Diamond Systems STEVIE User manual

STEVIE™
Carrier for NVIDIA®AGX Xavier Module
USER MANUAL
Revision No
Release Date
Comments
1.01
08/05/2019
Initial Release
1.02
02/25/2020
Major Feature Updates. Added Section: Getting Started
1.03
03/27/2020
Added Addendum
© Copyright 2020
Diamond Systems Corporation
www.diamondsystems.com
FOR TECHNICAL SUPPORT
PLEASE CONTACT:
Email: [e-mail]

Stevie User Manual Rev 1.03 www.diamondsystems.com Page 2
Contents
1Important Safe Handling Information .............................................................................................................4
2Introduction.......................................................................................................................................................6
2.1 Stevie Baseboard Overview..........................................................................................................................6
2.2 AGX Xavier Modules Overview.....................................................................................................................7
3Functional Overview.........................................................................................................................................9
3.1 Processor Modules........................................................................................................................................9
3.2 Power Supply Specifications .........................................................................................................................9
3.3 Backup Battery ..............................................................................................................................................9
3.4 Ethernet Ports................................................................................................................................................9
3.5 Display Controller ....................................................................................................................................... 10
3.6 Camera Serial Interface (CSI).................................................................................................................... 10
3.7 Audio Interface............................................................................................................................................ 10
3.8 Serial Ports................................................................................................................................................. 10
3.9 PCIe/USB 3.1/UFS Link Routing Controllers ............................................................................................. 11
3.10 PCIe MiniCard Socket ................................................................................................................................ 12
3.11 USB Ports................................................................................................................................................... 12
3.12 PCIe M.2 Socket......................................................................................................................................... 12
3.13 UFS and Micro SD Socket.......................................................................................................................... 12
3.14 Data Acquisition (DAQ) I/O Interface.......................................................................................................... 12
3.15 Controller Area Network (CAN) Interface................................................................................................... 13
3.16 Utility Header Connector ............................................................................................................................ 13
3.17 LED Indicators............................................................................................................................................ 13
4Functional Block Diagram ............................................................................................................................ 14
4.1 Stevie Baseboard Block Diagram............................................................................................................... 14
4.2 AGX Xavier Series Module Block Diagram ................................................................................................ 15
5Mechanical Drawing ...................................................................................................................................... 16
6Connector and Jumper Location ................................................................................................................. 18
7I/O Connectors, Jumpers and LED Specifications..................................................................................... 20
8Connector Pinout Specifications ................................................................................................................. 21
8.1 Power IN Connector: J20 ........................................................................................................................... 21
8.2 RTC Battery Connector: J21 ...................................................................................................................... 21
8.3 Ethernet Connector: J6............................................................................................................................... 22
8.4 USB 3.0 Ports: J7....................................................................................................................................... 22
8.5 Audio Connector: J11................................................................................................................................. 23
8.6 HDMI Connectors: J16, J17 ....................................................................................................................... 23
8.7 USB 2.0 Connector: J19............................................................................................................................. 24
8.8 Camera Expansion Connector: J10............................................................................................................ 25
8.9 Serial Port Connectors: J4, J5.................................................................................................................... 26
8.10 PCIe MiniCard Connector: J13................................................................................................................... 27
8.11 M.2 PCIe SSD Socket (M-KEY) Connector: J12........................................................................................ 28
8.12 Data Acquisition (DAQ) Connector: J15..................................................................................................... 29
8.13 Utility Connector: J2 ................................................................................................................................... 29
8.14 CAN Connectors: J8, J9............................................................................................................................. 30
8.15 UFS Interface Connector: J3...................................................................................................................... 30
9I/O Connector List.......................................................................................................................................... 31
9.1 I/O Cables................................................................................................................................................... 31
10 Jetson Xavier B2B Connector Interface...................................................................................................... 32

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11 Jumper Description ....................................................................................................................................... 34
11.1 Serial Termination and USB Mode Selection JP1...................................................................................... 34
11.2 Debug UART (J24)..................................................................................................................................... 35
11.3 MiniCard USB Selection (J18).................................................................................................................... 35
12 Getting Started............................................................................................................................................... 36
12.1 Flashing Operating System to the AGX Xavier Series Module.................................................................. 36
13 Data Acquisition (DAQ) SubSystem ............................................................................................................ 39
13.1 SAM Data Acquisition Circuit...................................................................................................................... 39
13.2 Analog Inputs.............................................................................................................................................. 39
13.3 Analog Outputs........................................................................................................................................... 42
13.4 Digital I/O Operations ................................................................................................................................. 43
13.5 Miscellaneous Functions ............................................................................................................................ 43
14 Specifications................................................................................................................................................. 45
15 Addendum ...................................................................................................................................................... 46
15.1 Camera Installation Procedures................................................................................................................. 46
15.2 Serial Multiprotocol Configuration............................................................................................................... 48
15.3 CAN Controller Configuration..................................................................................................................... 50
16 Third-Party Product Guidelines.................................................................................................................... 51
16.1 Board Design Considerations..................................................................................................................... 51
16.2 Labeling Guidelines.................................................................................................................................... 51
17 Limited Warranty Policy................................................................................................................................ 53

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1 IMPORTANT SAFE HANDLING INFORMATION
WARNING!
ESD-Sensitive Electronic Equipment
Observe ESD-safe handling procedures when working with this product.
Always use this product in a properly grounded work area and wear
appropriate ESD-preventive clothing and/or accessories.
Always store this product in ESD-protective packaging when not in use.
Safe Handling Precautions
Diamond Systems boards are designed with complex circuitry and electronic components that are ESD-
sensitive. This increases the likelihood of the boards incurring accidental damage during handling, installation,
and connection to other equipment.
It is highly recommended that the following precautionary measures and best practices be observed in
sequential order:
Wear an anti-static Wristband/Strap or/and an antistatic Lab Coat or/and Rubber-soled shoes.
Spread anti-static mats over the table or work surface or/and anti-static mats on the floor.
Unpack components and remove them from their anti-static bags only when they are ready to be
used.
Avoid ungrounded surfaces such as plastic, carpets, floors, or tables, in the work area.
Handle boards by the edges and their metal mounting brackets. Avoid touching components on the
boards and the edge connectors that connect to expansion slots.
The following information describes common causes of failure found on boards and components returned to
Diamond Systems for repair. It is provided as a guideline to avoid accidental damage.
ESD Damage: This type of damage is typically impossible to detect because there is no visual sign of failure
or damage. In this type of damage, the board eventually stops functioning because of some defective
components. Usually, the failure can be identified and the chip can be replaced.
To prevent ESD damage, always follow proper ESD-prevention practices when handling computer boards.
Damage During Handling or Storage: Physical damage on boards also occur due to mishandling. A common
observation is that of a screwdriver slipping on the board during installation, causing a gouge on the PCB
surface, cutting signal traces or damaging components.
Another common observation is damaged board corners, indicating the board was dropped. This may or may
not cause damage to the circuitry, depending on components located near the edges. Most Diamond System
boards are designed with a minimum 25 mils clearance between the board edge and component pad. The
ground/power planes are located a minimum of 20 mils from the edge to avoid possible shorting from this type
of damage. However, these design rules do not prevent damage in all situations.
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for
board manufacturers. Though Diamond Systems boards are resilient to damages, the components located
close to the board edges can be damaged or even knocked off the board if the board lies tilted in the rack.
Diamond Systems recommends that all its boards be stored only in individual ESD-safe packaging units. If
multiple boards are stored together, they should be contained in bins with dividers placed between the boards.
Do not pile boards on top of each other or cram too many boards within a small location. This can cause
damage to connector pins or fragile components.

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Damage During Installation in a PC/104 Stack: Damage on boards can also occur while installing the board
in a PC/104 Stack A common cause of damage occurs when the connector pins are misaligned with their
corresponding interfaces on the stack.
For example, during installation, if a PC/104 board pin-mapping is misaligned/shifted by 1 row or 1 column, it
can cause the 12V power and ground signal lines on the bus to contact the wrong pins on the board and
damage components linked to the data bus lines.
Bent Connector Pins: This type of problem can be resolved by re-bending the pins to their original shape
using needle-nose pliers.
The most common cause of a bent connector pin is when the board is pulled off a stack by tugging it at angles
from one end of the connector to the other, in an effort to release it off the stack. Tugging the board off the
stack in this manner can bend the pin(s) significantly.
A similar situation can occur when pulling a ribbon cable off a pin header. If the pins are bent too severely,
bending them back can cause them to weaken or break. In this case, the connector must be replaced.
Power Damages: There are various causes of power-specific damages that can occur while handling the
board. Some common causes such as –a metal screwdriver tip slipping, or a screw dropping onto the board
while it is powered-up, causes a short between a power pin and a signal pin on a component.
These faults can cause over-voltage/power supply problems besides other causes described below.
To avoid such damages, assembly operations must be performed when the system is powered off.
Power Supply Wired Backwards: Diamond Systems power supplies and boards are not designed to
withstand a reverse power supply connection. This will destroy almost all ICs connected to the power supply.
In this case, the board will likely be irreparable and must be replaced. A chip destroyed by reverse or excessive
power will often have a visible hole or show some deformation on the surface due to vaporization inside the
package.
Overvoltage on Analog Input: If a voltage applied to an analog input exceeds the power specification of the
board, the input multiplexer and/or parts behind it can be damaged. Most Diamond Systems boards will
withstand an erroneous connection of up to 36V on the analog inputs, even when the board is powered off,
but not on all boards, and not under all conditions.
Overvoltage on Analog Output: If an Analog output is accidentally connected to another output signal or a
power supply voltage, the output can be damaged. On most Diamond boards, a short circuit to ground on an
analog output will deter any damage to the board.
Overvoltage on Digital I/O Line: If a Digital I/O signal is connected to a voltage above the maximum specified
voltage, the digital circuitry can be damaged. The acceptable voltage range, on most Diamond Systems boards
connected to digital I/O signals is 0-5V, with overvoltage protection up to 5.5V (-0.5 to 5.5V). Overvoltage
beyond this limit can damage the circuitry.
Other considerations are Logic Signals, which are typically generated between 12V to 24V.
If a Digital I/O Line of 12V to 24V is connected to a 5V logic chip, the chip will be damaged, and the damage
could extend to other chips in the circuit.
IMPORTANT! Always check twice before Powering Up!

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2 INTRODUCTION
2.1 Stevie Baseboard Overview
The Stevie baseboard is the latest product from Diamond Systems to integrate the newly-released
Standalone NVIDIAAGX Xavier System on Module (SoM) Series:
AGX Xavier
AGX Xavier 8 GB
NOTE: Currently the Stevie Board Support Package (BSP) supports the AGX Xavier Module Series only.
Support for the AGX Xavier 8 GB Modules will be provided subsequently.
Packaged in an ultra-compact sized form-factor measuring H 3.6” x W 4.13” (92 mm x 105 mm) Stevie
baseboard is empowered to deliver the latest technologically innovative breakthroughs by converging Fifth
Generation (5G) and Fourth Generation (4G) Networking Technologies.
The Stevie baseboard integrates the AGX Xavier Series Module to offer a full-featured, embedded system
that significantly enhances performance, power efficiency, and optimized I/O capabilities, for processing
real-time Artificial Intelligence (AI), Machine and Deep Learning and high-level Audiovisual (AV) computing
tasks at unconventional speeds.
Feature Description and Connector Type
Feature Description Connector Type
Power 12V and/or 9V-20V Wide Input Supply Range 2x2 Samtec IPL1
USB 2x USB 2.0; 2x USB 3.1 2x5 Header, Dual Stack
UBS 3.0 Type A
Ethernet
10/100/1000 Mbps through I210 Controller with On-
board Magnetics RJ45 GbE (X2)
10/100/1000 Mbps through RGMII Interface to KSZ9031
PHY with On-board Magnetics
Mass Storage
1 Mini-PCI Express (mPCIe) Socket RA PCIe MiniCard 52
Position (52-Pin-Card-Edge-
Type Connector)
1 M.2 PCIe SSD Socket 2280 (22 mm wide x 80 mm
long) NVMe Expansion Slots (4-Lane PCIe Gen 3) M.2 (Key M) Socket
1 Universal Flash Storage (UFS) and Micro SD UFS & Micro SD Push-Pull
Type Connector
Audio Via SGTL500 CODEC 2x5 Header
Serial Ports
2 RS-232/422/485 Ports. Software configurable through
SP336 Transceivers 2x5 Header
2 RS-232/422/485 Ports. Software configurable through
SP336 Transceivers 2x5 Header
Display 1 HDMI 2.0a/b Routed from the Module HDMI (Type A)
1 HDMI 2.0a/b Routed from the Module 2x10 Header
Camera 4 x4 / 8 x2 Lane CSI-2 Camera Interface 2 x 60 Receptacle SMT
Data Acquisition
(DAQ) 6x SE ADC Input / 3x DE ADC Input to SAM Controller and 2x DAC via SAM Controller 2x13 Header
Digital I/Os 13 Digital I/O via SAM Controller
CAN Header 2x CAN 1x4 1.25mm SMD
Utility PWR_BTN, RESET, FORCE RECOVERY 2x3 Header

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Operating System Support
Linux Kernel version 4.4.38; Ubuntu 16.04 AArch64
Mechanical, Electrical and Environmental Properties
Form-Factor
H 3.6” x W 4.13” (92 mm x 105 mm)
Cooling Mechanism
Conduction Cooling
Power Input Range
+9V to +20V, +12V Typical
Operating Temperature
Range
-25°C to +80°C Ambient
2.2 AGX Xavier Modules Overview
Measuring L x 3.93”X W 3.42" X H 0.62" (100 mm x 87 mm x 0.02 mm) the AGX Xavier and AGX Xavier 8
Series are autonomous, highly sophisticated, low-powered modules, engineered to process more than 32
and 20 trillion operations per second respectively, at a speed of 56 Gbit per second.
Embedded with 9 billion Transistors and a 699 Neuro-Mezzanine Pin Board-to-Board connector that
supports Hi-Speed I/O processing of data including PCI/PCIe Gen 5 and Gen 4 technologies, the modules
enable Deep Learning Applications to operate in Small Form-Factor (SFF) products such as Computer-on-
Module (COMs), and Smart devices such as Cameras, within a secure and automotive environment.
The circuitry and I/O connectors on the baseboard utilize all available features of the AGX Xavier Series
Module to deliver highly versatile performance in industrial environments.

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AGX Xavier Series Feature Description
Feature Description
AGX XAVIER AGX XAVIER 8 GB
GPU 512-core NVIDIA Volta™ GPU
with 64 Tensor Cores 384-core NVIDIA Volta™ GPU with 48 Tensor Cores
DL Accelerator (2x) NVIDIA Deep Learning Accelerator
(NVDLA) Engines (2x) NVIDIA (NVDLA) Engines
CPU 8-core ARMv8.2 @ 64-bit CPU,
8MB L2 + 4 MB L3 6-core Arm®v8.2 64-bit CPU, 6 MB L2 + 4 MB L3
Memory 16 GB 256-bit LPDDR4x | 136.5 GB/s 8 GB 256-bit LPDDR4x | 85.3 GB/s
Video Encode
2x 1000MP/sec
4x 4K @ 60 (HEVC), 16x 1080p @ 60
(HEVC)
32x 1080p @ 30 (HEVC)
2x 464MP/sec
2x 4K @ 30 (HEVC), 6x 1080p @ 60
(HEVC)
14x 1080p @ 30 (HEVC)
Video Decode
2x 1500MP/sec
2x 8K @ 30 (HEVC), 6x 14k @ 60
(HEVC)
26x 1080p @ 60 (HEVC), 72x 1080p @
30 (HEVC)
2x 690MP/sec
2x 4K @ 60 (HEVC), 12x 1080p @ 60
(HEVC)
32x 1080p @ 30 (HEVC)
Vision Accelerator 7-way VLIW Processor 7-way VLIW Processor
Camera
16x CSI-2 Lanes
(40 Gbps in D-PHY V1.2 or 109 Gbps in
CPHY v1.1)
8x SLVS-EC Lanes (up to 18.4 Gbps)
Up to 16 Simultaneous Cameras
16x CSI-2 Lanes
(40 Gbps in D-PHY V1.2 or 64 Gbps in
CPHY v1.1)
8x SLVS-EC Lanes (up to 18.4 Gbps)
Up to 16 Simultaneous Cameras
PCIe 5x PCIe Gen4 (16GT/s) Controllers
1x8, 1x4, 1x2, 2x1
PCIe Gen4, Root Port and Endpoint
5x PCIe Gen4 (16GT/s) Controllers
1x8, 1x4, 1x2, 2x1
PCIe Gen3
Storage 32 GB eMMC 5.1 32 GB eMMC 5.1
UPHY (3x) USB 3.1 (10 Gb/s) (4x) USB 2.0
ports
1 x8 or 1 x4 or 1 x2 or 2 x1 PCIe (Gen4)
3x USB 3.1, 4x USB 2.0
1 x8 or 1 x4 or 1 x2 or 2 x1 PCIe (Gen3)
Connectivity 1 Gigabit Ethernet, MAC, Reduced
Gigabit Media Independent (RGMII)
Interface
1 Gigabit Ethernet, MAC, Reduced Gigabit
Media Independent (RGMII) Interface
Miscellaneous I/O's UFS, I2S, I2C, SPI, CAN, GPIOs, UART, UFS, I2S, I2C, SPI, CAN, GPIOs, UART,
SD
Mechanical, Electrical, and Environmental Properties
Form-Factor H 3.93” x W 3.42” (100 x 87 mm; 16 mm Z-height)
Weight 280 Grams (9.87 Ounces) +/- 10 grams with Packaging including Thermal Transfer
Plate (TTP)
Connector 699-Pin Board-to-Board Connector
Cooling Solution Integrated Thermal Transfer Plate (TTP) with Heat Pipe
Power Input Range 9.0-20VDC
Operating
Temperature Range -25°C to +80°C

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3 FUNCTIONAL OVERVIEW
The following section provides functional details of the key sub-systems implemented on the baseboard.
3.1 Processor Modules
The baseboard supports Jetson™AGX Xavier Series modules.
Both series, the AGX Xavier and Xavier 8 GB Modules integrate 512-core NVIDIA Volta GPU with Tensor
Cores, and offer 16 GB of 256-bit LPDDR4x memory with 137 GB/s of bandwidth at 2133 MHz bus speeds
that enable AI-powered platform tools to process high-resolution computing tasks at 20 to 32 Tera
Operations Per Second (TOPS) respectively.
The modules encapsulate a high-density 699-pin board-to-board connector for breaking out high-speed I/O
signals to carrier board systems. This enables the integration of applications and devices across a wide
range of products and form-factors.
3.2 Power Supply Specifications
The baseboard is powered by a regulated 12V supply or wide input voltage range of +9V to +20V power
supply.
The maximum permissible reflected ripple measured at the voltage input connector is 50mV p-p.
Power supply voltages for the baseboard are derived from the +9V-20V input source. It is recommended
that the power supply unit meet the specified voltage range with additional reserves to support the add-on
features listed in the table below.
Power Requirements for Supplementary Features
Feature
12V
5V
3.3V
AGX Xavier Series Module
2.5A
PCIe MiniCard Socket
2A
M.2 SSD
0.5A
USB 2.0/3.1 Ports (0.5A per USB 2.0 Port and 1A per USB 3.1)
3A
Camera Circuit
0.2A
0.4A
Second Ethernet Circuit
0.3A
Miscellaneous
1A
1A
3.3 Backup Battery
A 2x1 input connector is provided to enable the use of an external battery for rugged applications.
3.4 Ethernet Ports
The baseboard is equipped with two Gigabit Ethernet ports.
1. A 10/100/1000 Ethernet port is derived from the Intel WGI210IT PCIe Ethernet controller which
is accessed via x1 PCIe lane routed from the Module.
2. A 10/100/1000 Ethernet port is derived from the RGMII (Reduced Gigabit Media-Independent
Interface) output of the Module connected to the on-board KSZ9031 PHY from Microchip.
Both GbE ports accommodate the standard RJ45 (Registered Jack) network interface for connecting
RJ45/Ethernet cables. The LEDs on the RJ45 serve as an activity indicator to indicate the connectivity, link,
speed, and data transmission status across the network.

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3.5 Display Controller
The baseboard supports dual HDMI 2.0 a/b Video Output ports.
One HDMI port is routed from the AGX Xavier Series Module and is implemented through the standard
HDMI (Type A) connector which uses a 19-pin configuration to transmit audio and video signals.
The second HDMI port is routed from the AGX Xavier Series Module and is implemented through the 2x10
header on the baseboard.
3.6 Camera Serial Interface (CSI)
The AGX Xavier Series Module support four MIPI (Mobile Industry Processor Interface) CSI x4 bricks,
enabling a wide array of device types and combinations to be implemented. Up to four 4-lane or six 2-lane
or six 1-lane configurations or combinations of camera streams are available. Each lane supports up to 16
Virtual Channels (VC). Each data channel has a peak bandwidth of up to 2.5 Gbps.
The baseboard supports four MIPI CSI x4 camera interfaces through a 120-pin daughterboard connector.
Off-the-shelf add-on Camera Boards from Leopard Imaging/e-con Systems can be plugged into the
daughterboard connector to support the four 4-lane or six 2-lane cameras. Alternatively, clients can
customize a daughterboard to suit their requirements.
The daughterboard connector also supports I2C and control signals that enable users to directly interface
the camera to the baseboard.
Refer to Section 17.2: Camera Installation Procedures of the Addendum for installation and operation
procedures.
3.7 Audio Interface
The Audio Chip, Part Number SGTL5000 provides audio support on the baseboard. Audio I/O signals are
generated through a 2mm header and include the following features:
Stereo Line-Out
Mono Mic-In
In addition to the analog audio interface, the dual HDMI 2.0 a/b Video controller supports audio output.
3.8 Serial Ports
Four serial ports are available on the baseboard 2x5 header which are routed from the AGX Xavier Series
Module through the programmable SP336 serial transceivers that implement RS232/422/485 protocols via
GPIOs.
Two serial ports configured for RS-232 on the SP336 transceiver are accessible on the 2x5
header.
Two serial ports are configured with the option to select RS232/422/485 protocol via GPIOs on
the SP336 transceiver and are accessible through the 2x5 header.
An on-board Jumper option is provided to select any protocol and terminate RS422 and RS485 protocol
transmission lines at 120 Ohm.
NOTE: By default, the Elton baseboard does not feature a Debug Serial Console Port but provides the
option to set up a Debug Serial Console by mounting the Jumper on J24. This will initiate the Serial
Console configuration via serial port 1.