Dell P2422HB User manual

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1. Disassembly Procedures
S1
Turn off the monitor.
S2
To remove the stand
Place the monitor on a soft cloth or
cushion at the edge of the desk.
Press and hold the stand release button
at the back of the display.
Lift the stand assembly up and away
from the monitor.
S3 Unlock 4 RC screws
isassemble Rear Cover from Middle
Frame according to the sequence
shown in the picture
(Screw Torque: 9±1kgf)
S4
Pull out CTRL FFC from I/F B to take
off Rear Cover
S5
Tear off 1 tape from CTRL B FFC on
Rear Cover
Unlock 3 screws to disassemble CTRL
B from Rear Cover
(Screw Torque: 1.4±0.1kgf)

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S6
Pull out USB FFC from USB B and I/F
B
Unlock 1 screw on USB B
isassemble USB B from Middle
Frame
(Screw Torque: 4.5±0.5kgf)
S7
Tear off adhesive tape on Backlight
Wire
Tear off adhesive tape on LV S Cable
(Note: Only for LG panel)
Tear off two tapes to disassemble Main
SH from panel
S8
Pull out Backlight Wire from SPS B
S9
Pull out LV S cable and take off Main
SH from panel
S1
Unlock 9 screws on Middle Frame
Unlock 2 screws on Bezel Chin
(Screw Torque-MF: 3.5~~4.0kgf)
(Screw Torque-BZL Chin: 2.0±0.1kgf)

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S11
isassemble Middle Frame and Bezel
Chin from Panel
S12
Pull out Backlight Wire from panel
S13
isassemble Mylar from Main SH
S14
Unlock 5 PCB screws and 2 hex screws
(Screw Torque-PCB: 8.5±1kgf)
(Screw Torque-Hex: 5±0.6kgf)
S15
Take out I/F B and SPS B from Main
SH
S16
Pull out LV S cable and SPS B cable
from I/F B

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S17
Remove electrolyte capacitors (red mark) from printed circuit boards
S17-1 Cut the glue between bulk cap. and PCB with a knife
S17-2 Ensure cutting path within the glue, don’t touch bulk cap. or PCB

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S17-3 Take out bulk cap. pin solder with soldering iron and absorber
S17-4 Lift the bulk cap. up and away from the PCB

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2. Product material information
The following substances, preparations, or components should be disposed of or
recovered separately from other WEEE in compliance with Article 4 of EU Council
Directive 75/442/EEC.
Capacitors / condensers (containing
PCB/PCT)
No used
Mercury containing components
No used
Batteries No used
Printed circuit boards (with a surface greater
than 10 square cm)
Product has printed circuit boards
(with a surface greater than 10 square
cm)
Component contain toner, ink and liquids No used
Plastic containing BFR
No used
Component and waste contain asbestos
No used
CRT No used
Component contain CFC, HCFC, HFC and
HC
No used
Gas discharge lamps
No used
LCD display > 100 cm2 Product has an LCD greater than 100
cm2
External electric cable Product has external cables
Component contain refractory ceramic fibers
No used
Component contain radio
-
active substances
No used
Electrolyte capacitors (height
> 25mm, diameter > 25mm)
Product has electrolyte capacitors
(height >25mm, diameter > 25mm)
3. Tools Required
List the type and size of the tools that would typically can be used to disassemble the
product to a point where components and materials requiring selective treatment can be
removed.
Tool Description:
- Screwdriver
- Scraper Bar
- Penknife
- Soldering iron and absorber