DFI M8MP553 User manual

M8MP553
3.5" SBC Motherboard
User’s Manual
© February 10, 2023 DFI Inc.

2User's Manual | M8MP553
Copyright
This publication contains information that is protected by copyright. No part of it may be
reproduced in any form or by any means or used to make any transformation/adaptation
without the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes
no representations or warranties with respect to the contents or use of this manual and
specifically disclaims any express or implied warranties of merchantability or fitness for any
particular purpose. The user will assume the entire risk of the use or the results of the use of
this document. Further, the manufacturer reserves the right to revise this publication and make
changes to its contents at any time, without obligation to notify any person or entity of such
revisions or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2021. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur
in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

3User's Manual | M8MP553
Table of Contents
Chapter 1 - Introduction................................................................................................................6
Specifications ......................................................................................................................... 6
Block Diagram ........................................................................................................................8
Chapter 2 - Hardware Installation................................................................................................9
Board Layout...........................................................................................................................9
Installing the Heat Sink.................................................................................................10
Jumper Settings ...................................................................................................................11
Boot-CNFG (JP1) ...........................................................................................................11
LED Backlight (BLJP1) ..................................................................................................11
External I/O Ports.................................................................................................................12
9~36V DC-in (CN14) ....................................................................................................12
USB 2.0/3.1 & Micro USB (UBCN2 / UBCN1 & UBCN3).............................................13
LAN1 / LAN2 (ETCN1 / ETCN2)...................................................................................13
COM 3 (TSCN1) .............................................................................................................14
HDMI (DPCN1)...............................................................................................................14
uSD Slot (SDCN1)..........................................................................................................15
Internal I/O Connectors .......................................................................................................16
USB2_3/4 (UBJ1)...........................................................................................................16
Debug Port (COM2, J10)...............................................................................................16
Audio (AUJP1) ...............................................................................................................17
I2C (TPJP1) ....................................................................................................................17
DIO (IOJP1) ....................................................................................................................18
Front Panel (FPJP1) ......................................................................................................18
COM1 / COM4 (TSJP1).................................................................................................19
I2C / Touch (TPJ1) ........................................................................................................19
LCD Backlight (BLJ1) ....................................................................................................20
CAN1 & CAN2 (CBCN1 & CBCN2) ...............................................................................20
FAN (SFJ1)......................................................................................................................21
SPI (SPJP1)....................................................................................................................21
LCD LVDS (DPJ1)...........................................................................................................22
JTAG (J1) .......................................................................................................................23
Battery (BTJ1) ................................................................................................................23
Expansion Slots....................................................................................................................24
Installing the M.2 Module .............................................................................................24
Chapter 3 - Software User Guide...............................................................................................25
Flash Yocto Images to eMMC using UUU tool - V1.1 .......................................................25
Flash Yocto Images to SD using UUU tool - V1.1..............................................................28
Flash Android Images to eMMC/SD using UUU tool - V1.1 .............................................31
Software Feature..................................................................................................................34
General Support List......................................................................................................34
Linux AP/API Support List ............................................................................................34
Yocto Support List.........................................................................................................34
Android Support List .....................................................................................................35

4User's Manual | M8MP553
About this Manual
This manual can be downloaded from the website.
The manual is subject to change and update without notice, and may be based on editions
that do not resemble your actual products. Please visit our website or contact our sales
representatives for the latest editions.
Warranty
1. Warranty does not cover damages or failures that arise from misuse of the product,
inability to use the product, unauthorized replacement or alteration of components and
product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper
installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any
circumstances, attempt to perform service, adjustments or repairs on the product,
whether in or out of warranty. It must be returned to the purchase point, factory or
authorized service agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequential damages to
the product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in
handling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you
are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components,
contacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or
connectors by their ends.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other
components. Perform the upgrade instruction procedures described at an ESD
workstation only. If such a station is not available, you can provide some ESD
protection by wearing an antistatic wrist strap and attaching it to a metal part
of the system chassis. If a wrist strap is unavailable, establish and maintain
contact with the system chassis throughout any procedures requiring ESD
protection.
Safety Measures
• To avoid damage to the system, use the correct AC input voltage range.
• To reduce the risk of electric shock, unplug the power cord before removing the
system chassis cover for installation or servicing. After installation or servicing, cover
the system chassis before plugging the power cord.

5User's Manual | M8MP553
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• 1 M8MP553 board
• 1 Terminal block for RS485 (COM3) 342-361021-000G
• 1 Heatsink (Height: 21mm) A71-008168-000G
Note: The items are subject to change in the developing stage.
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
When installing the system board in a new system, you will need at least the following internal
components.
• Power adapter
External system peripherals may also be required for navigation and display, including at least a
keyboard, a mouse and a video display monitor.

6
Chapter 1
INTRODUCTION
User's Manual | M8MP553
Chapter 1 - Introduction
XSpecifications
System Processor i.MX 8M plus applications processors
MIMX8ML6CVNKZAB (Industrial), Quad 1.6GHz, VPU/ISP/CAN FD, -40~105°C
MIMX8ML3CVNKZAB (Industrial), Dual 1.6GHz, VPU/ML/ISP/CAN FD, -40~105°C
Memory 2GB/4GB/8GB LPDDR4 Memory Down
Graphics Controller GC7000UL
Feature HW Decode: 1080p60 H.265,H.264, VP9, VP8
HW Endcode: 1080p60 H.265,H.264
Display 1 x HDMI HDMI: resolution up to 1920x1080@60Hz
1 x LVDS LVDS: resolution up to 1920x1200 @60Hz
Dual Display LVDS + HDMI Android:support single output
Expension Interface 1 x M.2 B key 3052/2242 (USB 3.1 Gen2/USB 2.0)
1 x M.2 E key 2230 (PCIe x1/USB 2.0)
1 x Nano SIM slot
Audio Audio Codec Audio codec SGTL5000
Ethernet Phy AR8035
Rear I/O Ethernet 2 x GbE (RJ-45)
Serial 1 x RS485 (2-wire)
USB 2 x USB 3.1 Gen1
2 x USB 2.0
Display 1 x HDMI
Internal I/O Serial 1 x RS232
1 x RS232/422/485 (2.0mm pitch)
USB 2 x USB 2.0 (2.00mm pitch, the 2nd USB is shared with M.2 B-key by default)
1 x Micro USB 2.0 (Download mode)
Display 1 x LVDS LCD Panel connector
1 x LCD/Inverter Power
Audio 1 x Audio (Line-out/Mic-in)
SD 1 x uSD card
DIO 1 x 8-bit DIO
I2C1 x I2C / Touch
CANBus 2 x CAN bus 2.0b on Industrial CPU sku
Storage eMMC 1 x eMMC 5.1 with default 16GB (up to 64GB)
Watchdog Timer Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds
Power Type Wide Range 9~36VDC
Connector 2-pole terminal block (default)
Co-lay 4-pin vertical power connector
Consumption Typical: i.MX 8M Plus Quad, 12V, 3.6Watt
Max.: i.MX 8M Plus Quad, 12V, 5.28Watt
RTC Battery CR2032 Coin Cell

7
Chapter 1
INTRODUCTION
User's Manual | M8MP553
OS Support Microsoft/Linux Linux Yocto 3.0 (default)
Android 10
Environment Temperature Operating: -5 to 65°C, -30 to 80 °C Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH Storage: 5 to 90% RH
MTBF i.MX 8M Plus Quad (Industrial): 632,710 hrs @ 25°C; 386,370 hrs @ 45°C ; 252,204 hrs @ 60°C;
138,544 hrs @ 80°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanism Dimensions 3.5" SBC Form Factor 146mm (5.75") x 102mm (4.02")
Height PCB: 1.6mm
Top Side: 15mm
Bottom Side: 4mm
Standards and
Certifications Certifications CE, FCC, RoHS

8
Chapter 1
INTRODUCTION
User's Manual | M8MP553
XBlock Diagram

9
Chapter 2
HARDWARE INSTALLATION
User's Manual | M8MP553
Chapter 2 - Hardware Installation
XBoard Layout
Note:
Some components are optional and only available upon request.
Important:
Electrostatic discharge (ESD) can damage your board, processor,
disk drives, add-in boards, and other components. Perform
installation procedures at an ESD workstation only. If such a
station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part
of the system chassis. If a wrist strap is unavailable, establish
and maintain contact with the system chassis throughout any
procedures requiring ESD protection.
MADE IN TAIWAN
Line_out
Mic_in
LCD Invrter PWR
Case Open
CLEAR CMOS
Front Panel
M.2-B
M.2-E
DP/HDMI
eDP
BAT
SATA0
M2CN200_G3
DIO Power
COM1
DIO
M2.M
CPU_FAN
M2CN1_G4
M2CN1_G3
LVDS
M2CN100_G3
USB2_7/8
SPI
Buzzer
GLAN1
GLAN2
USB3_1/2
USB2_1/2
USB2_3/4
GLAN3
DC_IN_12V
SO-DIMM1
USB3_3/4
USB3_1/2
1
2
5
6
Boot-CNFG
M.2 E Key
USB 2.0
Download Mode
210
USB2_3/4
COM1/COM4
12
1112
12
5
6
1
BATTERY
1 2
11 12
1 2
9 10
12
5
6
Front Panel
Audio
DIO (5V)
LAN 1 HDMI
LAN 2
1
2
5
6
LED Backlight
1
2
5
6
USB2_1/2
JTAG
M.2 B Key
DC-IN
12
56
SPI (3.3V)
LCD LVDS
1
2
39
40
SIM
COM3
I2C
1
FAN 1
CAN2
CAN1
Debug(COM2)
uSD Card
I2C/Touch(3.3V)
11 1
11
DDR
LCD Backlight(5V/12V)
CPU
eMMC

CAN2
CAN1
Debug(COM2)
uSD Card
I2C/Touch(3.3V)
11 1
11
DDR
LCD Backlight(5V/12V)
CPU
eMMC
10
Chapter 2
HARDWARE INSTALLATION
User's Manual | M8MP553
Installing the Heat Sink
The CPU must be kept cool by using a heat sink, otherwise the CPU will overheat damaging
both the CPU and system board.
1. Before you install the fan / heat sink, you must apply a thermal paste onto the top of
the CPU. The thermal paste is usually supplied when you purchase the fan / heat sink
assembly. Do not spread the paste all over the surface. When you later place the heat
sink on top of the CPU, the compound will disperse evenly.
Some heat sinks come with a patch of pre-applied thermal paste. Do not apply thermal
paste if the fan / heat sink already has a patch of thermal paste on its underside. Peel
the strip that covers the paste before you place the fan / heat sink on top of the CPU.
2. Place the heat sink on top of the CPU. The 4 spring screws around the heat sink, which
are used to secure the heat sink onto the system board, must match the 4 mounting
holes around the board.
3. Screw tight two of the spring screws at opposite corners into the mounting holes. And
then proceed with the other two spring screws.
XCPU
Mounting holes
Mounting holes