DFI AL701 User manual

AL701
Qseven (Q7) Board
User’s Manual
A-550-M-2010
Preliminary
Version
Preliminary
Version
Copied from GH960

2User's Manual | AL701
Copyright
This publication contains information that is protected by copyright. No part of it may be repro-
duced in any form or by any means or used to make any transformation/adaptation without the
prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifi-
cally disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions or
changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2020. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the re-
ceiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for com-
pliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

3User's Manual | AL701
Table of Contents
Copyright........................................................................................................................................ 2
Trademarks....................................................................................................................................2
FCC and DOC Statement on Class B........................................................................................... 2
Notice:............................................................................................................................................2
About this Manual.........................................................................................................................4
Warranty ........................................................................................................................................ 4
Static Electricity Precautions ....................................................................................................... 4
Safety Measures ........................................................................................................................... 4
About the Package........................................................................................................................5
Optional Items............................................................................................................................... 5
Before Using the System Board................................................................................................... 5
Chapter 1 - Introduction................................................................................................................6
Specifications ......................................................................................................................... 6
Features .................................................................................................................................. 7
Chapter 2 - Hardware Installation................................................................................................8
Board Layout........................................................................................................................... 8
LED .......................................................................................................................................... 8
System Memory ..................................................................................................................... 9
Heat Sink................................................................................................................................. 9
Assembly ..............................................................................................................................10
I/O Connectors .....................................................................................................................11
MXM Connector.............................................................................................................11
Signal Descriptions ..............................................................................................................14
Pin Types........................................................................................................................14
PCI Express Interface Signals Descriptions................................................................14
UART Interface Signals .................................................................................................14
Gigabit Ethernet Signals................................................................................................15
Serial ATA Interface Signals .........................................................................................15
USB Interface Signals ..................................................................................................16
SDIO Interface Signals .................................................................................................17
High Definition Audio Signals/AC’97 ...........................................................................17
LVDS Flat Panel Signals................................................................................................17
DisplayPort Interface Signals .......................................................................................19
HDMI Interface Signals .................................................................................................19
LPC Interface Signals....................................................................................................20
SPI Interface Signals.....................................................................................................20
CAN Bus Interface Signals ...........................................................................................21
Power Control Signals...................................................................................................21
Power Management Signals.........................................................................................21
Miscellaneous Signals ..................................................................................................22
Manufacturing Signals ..................................................................................................22
Thermal Management Signals .....................................................................................23
Fan Control Implementation.........................................................................................23
Input Power Pins ...........................................................................................................23
Chapter 3 - Supported Software ................................................................................................24
Auto-run Menu......................................................................................................................24
Intel Chipset Software Installation Utility...........................................................................24
Intel HD Graphics Drivers ...................................................................................................25
Audio Drivers ........................................................................................................................26
Intel LAN Driver ...................................................................................................................27
Intel Serial IO Drivers ...........................................................................................................28
Intel Trusted Execution Engine Drivers...............................................................................29
Adobe Acrobat Reader 9.3 ..................................................................................................30

4User's Manual | AL701
About this Manual
This manual can be downloaded from the website, or acquired as an electronic file included in
the optional CD/DVD. The manual is subject to change and update without notice, and may be
based on editions that do not resemble your actual products. Please visit our website or con-
tact our sales representatives for the latest editions.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product,
inability to use the product, unauthorized replacement or alteration of components and
product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper in-
stallation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-
stances, attempt to perform service, adjustments or repairs on the product, whether in
or out of warranty. It must be returned to the purchase point, factory or authorized ser-
vice agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to
the product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you
are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, con-
tacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or
connectors by their ends.
Safety Measures
• To avoid damage to the system, use the correct AC input voltage range.
• To reduce the risk of electric shock, unplug the power cord before removing the sys-
tem chassis cover for installation or servicing. After installation or servicing, cover the
system chassis before plugging the power cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other
components. Perform the upgrade instruction procedures described at an ESD
workstation only. If such a station is not available, you can provide some ESD pro-
tection by wearing an antistatic wrist strap and attaching it to a metal part of the
system chassis. If a wrist strap is unavailable, establish and maintain contact with
the system chassis throughout any procedures requiring ESD protection.

5User's Manual | AL701
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One AL701 board
• One Heatsink
Optional Items
• Qseven Carrier Board
• Heat spreader
• Bracket
• Bulk Box
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
When installing the system board in a new system, you will need at least the following internal
components.
• Storage device such as hard disk drive, CD-ROM, etc.
• Power adaptor
External system peripherals may also be required for navigation and display, including at least
a keyboard, a mouse and a video display monitor.

6
Chapter 1
INTRODUCTION
User's Manual | AL701
Chapter 1 - Introduction
XSpecifications
The specifications listed here may be based on editions that do not
resemble your actual products. Please visit the download page at go.dfi.
com/AL701, or via the QR code to the right for the latest datasheet.
SYSTEM Processor Intel®Processors, BGA 1296
Atom®x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W
Atom®x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
Atom®x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5W
Pentium®Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6W
Celeron®Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
Memory 4GB/8GB LPDDR4 Memory Down
Dual Channel LPDDR4 3200MHz
BIOS AMI SPI 128Mbit (supports UEFI boot only)
GRAPHICS Controller Intel®HD Graphics Gen9LP Series
Feature OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H.265,
VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display 1 x DDI (HDMI/DVI/DP++)
1 x LVDS/(eDP+DDI) (DDI available upon request)
LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @
60Hz
HDMI: resolution up to 3840x2160 @ 30 Hz
DP++: resolution up to 4096x2160@60Hz
eDP: resolution up to 3840x2160 @ 60Hz
Dual/Triple
Display
LVDS + DDI (Dual)
eDP + DDI (Dual)
eDP+2DDI (Triple) (available upon request)
EXPANSION Interface 4 x PCIe x1 (Gen 2)
1 x SDIO (with LED)
1 x LPC
1 x I2C
1 x SMBus
1 x SPI
1 x UART (TX/RX)
AUDIO Interface HD Audio
ETHERNET Controller 1 x Intel®I211AT (10/100/1000Mbps) (0~60°C)
1 x Intel®I210IT (10/100/1000Mbps) (-40 to 85°C)
I/O USB 1 x USB 3.0 + 8 x USB 2.0
3 x USB 3.0 + 4 x USB 2.0 (option)
SATA 2 x SATA 3.0 (up to 6Gb/s)
eMMC Supports up to 32GB eMMC
eMMC 5.0, BGA-153 Ball 8~32G(MLC mode)
GPIO 1 x 4-bit GPIO
CAN Bus CAN Bus Function (only Linux support)
WATCHDOG
TIMER
Output &
Interval
System Reset, Programmable via Software from 1 to 255 Seconds
SECURITY FTPM Enables or Disables the BIOS support for the security device
POWER Type 5V, 5VSB, VCC_RTC
OS SUPPORT
(UEFI ONLY)
Windows 10 IoT Enterprise 64-bit
Linux (Intel graphic driver available)
ENVIRONMENT Temperature Operating: 0 to 60°C / -40 to 85°C
Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH
Storage: 5 to 90% RH
MECHANICAL Dimensions Qseven form factor: 70mm (2.76") x 70mm (2.76")
Compliance Qseven specification revision 2.1
CERTIFICATIONS CE, FCC Class B, RoHS

7
Chapter 1
INTRODUCTION
User's Manual | AL701
XFeatures
Qseven
Qseven (Q7) is a standardized form factor for a Computer-On-Module
with all the core components integrated on the module. It is mounted
on a carrier board designed for industry-specific applications and I/O
ports. A high-speed MXM connector with standardized pinout is re-
quired to carry signals between a Qseven module and its carrier board.
LPDDR4
LPDDR is a type of DDR SDRAM that operates at a lower power volt-
age and is commonly used in mobile devices as opposed to traditional
SDRAMs that are used in stationary devices and laptops. Each gen-
eration of LPDDR has doubled its prefetch size and increased its data
transfer rate, with LPDDR4’s prefetch size being 16 and data transfer
rate at 3200MHz.
Graphics
The integrated Intel®HD graphics engine delivers an excellent blend of
graphics performance and features to meet business needs. It provides
excellent video and 3D graphics with outstanding graphics responsive-
ness. These enhancements deliver the performance and compatibility
needed for today’s and tomorrow’s business applications. Supports 1 x
DDI (HDMI/DVI/ DP++) and 1 x LVDS/(eDP+optional DDI) interfaces for
display outputs.
Serial ATA
Serial ATA is a storage interface that is compliant with SATA 2.0a speci-
fication. With speed of up to 6Gb/s (SATA 3.0), it improves hard drive
performance faster than the standard parallel ATA whose data transfer
rate is 100MB/s.
Gigabit LAN
Intel®I211AT or I210IT Gigabit Ethernet controller supports up to 1Gbps
data transmission.
Watchdog Timer
The Watchdog Timer function allows your application to regularly
“clear” the system at the set time interval. If the system hangs or fails
to function, it will reset at the set time interval so that your system will
continue to operate.
The table below listes the Qseven standard specifications and the corresponding specifications supported by the
AL701 module.
System I/O Interface ARM/RISC Based
Minimum
X86 Based
Minimum
Maximum AL701 Maximum
PCI Express lanes 01 (x1 Link) 4 4
Serial ATA channels 0 0 2 2
USB 2.0 ports 3 4 8 8 x USB 2.0 + 1 x USB 3.0, or 4 x USB
2.0 + 3 x USB 3.0 (optional)
Note: USB2.0 Port 4-7 shared with
USB3.0 Port 0 and Port 2
USB 3.0 ports 0 0 3
LVDS channels 0 0 Dual Channel
24bits
1 (LVDS shared with eDP and DP++)
embedded DisplayPort 0 0 2 2 (eDP and DP++ )
(LVDS shared with eDP and DP++)
"DisplayPort, TMDS" 0 0 1 1 (DP++)
High Definition Audio
/ I2S
0 0 1 1
Ethernet 10/100/1000 0 0 1 (GbE) 1
UART 0 0 1 1
Low Pin Count bus 0 0 1 1
Secure Digital I/O 8-bit
for SD/MMC cards
0 0 1 1 (SD Card)
System Management
Bus
0 1 1 1
I2C Bus 1 1 1 1
SPI Bus 0 0 1 1
CAN Bus 0 0 1 0
Watchdog Trigger 1 1 1 1
Power Button 1 1 1 1
Power Good 1 1 1 1
Reset Button 1 1 1 1
LID Button 0 0 1 1
Sleep Button 0 0 1 1
Suspend To RAM (S3
mode)
0 0 1 1
Wake 0 0 1 1
Battery low alarm 0 0 1 1
Thermal control 0 0 1 1
FAN control 0 0 1 1

8
Chapter 2
HARDWARE INSTALLATION
User's Manual | AL701
Chapter 2 - Hardware Installation
XBoard Layout
Important:
When the Standby Power LED on the carrier board lights up, it indicates that there
is power on the system board. Power-off the PC then unplug the power cord prior
to installing any devices. Failure to do so will cause severe damage to the mother-
board and components.
XLED
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives,
add-in boards, and other components. Perform installation procedures at an ESD
workstation only. If such a station is not available, you can provide some ESD pro-
tection by wearing an antistatic wrist strap and attaching it to a metal part of the
system chassis. If a wrist strap is unavailable, establish and maintain contact with
the system chassis throughout any procedures requiring ESD protection.
CAN Bus LED
CANBus Status LED
SPI Flash BIOS
PTN3460
LPDDR4
iTE
IT8528VG
CAN MCU
LPDDR4
2
24
26
230
MXM Connector
1
229
23
25
MXM Connector
EMMC
Intel I211AT
or I210IT
LPDDR4
LPDDR4
Intel
Atom
E3900 Series
Bottom View
Top View

9
Chapter 2
HARDWARE INSTALLATION
User's Manual | AL701
• LPDDR4 3200MHz Memory Down
• Up to 4G or 8G Memory Down
• Dual channel memory interface
XSystem Memory XHeat Sink
Features
The system board supports the following memory interface.
Single Channel (SC)
Data will be accessed in chunks of 64 bits from the memory channels.
Dual Channel (DC)
Data will be accessed in chunks of 128 bits from the memory channels. Dual channel provides
better system performance because it doubles the data transfer rate.
Single Channel DIMMs are on the same channel. DIMMs in a channel can be identi-
cal or completely different. However, we highly recommend using
identical DIMMs. Not all slots need to be populated.
Dual Channel DIMMs of the same memory configuration are on different channels.
Top View of Heat Sink
Bottom View of Heat Sink
The metal interfaces at the bottom side of the heat sink are designed to directly contact the
chipset and passively absorb heat from them into the heat sink for heat dissipation. Additional
thermal adhesives can be applied to the metal interface to maximize contact area between the
interface and the chipset.
CPU metal interface
Memory metal interface
The heat sink is only included in certain standard package options. A heat spread-
er may be included instead.

10
Chapter 2
HARDWARE INSTALLATION
User's Manual | AL701
XAssembly
Note:
The carrier board is not included in the standard package and is typically custom-
ized.
Qseven Module Qseven Socket
Key
Bracket Screw Hole
Bracket MXM Connector
Bracket Screw Hole
Bracket Screw Hole
Bracket Screw Hole
Notch
Stand-off
Stand-off Screw Hole
Stand-off Screw Hole Stand-off
Qseven Module Qseven Socket
Key
Bracket Screw Hole
Bracket MXM Connector
Bracket Screw Hole
Bracket Screw Hole
Bracket Screw Hole
Notch
Stand-off
Stand-off Screw Hole
Stand-off Screw Hole Stand-off
Qseven Module Qseven Socket
Key
Bracket Screw Hole
Bracket MXM Connector
Bracket Screw Hole
Bracket Screw Hole
Bracket Screw Hole
Notch
Stand-off
Stand-off Screw Hole
Stand-off Screw Hole Stand-off
1. Locat the Q7 socket on the carrier board. The photo below is an example of a Q7 car-
rier board with the Q7 socket encircled.
2. Locat the MXM connector, stand-offs, and the brackt on the carrier board. Align the
module to the MXM connector by matching the notch and the key. The screw holes on
the module shall also align to the stand-offs and the screw holes on the carrier board.
3. Insert golden finger end of the Q7 module into the slot while making sure 1) the notch
and the key are aligned, and 2) the other end rises away from the bracket as indicated
by the dotted and solid lines. Press the card firmly into the socket while applying and
maintaining even pressure on both ends until a distinctive click sounds.
4. Press down the end of the module that is close to the bracket and away from the con-
nector.