Ebyte E01-2G4M27S User manual

E01-2G4M27S User Manual
nRF24L01P 2.4GHz 27dBm SPI Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd. E01-2G4M27S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
1
1 Overview
1.1 Introduction
E01-2G4M27S is a 2.4GHz SMD wireless module on Nordic's
NRF24L01P RF chip, which is small in size and has the maximum
transmission power of 27dBm.
The module uses imported nrf24l01p chip, built-in power amplifier
(PA) and low-noise amplifier (LNA), with PCB antenna, and the maximum
transmission power is 27dBm. At the same time, the communication
stability has been greatly improved by using industrial high-precision 16 MHz crystal oscillator.
Since the E01-2G4M27S is a SPI RF transceiver module, you need to use the MCU driver or a dedicated SPI
debugging tool.
1.2 Features
Small size,only 14*23mm；
Maximum transmission power of 27dBm, software multi-level adjustable；
Communication distance tested is up to 2.2km;
Support the global license-free ISM 2.4GHz；
Support air date rate of 2Mbps,1Mbps and 250kbps；
125 communication channels to meet the needs of multi-point communication, grouping, frequency
hopping, etc.；
Connect to the MCU through the SPI interface at a rate of 0～10Mbps;
Support 2.3V~3.6V power supply, power supply over 3.3V can guarantee the best performance；
Professional RF shield design, anti-interference, anti-static;
Onboard PCB antenna, no need to connect external antenna;
Enhanced ShockBurst, fully compatible with nRF24L, nRF24E, nRF24U series of NORDIC.
1.3 Application
Smart home and industrial sensors；
Security system and positioning system；
Wireless remote control, UAV；
Wireless game remote control;
Health care products；
Wireless voice, wireless headset；
Automotive industry applications.

Chengdu Ebyte Electronic Technology Co., Ltd. E01-2G4M27S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
2
2 Specification and parameter
2.1 Limit parameter
Main parameter
Performance
Remark
Min.
Max.
Power supply（V）
2.3
3.6
Voltage over 3.6V will cause permanent
damage to module
Blocking power（dBm）
-
10
Chances of burn is slim when modules
are used in short distance
Operating temperature（℃）
-40
85
/
2.2 Operating parameter
Main parameter
Performance
Remark
Min.
Typ.
Max.
Operating voltage（V）
2.3
3.3
3.6
Voltage over 3.6V will cause permanent
damage to module
Communication level（V）
-
3.3
-
For 5V TTL, it may be at risk of burning
down
Operating temperature（℃）
-40
-
85
Industrial design
Operating frequency（MHz）
2.4
-
2.525
Support ISM band
Power
consump
tion
TX current（mA）
-
700
-
Instant power consumption
RX current（mA）
-
23
-
Sleep current （μA）
-
-
-
Software is shut down
Max Tx power（dBm）
14
-
27
Receiving sensitivity（dBm）
-
-99
-
Air data rate is 250 kbps
Air data rate（bps）
250k
-
2M
Controlled via user’s programming
Main parameter
Description
Remark
Distance for reference
2km
Test condition：clear and open area, antenna gain: 5dBi，
antenna height: 2.5m，air data rate: 250kbps
FIFO
32 Byte
Max. Transmitting length per packet
Crystal frequency
16
Modulation
GFSK
Package
SMD
Communication interface
SPI
0-10Mbps
Size
14 * 23mm
Antenna
PCB antenna
50 ohm impedance
Weight(g)
1.2±0.1

Chengdu Ebyte Electronic Technology Co., Ltd. E01-2G4M27S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
3
3 Size and pin definition
No.
Name
Direction
Function
1
VCC
-
Power supply ：2.3~ 3.6V DC
2
CE
Input
Chip enable
3
CSN
Input
SPI Chip select
4
SCK
Input
SPI Clock
5
MOSI
Input
SPI master output slave input
6
MISO
Output
SPI master input slave output
7
IRQ
Output
Interrupt request, valid in low communication level
8
GND
Ground
9
GND
Ground
10
GND
Ground

Chengdu Ebyte Electronic Technology Co., Ltd. E01-2G4M27S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
4
4 Basic operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible,
and the module needs to be reliably grounded.；
Please pay attention to the correct connection of the positive and negative poles of the power supply.
Reverse connection may cause permanent damage to the module；
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged；
Please check the stability of the power supply, the voltage can not be fluctuated frequently；
When designing the power supply circuit for the module, it is often recommended to reserve more than 30%
of the margin, so the whole machine is beneficial for long-term stable operation.；
The module should be as far away as possible from the power supply, transformers, high-frequency wiring
and other parts with large electromagnetic interference.；
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under
the module. If it is necessary to pass through the module, assume that the module is soldered to the Top
Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close
to the digital part of the module and routed in the Bottom Layer；
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the
Bottom Layer or other layers, which will affect the module's spurs and receiving sensitivity to varying
degrees；
It is assumed that there are devices with large electromagnetic interference around the module that will
greatly affect the performance. It is recommended to keep them away from the module according to the
strength of the interference. If necessary, appropriate isolation and shielding can be done；
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency
analog, power traces) around the module that will greatly affect the performance of the module. It is
recommended to stay away from the module according to the strength of the interference.If necessary,
appropriate isolation and shielding can be done.
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended,
there is still a risk of damage)；
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；
Onboard PCB antennas should avoid conductors or other sources of interference.
4.2 Software editing
The module is nRF24L01P+PA+LNA. Its driving mode is exactly the same as nRF24L01P. Users can operate
according to nRF24L01P manual (please refer to the latest nRF24L01P data sheet.)
IRQ is an interrupt pin, which can be used to wake up the microcontroller and achieve fast response. If it is
not connected, the SPI query mode can be used to obtain the interrupt status (not recommended, which is
not conducive to the overall power consumption, and the efficiency is not enough)；

Chengdu Ebyte Electronic Technology Co., Ltd. E01-2G4M27S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
5
CE can be connected to a high level for a long time, but the module must first be set to the POWER DOWN
mode when writing the register. It is recommended that the CE be controlled by a MCU pin.
Make sure the CE pin connects to LNA enable pin ,when CE equal to 1,LNA is turned on,when CE to O,LNA is
turned off .This operation is perfectly matched with the transceiver mode of NRF24L01;that is to say,users do
not have to care about the LNA operation.
If the automatic response is needed, the CE pin must keep high level when transmitting, instead of keeping
high level time just more than 10us like the datasheet mentioned. The operation we recommended is: when
CE equal to 1,the module begin sending, after sending all, then make the CE equal to 0, instead of making the
CE equal to 0 after 10us. The reason is: the module turns into receiving mode immediately after sending LOIP
f CE equal to 0,it means LNA closed, will not be beneficial to the receiving senility.
Transmitting power settings
No
nRF24L01P Setting Power（dBm）
Transmitting power（dBm）
1
0
27
2
-6
25
3
-12
22
4
-18
14
Note: The above transmit power leveling needs to be achieved through software settings
5 Basic application
5.1 Basic circuit diagram

Chengdu Ebyte Electronic Technology Co., Ltd. E01-2G4M27S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
6
6 FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify
frequency and channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
The extension line and feeder quality are poor or too long, so the bit error rate is high;
7 Production guidance
7.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max

Chengdu Ebyte Electronic Technology Co., Ltd. E01-2G4M27S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
7
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time（tL）Maintained Above（TL）
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Aveage ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature for
25℃
max 6 minutes
max 8 minutes
7.2 Reflow soldering curve
8 E01 Series
Model No.
RFIC
Frequency
TX power
Distance
Package
Antenna
Hz
dBm
km
E01-ML01S
nRF24L01P
2.4G
0
0.1
SMD
PCB
E01-ML01D
nRF24L01P
2.4G
0
0.1
DIP
PCB
E01-ML01IPX
nRF24L01P
2.4G
0
0.2
SMD
IPEX
E01-2G4M13S
nRF24L01P
2.4G
13
0.8
SMD
PCB
E01-ML01DP4
nRF24L01P
2.4G
20
1.8
DIP
PCB

Chengdu Ebyte Electronic Technology Co., Ltd. E01-2G4M27S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
8
E01-ML01DP5
nRF24L01P
2.4G
20
2.5
DIP
SMA-K
E01-ML01SP2
nRF24L01P
2.4G
20
1.8
SMD
PCB/IPEX
E01-ML01SP4
nRF24L01P
2.4G
20
2
SMD
IPEX
E01-2G4M27D
nRF24L01P
2.4G
27
5
DIP
SMA-K
E01-2G4M27S
nRF24L01P
2.4G
27
2.2
SMD
PCB
E01-2G4M27S
X
nRF24L01P
2.4G
27
4
SMD
IPEX
All E01 series module are compatible with each other.
9 Packing method for batch order
Revision history
Version
Date
Description
Issued by
1.0
2020.06.05
Initial version
Ken

Chengdu Ebyte Electronic Technology Co., Ltd. E01-2G4M27S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
9
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