8.2.4 Intel®64 Architecture............................................................... 46
8.2.5 Intel®Virtualization Technology ............................................... 47
8.2.6 Thermal Management ............................................................. 47
8.3 ACPI Suspend Modes and Resume Events.............................. 48
8.4 Low Voltage Memory (DDR3L)................................................. 48
8.5 USB 2.0 EHCI Host Controller Support.................................... 49
9 Signal Descriptions and Pinout Tables..................................... 50
9.1 A-B Connector Signal Descriptions ......................................... 51
9.2 A-B Connector Pinout.............................................................. 61
9.3 C-D Connector Signal Descriptions......................................... 63
9.4 C-D Connector Pinout ............................................................. 72
9.5 Boot Strap Signals ................................................................... 74
10 System Resources .................................................................... 75
10.1 I/O Address Assignment.......................................................... 75
10.1.1 LPC Bus.................................................................................... 75
10.2 PCI Configuration Space Map ................................................. 76
10.3 PCI Interrupt Routing Map....................................................... 77
10.4 I²C Bus ..................................................................................... 78
10.5 SM Bus..................................................................................... 78
11 BIOS Setup Description........................................................... 79
11.1 Entering the BIOS Setup Program........................................... 79
11.1.1 Boot Selection Popup.............................................................. 79
11.2 Setup Menu and Navigation.................................................... 79
11.3 Main Setup Screen................................................................... 80
11.3.1 Platform Information Submenu................................................ 81
11.4 Advanced Setup ...................................................................... 81
11.4.1 Graphics Submenu................................................................... 82
11.4.1.1 GOP Configuration Submenu.................................................. 85
11.4.2 Watchdog Submenu ................................................................ 85
11.4.3 Hardware Health Monitoring Submenu ................................... 87
11.4.4 PCI & PCI Express Submenu.................................................... 88
11.4.4.1 PCI Express Settings Submenu................................................ 89
11.4.4.2 PIRQ Routing & IRQ Reservation Submenu............................. 90
11.4.4.3 PCI Express Graphics (PEG) Port Submenu ............................. 90
11.4.4.4 PCI Express Port Submenu ...................................................... 93
11.4.5 ACPI Submenu......................................................................... 95
11.4.6 RTC Wake Submenu ................................................................ 96
11.4.7 Trusted Computing Submenu.................................................. 96
11.4.8 CPU Submenu.......................................................................... 97
11.4.9 SATA Submenu ...................................................................... 101
11.4.9.1 Software Feature Mask Configuration ................................... 102
11.4.10 Intel(R) Rapid Start Technology Submenu.............................. 104
11.4.11 Acoustic Management Submenu........................................... 104
11.4.12 USB Submenu........................................................................ 105
11.4.12.1 USB Ports Per-Port Disable Control Submenu ....................... 107
11.4.13 SMART Settings Submenu..................................................... 108
11.4.14 Super I/O Submenu ............................................................... 108
11.4.15 Serial Port Console Redirection Submenu............................. 109
11.4.15.1 Console Redirection Settings Submenu ................................ 109
11.4.16 UEFI Network Stack Submenu............................................... 110
11.4.17 Intel (R) Ethernet Connection I218-LM Submenu .................. 110
11.4.18 NIC Configuration Submenu ................................................. 111
11.5 Chipset Setup ........................................................................ 112
11.5.1 Platform Controller Hub (PCH) Submenu .............................. 112
11.5.2 Processor (Integrated Components) Submenu...................... 113
11.5.2.1 DMI Configuration Submenu................................................. 114
11.5.2.2 Memory Configuration Submenu .......................................... 114
11.5.2.3 GT - Power Management Control Submenu ......................... 116
11.6 Boot Setup............................................................................. 116
11.6.1 Boot Settings Configuration .................................................. 116
11.6.1.1 CSM & Option ROM Control Submenu................................. 118
11.7 Security Setup........................................................................ 119

Copyright © 2014 congatec AG TS87m13 9/124
11.7.1 Security Settings .................................................................... 120
11.7.1.1 BIOS Security Features .......................................................... 120
11.7.1.2 Hard Disk Security Features................................................... 121
11.8 Save & Exit Menu................................................................... 122
12 Additional BIOS Features ...................................................... 123
12.1 Supported Flash Devices ....................................................... 123
12.2 Updating the BIOS................................................................. 123
13 Industry Specifications ........................................................... 124

Copyright © 2014 congatec AG TS87m13 10/124
List of Tables
Table 1 conga-TS87 Variants ................................................................ 12
Table 2 Feature Summary..................................................................... 13
Table 3 Display Combination ............................................................... 36
Table 4 Signal Tables Terminology Descriptions .................................. 50
Table 5 Intel®High Definition Audio Link Signals Descriptions............ 51
Table 6 Gigabit Ethernet Signal Descriptions....................................... 52
Table 7 Serial ATA Signal Descriptions ................................................. 52
Table 8 PCI Express Signal Descriptions (general purpose) ................. 53
Table 9 ExpressCard Support Pins Signal Descriptions........................ 54
Table 10 LPC Signal Descriptions........................................................... 54
Table 11 USB Signal Descriptions........................................................... 54
Table 12 CRT Signal Descriptions........................................................... 55
Table 13 LVDS Signal Descriptions......................................................... 56
Table 14 Embedded DisplayPort Signal Descriptions............................ 56
Table 15 SPI BIOS Flash Interface Signal Descriptions........................... 57
Table 16 Miscellaneous Signal Descriptions........................................... 57
Table 17 General Purpose I/O Signal Descriptions ................................ 58
Table 18 Power and System Management Signal Descriptions ............. 59
Table 19 General Purpose Serial Interface Signal Descriptions.............. 59
Table 20 Power and GND Signal Descriptions....................................... 60
Table 21 Connector A-B Pinout.............................................................. 61
Table 22 PCI Express Signal Descriptions (general purpose) ................. 63
Table 23 USB 3.0 Signal Descriptions..................................................... 63
Table 24 PCI Express Signal Descriptions (x16 Graphics)....................... 63
Table 25 DDI Signal Description............................................................. 66
Table 26 HDMI Signal Descriptions........................................................ 68
Table 27 DisplayPort (DP) Signal Descriptions ....................................... 69
Table 28 Module Type Definition Signal Description ............................. 71
Table 29 Power and GND Signal Descriptions....................................... 71
Table 30 Connector C-D Pinout ............................................................. 72
Table 31 Boot Strap Signal Descriptions ................................................ 74
Table 32 PCI Configuration Space Map ................................................. 76
Table 33 PCI Interrupt Routing Map....................................................... 77

Copyright © 2014 congatec AG TS87m13 11/124
1 Introduction
1.1 COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84mm x 55mm
•Compact 95mm x 95mm
•Basic 125mm x 95mm
•Extended 155mm x110mm
The COM Express™ specification 2.1 defines seven different pinout types.
Types Connector Rows PCIe Lanes PCI IDE SATA Ports LAN ports USB 2.0/ USB 3.0 Display Interfaces
Type 1 A-B Up to 6 - 4 1 8 / 0 VGA, LVDS
Type 2 A-B C-D Up to 22 32 bit 1 4 1 8 / 0 VGA, LVDS, PEG/SDVO
Type 3 A-B C-D Up to 22 32 bit - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 4 A-B C-D Up to 32 1 4 1 8 / 0 VGA,LVDS, PEG/SDVO
Type 5 A-B C-D Up to 32 - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 6 A-B C-D Up to 24 - 4 1 8 / 4* VGA,LVDS/eDP, PEG, 3x DDI
Type 10 A-B Up to 4 - 2 1 8 / 0 LVDS/eDP, 1xDDI
* The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Up to 4 of the USB 2.0 ports can support SuperSpeed USB
The conga-TS87 modules use the Type 6 pinout definition and comply with COM Express 2.1 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™

Copyright © 2014 congatec AG TS87m13 12/124
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
1.2 Options Information
The conga-TS87 is currently available in seven variants. This user’s guide describes all of these variants. The tables below show the different
configurations available. Check for the Part No. that applies to your product. This will tell you what options described in this user’s guide are
available on your particular module.
Table 1 conga-TS87 Variants
Part-No. 046804 046805 046806 046807 046808
Processor Intel®Core™ i7-4700EQ
2.4 GHz Quad Core™
Intel®Core™ i5-4402E
1.6 GHz Dual Core™
Intel®Core™ i5-4400E
2.7 GHz Dual Core™
Intel®Core™ i3-4102E
1.6 GHz Dual Core™
Intel®Core™ i3-4100E
2.4 GHz Dual Core™
Intel®Smart Cache 6 MByte 3 MByte 3 MByte 3 MByte 3 MByte
Graphics GT2 GT2 GT2 GT2 GT2
PEG Yes Yes Yes Yes Yes
LVDS Yes Yes Yes Yes Yes
DisplayPort (DP) Yes Yes Yes Yes Yes
HDMI Yes Yes Yes Yes Yes
Processor TDP 47 W 25 W 37 W 25 W 37 W
Part-No. 046810 046811
Processor Intel®Celeron®2000E
2.2 GHz Dual Core™
Intel®Celeron®2002E
1.5 GHz Dual Core™
Intel®Smart Cache 2 MByte 2 MByte
Graphics GT1 GT1
PEG Yes Yes
LVDS Yes Yes
DisplayPort (DP) Yes Yes
HDMI Yes Yes
Processor TDP 37 W 25 W

Copyright © 2014 congatec AG TS87m13 13/124
2 Specifications
2.1 Feature List
Table 2 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Basic size 95 x 125mm).
Processor Intel®4th Generation Core i7,i5,i3 and Celeron mobile processors.
Memory Two memory sockets (located on the top and bottom side of the conga-TS87). Supports
-SO-DIMM non-ECC DDR3L (low voltage @ 1.35V) modules
-Data rates up to 1600 MT/s
-Maximum 16 GB capacity
congatec Board
Controller
Multi-stage watchdog, manufacturing and board information, board statistics, hardware monitoring, fan control, I2C bus, Power loss control.
Chipset Intel®8 Series Chipset: Intel®DH82QM87 and DH82HM86 PCH
Audio HDA (High Definition Audio)/digital audio interface with support for multiple codecs
Ethernet Gigabit Ethernet support via Intel®l218LM GbE LAN controller. Variants with Intel®QM87 support AMT 9.0.
Graphics
Options
Next Generation Intel® HD Graphics with support for Intel®Clear Video Technology (HD encode/transcode, Blu-ray playback), DirectX Video Acceleration
(full AVC/VC1/MPEG2 hardware decode), OpenGL 4.0 and DirectX11.1. Up to 3 independent displays supported (DP, HDMI/DVI, VGA)
1x LVDS
-Integrated flat panel interface with 25-112MHz single/dual-channel LVDS Transmitter
-Single-channel LVDS interface: 1 x 18 bpp or 1 x 24 bpp.
-Dual channel LVDS interface: 2 x 18 bpp or 2 x 24 bpp panel.
-VESA LVDS and OpenLDI color mappings
-Automatic Panel Detection via Embedded Panel Interface based on VESA EDID™
1.3.
-Resolution up to 1920x1200 in dual LVDS bus mode.
1x Optional eDP interface (NOTE: Either eDP or LVDS signals supported. Both not
supported).
1x VGA
-180 MHz RAMDAC with resolution up to 1920 x 1200
and 24 bit color @ 60Hz refreshed rate with reduced
blanking.
1x PEG Port (x16 Gen 3 (8GT/s)).
3x DisplayPorts (DP 1.1) on digital ports B, C and D.
3x HDMI 1.4 ports on digital ports B, C and D.
3x DVI ports on digital ports B, C and D.
The DP and HDMI/DVI ports are multiplexed together. The
interfaces support Hot-Plug detect.
Peripheral
Interfaces
4x Serial ATA®with RAID support 0/1/5/10
7 PCI Express®Gen2 Lanes.
8x USB 2.0 (EHCI)
4x USB 3.0 (XHCI)
2x UART (Rev. B.0 and later)
LPC Bus
I²C Bus, Fast Mode, multimaster
SM Bus
SPI
GPIOs
2x ExpressCard
BIOS AMI Aptio®UEFI 4.x firmware, 8/16 MByte serial SPI with congatec Embedded BIOS features.
Power
Management
ACPI 4.0 compliant with battery support. Also supports Suspend to RAM (S3) and Intel AMT 9.0.
Configurable TDP
Security Optional discrete Trusted Platform Module “TPM 1.2”.

Copyright © 2014 congatec AG TS87m13 14/124
Note
Some of the features mentioned in the above feature summary are optional. Check the article number of your module and compare it to the
options information table in section 1.2 to determine what options are available on your particular module.
2.2 Supported Operating Systems
The conga-TS87 supports the following operating systems.
•Microsoft®Windows® 10
•Microsoft®Windows® 8
•Microsoft®Windows®7
•Microsoft®Windows®Embedded Standard
•Linux
2.3 Mechanical Dimensions
•95.0 mm x 125.0 mm (3.74” x 4.92”)
•Height approximately 18 or 21mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm (height)
carrier board connector is used, then approximate overall height is 18mm. If the 8mm (height) carrier board connector is used, then
approximate overall height is 21mm.

Copyright © 2014 congatec AG TS87m13 15/124
2.4 Supply Voltage Standard Power
•12V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin
Current Capability
(Amps)
Nominal
Input (Volts)
Input
Range
(Volts)
Derated
Input (Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that, during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

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2.5 Power Consumption
The power consumption values listed in this document were measured under a controlled environment. The hardware used for testing includes
a conga-TS87 module, conga-Cdebug carrier board, CRT monitor, SATA drive, and USB keyboard. The conga-Cdebug is modified so that
the 12V input is only routed to the module and all other circuitry on the carrier itself is powered by the 5V input. The SATA drive was powered
externally by an ATX power supply so that it does not influence the power consumption value that is measured for the module. The USB
keyboard was detached once the module was configured within the OS. All recorded values were averaged over a 30 second time period.
Cooling of the module was done by the module specific heatpipe heatspreader and a fan cooled heatsink to measure the power consumption
under normal thermal conditions.
The conga-Cdebug originally does not provide 5V standby power. Therefore, an extra 5V_SB connection without any external loads was made.
Using this setup, the power consumption of the module in S3 (Standby) mode was measured directly.
Each module was measured while running Windows 7 Professional 64Bit, Hyper Threading enabled, Speed Step enabled, CPU Turbo Mode
enabled and Power Plan set to “Power Saver”. This setting ensures that Core™ processors run in LFM (lowest frequency mode) with minimal
core voltage during desktop idle. Each module was tested while using two 1GB memory modules. Using different sizes of RAM, as well as one
or two memory modules, will cause slight variances in the measured results.
To measure the worst case power consumption the cooling solution was removed and the CPU core temperature was allowed to run up to
between 95° and 100°C while running 100% workload with the Power Plan set to “Balanced”. The peak current value was then recorded. This
value should be taken into consideration when designing the system’s power supply to ensure that the power supply is sufficient during worst
case scenarios.
Power consumption values were recorded during the following stages:
Windows 7 (64 bit)
•Desktop Idle (power plan = Power Saver)
•100% CPU workload (see note below, power plan = Power Saver)
•100% CPU workload at approximately 100°C peak power consumption (power plan = Balanced)
•Suspend to RAM. Supply power for S3 mode is 5V.
Note
A software tool was used to stress the CPU to Max Turbo Frequency.

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Processor Information
The tables below provide additional information about the power consumption data for each of the conga-TS97 variants offered. The values
are recorded at various operating mode.
2.5.1 Intel®Core™ i7-4700EQ 2.4 GHz Quad Core™ 6MB Cache
conga-TS87 Art. No. 046804 Intel®Core™ i7-4700EQ 2.4 GHz 4 Core™ 6MB Intel®Smart Cache (22nm)
Layout Rev. TS87LA0 /BIOS Rev. TS87R005
Max Turbo Frequency 3.4 GHz
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amps/Watts) Desktop Idle 0.3 A/3.7 W (12V) Suspend to Ram (S3) 5V Input Power 0.1 A/0.4 W (5V)
100% workload without turbo mode 3.1 A/36.9 W (12V) 100% Workload with turbo mode 4.0 A/48.2 W (12V)
100% CPU and GPU without turbo mode 4.5 A/53.4 W (12V) 100% CPU and GPU with turbo mode 5.0 A/60.4 W (12V)
Peak Power Consumption 5.6 A/67.3 W (12V)
2.5.2 Intel®Core™ i5-4402E 1.6 GHz Dual Core™ 3MB Cache
conga-TS87 Art. No. 046805 Intel®Core™ i5-4402E 1.6 GHz 2 Core™ 3MB Intel®Smart Cache (22nm)
Layout Rev. TS87LA0 /BIOS Rev. TS87R005
Max Turbo Frequency 2.7 GHz
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amps/Watts) Desktop Idle 0.3 A/3.5 W (12V) Suspend to Ram (S3) 5V Input Power 0.1 A/0.4 W (5V)
100% workload without turbo mode 1.3 A/16.0 W (12V) 100% Workload with turbo mode 2.3 A/28.0 W (12V)
100% CPU and GPU without turbo mode 2.3 A/27.2 W (12V) 100% CPU and GPU with turbo mode 2.9 A/34.2 W (12V)
Peak Power Consumption 3.4 A/40.5 W (12V)

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2.5.3 Intel®Core™ i5-4400E 2.7 GHz Dual Core™ 3MB Cache
conga-TS87 Art. No. 046806 Intel®Core™ i5-4400E 2.7 GHz 2 Core™ 3MB Intel®Smart Cache (22nm)
Layout Rev. TS87LA0 /BIOS Rev. TS87R005
Max Turbo Frequency 3.3 GHz
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amps/Watts) Desktop Idle 0.3 A/3.5 W (12V) Suspend to Ram (S3) 5V Input Power 0.1 A/0.4 W (5V)
100% workload without turbo mode 1.6 A/18.6 W (12V) 100% Workload with turbo mode 3.4 A/40.3 W (12V)
100% CPU and GPU without turbo mode 2.6 A/31.3 W (12V) 100% CPU and GPU with turbo mode 4.0 A/48.0 W (12V)
Peak Power Consumption 4.3 A/52.1 W (12V)
2.5.4 Intel®Core™ i3-4102E 1.6 GHz Dual Core™ 3MB Cache
conga-TS87 Art. No. 046807 Intel®Core™ i3-4102E 1.6 GHz 2 Core™ 3MB Intel®Smart Cache (22nm)
Layout Rev. TS87LA0 /BIOS Rev. TS87R005
Max Turbo Frequency N.A
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amps/Watts) Desktop Idle 0.3 A/3.4 W (12V) Suspend to Ram (S3) 5V Input Power 0.1 A/0.4 W (5V)
100% workload without turbo mode 1.2 A/14.4 W (12V) 100% Workload with turbo mode N.A
100% CPU and GPU without turbo mode 2.0 A/24.2 W (12V) 100% CPU and GPU with turbo mode N.A
Peak Power Consumption 2.1 A/25.1 W (12V)
2.5.5 Intel®Core™ i3-4100E 2.4 GHz Dual Core™ 3MB Cache
conga-TS87 Art. No. 046808 Intel®Core™ i3-4100E 2.4 GHz 2 Core™ 3MB Intel®Smart Cache (22nm)
Layout Rev. TS87LA0 /BIOS Rev. TS87R005
Max Turbo Frequency N.A
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amps/Watts) Desktop Idle 0.3 A/3.4 W (12V) Suspend to Ram (S3) 5V Input Power 0.1 A/0.4 W (5V)
100% workload without turbo mode 2.1 A/25.3 W (12V) 100% Workload with turbo mode N.A
100% CPU and GPU without turbo mode 3.4 A/40.8 W (12V) 100% CPU and GPU with turbo mode N.A
Peak Power Consumption 3.6 A/42.7 W (12V)

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2.5.6 Intel®Celeron®2000E 2.2 GHz Dual Core™ 2MB Cache
conga-TS87 Art. No. 046810 Intel®Celeron®2000E 2.2 GHz 2 Core™ 2MB Intel®Smart Cache (22nm)
Layout Rev. TS87LA0 /BIOS Rev. TS87R005
Max Turbo Frequency N.A
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amperes/Watts) Desktop Idle 0.58 A/6.9 W (12V) Suspend to Ram (S3) 5V Input Power 0.1 A/0.4 W (5V)
100% workload without turbo mode 1.76 A/21.1 W (12V) 100% Workload with turbo mode N.A
100% CPU and GPU without turbo mode 2.08 A/25.0 W (12V) 100% CPU and GPU with turbo mode N.A
Peak Power Consumption N.A
2.5.7 Intel®Celeron®2002E 1.5 GHz Dual Core™ 2MB Cache
conga-TS87 Art. No. 046811 Intel®Celeron®2002E 1.5 GHz 2 Core™ 2MB Intel®Smart Cache (22nm)
Layout Rev. TS87LA0 /BIOS Rev. TS87R005
Max Turbo Frequency N.A
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amps/Watts) Desktop Idle 0.56 A/6.7 W (12V) Suspend to Ram (S3) 5V Input Power 0.1 A/0.4 W (5V)
100% workload without turbo mode 1.12 A/13.4 W (12V) 100% Workload with turbo mode N.A
100% CPU and GPU without turbo mode 1.50 A/18.0 W (12V) 100% CPU and GPU with turbo mode N.A
Peak Power Consumption N.A
2.6 Supply Voltage Battery Power
•2.0V-3.5V DC
•Typical 3V DC