DFI DV970 User manual

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1
DV970
COM Express Basic Module
User’s Manual
A47900847
Preliminary
Version

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2
Copyright
This publication contains information that is protected by copyright. No part of it may be re-
produced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifi-
cally disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2018. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
COM Express Specification Reference
PICMG®COM Express ModuleTM Base Specification.
http://www.picmg.org/
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compli-
ance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

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Table of Contents
Copyright........................................................................................................... ..2
Trademarks ........................................................................................................2
COM Express Specification Reference...................................................2
FCC and DOC Statement on Class B.....................................................2
Warranty..............................................................................................................4
Static Electricity Precautions......................................................................4
Safety Measures ..............................................................................................4
About the Package......................................................................................... 5
Optional Items..................................................................................................5
Before Using the System Board...............................................................5
Chapter 1 - Introduction .............................................................................6
Specifications ................................................................................................6
Features..........................................................................................................7
Chapter 2 - Concept....................................................................... 8
COM Express Module Standards.............................................................. 8
Specification Comparison Table ...............................................................9
DV970 PCIe Lanes Routing Table ......................................................... 10
Chapter 3 - Hardware Installation.............................................. 11
Board Layout............................................................................................... 11
System Memory.......................................................................................... 12
Installing the DIMM Module ....................................................................... 12
Connectors................................................................................................... 13
CPU Fan Connector.................................................................................... 13
COM Express Connectors ........................................................................... 14
COM Express Connectors Signal Discription................................................. 17
Standby Power LED................................................................................... 29
Cooling Option............................................................................................ 29
Heat Sink with Fan ..................................................................................... 29
Installing DV970 onto a Carrier Board ................................................ 30

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Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product, in-
ability to use the product, unauthorized replacement or alteration of components and prod-
uct specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper instal-
lation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-
stances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequential damages to the
product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or con-
nectors by their ends.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servic-
ing. After installation or servicing, cover the system chassis before plugging the power
cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other com-
ponents. Perform the upgrade instruction procedures described at an ESD worksta-
tion only. If such a station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part of the system chas-
sis. If a wrist strap is unavailable, establish and maintain contact with the system
chassis throughout any procedures requiring ESD protection.

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About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One DV970 board
• One Cooler (Height: TBD)
Optional Items
• COM333-I carrier board kit
• Heat spreader (Height: 11mm)
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• Memory module
• Storage devices such as hard disk drive, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.

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Chapter 1 - Introduction
Specifications
Chapter 1
SYSTEM Processor Intel Atom®Processor C3000 Series, BGA1310
Intel Atom®C3958 Processor, 16 Cores, 16M Cache, 2.0GHz, 31W
Intel Atom®C3808 Processor, 12 Cores, 12M Cache, 2.0GHz, 25W
Intel Atom®C3708 Processor, 8 Cores, 16M Cache, 1.7GHz, 17W
Memory Two 260-pin ECC SODIMM up to 32GB
Dual Channel DDR4 2400MHz
(Memory max speed depends on CPU SKU)
BIOS Insyde SPI 128Mbit
EXPANSION Interface 000G/200G/300G:
B1: 2 x PCIe x2 or 2 x PCIe x1 (Gen 3)
B2: 1 x PCIe x2 (Gen 3) + 1 x PCIe x1 (Gen 2) or
2 x PCIe x1 (Lane 8 Gen 3, Lane 12 Gen 2)
B3: 1 x PCIe x8 or 2 x PCIe x4 or 4 x PCIe x2 or 4 x PCIe x1 (Gen 3)
100G:
B1: 1 x PCIe x8 or 2 x PCIe x4 or 4 x PCIe x2 or 4 x PCIe x1 (Gen 3)
B3: 2 x PCIe x2 or 2 x PCIe x1 (Gen 3)
B4: 2 x PCIe x2 or 2 x PCIe x1 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)
ETHERNET Controller PHY for X557 or CS4227/CS4223 and Controller for Intel®I210AT/
Intel®I210IT
2 x Independent 10GbE Media Access Controller (Sku dependent)
Supports up to Two 10GBASE-KR Interfaces and Max up to Four 10GbE
MAC Ports
Supports Intel®X557-AT/AT2/AT4 10GbE PHY
Supports Inphi CS4227 (2 port)/CS4223 (4 port)
(maximum bandwidth is 20Gb when 4 ports of 10G interface active at
the same time)
1 x Intel®I210AT (10/100/1000Mbps) (normal temp.) or
1 x Intel®I210IT (10/100/1000Mbps) (wide temp.)
I/O USB 2 x USB 3.0
4 x USB 2.0
SATA 2 x SATA 3.0 (up to 6Gb/s)
RAID 0/1/10
DIO 1 x 8-bit DIO (4 in, 4 out)
WATCHDOG
TIMER
Output &
Interval
System Reset, Programmable via Software from 15 to 255 Seconds
SECURITY TPM Available Upon Request
POWER Type 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption TBD
OS SUPPORT Windows Server 2012
Windows Server 2016
Yocto Project v1.8/v2.0
ENVIRONMENT Temperature Operating:
0 to 60°C or -20 to 70°C
Storage:
-40 to 85°C
Humidity Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF TBD
Mechanical Dimensions COM Express®Basic
95mm (3.74") x 125mm (4.9")
Compliance PICMG COM Express®R3.0, Type 7

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Chapter 1
Features
• Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
• DDR4
DDR4 delivers increased system bandwidth and improves performance. The advantages of
DDR4 provide an extended battery life and improve the performance at a lower power than
DDR3/DDR2.
• Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard paral-
lel ATA whose data transfer rate is 100MB/s. However, the bandwidth of the SATA 3.0 will be
limited by carrier board design.
• Gigabit LAN
The Intel®I210AT or I210IT Gigabit LAN PHY controller features up to 1Gbps data transmis-
sion with support for Intel®Active Management Technology. It provides remote maintenance
and manageability for networked computing assets in an enterprise environment.
• USB
The system board supports the new USB 3.0. It is capable of running at a maximum trans-
mission speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60
MB/s) and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission and
is backward compatible with USB 2.0. It is a marked improvement in device transfer speeds
between your computer and a wide range of simultaneously accessible external Plug and Play
peripherals.

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Chapter 2
Chapter 2 - Concept
COM Express Module Standards
The figure below shows the dimensions of the different types of COM Express modules.
DV970 is a COM Express Basic module. Its dimension is 95mm x 125mm.
106.00
91.00
70.00
51.00
4.00
18.00
6.00
0.00
16.50 4.00 0.00
Extended
BasicCompact
Mini
74.20 80.00 91.00 121.00 151.00
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only

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Chapter 2
Specification Comparison Table
• 5Indicates 12V-tolerant features on former VCC_12V signals.
•6 Cells in the connected columns spanning rows provide a rough approximation of features
sharing connector pins.
The table below shows the COM Express standard specifications and the corresponding specifications supported on the DV970 module.
Connector Feature
COM Express Module Base
Specification Type 7
Min / Max
DFI DV970
Type 7
(000G/200G/300G)
DFI DV970
Type 7
(100G)
A-B PCI Ex
p
ress Lanes 0 - 5 6 / 6 46
A-B
,
C-D PCI Ex
p
ress Lanes 6 - 15 0 / 10 32
C-D PCI Ex
p
ress Lanes 16 - 31 0 / 16 88
C-D PCI Ex
p
ress Gra
p
hics
(
PEG
)
NA NA NA
C-D 10G LAN Ports 0 - 3 0 / 4 44
A-B NC-SI 0 / 1 1 0
A-B 1Gb LAN Port 0 1 / 1 1 0
A-B DDI 0 NA NA NA
A-B DDIs 1 - 3 NA NA NA
A-B LVDS Channel A NA NA NA
A-B LVDS Channel B NA NA NA
A-B eDP on LVDS CH A
p
ins NA NA NA
A-B VGA Por
t
NA NA NA
A-B Serial Ports 1 - 2 0 / 2 2 2
A-B CAN interface on SER1 0 / 1 00
A-B SATA Ports 0 / 2 22
A-B HDA Di
g
ital Interface NA NA NA
A-B USB 2.0 Ports 4 / 4 44
A-B USB0 Client 0 / 1 00
A-B USB7 Client NA NA NA
C-D USB 3.0 Ports 0 / 4 22
A-B LPC Bus or eSPI 1 / 1 1 LPC 1 LPC
A-B SPI
(
Devices
)
1 / 2 11
C-D Ra
p
id Shutdown 0 / 1 00
A-B
6
SDIO
(
muxed on GPIO
)
0 / 1 00
A-B General Pur
p
ose I
/
O8 / 8 88
A-B SMBus 1 / 1 11
A-B I2C 1 / 1 11
A-B Watchdo
g
Timer 0 / 1 11
A-B S
p
eaker Out 1 / 1 11
A-B Carrier Board BIOS Flash
Su
pp
or
t
0 / 1 1 1
A-B Reset Functions 1 / 1 11
A-B
T
rusted Platform Module 0 / 1 11
A-B
T
hermal Protection 0 / 1 1 1
A-B Batter
y
Low Alarm 0 / 1 1 1
A-B Sus
p
end/Wake Si
g
nals 0 / 3 2 2
A-B Power Button Su
pp
or
t
1 / 1 1 1
A-B Power Good 1 / 1 1 1
A-B VCC_5V_SBY Contacts 4 / 4 4 4
A-B
5
Sleep Input 0 / 1 1 1
A-B
5
Lid Input 0 / 1 1 1
A-B
5
Carrier Board Fan Control 0 / 1 1 1
A-B
,
C-D VCC_12V Contacts 24 / 24 24 24
System Management
Power Management
Power
System I/O
Type 7 Based on Type 6. Modules trades all audio and video interfaces, 2 SATA ports and four USB 2.0 for
additional PCI Express lanes, four 10 Gb Ethernet ports and an NC-SI management interface for the GbE port.
Features C3958 C3808 C3708
Thermal Design Power (TDP) (Watts) 31 25 17
Number of 64-bit Intel Atom® Microarchitecture
Goldmont Cores
16 12 8
Processor Base Frequency (GHz) 2 2 1.7
Total SoC L2 Cache (MB) 16 12 16
Max. Number of Memory Channels Available 2
Max. DDR4 (1.2V) Memory Data Rate Supported
(MT/s)
2400 2133
Number of High-Speed I/O (HSIO) Lanes Shared
between PCIe, SATA, and USB 3.0
20
HSIO Lane Numbers (0 through 19) Available Lanes 0-19
Max. Number of PCI Express (8.0/5.0/2.5 GT/s)
Lanes
16 via HSIO Lanes
from Lanes 0-15
Max. Number of SATA (6.0/3.0/1.5 Gbps) Lanes 16 via HSIO Lanes
from Lanes 4-19
Max. Number of Sets of USB 3.0 Signals
(SSTX+/SSTX- SSRX+/SSRX-)
4 via HSIO Lanes
from Lanes 16-19
Number of Sets of USB 2.0 Signals
(DATA+/DATA-)
4
LAN Controller 0 (Gb/s)* 10/2.5/1
LAN Controller 1 (Gb/s)* 10/2.5/1
* Each LAN controller must run the same LEK.
Note: Different SKUs may require different BIOS.

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Chapter 2
DV970 PCIe Lanes Routing Table
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www.dfi.comChapter 3 Hardware Installation
11
Chapter 3
Chapter 3 - Hardware Installation
Board Layout
Top View
Bottom View
DDR4_1 SODIMM
DDR4_2 SODIMM
1
CPU fan
Intel
I210AT or
I210IT
Standby
Power LED
SPI Flash BIOS
TPM (optional)
Intel Atom
C3000 Series
P17C9X2G
304SL
CA
AAA
5
1
COM Express Connector
C1
D1
C110
D110
B1
B110
A1
A110
COM Express Connector
iTE
IT8528E

Chapter 3 Hardware Installation
12
Chapter 3
System Memory
DDR4_2
Standby
Power LED
DDR4_1
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in
boards, and other components. Perform installation procedures at an ESD workstation
only. If such a station is not available, you can provide some ESD protection by wear-
ing an antistatic wrist strap and attaching it to a metal part of the system chassis. If
a wrist strap is unavailable, establish and maintain contact with the system chassis
throughout any procedures requiring ESD protection.
Important:
When the Standby Power LED is red, it indicates that there is power on the board.
Power off the PC then unplug the power cord prior to installing any devices. Failure to
do so will cause severe damage to the board and components.
Installing the DIMM Module
1. Make sure the PC and all other peripheral devices connected to it has been powered down.
2. Disconnect all power cords and cables.
3. Locate the SODIMM socket on the system board.
4. Note the key on the socket. The key ensures that the module can be plugged into the
socket in only one direction.
Note:
The system board used in the following illustrations may not resemble the actual one.
These illustrations are for reference only.

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13
Chapter 3
Connectors
CPU Fan Connector
Connect the CPU fan’s cable connector to the CPU fan connector on the board. The cooling fan
will provide adequate airflow throughout the chassis to prevent overheating the CPU and board
components.
3
1
Sense
+12V
Ground
6. Push down the module until the clips at each end of the socket lock into position. You will
hear a distinctive “click”, indicating the module is correctly locked into position.
Clip
Clip
5. Grasping the module by its edges, align the module into the socket at an approximately 30
degrees angle. Apply firm even pressure to each end of the module until it slips down into
the socket. The contact fingers on the edge of the module will almost completely disappear
inside the socket.

www.dfi.comChapter 3 Hardware Installation
14
Chapter 3
COM Express Connectors
The COM Express connectors are used to interface the DV970 COM Express board to a carrier
board. Connect the COM Express connectors (located on the solder side of the board) to the
COM Express connectors on the carrier board.
COM Express Connectors
Refer to the following pages for the pin functions of these connectors.
CA
AAA
5
1

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15
Chapter 3
COM Express Connectors-Continued
A1 GND (FIXED) B1 GND (FIXED) A56 PCIE_TX4- B56 PCIE_RX4-
A2 GBE0_MDI3- B2 GBE0_ACT# A57 GND B57 GPO2
A3 GBE0_MDI3+ B3 LPC_FRAME# / ESPI_CS0#* A58 PCIE_TX3+ B58 PCIE_RX3+
A4 GBE0_LINK100# B4 LPC_AD0 / ESPI_IO_0* A59 PCIE_TX3- B59 PCIE_RX3-
A5 GBE0_LINK1000# B5 LPC_AD1 / ESPI_IO_1* A60 GND (FIXED) B60 GND (FIXED)
A6 GBE0_MDI2- B6 LPC_AD2 / ESPI_IO_2* A61 PCIE_TX2+ B61 PCIE_RX2+
A7 GBE0_MDI2+ B7 LPC_AD3 / ESPI_IO_3* A62 PCIE_TX2- B62 PCIE_RX2-
A8 GBE0_LINK# B8 LPC_DRQ0# / ESPI_ALERT0#* A63 GPI1 B63 GPO3
A9 GBE0_MDI1- B9 LPC_DRQ1# / ESPI_ALERT1#* A64 PCIE_TX1+ B64 PCIE_RX1+
A10 GBE0_MDI1+ B10 LPC_CLK / ESPI_CK* A65 PCIE_TX1- B65 PCIE_RX1-
A11 GND (FIXED) B11 GND (FIXED) A66 GND B66 WAKE0#
A12 GBE0_MDI0- B12 PWRBTN# A67 GPI2 B67 WAKE1#
A13 GBE0_MDI0+ B13 SMB_CK A68 PCIE_TX0+ B68 PCIE_RX0+
A14 GBE0_CTREF B14 SMB_DAT A69 PCIE_TX0- B69 PCIE_RX0-
A15 SUS_S3# B15 SMB_ALERT# A70 GND (FIXED) B70 GND (FIXED)
A16 SATA0_TX+ B16 SATA1_TX+ A71 PCIE_TX8+ B71 PCIE_RX8+
A17 SATA0_TX- B17 SATA1_TX- A72 PCIE_TX8- B72 PCIE_RX8-
A18 SUS_S4# B18 SUS_STAT# / ESPI_RESET#* A73 GND B73 GND
A19 SATA0_RX+ B19 SATA1_RX+ A74 PCIE_TX9+ B74 PCIE_RX9+
A20 SATA0_RX- B20 SATA1_RX- A75 PCIE_TX9- B75 PCIE_RX9-
A21 GND (FIXED) B21 GND (FIXED) A76 GND B76 GND
A22 N.C. B22 N.C. A77 N.C. B77 N.C.
A23 N.C. B23 N.C. A78 N.C. B78 N.C.
A24 SUS_S5# B24 PWR_OK A79 GND B79 GND
A25 N.C. B25 N.C. A80 GND (FIXED) B80 GND (FIXED)
A26 N.C. B26 N.C. A81 N.C. B81 N.C.
A27 BATLOW# B27 WDT A82 N.C. B82 N.C.
A28 (S)ATA_ACT# B28 RSVD A83 GND B83 GND
A29 RSVD B29 RSVD A84 NCSI_TX_EN B84 VCC_5V_SBY
A30 RSVD B30 RSVD A85 GPI3 B85 VCC_5V_SBY
A31 GND (FIXED) B31 GND (FIXED) A86 RSVD B86 VCC_5V_SBY
A32 RSVD B32 SPKR A87 RSVD B87 VCC_5V_SBY
A33 RSVD B33 I2C_CK A88 PCIE_CK_REF+ B88 BIOS_DIS1#
A34 BIOS_DIS0# / ESPI_SAFS* B34 I2C_DAT A89 PCIE_CK_REF- B89 NCSI_RX_ER
A35 THRMTRIP# B35 THRM# A90 GND (FIXED) B90 GND (FIXED)
A36 N.C. B36 N.C. A91 SPI_POWER B91 NCSI_CLK_IN
A37 N.C. B37 N.C. A92 SPI_MISO B92 NCSI_RXD1
A38 GND B38 GND A93 GPO0 B93 NCSI_RXD0
A39 PCIE_TX12+ B39 PCIE_RX12+ A94 SPI_CLK B94 NCSI_CRS_DV
A40 PCIE_TX12- B40 PCIE_RX12- A95 SPI_MOSI B95 NCSI_TXD1
A41 GND (FIXED) B41 GND (FIXED) A96 TPM_PP B96 NCSI_TXD0
A42 USB2- B42 USB3- A97 N.C. B97 SPI_CS#
A43 USB2+ B43 USB3+ A98 SER0_TX B98 NCSI_ARB_IN
A44 USB_2_3_OC# B44 USB_0_1_OC# A99 SER0_RX B99 NCSI_ARB_OUT
A45 USB0- B45 USB1- A100 GND (FIXED) B100 GND (FIXED)
A46 USB0+ B46 USB1+ A101 SER1_TX B101 FAN_PWMOUT
A47 VCC_RTC B47 ESPI_EN#* A102 SER1_RX B102 FAN_TACHIN
A48 RSVD B48 N.C. A103 LID# B103 SLEEP#
A49 GBE0_SDP B49 SYS_RESET# A104 VCC_12V B104 VCC_12V
A50 LPC_SERIRQ / ESPI_CS1#* B50 CB_RESET# A105 VCC_12V B105 VCC_12V
A51 GND (FIXED) B51 GND (FIXED) A106 VCC_12V B106 VCC_12V
A52 PCIE_TX5+ B52 PCIE_RX5+ A107 VCC_12V B107 VCC_12V
A53 PCIE_TX5- B53 PCIE_RX5- A108 VCC_12V B108 VCC_12V
A54 GPI0 B54 GPO1 A109 VCC_12V B109 VCC_12V
A55 PCIE_TX4+ B55 PCIE_RX4+ A110 GND (FIXED) B110 GND (FIXED)
* : DV970 only supports LPC interface, no eSPI mode interface.
Row A Row B Row A Row B

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C1 GND (FIXED) D1 GND (FIXED) C56 PCIE_RX17- D56 PCIE_TX17-
C2 GND D2 GND C57 N.C. D57 TYPE2#
C3 USB_SSRX0- D3 USB_SSTX0- C58 PCIE_RX18+ D58 PCIE_TX18+
C4 USB_SSRX0+ D4 USB_SSTX0+ C59 PCIE_RX18- D59 PCIE_TX18-
C5 GND D5 GND C60 GND (FIXED) D60 GND (FIXED)
C6 USB_SSRX1- D6 USB_SSTX1- C61 PCIE_RX19+ D61 PCIE_TX19+
C7 USB_SSRX1+ D7 USB_SSTX1+ C62 PCIE_RX19- D62 PCIE_TX19-
C8 GND D8 GND C63 RSVD D63 RSVD
C9 N.C. D9 N.C. C64 RSVD D64 RSVD
C10 N.C. D10 N.C. C65 PCIE_RX20+ D65 PCIE_TX20+
C11 GND (FIXED) D11 GND (FIXED) C66 PCIE_RX20- D66 PCIE_TX20-
C12 N.C. D12 N.C. C67 RAPID_SHUTDOWN D67 GND
C13 N.C. D13 N.C. C68 PCIE_RX21+ D68 PCIE_TX21+
C14 GND D14 GND C69 PCIE_RX21- D69 PCIE_TX21-
C15 10G_PHY_MDC_SCL3 D15 10G_PHY_MDIO_SDA3 C70 GND (FIXED) D70 GND (FIXED)
C16 10G_PHY_MDC_SCL2 D16 10G_PHY_MDIO_SDA2 C71 PCIE_RX22+ D71 PCIE_TX22+
C17 10G_SDP2 D17 10G_SDP3 C72 PCIE_RX22- D72 PCIE_TX22-
C18 GND D18 GND C73 GND D73 GND
C19 PCIE_RX6+ D19 PCIE_TX6+ C74 PCIE_RX23+ D74 PCIE_TX23+
C20 PCIE_RX6- D20 PCIE_TX6- C75 PCIE_RX23- D75 PCIE_TX23-
C21 GND (FIXED) D21 GND (FIXED) C76 GND D76 GND
C22 PCIE_RX7+ D22 PCIE_TX7+ C77 RSVD D77 RSVD
C23 PCIE_RX7- D23 PCIE_TX7- C78 PCIE_RX24+ D78 PCIE_TX24+
C24 10G_INT2 D24 10G_INT3 C79 PCIE_RX24- D79 PCIE_TX24-
C25 GND D25 GND C80 GND (FIXED) D80 GND (FIXED)
C26 10G_KR_RX3+ D26 10G_KR_TX3+ C81 PCIE_RX25+ D81 PCIE_TX25+
C27 10G_KR_RX3- D27 10G_KR_TX3- C82 PCIE_RX25- D82 PCIE_TX25-
C28 GND D28 GND C83 RSVD D83 RSVD
C29 10G_KR_RX2+ D29 10G_KR_TX2+ C84 GND D84 GND
C30 10G_KR_RX2- D30 10G_KR_TX2- C85 N.C. D85 N.C.
C31 GND (FIXED) D31 GND (FIXED) C86 N.C. D86 N.C.
C32 10G_SFP_SDA3 D32 10G_SFP_SCL3 C87 GND D87 GND
C33 10G_SFP_SDA2 D33 10G_SFP_SCL2 C88 N.C. D88 N.C.
C34 10G_PHY_RST_23 D34 10G_PHY_CAP_23 C89 N.C. D89 N.C.
C35 10G_PHY_RST_01 D35 10G_PHY_CAP_01 C90 GND (FIXED) D90 GND (FIXED)
C36 10G_LED_SDA D36 RSVD C91 PCIE_RX28+ D91 PCIE_TX28+
C37 10G_LED_SCL D37 RSVD C92 PCIE_RX28- D92 PCIE_TX28-
C38 10G_SFP_SDA1 D38 10G_SFP_SCL1 C93 GND D93 GND
C39 10G_SFP_SDA0 D39 10G_SFP_SCL0 C94 PCIE_RX29+ D94 PCIE_TX29+
C40 10G_SDP0 D40 10G_SDP1 C95 PCIE_RX29- D95 PCIE_TX29-
C41 GND (FIXED) D41 GND (FIXED) C96 GND D96 GND
C42 10G_KR_RX1+ D42 10G_KR_TX1+ C97 RSVD D97 RSVD
C43 10G_KR_RX1- D43 10G_KR_TX1- C98 N.C. D98 N.C.
C44 GND D44 GND C99 N.C. D99 N.C.
C45 10G_PHY_MDC_SCL1 D45 10G_PHY_MDIO_SDA1 C100 GND (FIXED) D100 GND (FIXED)
C46 10G_PHY_MDC_SCL0 D46 10G_PHY_MDIO_SDA0 C101 N.C. D101 N.C.
C47 10G_INT0 D47 10G_INT1 C102 N.C. D102 N.C.
C48 GND D48 GND C103 GND D103 GND
C49 10G_KR_RX0+ D49 10G_KR_TX0+ C104 VCC_12V D104 VCC_12V
C50 10G_KR_RX0- D50 10G_KR_TX0- C105 VCC_12V D105 VCC_12V
C51 GND (FIXED) D51 GND (FIXED) C106 VCC_12V D106 VCC_12V
C52 PCIE_RX16+ D52 PCIE_TX16+ C107 VCC_12V D107 VCC_12V
C53 PCIE_RX16- D53 PCIE_TX16- C108 VCC_12V D108 VCC_12V
C54 TYPE0# D54 RSVD C109 VCC_12V D109 VCC_12V
C55 PCIE_RX17+ D55 PCIE_TX17+ C110 GND (FIXED) D110 GND (FIXED)
Row C Row DRow C Row D

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COM Express Connectors Signals and Descriptions
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
GBE0_MDI0+ A13 I/O Analog 3.3V max Suspend
GBE0_MDI0- A12 I/O Analog 3.3V max Suspend
GBE0_MDI1+ A10 I/O Analog 3.3V max Suspend
GBE0_MDI1- A9 I/O Analog 3.3V max Suspend
GBE0_MDI2+ A7 I/O Analog 3.3V max Suspend
GBE0_MDI2- A6 I/O Analog 3.3V max Suspend
GBE0_MDI3+ A3 I/O Analog 3.3V max Suspend
GBE0_MDI3- A2 I/O Analog 3.3V max Suspend
GBE0_ACT# B2 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 activity indicator, active low.
GBE0_LINK# A8 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 link indicator, active low.
GBE0_LINK100# A4 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low.
GBE0_LINK1000# A5 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
GBE0_CTREF A14 REF GND min, 3.3V max N.C.
Reference voltage for Carrier Board Ethernet channel 0 magnetics center tap. The
reference voltage is determined by the requirements of the Module PHY and may
be as low as 0V and as high as 3.3V. The reference voltage output shall be
current limited on the Module. In the case in which the reference is shorted to
ground, the current shall be limited to 250 mA or less.
GBE0_SDP A49 I/O 3.3V Suspend/3.3V RSVD PU 10KɏGigabit Ethernet Controller 0 Software-Definable Pin. Can also be used for
IEEE1588 support such as a 1pps signal.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
NCSI_CLK_IN B91 I CMOS 3.3V Suspend/3.3V PD 10KɏPD 10Kɏto GND NC-SI Clock reference for receive, transmit, and control interface.
NCSI_RXD0 B93 O CMOS 3.3V Suspend/3.3V PD 3Kƻto GND NC-SI Receive Data (from NC to BMC).
NCSI_RXD1 B92 O CMOS 3.3V Suspend/3.3V PD 3Kƻto GND NC-SI Receive Data (from NC to BMC).
NCSI_TXD0 B96 I CMOS 3.3V Suspend/3.3V PD 10KɏPD 10Kƻto GND NC-SI Transmit Data (from BMC to NC).
NCSI_TXD1 B95 I CMOS 3.3V Suspend/3.3V PD 10KɏPD 10Kƻto GND NC-SI Transmit Data (from BMC to NC).
NCSI_CRS_DV B94 O CMOS 3.3V Suspend/3.3V PD 10Kƻto GND NC-SI Carrier Sense/Receive Data Valid to MC, indicating that the transmitted
data from NC to BMC is valid.
NCSI_TX_EN A84 I CMOS 3.3V Suspend/3.3V PD 10KƻPD 10Kƻto GND NC-SI Transmit enable.
NCSI_RX_ER B89 O CMOS 3.3V Suspend/3.3V RSVD PU 10Kɏto
3.3V Suspend NC-SI Receive error.
NCSI_ARB_IN B98 I CMOS 3.3V Suspend/3.3V PU 10Kƻto 3.3V Suspend
RSVD PU 4.7Kɏto
3.3V Suspend
(IPD 20Kȟ)
NC-SI hardware arbitration input.
NCSI_ARB_OUT B99 O CMOS 3.3V Suspend/3.3V NC-SI hardware arbitration output.
NC-SI Signals Descriptions
Pin Types
I Input to the Module
O Output from the Module
I/O Bi-directional input / output signal
OD Open drain output
RSVD pins are reserved for future use and should be no connect. Do not tie the RSVD pins together.
Power Inputs used for power delivery to the Module electronics.
KR 10GBASE-KR compatible signal.
Gigabit Ethernet Signals Descriptions
Gigabit Ethernet Controller 0: Media Dependent Interface Differential Pairs
0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec modes. Some pairs
are unused in some modes, per the following:
1000BASE-T 100BASE-TX 10BASE-T
MDI[0]+/- B1_DA+/- TX+/- TX+/-
MDI[1]+/- B1_DB+/- RX+/- RX+/-
MDI[2]+/- B1_DC+/-
MDI[3]+/- B1_DD+/-

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Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
10G_KR_TX0+ D49 O KR AC coupled at receiver 10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX0- D50 O KR AC coupled at receiver 10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX1+ D42 O KR AC coupled at receiver 10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX1- D43 O KR AC coupled at receiver 10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX2+ D29 O KR AC coupled at receiver 10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX2- D30 O KR AC coupled at receiver 10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX3+ D26 O KR AC coupled at receiver 10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX3- D27 O KR AC coupled at receiver 10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_RX0+ C49 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX0- C50 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX1+ C42 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX1- C43 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX2+ C29 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX2- C30 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX3+ C26 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX3- C27 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_PHY_MDIO_SDA0 D46
10G_PHY_MDIO_SDA1 D45
10G_PHY_MDIO_SDA2 D16
10G_PHY_MDIO_SDA3 D15
10G_PHY_MDC_SCL0 C46
10G_PHY_MDC_SCL1 C45
10G_PHY_MDC_SCL2 C16
10G_PHY_MDC_SCL3 C15
10G_PHY_CAP_01 D35 I CMOS 3.3V Suspend/3.3V PU 10Kƻto 3.3V Suspend PU 100Kƻto
3.3V Suspend
Phy mode capability pin: Indicates if the PHY for 10G lanes 0 and 1 is capable of
configuration by I²C. High indicates MDIO-only configuration, and low indicates
configuration capability via I²C or MDIO. The actual protocol used for PHY
configuration is determined by the module, in part based on this input. The actual
protocol used is indicated over the dedicated I²C interface
10G_PHY_CAP_23 D34 I CMOS 3.3V Suspend/3.3V PU 10Kƻto 3.3V Suspend PU 100Kƻto
3.3V Suspend
Phy mode capability pin: Indicates if the PHY for 10G lanes 2 and 3 is capable of
configuration by I²C. High indicates MDIO-only configuration, and low indicates
configurationcapability via I²C or MDIO. The actual protocol used for PHY
configuration is determined by the module, in part based on this input. The actual
protocol used is indicated over the dedicated I²C interface
10G_SFP_SDA0 C39 I/O OD
CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend
IPU 5Kƻ,
RSV PU 4.7Kƻto
3.3V Suspend
I2C data signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SDA1 C38 I/O OD
CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend
IPU 5Kƻ,
RSV PU 4.7Kƻto
3.3V Suspend
I2C data signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
MDIO:
PU 2.2Kƻto
3.3V Suspend
MDC :
PU 2.2Kƻto
3.3V Suspend
10Gb Ethernet Signals Descriptions
MDIO Mode: Management Data I/O interface mode data signal for serial data
transfers between the MAC and an external PHY.
I2C Mode: I2C data signal, of the 2-wire management interface used for serial
data transfers between the MAC and an external PHY.
3.3V Suspend/3.3V
O CMOS
I/O OD
CMOS
PU 2.2Kƻto 3.3V Suspend
MDIO Mode: Management Data I/O Interface mode clock signal for serial data
transfers between the MAC and an external PHY.
I2C Mode: I2C Clock signal, of the 2-wire management interface used for serial
data transfers between the MAC and an external PHY.
O CMOS
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend

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10G_SFP_SDA2 C33 I/O OD
CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend PU 4.7Kƻto
3.3V Suspend
I2C data signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SDA3 C32 I/O OD
CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend PU 4.7Kƻto
3.3V Suspend
I2C data signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SCL0 D39 I/O OD
CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend
IPU 5Kƻ,
RSV PU 4.7Kƻto
3.3V Suspend
I2C clock signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SCL1 D38 I/O OD
CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend
IPU 5Kƻ,
RSV PU 4.7Kƻto
3.3V Suspend
I2C clock signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SCL2 D33 I/O OD
CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend PU 4.7Kƻto
3.3V Suspend
I2C clock signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SCL3 D32 I/O OD
CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend PU 4.7Kƻto 3.3V Suspend
I2C clock signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_LED_SDA C36 I/O OD
CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend PU 4.7Kƻto
3.3V Suspend
I2C Data of the 2-wire interface that transfers LED signals and PHY straps for I2C
or MDIO operation of optical PHYs. Refer to the details in I2C Data Mapping to
Carrier Board Based PCA9539 I/O Expander.
10G_LED_SCL C37 I/O OD
CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend PU 4.7Kƻto 3.3V Suspend
I2C Clock of the 2-wire interface that transfers LED and strap signals for I2C or
MDIO operation of optical PHYs.
10G_INT0 C47 I CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend PU 2.2Kƻto
3.3V Suspend Interrupt pin from copper PHY or optical SFP Module to the 10GbE controller.
10G_INT1 D47 I CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend PU 2.2Kƻto
3.3V Suspend Interrupt pin from copper PHY or optical SFP Module to the 10GbE controller.
10G_INT2 C24 I CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend PU 2.2Kƻto
3.3V Suspend Interrupt pin from copper PHY or optical SFP Module to the 10GbE controller.
10G_INT3 D24 I CMOS 3.3V Suspend/3.3V PU 2.2Kƻto 3.3V Suspend PU 2.2Kƻto
3.3V Suspend Interrupt pin from copper PHY or optical SFP Module to the 10GbE controller.
10G_SDP0 C40 I/O CMOS 3.3V Suspend/3.3V Software-Definable Pins. Can also be used for IEEE1588 support such as a 1pps
signal.
10G_SDP1 D40 I/O CMOS 3.3V Suspend/3.3V Software-Definable Pins. Can also be used for IEEE1588 support such as a 1pps
signal.
10G_SDP2 C17 I/O CMOS 3.3V Suspend/3.3V Software-Definable Pins. Can also be used for IEEE1588 support such as a 1pps
signal.
10G_SDP3 D17 I/O CMOS 3.3V Suspend/3.3V Software-Definable Pins. Can also be used for IEEE1588 support such as a 1pps
signal.
10G_PHY_RST_01 C35 O CMOS 3.3V Suspend/3.3V PU 10Kƻto
3.3V Suspend
Output signal that resets an optical PHY on port 0 and port1 (with copper PHY
this signal is not used).
10G_PHY_RST_23 C34 O CMOS 3.3V Suspend/3.3V PU 10Kƻto
3.3V Suspend
Output signal that resets an Optical PHY on port 2 and port 3 (with Copper PHY
this signal is not used).
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
SATA0_TX+ A16 O SATA AC coupled on Module AC Coupling capacitor
SATA0_TX- A17 O SATA AC coupled on Module AC Coupling capacitor
SATA0_RX+ A19 I SATA AC coupled on Module AC Coupling capacitor
SATA0_RX- A20 I SATA AC coupled on Module AC Coupling capacitor
SATA1_TX+ B16 O SATA AC coupled on Module AC Coupling capacitor
SATA1_TX- B17 O SATA AC coupled on Module AC Coupling capacitor
SATA1_RX+ B19 I SATA AC coupled on Module AC Coupling capacitor
SATA1_RX- B20 I SATA AC coupled on Module AC Coupling capacitor Serial ATA Channel 1 receive differential pair.
SATA Signals Descriptions
Serial ATA Channel 0 transmit differential pair.
Serial ATA Channel 0 receive differential pair.
Serial ATA Channel 1 transmit differential pair.

www.dfi.comChapter 3 Hardware Installation
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Chapter 3
(S)ATA_ACT# A28 I/O CMOS 3.3V / 3.3V AND Gate out,
up to 3.3V Serial ATA (activity indicator), active low.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
PCIE_TX0+ A68 AC Coupling capacitor
PCIE_TX0- A69 AC Coupling capacitor
PCIE_RX0+ B68
PCIE_RX0- B69
PCIE_TX1+ A64 AC Coupling capacitor
PCIE_TX1- A65 AC Coupling capacitor
PCIE_RX1+ B64
PCIE_RX1- B65
PCIE_TX2+ A61 AC Coupling capacitor
PCIE_TX2- A62 AC Coupling capacitor
PCIE_RX2+ B61
PCIE_RX2- B62
PCIE_TX3+ A58 AC Coupling capacitor
PCIE_TX3- A59 AC Coupling capacitor
PCIE_RX3+ B58
PCIE_RX3- B59
PCIE_TX4+ A55 AC Coupling capacitor
PCIE_TX4- A56 AC Coupling capacitor
PCIE_RX4+ B55
PCIE_RX4- B56
PCIE_TX5+ A52 AC Coupling capacitor
PCIE_TX5- A53 AC Coupling capacitor
PCIE_RX5+ B52
PCIE_RX5- B53
PCIE_TX6+ D19 AC Coupling capacitor
PCIE_TX6- D20 AC Coupling capacitor
PCIE_RX6+ C19
PCIE_RX6- C20
PCIE_TX7+ D22 AC Coupling capacitor
PCIE_TX7- D23 AC Coupling capacitor
PCIE_RX7+ C22
PCIE_RX7- C23
PCIE_TX8+ A71 AC Coupling capacitor
PCIE_TX8- A72 AC Coupling capacitor
PCIE_RX8+ B71
PCIE_RX8- B72
PCIE_TX9+ A74 AC Coupling capacitor
PCIE_TX9- A75 AC Coupling capacitor
PCIE_RX9+ B74
PCIE_RX9- B75
PCIE_TX10+ A77 N.C.
PCIE_TX10- A78 N.C.
PCIE_RX10+ B77 N.C.
PCIE_RX10- B78 N.C.
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 7
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 6
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 7
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 8
Different connector layout for Type 7
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 9
Different connector layout for Type 7
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 9
Different connector layout for Type 7
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 10
Different connector layout for Type 7
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 5
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 6
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 4
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 5
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 1
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 3
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 4
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 2
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 3
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 8
Different connector layout for Type 7
General Purpose PCI Express Lanes Signals Descriptions
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 0
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 1
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 2
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 0
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 10
Different connector layout for Type 7