Dfi Ehl9a2 Guide

EHL9A2

COM Express Mini Module

Carrier Board Design Guide

2Design Guide | EHL9A2

This publication contains information that is protected by copyright. No part of it may be re-

produced in any form or by any means or used to make any transformation/adaptation with-

out the prior written permission from the copyright holders.

This publication is provided for informational purposes only. The manufacturer makes no rep-

resentations or warranties with respect to the contents or use of this manual and specifically

disclaims any express or implied warranties of merchantability or fitness for any particular

purpose. The user will assume the entire risk of the use or the results of the use of this docu-

ment. Further, the manufacturer reserves the right to revise this publication and make changes

to its contents at any time, without obligation to notify any person or entity of such revisions

or changes.

Changes after the publication’s first release will be based on the product’s revision. The web-

site will always provide the most updated information.

Trademarks

Product names or trademarks appearing in this manual are for identification purpose only and

are the properties of the respective owners.

COM Express Specification Reference

PICMG® COM Express® Module Base Specification.

http://www.picmg.org/

FCC and DOC Statement on Class B

This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-

able protection against harmful interference when the equipment is operated in a residential

installation. This equipment generates, uses and can radiate radio frequency energy and, if not

installed and used in accordance with the instruction manual, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or television

reception, which can be determined by turning the equipment off and on, the user is encour-

aged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that to which the re-

ceiver is connected.

• Consult the dealer or an experienced radio TV technician for help.

Notice:

• The changes or modifications not expressly approved by the party responsible for

compliance could void the user’s authority to operate the equipment.

• Shielded interface cables must be used in order to comply with the emission limits.

3Design Guide | EHL9A2

Table of Contents

Chapter 1 - Introduction................................................................................................................6

COM Express Overview..........................................................................................................6

Specification ........................................................................................................................... 7

Block Diagram ........................................................................................................................ 9

Board Layout .......................................................................................................................10

System Memory ..................................................................................................................10

Terminology .........................................................................................................................11

Chapter 2 - Concept....................................................................................................................12

COM Express Module Standards .......................................................................................12

Chapter 3 - Carrier Board Schematic Guidelines......................................................................13

PCI Express Bus ..................................................................................................................13

Serial ATA .............................................................................................................................16

Gigabit Ethernet (GBE).........................................................................................................18

HD Audio...............................................................................................................................23

Universal Serial Bus 2.0 and 3.1 (USB 2.0 and 3.1) ..........................................................27

LVDS ......................................................................................................................................32

Digital Display Interface.......................................................................................................36

Miscellaneous.......................................................................................................................42

4Design Guide | EHL9A2

About this Manual

This manual can be downloaded from the website.

The manual is subject to change and update without notice, and may be based on editions

that do not resemble your actual products. Please visit our website or contact our sales repre-

sentatives for the latest editions.

Warranty

• Warranty does not cover damages or failures that occur from misuse of the product,

inability to use the product, unauthorized replacement or alteration of components

and product specifications.

• The warranty is void if the product has been subjected to physical abuse, improper

installation, modification, accidents or unauthorized repair of the product.

• Unless otherwise instructed in this user’s manual, the user may not, under any cir-

cumstances, attempt to perform service, adjustments or repairs on the product,

whether in or out of warranty. It must be returned to the purchase point, factory or

authorized service agency for all such work.

• We will not be liable for any indirect, special, incidental or consequential damages to

the product that has been modified or altered.

Static Electricity Precautions

It is quite easy to inadvertently damage your PC, system board, components or devices even

before installing them in your system unit. Static electrical discharge can damage computer

components without causing any signs of physical damage. You must take extra care in han-

dling them to ensure against electrostatic build-up.

• To prevent electrostatic build-up, leave the system board in its anti-static bag until

you are ready to install it.

• Wear an antistatic wrist strap.

• Do all preparation work on a static-free surface.

• Hold the device only by its edges. Be careful not to touch any of the components,

contacts or connections.

• Avoid touching the pins or contacts on all modules and connectors. Hold modules or

connectors by their ends.

Safety Measures

• To avoid damage to the system, use the correct AC input voltage range.

• To reduce the risk of electric shock, unplug the power cord before removing the sys-

tem chassis cover for installation or servicing. After installation or servicing, cover

the system chassis before plugging the power cord.

Important:

Electrostatic discharge (ESD) can damage your processor, disk drive and other

components. Perform the upgrade instruction procedures described at an ESD

workstation only. If such a station is not available, you can provide some ESD

protection by wearing an antistatic wrist strap and attaching it to a metal part of

the system chassis. If a wrist strap is unavailable, establish and maintain contact

with the system chassis throughout any procedures requiring ESD protection.

5Design Guide | EHL9A2

About the Package

The package contains the following items. If any of these items are missing or damaged,

please contact your dealer or sales representative for assistance.

The accessories in the package may not come similar to the information listed below. This may

differ in accordance with the sales region or models in which it was sold. For more information

about the standard package in your region, please contact your dealer or sales representative.

• Heat Sink (For IHS package CPU)

• Heat Sink (For BARE-DIE CPU)

• Cooler (For IHS packages CPU with wide temperature environment.)

* IHS : Integrated Heat Spreader

Optional Items

The board and accessories in the package may not come similar to the information listed

above. This may differ in accordance with the sales region or models in which it was sold. For

more information about the standard package in your region, please contact your dealer or

sales representative.

Before Using the System Board

Before using the system board, prepare basic system components.

If you are installing the system board in a new system, you will need at least the following

internal components.

• Storage devices such as hard disk drive, etc.

You will also need external system peripherals you intend to use which will normally include

at least a keyboard, a mouse and a video display monitor.

Chapter 1

INTRODUCTION

Design Guide | EHL9A2

Chapter 1 - Introduction

XCOM Express Overview

This design guide addendum organizes and provides the recommendations of DFI’s COM car-

rier board design for COM-Express Modules. All other Schematic Guidelines for the carrier

board are applicable and can be found in the PICMG Design Guide V1.0. Please contact DFI

sales and application engineers if there are any questions about designing the carrier board,

or you plan to use this processor in applications other than mobile or desktop platforms.

COM Express complies with COM Express standard from the PCI Industrial Computer Manu-

facturers Group (PICMG) which provides next-generation performance of the smallest state

in the art of embedded modules. DFI’s COM Design Support Services (CDSS) help customers

develop and integrate their carrier boards with DFI’s COM modules. CDSS provides a series

of valuable services such as Product, Design Assistance, Software and Thermal Solution ser-

vices, together they help reduce risks when designing carrier boards. For more details, please

visit at “http://www.dfi.com” DFI offers a wide range of COM products to cater to various

customers’ demands. The modular designs add more flexibilities to the system. The COM Ex-

press form factor allows the COM Express Modules to be easily and securely mounted on a

customized solution board. The design and multiple processor choices eliminate CPU integra-

tion worries and allow fast applications supporting for the most dynamic embedded needs.

Mini

Carrier Board

Compact

Basic

COM Express

Carrier Board

COMs are widely used by modular CPU boards with high-integration features.

COM-Express supports a wide range of processors and chipsets. They utilize specialized

technologies, including PCI Express, Serial ATA, USB 2.0, etc. Not only do COMs allow quick

design, they also provide the benefits of easy installation, maintenance and upgrade ease.

Though small in size, COMs implement CPU architectures and basic common circuits.

Many system integrators find that DFI COM solutions have already covered around 80%

of their feature requirements. This makes COM products powerful and cost-efficient.

Carrier board

COM Express Mini Module

Chapter 1

INTRODUCTION

Design Guide | EHL9A2

XSpecification

SYSTEM Processor Intel Atom®x6000 series and Intel®Celeron®and Pentium®N & J series processors (formerly Code name “Elkhart Lake”)

Memory LPDDR4X max up to 16GB within dual channel and maximum speed depends on SOC.

(The LPDDR4X speed ≤ 3733 MT/s (2RPC/1RPC) and 4267 MT/s (1RPC) which depends on processor.)

Note:

• 8GB/16GB supported by project basis.

• In-band ECC (IBECC) with normal memory chip support on selected ATOM x6000 series SKUs.

IBECC can set enabled or disabled in BIOS setup menu.

BIOS AMI SPI 256Mbit

GRAPHICS Controller Intel®HD Graphics

Feature OpenGL 4.5, DirectX 12, OpenCL 1.2

HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC

HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, MVC

Display 1 x DDI

1 x LVDS/eDP

LVDS: single channel 24-bit, resolution up to 1920x1200 @ 60Hz

eDP: resolution up to 4096x2160 @ 60Hz

HDMI: resolution up to 4096x2160 @ 30Hz

DP++: resolution up to 4096x2160 @ 60Hz, 3840x2160 @60Hz

EXPANSION Interface 4 x PCIe x1 (Gen 3)

1 x SD/SDIO (available upon request)

1 x I2C

1 x SMBus

1 x LPC

1 x Speaker

1 x SPI

2 x UART (TX/RX)

AUDIO Interface HD Audio

ETHERNET Controller 1 x Intel®I225IT / I225-LM (10/100/1000Mbps/2.5Gbps)

I/O USB 2 x USB 3.1 Gen2

8 x USB 2.0

SATA 2 x SATA 3.0 (up to 6Gb/s)

eMMC 1 x 8GB/16GB/32GB/64GB*/128GB eMMC 5.1 (available upon request)

DIO 1 x 8-bit DIO

Chapter 1

INTRODUCTION

Design Guide | EHL9A2

WATCHDOG TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds

SECURITY TPM dTPM or fTPM (Opational)

Power Type 4.75V~20V, 5VSB, VCC_RTC (ATX mode)

4.75V~20V, VCC_RTC (AT mode)

Consumption TBD

OS SUPPORT OS Support (UEFI

Only) Windows: Windows 10 IoT Enterprise 64-bit

Linux

ENVIRONMENT Temperature Operating: -5 to 65°C, -40 to 85°C

Storage: -40 to 85°C

Humidity Operating: 5 to 90% RH

Storage: 5 to 90% RH

MTBF TBD

MECHANICAL Dimensions COM Express® Mini 84mm (3.3") x 55mm (2.16")

Compliance PICMG COM Express® R3.0, Type 10

STANDARDS AND CER-

TIFICATIONS

Certification CE, FCC

Chapter 1

INTRODUCTION

Design Guide | EHL9A2

XBlock Diagram

Chapter 1

INTRODUCTION

Design Guide | EHL9A2

XBoard Layout

TOP VIEW

LPDDR4XLPDDR4X

LPDDR4X

SPI

LPDDR4X

COM Express connector

EMMC

BOTTOM VIEW

Important:

Boards, and other components. Perform installation procedures at an ESD work-

station only. If such a station is not available, you can provide some ESD protec-

tion by wearing an antistatic wrist strap and attaching it to a metal part of the

system chassis. If a wrist strap is unavailable, establish and maintain contact with

the system chassis throughout any procedures requiring ESD protection.

XSystem Memory

LPDDR4XLPDDR4X

LPDDR4X

SPI

LPDDR4X

The system board is equipped with LPDDR4X memory chips onboard.

Chapter 1

INTRODUCTION

Design Guide | EHL9A2

XTerminology

Conventions and Terminology

BTB Board to board COMe connector

COM A serial port interface on IBM PC-compatible computers running

Microsoft Windows or MS-DOS

COM-Express New generation technology of Computer On Module

CPU Central Processing Unit

CRT Cathode Ray Tube

LPDDR4/4X Low Power Double Data Rate IV SDRAM memory technology

DVI Digital Visual Interface

DVO Digital Video Out

EMI Electromagnetic Interference

ESD Electrostatic Discharge

FSB Front Side Bus, synonymous with Host or CPU bus

PCH Refers to the Peripheral Component Interface (PCI) Controller Hub

HD Audio High Denition Audio

I2CInter-IC (a two wire serial bus created by Philips)

IDE (ATA) Integrated Drive Electronics (Advanced Technology Attachment)

INTx An interrupt request signal where x stands for interrupts A, B, C,

and D

LAN A local area network (LAN) is a computer network covering a small

physical area

LCD Liquid Crystal Display

LPC The Low Pin Count (LPC) Interface Specication for legacy I/O has

facilitated the industry's transition toward ISA-less systems

LVDS LCD Low Voltage Dierential Signaling: A high speed, low power data

transmission standard used for display connections to LCD panels

MCH Refers to the Memory Controller Hub chipset component

NTSC National Television Standards Committee

PAL Phase Alternate Line

PCI Peripheral Component Interface

PCI-Express New generation PCI interface with serial interconnection technology

RTC Real Time Clock

SATA Serial ATA interface

SMBus System Management Bus

TMDS Transition Minimized Dierential Signaling

TV Television supports NTSC and PAL

UART A universal asynchronous receiver/transmitter that translates data

between parallel and serial forms.

USB Universal Serial Bus

Chapter 2

CONCEPT

Design Guide | EHL9A2

Chapter 2 - Concept

106.00

91.00

70.00

51.00

4.00

18.00

6.00

0.00

16.50

4.00

0.00

Extended

BasicCompact

Mini

74.20

80.00

91.00

121.00

151.00

Common for all Form Factors

Extended only

Basic only

Compact only

Compact and Basic only

Mini only

XCOM Express Module Standards

The figure below shows the dimensions of the different types of COM Express modules.

EHL9A2 is a COM Express Mini. The dimension is 84mm x 55mm.

Chapter 3

CARRIER BOARD SCHEMATIC GUIDELINES

Design Guide | EHL9A2

Chapter 3 - Carrier Board Schematic Guidelines

XPCI Express Bus

Signal Pin# Pin Type Pwr Rail /Tolerance EHL9A2 PU/PD Module Base Specification R3.0 Description COM Express Carrier Design Guide R2.0 Description

PCIE_TX0+ A68 AC Coupling capacitor

PCIE_TX0- A69 AC Coupling capacitor

PCIE_RX0+ B68

PCIE_RX0- B69

PCIE_TX1+ A64 AC Coupling capacitor

PCIE_TX1- A65 AC Coupling capacitor

PCIE_RX1+ B64

PCIE_RX1- B65

PCIE_TX2+ A61 AC Coupling capacitor

PCIE_TX2- A62 AC Coupling capacitor

PCIE_RX2+ B61

PCIE_RX2- B62

PCIE_TX3+ A58 AC Coupling capacitor

PCIE_TX3- A59 AC Coupling capacitor

PCIE_RX3+ B58

PCIE_RX3- B59

PCIE_CLK_REF+ A88

PCIE_CLK_REF- A89

Note: For PCIe device down or slot card components on the carrier board, please use the PCIe Lane0 port first.

Signal Pin# Pin Type Pwr Rail /Tolerance EHL9A2 PU/PD Module Base Specification R3.0 Description COM Express Carrier Design Guide R2.0 Description

USB0+ A46 USB Port 0, data + or D+

USB0- A45 USB Port 0, data - or D-

USB1+ B46 USB Port 1, data + or D+

USB1- B45 USB Port 1, data - or D-

USB2+ A43 USB Port 2, data + or D+

USB2- A42 USB Port 2, data - or D-

USB3+ B43 USB Port 3, data + or D+

USB3- B42 USB Port 3, data - or D-

USB4+ A40 USB Port 4, data + or D+

USB4- A39 USB Port 4, data - or D-

USB5+ B40 USB Port 5, data + or D+

USB5- B39 USB Port 5, data - or D-

USB6+ A37 USB Port 6, data + or D+

USB6- A36 USB Port 6, data - or D-

USB7+ B37 USB Port 7, data + or D+

USB7- B36 USB Port 7, data - or D-

USB_0_1_OC# B44 I CMOS 3.3V Suspend/3.3V PU 10Kto 3.3V Suspend

USB over-current sense, USB channels 0 and 1.

A pull-up for this line shall be present on the Module.

An open drain driver from a USB current monitor on the Carrier Board

may drive this line low.

Do not pull this line high on the Carrier Board.

USB over-current sense, USB ports 0 and 1.

Do not pull up these lines to 3.3V on the Carrier Board – this shall be

done on the Module.

I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 6. If implemented, shall be host ports.

I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 7. If implemented, shall be host ports.

I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 4. If implemented, shall be host ports.

I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 5. If implemented, shall be host ports.

I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 2. If implemented, shall be host ports.

I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 3. If implemented, shall be host ports.

USB Si

nals Descri

tions

I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 0. If implemented, shall be host ports.

I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 1. If implemented, shall be host ports.

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 3 PCIe channel 3. Receive Input differential pair.

O PCIE PCIE Reference clock output for all PCI Express and PCI Express Graphics

lanes.

PCIe Reference Clock for all COM Express PCIe lanes, and for PEG

lanes.

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 2 PCIe channel 2. Receive Input differential pair.

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 3 PCIe channel 3. Transmit Output differential pair.

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 1 PCIe channel 1. Receive Input differential pair.

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 2 PCIe channel 2. Transmit Output differential pair.

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 0 PCIe channel 0. Receive Input differential pair.

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 1 PCIe channel 1. Transmit Output differential pair.

PCI Ex

ress Lanes Si

nals Descri

tions

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 0 PCIe channel 0. Transmit Output differential pair.

Signal Description

The table listed below illustrates the signal descriptions of PCI Express Bus, including the following information:

Signal: signal name

Pin: pin number

Pin Type: the methods of transmission and reception

I input to the Module

O output from the Module

I/O bi-directional input/output signal

OD open drain output

Pwr Rail/Tolerance: power voltage

EHL9A2: the description of Module board

Carrier Board: suggestions for the design of customer’s carrier board

Description: signal descriptions

Chapter 3

CARRIER BOARD SCHEMATIC GUIDELINES

Design Guide | EHL9A2

• Schematic Guidelines

Each PCI Express lane is AC coupled between its corresponding transmitter (TX) and receiver (RX). The figure below displays the connection for COM Express signals and

PCI Express connectors. The AC coupling capacitors of TX+/- is shown on COM Express Module. The AC coupling capacitors of RX+/- should be close to TX+/- pin oh the

PCIE device. The RX+/- of the PCIe slot pin should be connected to BTB RX+/- pin directly.

Use the exactly same package size for the capacitor on each signal in a differential pair. The reference for the PCI Express capacitor is indicated below.

AC Coupling

Capacitor Value Gen1 or Gen2

Min = 75 nF

Max = 265 nF

AC Coupling

Capacitor Value Gen3

Min = 180 nF

Max = 265 nF

Chapter 3

CARRIER BOARD SCHEMATIC GUIDELINES

Design Guide | EHL9A2

• Layout Guidelines

The table listed below summaries the layout routing guidelines of PCI Express Lanes.

BTB Pin Name BTB Pin# Max VIA

Number

(Intel Spec)

VIA

Number

Actual

Impedance

(Intel Spec)

Total Trace

Length

(Intel Spec)

Total Module

Board Trace

Length

BTB Length Carrier Board maximum

Trace Length

• Note: For PCIe device down components on the carrier board, please use and place on the PCIe Lane0 port rst.

PCIE_TX0+ A68 1

Differential

85Ω±10%

6755 913.3 500 5341.3

914.0

PCIE_TX0- A69

PCIE_RX0- B68

6755 458.2 500 5796.8

458.1

PCIE_RX0- B69

PCIE_TX1+ A64

6755 873.5 500 5381.6

873.2

PCIE_TX1- A65

PCIE_RX1+ B64

6755 399.2 500 5853.4

404.0

PCIE_RX1- B65

PCIE_TX2+ A61

6755 869.8 500 5386.7

866.7

PCIE_TX2- A62

PCIE_RX2+ B61

6755 537.5 500 5719.6

533.2

PCIE_RX2- B62

PCIE_TX3+ A58 16755 877.2 500 5377.4

878.0

PCIE_TX3- A59

PCIE_RX3+ B58 16755 478.7 500 5777.9

475.4

PCIE_RX3- B59

PCIE_CK_REF+ A88

9000 1996.60 500 6502.0

1999.30

PCIE_CK_REF- A89

* Trace length Unit: mils

Chapter 3

CARRIER BOARD SCHEMATIC GUIDELINES

Design Guide | EHL9A2

XSerial ATA

Signal Description

The table listed below illustrates the signal descriptions of Serial ATA devices, including the following information:

Signal: signal name

Pin: pin number

Pin Type: the methods of transmission and reception

I input to the Module

O output from the Module

I/O bi-directional input/output signal

OD open drain output

Pwr Rail/Tolerance: power voltage

EHL9A2: the description of Module board

Carrier Board: suggestions for the design of customer’s carrier board

Description: signal descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance EHL9A2 PU/PD Module Base Specification R3.0 Description COM Express Carrier Design Guide R2.0 Description

HDA_RST# A30 O CMOS 3.3V Suspend/3.3V series 33Ωresistor Reset output to CODEC, active low. CODEC Reset.

HDA_SYNC A29 O CMOS 3.3V/3.3V series 33Ωresistor Sample-synchronization signal to the CODEC(s). Serial Sample Rate Synchronization.

HDA_BITCLK A32 I/O CMOS 3.3V/3.3V series 33Ωresistor Serial data clock generated by the external CODEC(s). 24 MHz Serial Bit Clock for HDA CODEC.

HDA_SDOUT A33 O CMOS 3.3V/3.3V series 33Ωresistor Serial TDM data output to the CODEC. Audio Serial Data Output Stream.

HDA_SDIN0 B30 I/O CMOS 3.3V Suspend/3.3V

HDA_SDIN1 B29 I/O CMOS 3.3V Suspend/3.3V

HDA_SDIN2 B28 I/O CMOS 3.3V Suspend/3.3V NC

Signal Pin# Pin Type Pwr Rail /Tolerance EHL9A2 PU/PD Module Base Specification R3.0 Description COM Express Carrier Design Guide R2.0 Description

GBE0_MDI0+ A13 I/O Analog 3.3V max Suspend

GBE0_MDI0- A12 I/O Analog 3.3V max Suspend

GBE0_MDI1+ A10 I/O Analog 3.3V max Suspend

GBE0_MDI1- A9 I/O Analog 3.3V max Suspend

GBE0_MDI2+ A7 I/O Analog 3.3V max Suspend

GBE0_MDI2- A6 I/O Analog 3.3V max Suspend

GBE0_MDI3+ A3 I/O Analog 3.3V max Suspend

GBE0

MDI3- A2 I

O Analo

3.3V max Sus

end

GBE0_ACT# B2 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 activity indicator, active low. Ethernet controller 0 activity indicator, active low.

GBE0_LINK# A8 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 link indicator, active low. Ethernet controller 0 link indicator, active low.

GBE0_LINK100# A4 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low. Ethernet controller 0 100Mbit/sec link indicator, active low.

GBE0_LINK1000# A5 OD CMOS 3.3V Suspend/3.3V LED for link speed with

2.5Gb

sGigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low. Ethernet controller 0 1000Mbit/sec link indicator, active low.

GBE0_CTREF A14 REF GND min, 3.3V max NC

Reference voltage for Carrier Board Ethernet channel 0 magnetics center

tap. The reference voltage is determined by the requirements of the

Module PHY and may be as low as 0V and as high as 3.3V.

The reference voltage output shall be current limited on the Module. In

the case in which the reference is shorted to ground, the current shall be

limited to 250 mA or less.

Reference voltage for Carrier Board Ethernet channel 0

magnetics center tap.

GBE0_SDP A49 I/O 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 Software-Definable Pin.

Can also be used for IEEE1588 support such as a 1pps signal.

Signal Pin# Pin Type Pwr Rail /Tolerance EHL9A2 PU/PD Module Base Specification R3.0 Description COM Express Carrier Design Guide R2.0 Description

SATA0_TX+ A16 O SATA AC coupled on Module AC Coupling capacitor

SATA0_TX- A17 O SATA AC coupled on Module AC Coupling capacitor

SATA0_RX+ A19 I SATA AC coupled on Module AC Coupling capacitor

SATA0_RX- A20 I SATA AC coupled on Module AC Coupling capacitor

SATA1_TX+ B16 O SATA AC coupled on Module AC Coupling capacitor

SATA1_TX- B17 O SATA AC coupled on Module AC Coupling capacitor

SATA1_RX+ B19 I SATA AC coupled on Module AC Coupling capacitor

SATA1_RX- B20 I SATA AC coupled on Module AC Coupling capacitor

(S)ATA_ACT# A28 I/O CMOS 3.3V / 3.3V Single buffer Serial ATA (activity indicator), active low. Serial ATA activity LED. Open collector output pin driven during

SATA command activity.

Serial ATA or SAS Channel 1 receive differential pair. Serial ATA channel 1

Receive input differential pair.

SATA Signals Descriptions

Serial ATA or SAS Channel 0 transmit differential pair. Serial ATA channel 0

Transmit output differential pair.

Serial ATA or SAS Channel 0 receive differential pair. Serial ATA channel 0

Receive input differential pair.

Serial ATA or SAS Channel 1 transmit differential pair. Serial ATA channel 1

Transmit output differential pair.

HDA Signals Descriptions

Serial TDM data inputs from up to 3 CODECs. Audio Serial Data Input Stream from CODEC[0:2].

Gigabit Ethernet Signals Descriptions

Gigabit Ethernet Controller 0: Media Dependent Interface Differential

Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec

modes. Some pairs are unused in some modes, per the following:

1000BASE-T 100BASE-TX 10BASE-T

MDI[0]+/- B1_DA+/- TX+/- TX+/-

MDI[1]+/- B1_DB+/- RX+/- RX+/-

MDI[2]+/- B1_DC+/-

MDI[3]+/- B1_DD+/-

Media Dependent Interface (MDI) differential pair 0.

Media Dependent Interface (MDI) differential pair 1.

Media Dependent Interface (MDI) differential pair 2.

Only used for 1000Mbit/sec Gigabit Ethernet mode.

Media Dependent Interface (MDI) differential pair 3.

Only used for 1000Mbit/sec Gigabit Ethernet mode.

LED for link speed with 1Gbps.

Only at Pin A4 or A5 link speed the

GBE0_LINK# will active low.

Board-to-Board

COMe Module Carrier Board

Couple

AC Couple

0.1uF

AC Couple 0.22uF

Chapter 3

CARRIER BOARD SCHEMATIC GUIDELINES

Design Guide | EHL9A2

• Schematic Guidelines

Both the TX and RX SATA differential pairs require AC coupling capacitors. It shows the connection for COM Express SATA signals as the figures dis-

played below. All AC coupling capacitors on the transmitter (TX) and receiver (RX) are placed on the COM-Express Module. Do not place the AC cou-

pling capacitors on the carrier board. The following figures indicate the connections.

Board-to-Board

COMe Module Carrier Board

Couple

SATA 0-1

D D

C C

B B

A A

SATA 0-1 SATA 2-3

LAN

USB_3.0 _2.0

DEFAULT 1-2

SATA_RXN0

SATA_RXP0

SATA_RXN1

SATA_RXP1

SATA_TXP1

SATA_TXN1

SATA_TXP0

SATA_TXN0

LAN_LED_1000#

LAN_LED_100#

501_MDI0_P

501_MDI0_N

501_MDI1_P

501_MDI1_N

501_MDI2_P

501_MDI2_N

501_MDI3_P

501_MDI3_N

USB3Tn3_CON

USB3Rn3_CON

USB3Rn4

USB3Rp4

USB3Rn4_CON

USB3Rp4_CON

USB3Rp3

USB3Tn3

USB3Tp3

USB3Tn3_CON

USB3Rn3_CONUSB3Rn3

USB3Rp3_CON

USB3Tp3_CON

USB3Rp3_CON

USB3Tn4_CON

USB3Rn4_CON

USB3Rp4_CON

USB3Tp4_CON

USB3Rn4_CON

USB3Tn4_CON

USB3Tp4_CON

USB3Rp4_CON

USB3Tp3_CON

USB3Rn3_CON

USB3Tn3_CON

USB3Tp3_CON

USB3Rp3_CON

USB3Tp4

USB3Tn4

+SBD3

+SBD2

USB_PW2_3

-SBD3

-SBD2

USB3Tp4_CON

USB3Tn4_CON

-SBD2

USB3Tn4_CON

USB3Tp3_CON

+SBD3

USB3Tn3_CON

USB3Tp4_CON

USB3Rp4_CON

USB3Rn3_CON

USB_PW2_3

-SBD3

USB3Rn4_CON

USB3Rp3_CON

+SBD2

USB_PW2_3

SATA_RX2N

SATA_RX2P

SATA_TX2P

SATA_TX2N

SATA_RX3N

SATA_RX3P

SATA_TX3P

SATA_TX3N

USB_PW2_3

501_LED_ACT-

LAN_LEDPWR

USBP_2P

USBP_2N

+SBD2

-SBD2

+SBD3

-SBD3

USBP_3P

USBP_3N

3VDU

EMI-GND_USBLAN

5VDU USB5V_23

3VDU

EMI-GND_USBLAN

SATA_TX0N3

SATA_RX0P3

SATA_TX0P3

SATA_RX1N3

SATA_RX1P3

SATA_TX1P3

SATA_TX1N3

SATA_RX0N3

501_LED_100- 3

501_LED_1000- 3

501_MDI0_P3

501_MDI0_N3

501_MDI1_P3

501_MDI1_N3

501_MDI2_P3

501_MDI2_N3

501_MDI3_P3

501_MDI3_N3

USB3Rn33

USB3Rp33

USB3Tp33

USB3Tn33

SATA_TX2P3

SATA_TX2N3

SATA_RX3P3

SATA_RX3N3

SATA_TX3N3

SATA_TX3P3

SATA_RX2P3

SATA_RX2N3

USB_2_3_OC- 3

GB0_DTREF3

501_LED_ACT- 3

USB3Rp43

USB3Rn43

USB3Tp43

USB3Tn43

USBP_2P3

USBP_2N3

USBP_3P3

USBP_3N3

Title

Size Document Number Rev

Date: Sheet of

Express Card&SATA&LAN/USB3.0

DFI Inc.

9 13Monday, August 26, 2013

COM331-B

Title

Size Document Number Rev

Date: Sheet of

Express Card&SATA&LAN/USB3.0

DFI Inc.

9 13Monday, August 26, 2013

COM331-B

Title

Size Document Number Rev

Date: Sheet of

Express Card&SATA&LAN/USB3.0

DFI Inc.

9 13Monday, August 26, 2013

COM331-B

R184

1K,1

R184

1K,1

0805

FB19

80,3A

0805

FB19

80,3A

R169 0

R167 0

LI8

GLECM2012B-900

LI8

GLECM2012B-900

4 3

EC85

EC27

560U,6.3V,8,S

EC85

EC27

560U,6.3V,8,S

0402

C582 0

0402

C582 0

J10

SATA,F

J10

SATA,F

GND1

TXP

TXM

GND2

RXM

RXP

GND3

0402

C169 NC/471P

0402

C169 NC/471P

0402

C178 NC/471P

0402

C178 NC/471P

LI16

CMM21T-900M

LI16

CMM21T-900M

U24

IP4281CZ10

SLP2510P8

U24

IP4281CZ10

SLP2510P8

4 5

0402

C580 0

0402

C580 0

LI7

GLECM2012B-900

LI7

GLECM2012B-900

4 3

R163 150,1

0402

C189 104P,16V

0402

C189 104P,16V

0402

C188 104P,16V

0402

C188 104P,16V

U25

IP4223CZ6

TSOP6-1

U25

IP4223CZ6

TSOP6-1

3 4

R185

1K,1

R185

1K,1

LI5

GLECM2012B-900

LI5

GLECM2012B-900

4 3

U26

IP4281CZ10

SLP2510P8

U26

IP4281CZ10

SLP2510P8

4 5

SATA3-F

GND1

TXP

TXM

GND2

RXM

RXP

GND3

CN13A

USB3RJ45G_B

CN13A

USB3RJ45G_B

VBUSA

DA-

DA+

GNDA

4SSRXA-

SSRXA+

GND_DRAINA

SSTXA-

SSTXA+

P_GND1A

P_GND2A

P_GND2B

SSRXB-

GNDB

SSRXB+

DB+

GND_DRAINB

DB-

SSTXB-

VBUSB

SSTXB+

P_GND1B

J12

SATA3-F

J12

SATA3-F

GND1

TXP

TXM

GND2

RXM

RXP

GND3

0402

C180

104P,16V

0402

C180

104P,16V

R170 0

JP8

1X3,R

JP8

1X3,R

LI17

CMM21T-900M

LI17

CMM21T-900M

LI6

GLECM2012B-900

LI6

GLECM2012B-900

4 3

R161 150,1

J11

SATA,F

J11

SATA,F

GND1

TXP

TXM

GND2

RXM

RXP

GND3

R162 150,1

0402

C581 0

0402

C581 0

F10

3A,6V

1206FUSE

F10

3A,6V

1206FUSE

GREEN

ORANGE

YELLOW

CN13B

USB3RJ45G_B

GREEN

ORANGE

YELLOW

CN13B

USB3RJ45G_B

TRD1+

TRD1-

TRD3+

TRD2+

TRD2-

TRCT

Y- 29

Y+ 30

G+ 31

O+ 32

SH1 M8

SH2 M2

TRD3-

TRD4+

TRD4-

TRC

SH3 M7

SH4 M5

0402

C179 NC/471P

0402

C179 NC/471P

0402

C187

104P,16V

0402

C187

104P,16V

U23

TPS2062

SO8

U23

TPS2062

SO8

GND

EN1

3EN2

OC1 8

OUT1 7

OUT2 6

OC2 5

0402

C579 0

0402

C579 0

• Layout Guidelines

The table shown below summarizes the layout routing guidelines of Serial ATA interfaces.

BTB Pin Name BTB Pin# Max VIA

Number

(Intel Spec)

VIA

Number

Actual

Impedance

(Intel Spec)

Total Trace

Length

(Intel Spec)

Total Module

Board Trace

Length

BTB Length Carrier Board maximum

Trace Length

SATA0_TX+ A16 2

Differential

85Ω±10%

5000 1299.9 500 3200.1

SATA0_TX- A17 2 1300.3 3199.7

SATA0_RX+ A19 2 5000 1450.8 500 3049.2

SATA0_RX- A20 2 1452.2 3047.8

SATA1_TX+ B16 2 5000 921.9 500 3578.1

SATA1_TX- B17 2 925.5 3574.5

SATA1_RX+ B19 2 5000 1023.5 500 3476.5

SATA1_RX- B20 2 1021.5 3478.5

SOC to CN1

* Trace length Unit: mils

Chapter 3

CARRIER BOARD SCHEMATIC GUIDELINES

Design Guide | EHL9A2

XGigabit Ethernet (GBE)

Signal Description

The table listed below illustrates the signal descriptions of RJ45 LAN device, including the following information: