DFI KH960-CM238 User manual

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KH960-CM238/QM175/HM175
COM Express Basic Module
User’s Manual
A45420952

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Copyright
This publication contains information that is protected by copyright. No part of it may be re-
produced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifi-
cally disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2017. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
COM Express Specification Reference
PICMG®COM Express ModuleTM Base Specification.
http://www.picmg.org/
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compli-
ance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

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Table of Contents
Copyright ..................................................................... 2
Trademarks.................................................................. 2
COM Express Specification Reference................. 2
FCC and DOC Statement on Class B................. 2
About this Manual ..................................................... 4
Warranty .................................................................... 4
Static Electricity Precautions................................... 4
Safety Measures.......................................................... 4
About the Package .................................................... 5
Optional Items............................................................ 5
Before Using the System Board............................. 5
Chapter 1 - Introduction......................................... 6
Specifications.......................................................................................................... 6
Features................................................................................................................... 7
Chapter 2 - Concept................................................ 8
COM Express Module Standards ..................................................................... 8
Specification Comparison Table ........................................................................ 9
Chapter 3 - Hardware Installation.........................10
Board Layout........................................................................................................10
Block Diagram ...................................................................................................10
Mechanical Diagram...........................................................................................11
System Memory..................................................................................................12
Connectors ..........................................................................................................13
CPU Fan Connector....................................................................................................................... 13
COM Express Connectors ........................................................................................................... 14
COM Express Connectors Signals and Descriptions................................16
Standby Power LED ...........................................................................................30
Cooling Option...................................................................................................30
Chapter 4 - BIOS Setup.....................................33
Overview .............................................................................................................33
Insyde BIOS Setup Utility.................................................................................34
Main .................................................................................................................................................... 34
Advanced ......................................................................................................................................... 34
Security .............................................................................................................................................. 43
Boot.................................................................................................................................................... 44
Exit...................................................................................................................................................... 46
Chapter 5 - Supported Software...........................48
Chapter 6 - RAID .....................................................57
Chapter 7 - Intel AMT Settings ............................ 61
Appendix A - Troubleshooting................................ 75
Appendix B - Insyde BIOS Standard Status POST Code 77

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About this Manual
This manual can be downloaded from the website, or acquired as an electronic file included in
the optional CD/DVD. The manual is subject to change and update without notice, and may be
based on editions that do not resemble your actual products. Please visit our website or con-
tact our sales representatives for the latest editions.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product, in-
ability to use the product, unauthorized replacement or alteration of components and prod-
uct specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper instal-
lation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-
stances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequential damages to the
product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or con-
nectors by their ends.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servic-
ing. After installation or servicing, cover the system chassis before plugging the power
cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other com-
ponents. Perform the upgrade instruction procedures described at an ESD worksta-
tion only. If such a station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part of the system chas-
sis. If a wrist strap is unavailable, establish and maintain contact with the system
chassis throughout any procedures requiring ESD protection.

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About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One KH960 board
• One Cooler (Height: 36.58mm)
Optional Items
• COM332-B carrier board kit
• Heat spreader (Height: 11mm)
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• Memory module
• Storage devices such as hard disk drive, CD-ROM, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.

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Chapter 1 - Introduction
Specifications
Chapter 1
System Processor 7th Generation Intel®Core™ Processors, BGA 1440
Intel® Xeon®E3-1505M v6 Processor, Quad Core, 8M Cache, 3.0GHz (4.0GHz), 45W*
Intel®Xeon®E3-1505L v6 Processor, Quad Core, 8M Cache, 2.2GHz (3.0GHz), 25W*
Intel®Core™ i7-7820EQ Processor, Quad Core, 8M Cache, 3.0GHz (3.7GHz), 45W
Intel®Core™ i5-7440EQ Processor, Quad Core, 6M Cache, 2.9GHz (3.6GHz), 45W
Intel®Core™ i5-7442EQ Processor, Quad Core, 6M Cache, 2.1GHz (2.9GHz), 25W
Intel®Core™ i3-7100E Processor, Dual Core, 3M Cache, 2.9GHz, 35W
Intel®Core™ i3-7102E Processor, Dual Core, 3M Cache, 2.1GHz, 25W
Chipset Intel®CM238/Intel®QM175/Intel®HM175 Chipset
Memory Two 260-pin SODIMM up to 32GB
Dual Channel DDR4 2400MHz†
BIOS Insyde SPI 128Mbit
Graphics Controller Intel®HD Graphics
Feature OpenGL up to 5.0, DirectX 11, OpenCL 2.1
HW Decode: HEVC/H.265, H.264, M/JPEG, MPEG2, VC1/WMV9, VP8
(8-bit), VP9 (10-bit)
HW Encode: HEVC/H.265, M/JPEG, MPEG2, VP8
Display 1 x VGA/DDI3 (DDI3 available upon request)
1 x LVDS/eDP (eDP available upon request)
2 x DDI (HDMI/DVI/DP++)
VGA: resolution up to 1920x1200@60Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
HDMI: resolution up to 4096x2160 @ 30Hz, 24bpp
DVI: resolution up to 1920x1200 @ 60Hz
DP++/eDP: resolution up to 4096x2304 @ 60Hz, 24bpp
Triple Displays VGA+LVDS+DDI or VGA+ DDI1+DDI2
eDP + 2 x DDI (or 3 x DDI available upon request)
Expansion Interface 1 x PCIe x16 (or 2 x PCIe x8 upon request) (Gen 3)
8 x PCIe x1 (or 2 x PCIe x4 or 4 x PCIe x2 upon request) (Gen 3)
1 x LPC
1 x I²C
1 x SMBus
2 x UART (TX/RX)
Audio Interface HD Audio
Ethernet Controller 1 x Intel®I219LM PCIe with iAMT (10/100/1000Mbps)‡
I/O USB 4 x USB 3.0
8 x USB 2.0
SATA 4 x SATA 3.0 (up to 6Gb/s); capable of RAID configuration of 0,
1, 5, 10
DIO 1 x 8-bit DIO (default 4 inputs and 4 outputs)
WatchDog
Timer Output &
Interval System Reset, Programmable via Software from 1 to 255
Seconds
Security TPM Available Upon Request
Power Type 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
OS Support Windows: Windows 10 IoT Enterprise 64-bit
Linux: Yocto Project v2.2
Environment Temperature Operating
: 0 to 60°C
: -40 to 85°C (with heat spreader)
Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF TBD
Mechanical Dimensions COM Express®Basic
95mm (3.74") x 125mm (4.9")
Compliance PICMG COM Express®R2.1, Type 6
* Intel
®
Xeon
®
E3-1505M/1505L v6 can only be paired with the Intel®CM238 Chipset.
† The maximum memory speed supported differs by SKU.
‡ Intel Active Management Technology (Intel®AMT) is not available on Core™ i3 processors
or HM175 chipset.

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Chapter 1
Features
• Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
• DDR4
DDR4 delivers increased system bandwidth and improves performance. The advantages of
DDR4 provide an extended battery life and improve the performance at a lower power than
DDR3/DDR2.
• Graphics
The integrated Intel®HD Graphics 630 engine delivers an excellent blend of graphics per-
formance and features to meet business needs. It delivers enhanced media conversion rates
and higher frame rates on 4K Ultra HD videos. These enhancements deliver the performance
and compatibility to meet the demand for business and home entertainment applications. The
system supports VGA, LVDS (or eDP) and DDI (HDMI/DVI/DP++) display outputs.
• Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard paral-
lel ATA whose data transfer rate is 100MB/s. However, the bandwidth of the SATA 3.0 will be
limited by carrier board design.
• Gigabit LAN
The Intel®I219LM Gigabit LAN PHY controller features up to 1Gbps data transmission with
support for Intel®Active Management Technology. It provides remote maintenance and man-
ageability for networked computing assets in an enterprise environment.
• USB
The system board supports the new USB 3.0. It is capable of running at a maximum transmis-
sion speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s)
and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces
power consumption, and is backward compatible with USB 2.0. It is a marked improvement
in device transfer speeds between your computer and a wide range of simultaneously
accessible external Plug and Play peripherals.
• Intel®Rapid Storage Technology
With a newer release of the Intel Rapid Storage Technology software, the system offers bet-
ter performance and responsiveness. New features such as Smart Response Technology and
Dynamic Storage Accelerator maximize the utilization of the SSD cache acceleration in your
system.
• Intel Turbo Boost 2.0
With the new Intel Turbo Boot Technology 2.0, the system shows better power efficiency when
the processor’s frequency is dynamically increased to provide better performance state using
this technology.
• PCI Express Revision 3.0
The 3 chipsets offered by the model all support PCIe Gen 3 data transfer rates of 8 GT/s,
higher than PCIe Gen 2 speeds of 5 GT/s and providing faster access to expansion cards and
networking.

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Chapter 2
Chapter 2 - Concept
COM Express Module Standards
The figure below shows the dimensions of the different types of COM Express modules.
KH960 is a COM Express Basic module. Its dimension is 95mm x 125mm.
106.00
91.00
70.00
51.00
4.00
18.00
6.00
0.00
16.50 4.00 0.00
Extended
BasicCompact
Mini
74.20 80.00 91.00 121.00 151.00
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only

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Chapter 2
Specification Comparison Table
• 5Indicates 12V-tolerant features on former VCC_12V signals.
•6 Cells in the connected columns spanning rows provide a rough approximation of features
sharing connector pins.
The table below shows the COM Express standard specifications and the corresponding specifications supported on the KH960 module.
PICMG ® COM.0
COM Express ® Module Base Specification
Revision 2.1
3 Required and Optional Features
3.2 Module Pin-out Types 1-6 & 10 - Required and Optional Features
Table 3.2: Module Pin-out - Required and Optional Features A-B Connector
Connector Feature
COM Express Module Base
Specification Type 6
(No IDE or PCI, add DDI+ USB3) Min
/
Max
DFI KH960
Type 6
A-B
A-B PCI Express Lanes 0 - 5 1 / 6 6
A-B LVDS Channel A 0 / 1 1
A-B LVDS Channel B 0 / 1 1
A-B eDP on LVDS CH A pins 0 / 1 1
A-B VGA Port 0 / 1 1
A-B TV-Out NA NA
A-B DDI 0 NA NA
A-B5Serial Ports 1 - 2 0 / 2 2
A-B CAN interface on SER1 0 / 1 0
A-B SATA / SAS Ports 1 / 4 4
A-B AC’97 / HDA Digital Interface 0 / 1 1
A-B USB 2.0 Ports 4 / 8 8
A-B USB Client 0 / 1 0
A-B USB 3.0 Ports NA NA
A-B LAN Port 0 1 / 1 1
A-B Express Card Support 1 / 2 2
A-B LPC Bus 1 / 1 1
A-B SPI 1 / 2 1
A-B
SDIO (muxed on GPIO) 0 / 1 NA
General Purpose I/O 8 / 8 8
A-B SMBus 1 / 1 1
A-B I2C 1 / 1 1
A-B Watchdog Timer 0 / 1 1
A-B Speaker Out 1 / 1 1
A-B External BIOS ROM Support 0 / 2 1
A-B Reset Functions 1 / 1 1
4
Indicates 12V-tolerant features on former VCC_12V signals.
5 Cells in the connected columns spanning rows provide a rough approximation of features sharing connector pins.
Connector Feature
COM Express Module Base
Specification Type 6
(No IDE or PCI, add DDI+ USB3) Min
/
Max
DFI KH960
Type 6
A-B
A-B Thermal Protection 0 / 1 1
A-B Battery Low Alarm 0 / 1 1
COM Express Required and Optional features are summarized in the following table. The fe
a
Minimum (Min.) shall be implemented by all Modules. Features identified up to Maximum (
M
implemented by a Module.
A-B6
Change Key:
System I/O
System Management
Power Management
Module Pin-out - Required and Optional Features C-D Connector.
Module Pin-out - Required and Optional Features A-B Connector.
Connector Feature
COM Express Module Base
Specification Type 6
(No IDE or PCI, add DDI+ USB3) Min
/
Max
DFI KH960
Type 6
A-B
A-B Thermal Protection 0 / 1 1
A-B Battery Low Alarm 0 / 1 1
A-B Suspend/Wake Signals 0 / 3 2
A-B Power Button Support 1 / 1 1
A-B Power Good 1 / 1 1
A-B VCC_5V_SBY Contacts 4 / 4 4
A-B5Sleep Input 0 / 1 1
A-B5Lid Input 0 / 1 1
A-B5Fan Control Signals 0 / 2 1
A-B Trusted Platform Modules 0 / 1 1 (optional)
A-B
A-B VCC_12V Contacts 12 / 12 12
Table 3.3: Module Pin-out - Re
q
uired and O
p
tional Features C-D Connecto
r
Connector Feature
COM Express Module Base
Specification Type 6
(No IDE or PCI, add DDI+ USB3) Min
/
Max
DFI KH960
Type 6
C-D
PCI Express Lanes 16 - 31 0 / 16 16
PCI Express Graphics (PEG) 0 / 1 1
Muxed SDVO Channels 1 - 2 NA NA
PCI Express Lanes 6 - 15 0 / 2 2
PCI Bus - 32 Bit NA NA
PATA Port NA NA
LAN Ports 1 - 2 NA NA
DDIs 1 - 3 0 / 3 3 (DDI3 option)
USB 3.0 Ports 0 / 4 4
C-D
C-D VCC_12V Contacts 12 / 12 12
Power
C-D6
C-D6
Power Management
Power
System I/O
Connector Feature
COM Express Module Base
Specification Type 6
(No IDE or PCI, add DDI+ USB3) Min
/
Max
DFI KH960
Type 6
A-B
A-B Thermal Protection 0 / 1 1
A-B Battery Low Alarm 0 / 1 1
A-B Suspend/Wake Signals 0 / 3 2
A-B Power Button Support 1 / 1 1
A-B Power Good 1 / 1 1
A-B VCC_5V_SBY Contacts 4 / 4 4
A-B5Sleep Input 0 / 1 1
A-B5Lid Input 0 / 1 1
A-B5Fan Control Signals 0 / 2 1
A-B Trusted Platform Modules 0 / 1 1 (optional)
A-B
A-B VCC_12V Contacts 12 / 12 12
Table 3.3: Module Pin-out - Re
q
uired and O
p
tional Features C-D Connecto
r
Connector Feature
COM Express Module Base
Specification Type 6
(No IDE or PCI, add DDI+ USB3) Min
/
Max
DFI KH960
Type 6
C-D
PCI Express Lanes 16 - 31 0 / 16 16
PCI Express Graphics (PEG) 0 / 1 1
Muxed SDVO Channels 1 - 2 NA NA
PCI Express Lanes 6 - 15 0 / 2 2
PCI Bus - 32 Bit NA NA
PATA Port NA NA
LAN Ports 1 - 2 NA NA
DDIs 1 - 3 0 / 3 3 (DDI3 option)
USB 3.0 Ports 0 / 4 4
C-D
C-D VCC_12V Contacts 12 / 12 12
Power
C-D6
C-D6
Power Management
Power
System I/O

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Chapter 3
Chapter 3 - Hardware Installation
Board Layout
Top View
Bottom View
1
CPU fan
Standby
Power LED
BGA 1440
Xeon E3
Core™ i7/i5/i3
Intel
®
CPU fan
Standby Power LED
Intel
CM238/QM175/HM175
DDR4_1 SODIMM DDR4_2 SODIMM
Intel
I219LM
SPI Flash BIOS
Chrontel
CH7517A-BF
PTN3460BS
TPM
(optional)
COM Express connector
C110
D110
C1
D1
B110 B1
A110 A1
COM Express connector
iTE
IT8528E
Block Diagram
Mobile
Intel®CM238/QM175/HM175
Chipset
USB 3.0 4x
CORE
Processor
Graphics
CORE
Memory
Controller
A / B
7th Generation
Intel®Xeon® E3
Core™i7/i5/i3
DMI
CORE CORE CORE
DDI Port 1
PCIe (2 x1/1 x2)
C / D
DDR4 2400MHz
SODIMM
Channel A
DDR4 2400MHz
SODIMM
Channel B
DDI Port 2
EEPROM
SMBus
LPC Bus
8-bit DIO
WDT
I2C Bus
TPM 1.2
(optional)
Serial Port 0,1
Fan PWM/
TACH_IN
SLP/LID
TCA6408A
Embedded
Controller
IT8528E
SPI Flash
SPI Bus
SATA 3.0 4x
Intel®GLAN
I219LM
MDI PCIe x1
PCIe (4 x1/1 x4)
HDA
USB 2.0 8x
DDI Port 3 (optional)
PCIe x16 (PEG)
CH7517
VGA
PCIe (2 x1/1 x2)
eDP
PTN3460
LVDS
(optional)