DGC ZM-DGC900 User manual

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BGA Rework Station ZM-DGC900
SOFTWARE SOLUTIONS
Address: Office 12D Fuxin Building , 318 Fuhua Road , 558000, Shenzhen, China
Telephone: [phone] Fax：[phone]
Http : //www.dragongroupchina.com

Contents
A. Company Profile
B. BGA Rework Station
C. Installation
D. Safety Cautions
E. Introduction of Structure
F. Operation Steps
G. PLC (Programmable logic Controller）
H. Curve Program Controller
I. Related information
J. Tips for operation
Appendix: Packing list.
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A. Company Profile
DGC as quality control specialist in China started operations since 2007, with the Union of
intelligent human resources from China and Overseas, it has since then paved the way for Chinese
brand best products in outside markets, also promote and develop strategies for different products
according to languages and needs have been basic in DGC objectives. DGC now is involved
directly in the production of different lines for specific markets according to the conclusion of the
studies about each field, and the real needs for those.
Shenzhen Machine Co., Ltd. is located in one of the most prosperous parts—Xixiang, with
Shenzhen International Airport to its south and State Hwy. 107 as well as Shenzhen-Guangzhou
Superhighway to its north, enjoying convenient transportation.
Shenzhen Zhuomao Co., Ltd. aims to expand the market with advanced thinking and
pioneering philosophy; seizes the market with strong technical expertise; ensures the high quality of
the products with modern scientific management and mature advanced technology; and offers our
clients the best service with perfect sales network and high-quality staff.
We sincerely hope that our products will bring you more and more profits and wealth.
B. BGA Rework Station
1. Knowledge about BGA
BGA is short for Ball Grid Array. It is a kind of package method which use organic carrier in IC. It
has the following features:
Small①package area. Greater functions and more pins.②
Self③-centerize while PCB puddle welding, easy to put on tin. More reliable.④
Good conductivity and low overall cost.⑤
Memory which applies BGA can enlarge the memory capacity by 2 to 3 times
while the volume of memory remains the same. Compared with TSOP, BGA is much
smaller and better at radiating and conducting electricity.
2. Types and Features of BGA
a. Types
According to the encapsulation material, BGA can be classified into the following types:
(1)PBGA（Plastic BGA）
(2)CBGA（Ceramic BGA）
(3)CCBGA（Ceramic Column BGA）
(4)TBGA（Tape BGA）
(5)CSP (Chip Scale Package or MBGA)
b. Features
Compared with QFP, BGA has the following features:
(1) I/O terminal space is big (eg. 1.0mm, 1.27mm, 1.5mm), and it can accommodate
more I/O.
(2) More reliable package, low rate of welding defects and welding spot durable.
(3) Paraposition of QFP is usually observed with naked eyes. When the pin space is
smaller than 0.4mm, it is hard to paraposition and weld. While the pin space of
BGA is bigger, by applying the paraposition-amplification device, it is easy to
paraposition and weld.
(4) The welding coplanarity of BGA is better than QFP, because solder can make up
the flat error between BGA and PCB after melting.
(5)Good electrical property. The pins are small, the selfinductance and mutualinductance
of the conductivity is low, and the frequency characteristic is good.
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(6)The tension between solder points produces good self-centration effect in solder-
reflow, allowing 5% error of patch precision.
(7)Compatible with original SMT mount technology and machines. The original
screen printer machine, mounter and solder-reflow machine all can be used. The
comparison between BGA and QFP is shown in Table 1. The main defect of BGA is
the necessity of X-ray detection after welding.
c. Welding of BGA
The success of welding BGA is affected by the assembly of PCB. So 3 key
factors must be considered in the layout of PCB.
Features BGA QFP
Package size S/m2525 1600
Pin space L/mm 1.27 0.50
fault rate (×10-6/ pcs）0.60 100
(1)Thermal management
Thermal management must be considered when we design the assembly of PCB.
If many pieces of BGA gather on a small area of PCB, it will cause the imbalance of
PCB in the reflow oven. If many big pieces of BGA gather on a certain area of PCB,
longer heating period will damage some of the BGA. The areas with fewer
components have reached the welding temperature, while those areas with BGA are
still in low temperature. So the welding period is over before the flux paste
withdraws from the welding spots, thus there may be poor soldering or no-melting
of welding balls.
(2)Rabbet
The design of rabbet on PCB should stick to relevant standards strictly. Any
rabbet near BGA welding pad must cover the solder mask very well. If not, the extra
welding paste will flow from the welding pad to the rabbet, then leads to short
circuit between welding pad and rabbets nearby.
The geometric shape and diameter of welding pad:
The compactness of pins has immediate impact on the geometric shape and
diameter of welding pad. Similarly, BGA has different sizes, shapes and complexity.
As the package size decreases, the geometric shape and diameter of the welding pad
calls for higher precision in detection.
3. Inspection standards of BGA
For BGA assembled on PCB, inspection standard is a very important issue.
Before BGA is applied to the PCB, most BGA manufacturers don't use X-ray in
process of inspection. Instead, they employ some traditional methods to test PCB,
such as automatic optical inspection, man-eye inspection or on-line function test.
However, these methods can't detect the invisible problems very exactly, such as
poor soldering, cold welding and bridging. The X-ray can discover these problems
very efficiently. At the same time, it can do live monitoring, guarantee the quality,
and realize the in-time feedback of the process control,
a. Evaluation of X-ray
When BGA is first used on BGA, X-ray can evaluate the solder-reflow according
to the situation of un-solder area or areas around it. Open-circuit, non-touching and
other similar situations show the solder paste has not reflow enough. Bridging may
result from the fact that the temperature is too high for the solder to liquefy. So the
solder flows from the pad to the interval between them, causing short-circuit.
Poor welding should be evaluated objectively: it is not so terrible; the key
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point is that the welding spots can still be welded on the pad. The ideal situation is
no poor welding. Poor welding may be caused by pollution or the uneven
distribution of flux paste. What's more, warped PCB may also lead to poor welding.
Open-circuit welding spot may exist, too.
The quantity and size of poor welding are the key factors to decide whether it
will be accepted. Generally the size of single poor welding should be less than 50%
of the solder ball's diameter. If the ball is surrounded by reflow solder, BGA is able
to work. It is a very critical standard. The electrical properties may meet the
requirements but the mechanical strength will be affected.
PCB with BGA must use X-ray evaluation systems that can decern holes of less
than 100 µm diameter. The X-ray must be able to observe from top-down and tilt.
X-rays is a reliable guarantee of successful BGA welding,
b. Proposed inspection criteria
The inspection criteria will help X-ray inspection system confirm some typical
welding problems, which is related with the use of BGA device. It includes the
following factors:
(1)Poor welding
Poor welding results from the expansion of compounds in solder during the
heating of BGA. BGA with poor welding may cause some problems such as
ineffectiveness. The inspection criterias are as follows: the size of single poor
welding should be no more than 20% of the solder ball's diameter, with no single
poor welding on the surface; if many poor welding may exist, the total should be no
more than 20% of the solder ball's diameter.
(2)Desoldering spots
No desoldering spots.
(3)Bridging and short-circuit.
When there is extra solder or the solder is not put on the right place, bridging
and short-circuit may happen. So no bridging or short-circuit.
(4)None paraposition.
The X-ray image will show very clearly whether the BGA solder ball is aimed
at the welding pad on PCB.
(5)Broken circuit and cold welding
When solder don't touch the relevant pad or the solder doesn’t flow very well, there
will be broken circuit or cold welding. It is absolutely not allowed.
4. BGA rework process
Most of the semiconductor device’s heat-resistant temperatures are between
240°C and 600 °C. Therefore, the control of the temperature and uniformity are very
important to BGA rework systems. BGA rework process as follows:
a. Printed Circuit Board and BGA preheating
Printed Circuit Board and BGA’s preheating is meant to wipe off the moisture. If
the moisture was little, this step can be omitted.
b. Remove BGA
If the BGA will not be reused, and the PCB can endure high temperature, we can
use high temperature (shorter heating period) to remove it.
c. Clean the pad.
Pad cleaning is mainly clearing the solder paste and scaling powder remained on the
surface of PCB after BGA removal. For that process, it must use standard cleaning agent. To
ensure the reliability of the BGA solders, generally we cannot use the remained solder
paste in the pad, and we must clear away the used solder paste, except that solder balls reform on
the BGA. Because of the small size of BGA, especially CSP (or µBGA smaller), it is always
difficult to cleaning the pad, so when reworking CSP, it needs to use Rinse-free Flux if
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the space around CSP is very small.
d. Lay on BGA Flux Paste
Laying solder paste on the PCB has important influence on the result of BGA
Rework. It is convenient to lay solder paste on the PCB by selecting mould matched with
BGA. For CSP, there are three solder pastes for choice, including flux paste, clean-free and
water-soluble. If we choose the flux paste, the reflow time should be longer, if choose the clean-
free solder paste, reflux temperature should be lower.
(1) Mounting: The main purpose of mounting to make every BGA solder align to the PCB pad
with special equipment.
(2)Hot air reflow: Hot air reflow soldering is the key to the whole BGA Rework.
①The curve of reflow soldering of BGA Rework should be similar with the original soldering
one. Hot air reflow soldering curve can be divided into four zones, including preheat zone, heating
zone, recirculation zone and cooling area. These four zones’ temperature and time parameter can be
set respectively, when it connects with the computer, these programs can be saved and transferred at
any moment.
②In reflow soldering process, we must choose the right heating temperature and time of different
zones; at the same time, we should notice the heating speed. Commonly, the maximal heating rate
is not more than 6℃/s before 100℃, and the maximal heating rate is not more than 3℃/s
after 100℃. In the cooling zone, the maximal cooling rate is not more than 6℃/s, because
both of the exorbitant heating rate and cooling rate may cause damage to PCB and BGA,
which sometimes cannot be observed by unaided eyes. For different BGA and
different solder pastes, we should choose different heating temperature and time. For example,
reflux temperature of CBGA BGA should be higher than that of PBGA…choose the
higher reflux temperature. For no clean solder paste, its activity is lower than non-no clean solder
paste, so the soldering temperature should not be too high, and the soldering time should not be too
long, so as to prevent the oxidation of solder particle.
③In hot air reflow soldering, the bottom of PCB board should be heated. There are two
purposes for this kind of heating. First, avoid the warping and deformation in one-side
heated PCB board; second, shorten the time of the solder paste melting. For the dimension pad
of BGA rework, this kind of heating on the bottom of PCB is especially important. There are
two ways of heating on the bottom of BGA rework equipment. One of them is hot air heating,
and the other is infrared ray heating. The advantage of hot air heating is the homogeneous heating,
which common Rework Techniques suggest to adopt this way of heating. What opposite with it is
the disadvantage of infrared ray’s inhomogeneous heating.
④We should choose the right hot air reflux suction nozzle. The hot air reflux nozzle is non-
contact heating, which depend on the high temperature air current make every solder of joint on
BGA melt synchronously. For that reason, it ensures the steady temperature circumstance in the
whole of reflux process, and it protects the adjacent parts from damaging by the convective hot air’s
regeneration.
C. Installation
1. Place
In order to ensure the validity of BGA Rework Station, the installation should meet the following
requirements.
a. Away from inflammable and explosives;
b. Away from water and other liquids;
c. Ventilated, dry place;
d. Stable and flat, free from tremor.
e. Less dust;
f. No heavy objects on the controlling box;
g. Not affected by airflow of air conditioner, heater or ventilator.
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h. Leave a space of 30cm or more behind the rework station for the upper part to move and rotate.
2. Power supply:
a. Use a power supply with little fluctuations in voltage.
b. Fluctuation: 220V±10
c. Frequency fluctuation: 50Hz±3
D. Safety Cautions
1. Don't blow to the rework station directly when it is working, or there will be a negative
difference from the surface of the heating board, thus some parts will be burnt out.
2. After it is started, the high temperature area should not touch any objects, or it will lead to a fire
or explosion. The PCB and other parts should be put on the PCB bracket.
3. No vibration. Handle it gently.
4. Don't touch the heaters with your hands when it is working, or you will get hurt.
5. Don't use combustible spray, liquefied and flammable gas near the rework station after it is
started.
6. Don't try to re-equip the machine, or there may be a fire or an electric shock.
7. There are high-pressure parts in the circuit box. Don't disassemble it.
8. If some metals fall in the rework station when it is working, turn off the power immediately.
After it is cooled down, get the metal out, and clean the machine. If not, there may a smell when the
machine starts working next time.
9. When the rework station's temperature rises abnormally or smokes, turn off the power and
inform the service technicians to repair it. Turn off the power of the circuit box and the the machine
while moving the rework station. Hold the plug when we remove the wire, or it will lead to a poor
contact then the machine can't work very well.
10. Turn off the power when stop using it.
11. Don't put the rework station on the wires, or there may be a failure, a fire, or an electric shock.
12. Before you use the machine, you must read the instructions attentively.
Note: when the machine works, it will produce some smell. So ensure the comfortable, healthy and
safe operation environment, please keep the air in circulation.
E. Introduction of Structure
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01 上部加热Y轴调节手柄
02 上部加热Z轴调节手柄
03 发热器组
04 发热器射灯
05 下部测温器
07 下部发热器板
09 上部温控器
11 下部温控器
12 冷却开关
13 启动
14 停止
08 横流风扇
10 电脑连接口
06 PCB托板
Introduction of host labels：
1. Top heater temp control 2. Bottom heater temp control
3. Top breeze adjust 4. IR Light Beam
5. Running show 6. Stop
7. Cooling AUTO/HAND 8. Power
9. Heat box 10. PCB fixer
11. Heater
Specification:
1．Total power：3.2 KW
2．Top heater：0.8 KW
3．Bottom heater：2.4KW
4．Power supply ：220V±10 50Hz±3
5．Dimension ：450×400×580mm
6．Temperature control ：K sensor
7．Positioning: V-groove for PCB positioning
Max PCB size: 280×320mm mm
8．Weight ：20kg
Features:
1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control BGA
desoldering & soldering procedures precisely.
2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature
segments and 8 constant temperature segments to control. It can save 10 groups of temperature
curves at the same time.
3. Choose imported high-precision thermocouple to detect the top/bottom temperature precisely.
4. Top & bottom heating can be controlled independently by the temperature graphs. A cross-flow
fan cools rapidly to protect the PCB from deformation when welding.

5. This machine can be connected to a computer to be controlled more conveniently with a built-in
PC serial port and a proprietary software attached to it.
6. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a
vacuum suction pen to facilitate the removing of BGA after desoldering.
7. For large thermal capacity of PCB or other high-temperature and lead-free welding requirements,
all can be handled easily.
F. Operation Steps
1. Preheating
Preheat the BGA and PCB before repairing. The temperature in thermostat is usually set at
80℃-100℃,time 12-24 hours, to remove the moisture in PCB and BGA, and prevent burst when
heating.
2.Desoldering
Put PCB on the positioning bracket, choose the appropriate hot-air reflow nozzle, set the right
soldering temperature curve, and press the START button. After the procedure is over, move the
hot-air nozzle away by hand, and use the vacuum suction pen to remove BGA.
3.Clean the soldering pad.
There are mainly 2 ways: one is use suction line to make it flat, the other is use the soldering
iron to remove the dregs directly. It is better to remove the dregs soon after the desoldering of BGA,
for the BGA has not cooled down, and the damage caused by temperature difference is less.To use
some flux paste when cleaning the pad can increase the solder activity and achieve better cleaning
effect. Be careful to not to destroy PCB pad! Try to use some volatile solvents.
4.Reballing
Lay the BGA Flux Paste on the BGA pad evenly with a brush. Choose corresponding steel net,
and plant the soldering ball on the BGA pad with a BGA Reball Kit.
5.Soldering
Put the BGA on the bottom heating area of BGA Rework Station, and solder the balls on the
pad.
6.Lay on Flux paste
Lay the BGA Flux Paste on the BGA pad evenly with a brush, no more, no less.
7.Mounting
Mount the BGA on the right place of PCB. When we place in by hand, we can make use of the
silk screen borders. We can touch the surface of the pad and the balls to know whether it is placed
in the right area.
8.Soldering
Put PCB with new-mounted BGA on the positioning bracket, move the hot-air nozzle to the
right place, choose the appropriate hot-air reflow nozzle, set the right soldering temperature curve,
and press the START button. After the procedure is over, turn on the cooling fan to cool down BGA
for 30-40 seconds, and elevate the upper hot-air nozzle to be 8-10mm away from the surface of
BGA. Or move away the hot-air nozzle after the START light is off, then remove PCB from the
heating area.
G. PLC (Programmable Logic Controller）
1.Top/bottom PLC
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a. Panel introduction Model: PC410 sectional type temperature controller
12
3
4
5
6
78 9 10 11
Set Procedure
first turn on the switch
1) the NO. Of the group set
Choose the position to keep the temperature(can keep 10 groups temperature
graphs)
Press the PTN to set the NO. Of group from one of (1,2,3,4,5,..0) and the
temperature graphs,(choose NO.X from ten groups,take NO.1 group as an example)
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
2) Preheating section: slope(r)set
Press SET, enter the temperature parameter set part,r1 means slope(the
raised temperature per second )
3.00 means 3 Celsius/second, press the UP/DOWN to adjust. Press the PAR
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to enter the next step.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
r1
3.00
3)Preheating section: temperature(L)set
Press the UP/DOWN to increase/decrease, 160 means the preheating
temperature is 160℃,Press the PAR to enter the next step.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
L1
160.00
4)Preheating section:time (d)set
Press the UP/DOWN to increase/decrease, it means up to 160 ℃ , constant
temperature lasts 30 seconds. Press the PAR to enter the next step.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
d1
30
5)Enter the second section :heatingup speed set, press UP/DOWN to
modify.Press the PAR to define.
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DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
r2
3.00
6)Enter the second section: heatingup temperature set, press UP/DOWN to
modify.Press the PAR to define.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
L2
185
7)Enter the second section :constant temperature time set, press UP/DOWN to
modify.Press the PAR to define.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
d2
30
8)Enter the third section :heatingup speed set, press UP/DOWN to
modify.Press the PAR to define.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
r3
3.00
12

9)Enter the third section:constant temperature set, press UP/DOWN to
modify.Press the PAR to define.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
L3
210
10)Enter the third section:constant temperature time set, press UP/DOWN to
modify.Press the PAR to define.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
d3
30
11)Enter the fourth section:welding set, press UP/DOWN to modify.Press the
PAR to define.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
r4
3.00
12)Enter the fourth section:preheating constant temperature set, press
UP/DOWN to modify.Press the PAR to define.
13

DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
L4
225
13)Enter the fourth section:constant temperature time set, press UP/DOWN
to modify.Press the PAR to define.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
d4
35
14)Enter the fifth section: heating up speed set, press UP/DOWN to modify.
Press the PAR to define.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
r5
3.00
15) Enter the fifth section: preheating constant temperature set,
press UP/DOWN to modify. Press the PAR to define.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
L5
230
14

(16)Enter the fifth section: constant temperature time set, press UP/DOWN to
modify. Press the PAR to define.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
d5
25
(17)Graphs set finish, press the DOWN, then it will show END means close.
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
r8
End
(Remarks: if you need to increase the temperature then press the UP to open.)
(18)Set finished then it will show the following picture.(The function is
the highest temperature limit, and forbid modifying.)
DISP
SELE
SET
PROG
RUN
PROG
PTN PAR
SET
HAND
AUTO
PV
SV
PC410
PTN STEP
PRO
RUN
OUT1 OUT2
SV AL1
MAN
MV
TIME COM
ALTEC
1
Hb
300
Bottom temperature set: the specification of the upper temperature control and the bottom
one should be unanimous. The method of the temperature set is the same as the top one.(no
introduction again)
15

16
b. Panel display
When we turn on the meter, the upper screen displays the basic model, the lower shows the
version of the software (for the customized meter, the customer should pay special attention to the
software version, to facilitate future order).
Three seconds after, the upper screen displays measurements (PV), the lower screen displays
settings (SV).
The meter has two rows of LED, the upper one is used to display the measurements (PV) and
various codes of parameters ;the lower one is mainly used to display setting value (SV), the output
value (MV) or the remained time of running(TIME) and various parameters. When press the DISP
SELECT button, the lower screen will show the items in the SV, MV, TIME order. When the meter
is set as curve process controller (ctrl set to prog), TIME shows the remaining time of certain
period of procedures. While the meter is set to constant temperature controller, TIME shows cent
code. In some special type of instrument, TIME shows the second group measured value or special
meaning of input signals.
On the panel of the meter, there are two digital tubes display window: PTN and STEP, and four
indicative lights: PROFILE, RUN etc.. These two digital tubes and four indicative lights are used to
indicate the operation states of these curves. When the meter is set to curve procedures controller
(ctrl set to prog), PTN is the display window of the No. of curve procedure. By pressing PTN
button, we can select the curve which needs to run or be modified. When the curve is running, RUN
blinks, STEP window shows the No. of the running curve. When running on the slopes of the
increase, the indicator "/" is on. When running on the platform, indicator "-" is on. While running
on the slope of decline, indicator "\" is on.

When the meter is set to constant temperature controller, the two display windows: PTN and
STEP, PROFILE, RUN, these four lights were off.
OUT1 is used to indicate the working state of output 1. It is on when there is output.
OUT2 is used to indicate the working state of output 2, It is on when there is output.
SV lights: when the lower screen shows setting value, SV is on.
MV lights: when the lower screen shows the output value, MV is on.
TIME lights: the lower screen shows the remained time of the operating procedures, TIME is
on.
AL1 is used to indicate the working state of emergency. When the AL1 is in the state of alarm,
the lights lit.
MAN is used to indicate the state of manual work. When working in manually state, MAN is on.
COM is used to indicate the state of communication. When the meter sends data, COM is on.
AT is used to indicate the PID state. When the meter is in the state of PID, AT is on.
OP3 is used to indicate the state of output 3, or used as special indicator in certain model.
c. Button operation
The meter have eight buttons, in which PTN, RUN/ PROG and SET/ PROG these three buttons
are dedicated to a number of the setting of curve program parameters. When the meter is set to
curve process controller (ctrl set to prog), PTN is used to set the number of curve program.
SET/PROG is used to set operating parameters; RUN/PROG is used to start the program. When the
equipment is set to constant temperature controller, RUN/ PROG, SET/ PROG are not working.
DISP / SELECT is the switch button. When we press DISP/ SELECT button, the lower screen
shows settings value, the output value or the remained time of operation, the corresponding
indicator SV, MV, TIME are on.
AUTO / HAND is the automatic / manual switch button. When switch to manual output, MAN is
on
PAR is parameters setting button. ▲means value increase. ▼means value decrease.
(1) settings modifying
When the meter is in a state of display, the upper screen shows actual measured value. When you
use DISP / SELECT button to select the setting value of the lower screen (SV light is on), by
pressing ▲or ▼, you can modify settings.
The scope of setting value is from the minimum settings (code for the SPL) to the maximum
settings (code for the SPH).
When the equipment is set to curve program controller (ctrl set to prog), for example, in
running state, settings can not be modified.
(2) AUTO/HAND switch without interference
Press the AUTO / HAND button, then it can realize two-way switch without interference.
When working in manual control, the manual control indicator (MAN) is on. When we use DISP
/ SELECT button to select output power value in lower screen (MV is on), by pressing ▲or ▼, you
can modify the value of manual dynamic output.
The maximum value of power output is the limit value for the output power (code for HPL)
If we set AUTO/HAND switch parameter (code for AH) at Auto, AUTO/HAND switch is
forbidden.
No
.
parameter code Parameter name adjusting range explanation
If we set AUTO/HAND switch parameter (code for AH) as Hand, AUTO/HAND can be switched
without interference.
(3 ) Adjusting parameters and modifying
When the meter is in a state of measurement (PV) display, pressing PAR button for three
seconds, the meter will enter the state of parameters modifying; the upper screen shows the first
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parameter code; the lower screen shows the value of the parameters. Then press ▲or ▼button to
modify the value of the parameter. When finished, press the button PAR, meters will show next
code and the value of the parameters in order. Revised data will be saved in the memory of the
instrument.
After showing the last parameter or no operation in 16 seconds, the instrument will return to the
measured value (PV) display state.
（4）Code and meaning of regulation parameter
d. PID self-setting
Before the meter starts working, the best PID adjust parameters should be set, then the control
precision can be ensured.
Theoretically, systems on different settings have different ideal PID parameters. Therefore,
before start the PID self-setting, you should set the SV to the exact parameter that the user needs.
When the meter stay in the state of auto-control, set the PID self-setting ( the code is tunE)to
ON, then the PID self-setting works, and AT lamp is on.
In the PID self-setting process, when the self-setting is set to OFF, the process will stop. At the
same time, the top heater's position is being adjusted, so the measured value is not vibrating. After
1.5 periods of vibration, the PID self-setting is completed. Then the AT lamp is off. The meter can
calculate the best PID parameter and save it in the meter according to the vibration period and
amplitude.
If the system can't give vibrate response during the PID self-setting, the PID self-setting can't
finish successfully. As different systems have different response periods, the time of PID self-
setting ranges from several seconds to several hours. The time is affected by the system, not the
meter.
Order Parameter
code
parameter Adjustment range Note
1 C F Measurement
unit
Celsius or Fahrenheit
2 Prog Curve procedure
control
ldLE / Run / Hold Stop / Start / Pause
3 SP Basic settings SPH-SPL
4 TunE PID self-setting OFF
ON
Stop PID
Start PID
5 AU First alarming
value
Input signal range
6 AL2 Second alarming
value
Input signal range
7 HyS1 First alarming D-
value
1～300℃Optional function
8 HyS2 Second alarming
D-value
1～300℃Optional function
9 ProP Heating
proposition area
1～2000℃
10 Intt Integral time OFF，1～8000 s No display when Ctrl is set at
ON/OFF
11 dEr とDifferential time OFF，1～999 s No display when Ctrl is set at
ON/OFF
12 rElc Cooling coefi 0.1～10.0 Display when heating/cooling
13 Db Static area
coefficient
0.1～10.0 Display when heating/cooling
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Don't change the settings during PID self-setting, because one change leads to one restart, then
PID time is prolonged.
When we use meters with the function of curve procedure control, we should stop the curve
procedures first, set the PID self-setting according to the above steps, then start the curve procedure
control.
If we only choose PID self-setting, please set the differential time to OFF so that it is not
changed when the meter is in the process of PID self-setting. In the system that doesn't allow output
signals change frequently, we should choose PID self-setting.
e. Problems display
When the input sensor breaks or the input signals exceed the max range, the upper screen will
show the fault code snb; when the sensor short-circuits, or the input signals is less than the min
range, the upper screen will show the fault code ur.
In general, the meter works in the state of auto-control. When the meter shows Snb or ur, it
shifts to start working very soon, outputting powers. Then, the power can be controlled by button
▲and ▼,at the same time, the MAN lamp flickers. Once the problem is solved, the meter will
return to the state of auto-control.
f. Software configuration (code and meaning of function parameters)
Set the configuration password as 808 (the parameter code Loc), when the meter shows PV,
press button PAR and ▲for 3 seconds to enter the menu of software configuration. The upper
screen shows code of the first parameter, and then we can modify the parameter value in the state of
IdLE. After the modification, press PAR again, then the code and value of the next parameter. In the
meantime, the modified data is saved in the memory.
If no operation within 16 seconds after display of the last parameter, the meter returns to the
state of PV.
After the configuration, we should set the password as some other numbers besides 808, to
protect the data from unconsciously modification of the operator.
g. Code and meaning of function parameters:
14 Hc とHeating period 0.1～240.0 s No display when Ctrl is set at
ON/OFF
15 cc とCooling period 0.1～240.0 s Display when heating/cooling
16 Loc Configuration
password
0～9999
Order Code Parameter Range of
adjustment
Note
1 SPH MAX Measuring range
of input signals
350
2 SPL MIN Measuring range
of input signals
0
3 HPL Maximum output 0.0～100.0 100
4 Snbp Breakdown output
0.0～100.0 0
5 DFS とInput error
correction
-19.99～99.99
6 C—F Measuring unit c（Celsius）
F（Fahrenheit）
No display when Sn is of liner-
input
19

7 Sn Output signals JとC
[R とC
EとC
rとc
sとc
bとc
とと c
rとd
cu
cu
L1n
L1m
PrE
PrE
J Sensor
K Sensor
E Sensor
R Sensor
S Sensor
B Sensor
T Sensor
Pt100 platinum resistor
Pt100 platinum resistor (with
decimal)
Cu50 copper resistor
Cu50 copper resistor (with
decimal)
Linear input
Linear input (with decimal)
Distant transmission pressure
resistance signal
Distant transmission pressure
resistance signal(with decimal)
8 Rddr Local address 0--99
9 bRud Communication
baud rate
600 1200
2400 4800
9600 19.2KB
10 Ctrl Regulation On.of
PLd
rSP
Prog
Switch（ON/OFF）
PID
Heating speed control
Curve procedure control
11 SPll Heating speed 0.01～99.99 When the screen shows rSP（℃/min）
12 Op1 Main output とP
0-20
4-20
Output of time proportion
0-20mA output
4-20mA output
13 OP1 Second output
(cooling)
FRn
olL
H20
0.05
Wind cooling
Oil cooling
Water cooling
Compressor cooling
20