Digital Equipment MicroVAX II 630QB User manual

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MicroVAX II
630Q8
Technical Manual
Prepared by Educational Services
of Digital Equipment Corporation

1st Edition, November 1985
© Digital Equipment Corporation 1985.
All Rights Reserved.
The material
in this manual is for informational purposes and is subject to change
without notice.
Digital Equipment Corporation assumes
no responsibility for any errors that may
appear
in this manual.
FCC Notice: This equipment generates, uses, and may emit radio frequency
energy. The equipment has heen tested and found to comply with the limits for a
Class A computing device pursuant to Subpart J of Part 15 of FCC Rules, which
are designed to provide reasonable protection against such radio frequency interfer-
ence when operated
in a commercial environment. Operation of this equipment in a
residential area may cause interference, in which case the user, at his own
expense, may be required to take measures to correct the interference.
Printed in U.S.A.
The manuscript for this book was created on a VAX-1l/780 system and, via a
translation program, was automatically typeset
by Digital's DECset Integrated Pub-
lishing System. The book was produced by Educational Services Development and
Publishing in Marlboro, MA.
The following are trademarks of Digital Equipment Corporation:
mamaDma™
MicroVAX RT
COMPACTape MicroVMS ULTRIX-32m
DEC
PDP UNIBUS
DECmate
P/OS
VAX
DECUS Professional
VAXELN
DECwriter
Q-Bus
VMS
DIBOL
Rainbow VT
LSI-II RSTS Work Processor
MASSBUS
RSX

Introduction
Chapter 1
1.1
1.2
1.3
1.3.1
1.3.2
1.4
1.5
1.6
1.7
Chapter 2
2.1
2.2
2.2.1
2.2.2
2.2.3
2.3
Chapter 3
3.1
3.1.1
3.1.2
3.2
3.2.1
3.2.2
Contents
BA123-A Enclosure
INTRODUCTION .................................................................. 1-1
ENCLOSURE FRAME........................................................... 1-2
CONTROL PANEL................................................................ 1-5
Mass Storage Shelves........................................................ 1-5
CPU Console Board........................................................... 1-6
SIGNAL DISTRIBUTION BOARD ........................................ 1-8
BACKPLANE ......................................................................... 1-10
POWER SUPPLy................................................................... 1-13
I/O DISTRIBUTION PANEL................................................. 1-17
Base System
INTRODUCTION .................................................................. 2-1
KA630-A CPU........................................................................ 2-1
Console Program ............................................................... 2-4
Primary Bootstrap Program (VMB) ................................... 2-5
CPU Patch Panel Insert .................................................... 2-6
MS630 MEMORY MODULE................................................. 2-9
System Options
INTRODUCTION .................................................................. 3-1
Ordering Options............................................................... 3-1
Module Configuration ........................................................ 3-2
COMMUNICATIONS............................................................. 3-4
DEQNA Ethernet Interface............................................... 3-4
DHVll Asynchronous Multiplexer (Eight Lines) .............. 3-6
iii

Contents
3.2.3
3.2.4
3.2.5
3.2.6
3.2.7
3.2.8
3.2.9
3.2.10
3.3
3.3.1
3.3.2
3.3.2.1
3.3.2.2
3.3.3
3.4
3.4.1
Chapter 4
4.1
4.1.1
4.1.2
4.1.2.1
4.1.2.2
4.1.3
4.1.4
4.1.5
4.2
Chapter 5
5.1
5.2
5.2.1
5.2.2
5.2.3
5.3
5.4
5.4.1
iv
DHV11 Remote Distribution Cabinet Kit
(CK-DHV11-VA) ............................................................ 3-9
DLVJ1 Asynchronous Interface (Four Lines) .................... 3-11
DMV11 Synchronous Controller........................................ 3-14
DPV11 Synchronous Interface .......................................... 3-20
DRV11-J High Density Parallel Interface (Four Lines)..... 3-24
DZQ11 Asynchronous Multiplexer (Four Lines)................ 3-26
DZV11 Asynchronous Multiplexer (Eight Lines)............... 3-29
LPV11 Interface Module (For LP25 System Printer)....... 3-32
DISK STORAGE.................................................................... 3-34
RQDX2,
RQDX3 Disk Controllers..................................... 3-34
RD52, RD53 Disk Drives.................................................. 3-37
Factory Configuration ................................................... 3-37
Disk Formatting............................................................ 3-37
RX50 Diskette Drive......................................................... 3-39
TAPE STORAGE................................................................... 3-40
TK50 Tape Drive Subsystem............................................ 3-40
Configuration
CONFIGURATION RULES................................................... 4-1
Module Physical Priority ................................................... 4-1
Expansion Space ................................................................ 4-3
Backplane ...................................................................... 4-3
1/0 Distribution Panel Insert Space.............................. 4-3
Power Requirement........................................................... 4-3
Bus Loads .......................................................................... 4-6
Module CSR Addresses and Interrupt Vectors ................. 4-6
CONFIGURATION EXAMPLES ........................................... 4-9
Diagnostics
INTRODUCTION .................................................................. 5-1
KA630-A BOOT
AND DIAGNOSTIC ROM .......................... 5-1
Power-up Mode ................................................................. 5-1
Console Mode .................................................................... 5-5
Console Terminal Error Messages .................................... 5-5
POWER-UP LEDS ON MASS STORAGE, BACKUP,
AND COMMUNICATIONS DEVICES............................... 5-7
MicroVAX MAINTENANCE SySTEM.................................. 5-10
Test the System (Menu Item #1)...................................... 5-12

5.4.2
5.4.3
5.4.4
5.4.5
5.5
5.5.1
5.5.2
Chapter 6
6.1
6.2
6.2.1
6.2.2
6.3
6.4
6.5
6.5.1
6.5.2
6.6
6.6.1
6.6.2
6.7
6.8
6.9
6.10
6.11
6.12
Appendixes
Appendix A
Appendix B
Contents
Display System Configuration and Devices
(Menu Item #2) ............................................................. 5-12
Display the Utilities Menu (Menu Item #3) ...................... 5-12
Display the Service Menu (Menu Item #4)....................... 5-12
Exit the MicroV AX Maintenance System
(Menu Item #5) ............................................................. 5-12
TROUBLESHOOTING........................................................... 5-13
Unknown System Level Problems
(System Fails to Boot) ................................................... 5-13
Device-Specific Problems................................................... 5-13
FRU Removal and Replacement Procedures
INTRODUCTION .................................................................. 6-1
REMOVAL OF THE EXTERIOR PANELS .......................... 6-4
Removal of the Right Side Panel....................................... 6-4
Removal of the Left Side Panel......................................... 6-6
ON/OFF SWITCH REMOVAL............................................... 6-8
CPU CONSOLE BOARD REMOVAL .................................... 6-9
13.3 cm (5.25 in) MASS STORAGE DEVICE REMOVAL ... 6-10
RD52 Read/Write Board Removal..................................... 6-10
RD53 ReadfWrite Board Removal..................................... 6-14
FAN REMOVAL .................................................................... 6-16
Mass Storage Fan Removal............................................... 6-16
Card-Cage Fan Removal .................................................... 6-18
MODULE REMOVAL............................................................ 6-19
DOOR INTERLOCK SWITCH REMOVAL ........................... 6-21
TEMPERATURE SENSOR REMOVAL ................................ 6-21
POWER SUPPLY REMOVAL ............................................... 6-23
BACKPLANE REMOVAL...................................................... 6-25
FILTER CONNECTOR REMOVAL ...................................... 6-27
Console Commands ................................................................ A-I
Console Error Messages and Explanations ............................ B-1
v

Contents
FIGURES
1-1 BAI23-A Enclosure .............................................................................. 1-1
1-2
BAI23-A Removable Panels and Doors................................................ 1-2
1-3
Air Flow ............................................................................................... 1-3
1-4 Temperature Sensor PC Board ............................................................ 1-4
1-5 Mass Storage Shelves........................................................................... 1-5
1-6
CPU Console Board.............................................................................. 1-7
1-7
Signal Distribution Board...................................................................... 1-8
1-8 Signal Distribution Board Cabling ......................................................... 1-9
1-9 Backplane Grant Continuity.................................................................. 1-11
1-10 Backplane Connectors........................................................................... 1-12
1-11 Power Supply ........................................................................................ 1-14
1-12 Circuit Breaker, Voltage Select Switch, Connectors (Rear
View) ........ 1-15
1-13 Electrical Distribution........................................................................... 1-16
1-14
I/O Distribution Panel........................................................................... 1-18
1-15 Filter Connectors
and Adapter Plate.................................................... 1-19
2-1 KA630-A CPU Module ......................................................................... 2-3
2-2 CPU Patch Panel Insert (Front View) .................................................. 2-6
2-3 CPU Patch Panel Insert (Rear View) ................................................... 2-7
3-1 DEQNA Module Layout........................................................................ 3-4
3-2 DEQNA Internal Cabling ...................................................................... 3-5
3-3
DHVll Module Layout ........................................................................ 3-7
3-4 DHVll Internal Cabling ....................................................................... 3-8
3-5
DHVll Remote Distribution Cabinet Kit............................................. 3-10
3-6 DL VJl Module Layout.......................................................................... 3-12
3-7 DL VJl Internal Cabling ........................................................................ 3-13
3-8
DMVll (M8053) Module Layout......................................................... 3-17
3-9
DMVll (M8064) Module Layout......................................................... 3-17
3-10 M8053 Internal Cabling ........................................................................ 3-18
3-11 M8064 Internal Cabling........................................................................ 3-19
3-12 DPVll Module Layout......................................................................... 3-20
3-13 DPVll Internal Cabling ....................................................................... 3-23
3-14 DRVII-J
Module Layout ...................................................................... 3-24
3-15 DRVII-J Internal
Cabling ..................................................................... 3-25
3-16 DZQll
Module Layout......................................................................... 3-26
3-17 DZQll Internal
Cabling ........................................................................ 3-28
3-18 DZVll Module Layout ......................................................................... 3-29
3-19 DZVll Internal
Cabling ....................................................................... 3-31
3-20 LPVll Module Layout ......................................................................... 3-32
3-21 LPVll Internal Cabling ........................................................................ 3-33
vi

Contents
3-22 RQDX2 Module Layout ........................................................................ 3-35
3-23
RQDX3 Module Layout ........................................................................ 3-35
3-24 RD52 Disk Drive and Shunt Jumper .................................................... 3-38
3-25 RX50 Diskette Drive............................................................................ 3-39
3-26 TK50 Tape Drive Subsystem............................................................... 3-40
3-27 M7546 Module Layout ......................................................................... 3-41
4-1 Configuration Worksheet...................................................................... 4-4
4-2 Module Utilizations............................................................................... 4-9
4-3 Base System ......................................................................................... 4-11
4-4 Advanced System ................................................................................. 4-12
5-1 KA630-A CPU Module LEDs............................................................... 5-5
5-2 Example
of a Console Terminal Error Message................................... 5-6
5-3 LED Orientation
on the DEQNA Module ............................................. 5-7
5-4
LED Orientation on the RQDX2 Module ............................................. 5-7
5-5
LED Orientation on the TQK50 Module .............................................. 5-9
5-6 Disclaimer Screen................................................................................. 5-10
5-7 Load Additional Media Screen.............................................................. 5-11
5-8 Maintenance System Main Menu ......................................................... 5-11
5-9 Troubleshooting Flowchart for Fail-to-Boot Problems ......................... 5-14
5-10 Troubleshooting Flowchart for Device-Specific Problems.................... 5-15
6-1 BA123-A FRUs .................................................................................... 6-3
6-2 Unhooking the Right Side PaneL......................................................... 6-4
6-3 Removing the Right Side Pane!............................................................ 6-5
6-4 Unhooking the Left Side PaneL........................................................... 6-6
6-5 Removing the Left Side Pane!.............................................................. 6-7
6-6 On/Off Switch Removal ........................................................................ 6-8
6-7 CPU Console Board Removal ............................................................... 6-9
6-8 Removing the Slide Plate ..................................................................... 6-11
6-9 Removing the 2-Pin Connector and Screws ......................................... 6-11
6-10 Removing the Front Bezel.................................................................... 6-12
6-11 Removing Phillips Screws from Heatsink............................................. 6-13
6-12 Removing the
MPCB ............................................................................ 6-13
6-13 RD53 Read/Write Board RemovaL...................................................... 6-15
6-14 Mass Storage Fan Removal.................................................................. 6-17
6-15 Card-Cage Fan Removal....................................................................... 6-18
6-16 Module Removal................................................................................... 6-20
6-17 Door Interlock Switch/Temperature Sensor......................................... 6-22
6-18 Power Supply Removal......................................................................... 6-24
6-19 Backplane Removal............................................................................... 6-26
vii

Contents
TABLES
1-1 Regulator A and B Current and Power................................................ 1-13
1-2 Cutout and Insert Panel Sizes .............................................................. 1-17
2-1 Console Program Boot Sequence.......................................................... 2-5
2-2 MS630 Memory Module Versions........................................................ 2-9
3-1 DEQNA CSR Address and Interrupt Vector........................................ 3-5
3-2
DHV11 CSR Address ........................................................................... 3-7
3-3
DHVll Interrupt Vector...................................................................... 3-7
3-4
DLVJ1 CSR Address ............................................................................ 3-11
3-5
DL VJ1 Interrupt Vector....................................................................... 3-12
3-6
DMV11 Versions.................................................................................. 3-14
3-7
DMV11 Interfaces................................................................................ 3-14
3-8
DMV11 CSR Address........................................................................... 3-15
3-9
DMV11 Interrupt Vector ..................................................................... 3-15
3-10 DMVll Switch Selectable Settings...................................................... 3-16
3-11
DPVll CSR Address............................................................................ 3-21
3-12 DPV11 Interrupt Vector ...................................................................... 3-21
3-13 DRV11-J
CSR Address......................................................................... 3-25
3-14
DZQ11 CSR Address............................................................................ 3-27
3-15
DZQll Interrupt Vector ...................................................................... 3-27
3-16 DZVl1
CSR Address............................................................................ 3-30
3-17 DZV11 Interrupt Vector ...................................................................... 3-30
3-18 LPV11 CSR Address ............................................................................ 3-32
3-19 LPV11 Interrupt Vector....................................................................... 3-33
3-20 RQDX2/RQDX3 CSR Address.............................................................. 3-36
3-21 Revision Level Switch Settings ............................................................ 3-41
3-22 Unit Number Settings .......................................................................... 3-42
3-23 M7546 Controller Module
CSR Address.............................................. 3-42
4-1 Power Requirements, Bus Loads, I/O Inserts ...................................... 4-5
4-2 Address/Vector Worksheet................................................................... 4-7
4-3 Floating
CSR Addresses....................................................................... 4-8
5-1 LED Status and Countdown Error Messages....................................... 5-2
5-2 DEQNA Module LED Indications......................................................... 5-7
5-3 RQDX2 Module LED Indications.......................................................... 5-8
5-4 TQK50 Module
LED Indications .......................................................... 5-9
6-1 BA123-A FRUs .................................................................................... 6-1
B-1 Console Error Messages and Explanations........................................... B-1
viii

Introduction
This manual describes the MicroVAX II 630QB system. Housed in the BA123-A
enclosure, this system uses standard Q22-Bus options and mass storage devices.
Chapter 1 describes the BA123-A enclosure, including the backplane, power supply,
mass storage area, I/O distribution panel, and internal cabling.
Chapter 2 describes the MicroV AX II KA630-A CPU module, the CPU patch panel
insert, and MS630 memory module.
Chapter 3 describes the communications, mass storage, and backup devices cur-
rently available as system options. The chapter provides configuration tables, cabi-
net kit information, and a brief description
of each device.
Chapter 4 provides configuration information required for system expansion. Exam-
ples
of typical systems are shown.
Chapter 5 describes the Micro VAX II power-up self-test and corresponding count-
down error messages. The customer version
of the MicroV AX Maintenance System
and basic troubleshooting are also covered.
Chapter 6 lists the field replaceable units (FRUs) and provides appropriate removal
and replacement procedures.
Appendix A provides information
on MicroV AX II console commands.
Appendix B lists the console
error messages produced by the KA630-A CPU, along
with a brief explanation
of each message.
CONVENTIONS
Lower case n represents multiple numbers, where a specific designation is unnec-
essary or cumbersome (for example,
RD5n instead of RD51, RD52, RD53). Simi-
larly, a lowercase x represents multiple letters.
ix

Introduction
NOTES, CAUTIONS, AND WARNINGS
Notes, cautions, and warnings appear throughout this manual and are defined as
follows. A note contains general information. A caution contains information to
prevent damage to equipment. A warning contains information to prevent personal
injury.
RELATED DOCUMENTS
The following is a list of related documents for the MicroV AX II systems.
KA630-A CPU Module User's Guide
Micro
VAX System Maintenance Guide
DEQNA Ethernet User's Guide
DHVll Technical Manual
DLVll-J User's Guide
DMVll Synchronous Controller Technical Manual
DPVll Synchronous Interface User's Manual
DRVll-J Interface User's Manual
DZVll Asynchronous Multiplexer Technical Manual
RDS2-D, -R Fixed Disk Drive Subsystem Owner's Manual
RDS3-D, -R Fixed Disk Drive Subsystem Owner's Manual
RQDX2 Controller Module User's Guide
RQDX3 Controller Module User's Guide
RXSO-AA Diskette Drive Subsystem Owner's Manual
TKSO Tape Drive Subsystem User's Guide
You can order these documents from:
Digital Equipment Corporation
Accessories and Supplies Group
P.O. Box CS2008
Nashua, NH 03061
Attention: Documentation Products
x
BK-KA630-UG
AZ-GM3AA-MN
EK-DEQNA-UG
EK-DHVll-TM
EK-DLVlj-UG
EK-DMVll-TM
EK-DPVll-UG
EK-DRVlj-UG
EK-DZVll-TM
EK-LEP03-0M
EK-LEP06-0M
EK-RQDX2-UG
EK-RQDX3-UG
EK-RX50A-MM
EK-LEP05-0M

BA123-A Enclosure 1
1.1 INTRODUCTION
The BAI23-A enclosure (Figure 1-1) is a floor stand unit for microcomputer sys-
tems.
It can support a wide variety of hardware options. The air-cooled enclosure
is designed to operate in an open office environment. It includes the following
major components:
• Enclosure frame • Backplane assembly
• Control panel • Power supply
• Mass storage area • I/O distribution panel
Figure 1-1 BAI23-A Enclosure
1-1

SA 123-A Enclosure
1.2 ENCLOSURE FRAME
The BA123-A enclosure frame houses the power supply and the backplane assem-
bly. It also provides mounting space for five 13.3 cm (5.25 in) mass storage
devices. It is mounted on four shock-isolating casters and has the following
dimensions:
Height: 62.2 em (24.5 in)
Width: 33.0 em (13.0 in)
Depth: 70.0 em (27.5 in)
The enclosure frame is covered
by removable panels on the front, right, and left
sides (Figure 1-2).
There are three doors: a control panel door
on the front, an I/O panel door at the
rear, and a card-cage door inside the right side panel.
NOTE
For panel removal procedures, see Section 6.2.
MR-14028
Figure 1-2 BA123-A Removable Panels and Doors
1-2

BA 123-A Enclosure
Three fans in the BA123-A enclosure draw air into the top of the enclosure from
the
following areas (Figure 1-3):
• Below the module card cage
• Behind the control panel
• Inside the power supply
Figure 1-3 Air Flow
1-3

SA 123-A Enclosure
A printed circuit (PC) board above the card cage contains two temperature sensors
(Figure 1-4).
One sensor regulates the speed of the card-cage fan, keeping it at the
minimum level required to maintain a constant temperature within the card cage.
The other sensor shuts
down the system at high temperature. The card-cage door
encloses the area surrounding the modules. Removal
of this door triggers an inter-
lock switch, which increases the speed of the card-cage fan to maximum. If the
proper temperature within the card cage cannot be maintained, even at maximum
fan speed, the over-temperature sensor causes the system to shut down. The sys-
tem also shuts
down if the card-cage fan fails.
Figure 1-4 Temperature Sensor
PC Board
1-4

BA 123-A Enclosure
1.3 CONTROL PANEL
The control panel has six cutouts to provide space for control circuits. One cutout
is used for a CPU console board. The other five cutouts provide space for mass
storage console boards. Unused cutouts are covered with removable plates. Figure
1-5 shows the relationship between the cutouts and the mass storage shelves.
LEGEND:
1. DISK DRIVE 1 4. TAPE DRIVE
2. DISK DRIVE 2
5. DISKETTE DRIVE
3. DISK DRIVE 3
Figure 1-5 Mass Storage Shelves
1.3.1 Mass Storage Shelves
The front panel covers five shelves used for mounting 13.3 cm (5.25 in) mass
storage devices (Figure
1-5)_ The maximum recommended number of mass storage
devices
is four. These should be installed with two in shelves 1 and 2 and two in
shelves 3, 4 or 5. Removable plates in front of shelves 3, 4 and 5 allow access to
removable mass storage devices.
1-5

BA 123-A Enclosure
1.3.2 CPU Console Board
The CPU console board (Figure 1-6) is attached to the back of the control panel. It
contains a
DC OK indicator light, and two buttons that allow the user to halt or
restart the system. A ribbon cable connects the CPU console board to the back-
plane. This cable provides the connection between the CPU and the CPU console
board. The buttons and
DC OK light provide the following functions:
• When the Halt button is depressed, the red LED in the Halt button lights. The
system then enters console I/O mode (Section 2.2.1), providing halts are enabled
by the switch on the CPU distribution panel at the rear of the system (Section
2.2.3).
NOTE
If halts are disabled at the rear of the system, the LED
in the
Halt button still lights when the button is depressed, but the
system is not halted.
• When the DC OK light is ON, the system is receiving stable dc voltage from the
power supply.
• When the Restart button is depressed, the system boots.
There are two LEDs on the CPU console board. These can be seen
by removing
the left side panel of the enclosure.
If the DC OK light on the control panel is not
lit, these two LEDs indicate which regulator supply to the backplane has failed:
Left LED:
Right LED:
1-6
Regulator A
Regulator B

BA 123-A Enclosure
When a LED is
ON, +5 Vdc to the backplane is OK. When the LEDs are OFF, a
regulator or connection to a regulator has failed.
NOTE
There should be at least one module in both odd- and even-
numbered backplane slots to draw enough current to start each
regulator. See Section 1.6.
There is a DIP switch pack to the left of the LEDs that contains two switches.
Both switches are normally OFF and are unused
in Micro VAX II systems.
LED
IREGULATOR A)
LED
IREGULATOR 8)
Figure 1-6 CPU Console Board
RESTART/RUN
DC OK
HALT
MR-14187
1-7

SA 123-A Enclosure
1.4 SIGNAL DISTRIBUTION BOARD
The signal distribution board (M9058, Figure 1-7) is mounted in the bottom two
(C and D) rows of backplane slot 13.
Up to four fixed disk drives, or an RX50 diskette drive and up to two fixed disk
drives, can
be connected to the signal distribution board (Figure 1-8). The signal
distribution board is connected
by a 50-conductor ribbon cable to an RQDXn mass
storage controller module in the card cage. The signal distribution board is also
connected to the
RD console boards behind the control panel by a 40-conductor
ribbon cable.
@
@
@
MM-14032
Figure 1-7 Signal Distribution Board
1-8