DFI SH960MD-CM236 User manual

SH960MD-CM236/QM170/HM170
COM Express Basic Module
User’s Manual
A-520-M-2002
Preliminary
Version
Preliminary
Version

2User's Manual | SH960MD
Copyright
This publication contains information that is protected by copyright. No part of it may be repro-
duced in any form or by any means or used to make any transformation/adaptation without the
prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifi-
cally disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions or
changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2019. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the re-
ceiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for com-
pliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

3User's Manual | SH960MD
Table of Contents
Copyright........................................................................................................................................ 2
Trademarks....................................................................................................................................2
FCC and DOC Statement on Class B........................................................................................... 2
Notice:............................................................................................................................................2
About this Manual.........................................................................................................................4
Warranty ........................................................................................................................................ 4
Static Electricity Precautions ....................................................................................................... 4
Safety Measures ...........................................................................................................................4
About the Package........................................................................................................................5
Optional Items............................................................................................................................... 5
Before Using the System Board................................................................................................... 5
Chapter 1 - Introduction................................................................................................................6
Specifications ......................................................................................................................... 6
Features .................................................................................................................................. 7
Concept................................................................................................................................... 8
Chapter 2 - Hardware Installation................................................................................................8
Board Layout........................................................................................................................... 8
Standby Power LED................................................................................................................8
System Memory ..................................................................................................................... 9
Assembly ................................................................................................................................ 9
I/O Connectors .....................................................................................................................11
CPU Fan..........................................................................................................................11
Board-to-board Connector ............................................................................................12
Signal Descriptions ..............................................................................................................15
Pin Types........................................................................................................................15
HDA Signals Descriptions.............................................................................................15
Gigabit Ethernet Signals Descriptions .........................................................................15
SATA Signals Descriptions ...........................................................................................16
PCI Express Lanes Signals Descriptions.....................................................................17
PEG Signals Descriptions .............................................................................................18
ExpressCard Signals Descriptions ...............................................................................19
USB Signals Descriptions .............................................................................................19
LVDS Signals Descriptions............................................................................................21
LPC Signals Descriptions..............................................................................................22
SPI Signals Descriptions...............................................................................................22
VGA Signals Descriptions .............................................................................................22
DDI Signals Descriptions .............................................................................................23
Serial Interface Signals Descriptions...........................................................................25
I2C Signal Descriptions.................................................................................................25
Miscellaneous Signal Descriptions ..............................................................................26
Power and System Management Signals Descriptions .............................................26
Thermal Protection Signals Descriptions....................................................................27
SMBUS Signals Descriptions........................................................................................27
GPIO Signals Descriptions............................................................................................27
Power and GND Signal Descriptions ...........................................................................28
Module type Signal Descriptions..................................................................................28
Chapter 3 - BIOS Setup...............................................................................................................29
Overview ...............................................................................................................................29
Main.......................................................................................................................................30
Advanced .............................................................................................................................30
ACPI Configuration........................................................................................................31
CPU Configuration.........................................................................................................31
Video Configuration.......................................................................................................32
Audio Configuration.......................................................................................................32
SATA Configuration .......................................................................................................33
USB Configuration .........................................................................................................33
PCI Express Configuration............................................................................................34
ME Configuration...........................................................................................................34
SIO ITE8528E .................................................................................................................35
Security .................................................................................................................................36
Boot .......................................................................................................................................36
Exit.........................................................................................................................................38
Updating the BIOS................................................................................................................38
Notice: BIOS SPI ROM..........................................................................................................38
Chapter 4 - Supported Software ................................................................................................39
Auto-run Menu......................................................................................................................39
Intel Chipset Software Installation Utility...........................................................................39
Intel HD Graphics Drivers ...................................................................................................40
Realtek Audio Drivers...........................................................................................................41
Intel LAN Driver ...................................................................................................................42
Intel ME Drivers ....................................................................................................................43
Intel Rapid Storage Technology .........................................................................................44
Adobe Acrobat Reader 9.3 ..................................................................................................45

4User's Manual | SH960MD
About this Manual
This manual can be downloaded from the website, or acquired as an electronic file included in
the optional CD/DVD. The manual is subject to change and update without notice, and may be
based on editions that do not resemble your actual products. Please visit our website or con-
tact our sales representatives for the latest editions.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product,
inability to use the product, unauthorized replacement or alteration of components and
product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper in-
stallation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-
stances, attempt to perform service, adjustments or repairs on the product, whether in
or out of warranty. It must be returned to the purchase point, factory or authorized ser-
vice agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to
the product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you
are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, con-
tacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or
connectors by their ends.
Safety Measures
• To avoid damage to the system, use the correct AC input voltage range.
• To reduce the risk of electric shock, unplug the power cord before removing the sys-
tem chassis cover for installation or servicing. After installation or servicing, cover the
system chassis before plugging the power cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other
components. Perform the upgrade instruction procedures described at an ESD
workstation only. If such a station is not available, you can provide some ESD pro-
tection by wearing an antistatic wrist strap and attaching it to a metal part of the
system chassis. If a wrist strap is unavailable, establish and maintain contact with
the system chassis throughout any procedures requiring ESD protection.

5User's Manual | SH960MD
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One SH960MD-CM236/QM170/HM170 board
• CPU Cooler
Optional Items
• COM332-B carrier board kit
• Heat spreader
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following inter-
nal components.
• Monitor
• USB keyboard
• Storage device such as hard disk drive, CD-ROM, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.

6
Chapter 1
INTRODUCTION
User's Manual | SH960MD
Chapter 1 - Introduction
XSpecifications
SYSTEM Processor 6th Generation Intel®CoreTM Processors, BGA 1440
- Xeon®E3-1515M v5 Processor, Quad Core, 8M Cache, 2.8GHz (3.7GHz),
45W (Support ECC)
- Core™ i7-6820EQ Processor, Quad Core, 8M Cache, 2.8GHz (3.5GHz), 45W
- Core™ i5-6442EQ Processor, Quad Core, 6M Cache, 1.9GHz (2.7GHz), 25W
- Core™ i3-6100E Processor, Dual Core, 3M Cache, 2.7GHz, 35W (Support
ECC)
- Celeron®Processor G3900E, Dual Core, 2M Cache, 2.4GHz, 35W (Support
ECC)
Chipset Intel®CM236/QM170/HM170
Memory - 8GB/16GB DDR4 Memory Down
- Dual Channel DDR4 2133MHz
- ECC (CPU dependent)
BIOS Insyde SPI 128Mbit
GRAPHICS Controller Intel®HD Graphics
Feature OpenGL up to 4.4, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265,
VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
Display 1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request)
2 x DDI (HDMI/DVI/DP++)
Resolution VGA: resolution up to 1920x1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz or 2560x1600 @ 60Hz
DVI: resolution up to 1920x1200 @ 60Hz
DP++/eDP: resolution up to 4096x2304 @ 60Hz
Triple Displays VGA + LVDS + DDI, VGA + DDI1 + DDI2
eDP + 2 DDI (available upon request)
EXPANSION Interface 1 x PCIe x16 or 2 x PCIe x8 (Gen 3)
8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)
AUDIO Interface HD Audio
ETHERNET Controller 1 x Intel®I210IT (10/100/1000Mbps)
I/O USB 4 x USB 3.0
8 x USB 2.0
SATA 4 x SATA 3.0 (up to 6Gb/s)
RAID 0/1/5/10
DIO 1 x 8-bit DIO
WATCHDOG
TIMER
Output &
Interval
System Reset, Programmable via Software from 1 to 255 Seconds
SECURITY TPM Available Upon Request
POWER Type 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
OS SUPPORT Windows 8.1 64-bit
Windows 7 (/WES7) 32/64-bit
Windows 10 IoT Enterprise 64-bit
Debian 8 (with VESA graphic driver)
CentOS 7 (with VESA graphic driver)
Linux
ENVIRONMENT Temperature Operating: 0 to 60°C; Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH; Storage: 5 to 90% RH
MECHANICAL Dimensions COM Express®Basic: 95mm (3.74") x 125mm (4.9")
Compliance PICMG COM Express®R2.1, Type 6

7
Chapter 1
INTRODUCTION
User's Manual | SH960MD
XFeatures
Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so that
your system will continue to operate.
DDR4
DDR4 delivers increased system bandwidth and improves performance. The advantages of
DDR4 provide an extended battery life and improve the performance at a lower power than
DDR3/DDR2. Instead of using memory connectors, the system features memory down with the
support of ECC memory.
Graphics
The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance
and features to meet business needs. It provides excellent video and 3D graphics with out-
standing graphics responsiveness. These enhancements deliver the performance and compat-
ibility needed for today’s and tomorrow’s business applications. Supports VGA, LVDS, eDP and
DDI display outputs.
Serial ATA
The system supports multiple SATA 3.0 (up to 6Gb/s) ports and allows for different configura-
tions of RAID levels to meet various requirements for data redundancy and performance.
Gigabit LAN
The Intel® I210IT Gigabit LAN controller features up to 1Gbps data transmission with support
for Intel® Active Management Technology. It provides remote maintenance and manageability
for networked computing assets in an enterprise environment.
Wake-On-LAN
This feature allows the network to remotely wake up a Soft Power Down (Soft-Off) PC. It is
supported via the onboard LAN port or via a PCI LAN card that uses the PCI PME (Power Man-
agement Event) signal. However, if your system is in the Suspend mode, you can power-on the
system only through an IRQ or DMA interrupt.
USB
The system board supports the new USB 3.0. It is capable of running at a maximum transmis-
sion speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s)
and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces power
consumption, and is backward compatible with USB 2.0. It is a marked improvement in device
transfer speeds between your computer and a wide range of simultaneously accessible exter-
nal Plug and Play peripherals.
ACPI STR
The system board is designed to meet the ACPI (Advanced Configuration and Power Interface)
specification. ACPI has energy saving features that enables PCs to implement Power Manage-
ment and Plug-and-Play with operating systems that support OS Direct Power Management.
ACPI when enabled in the Power Management Setup will allow you to use the Suspend to RAM
function.
With the Suspend to RAM function enabled, you can power-off the system at once by pressing
the power button or selecting “Standby” when you shut down Windows® without having to go
through the sometimes tiresome process of closing files, applications and operating system.
This is because the system is capable of storing all programs and data files during the entire
operating session into RAM (Random Access Memory) when it powers-off. The operating ses-
sion will resume exactly where you left off the next time you power-on the system.
Power Failure Recovery
When power returns after an AC power failure, you may choose to either power-on the system
manually or let the system power-on automatically.

8
Chapter 1
INTRODUCTION
User's Manual | SH960MD
XConcept
106.00
91.00
70.00
51.00
4.00
18.00
6.00
0.00
16.50 4.00 0.00
Extended
BasicCompact
Mini
74.20 80.00 91.00 121.00 151.00
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only
COM Express
Computer-on-module (COM) Express is a PC form factor designed with the core computing in-
tegrated on a fairly compact module. All the I/O signals and power supply are concentrated and
mapped to the board-to-board connectors on the bottom side to interface with a carrier board
that is typically customized to fit the application. When an upgrade or change of application is
needed, the physical separation of the core computing and the I/O of COM Express cuts back
the cost greatly, whereas canonical IPC designs would typically require an entire makeover. The
COM Express module can be replaced when there is only need to upgrade for higher computing
performance, while the carrier board can be redesigned when there is solely change in applica-
tion. COM Express also comes in different form factors and signal Types cut out for different
scales and aspects of the system's application. Detailed specifications of COM Express are
available on the website of PCI Industrial Computer Manufacturers Group (PICMG).
Carrier Board
The design of a carrier board for COM Express greatly depends on the form factor and signal
Type of the COM Express module. The carrier board typically handles — but not limited to —
one COM Express module, and is populated with stand-offs that conform to the form factor of
the module's mounting holes.
SH960MD is a Type 6 COM Express (R2.1) module compatible with DFI's proprietary carrier
board — COM332-B — as an optional item. If the carrier board is to be customized, the design
guide for the carrier board can be attained via the Partner Zone page on our website.

8
Chapter 2
HARDWARE INSTALLATION
User's Manual | SH960MD
Chapter 2 - Hardware Installation
XBoard Layout
Important:
When the Standby Power LED lights red, it indicates that there is power on the
system board. Power-off the PC then unplug the power cord prior to installing any
devices. Failure to do so will cause severe damage to the motherboard and com-
ponents.
XStandby Power LED
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives,
add-in boards, and other components. Perform installation procedures at an ESD
workstation only. If such a station is not available, you can provide some ESD pro-
tection by wearing an antistatic wrist strap and attaching it to a metal part of the
system chassis. If a wrist strap is unavailable, establish and maintain contact with
the system chassis throughout any procedures requiring ESD protection.
Intel
CM236/QM170/
HM170
Intel
6
th
Gen Processor
Xeon/Core/Celeron
SPI Flash BIOS
CPU Fan
Standby
Power
LED
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
DDR4
TPM 2.0
COM Express Connectors
D110
C110
B110
A110
D1
C1
B1
A1
Bottom View
Top View
Standby Power LED

9
Chapter 2
HARDWARE INSTALLATION
User's Manual | SH960MD
• DDR4 2133MHz memory
• ECC (only available with certain options, see Specifications)
• Dual channel memory interface
XSystem Memory
Features
The system board supports the following memory interface.
Single Channel (SC)
Data will be accessed in chunks of 64 bits from the memory channels.
Dual Channel (DC)
Data will be accessed in chunks of 128 bits from the memory channels. Dual channel provides
better system performance because it doubles the data transfer rate.
Single Channel DIMMs are on the same channel. DIMMs in a channel can be identi-
cal or completely different. However, we highly recommend using
identical DIMMs. Not all slots need to be populated.
Dual Channel DIMMs of the same memory configuration are on different channels.
DDR4
Carrier Board
COM Express
module
CPU Cooler
XAssembly
A CPU cooler is included in the standard package. The CPU cooler contains six spring screws
and shall be installed after the COM Express module is securely mounted onto the carrier
board. Please make sure the cooler, the module, and the carrier board are oriented correctly by
inspecting whether the screws, screw holes, and stand-offs all align.
1
6
3
2
5
4
Note:
The carrier board is not included in the standard package and is typically custom-
ized.