Ebyte E22-900MM22S Installation instructions

E22-900MM22S Product specifications
SX1262 868/915MHz ultra small size
Lora SMD module

Chengdu Ebyte Electronic Technology Co.,Ltd E22-900M22S User manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
1
Catalog
Chapter 1 Overview..................................................................................................................................................................................... 2
1.1 Introduce........................................................................................................................................................................................2
1.2 Features.......................................................................................................................................................................................... 2
1.3 Application Scenarios............................................................................................................................................................2
Chapter 2 Specifications....................................................................................................................................................................... 3
2.1 Limit parameters....................................................................................................................................................................... 3
2.2 Working parameters...................................................................................................................................................................3
Chapter 3 machine dimensions and pin definition..................................................................................................................4
Chapter 4 Basic operations...................................................................................................................................................................5
4.1 Hardware design..........................................................................................................................................................................5
4.2 Software programming.............................................................................................................................................................. 6
Chapter 5 basic application................................................................................................................................................................ 6
5.1 Basic circuit.............................................................................................................................................................................. 6
Chapter 6 FAQ.................................................................................................................................................................................................7
6.1 Transmission distance is not ideal..............................................................................................................................7
6.2Modules are easily damaged.................................................................................................................................................. 7
6.3 Bit error rate is too high................................................................................................................................................ 7
Chapter 7 Welding operation guidance............................................................................................................................................8
7.1 Reflow soldering temperature............................................................................................................................................8
7.2 Diagram of reflow welding.................................................................................................................................................. 9
Chapter 8 Related models....................................................................................................................................................................... 9
Chapter 9 Antenna Guide....................................................................................................................................................................... 10
9.1 Antenna recommendation.......................................................................................................................................................10
Revise history............................................................................................................................................................................................ 10
About us.......................................................................................................................................................................................................... 11

Chengdu Ebyte Electronic Technology Co.,Ltd E22-900M22S User manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
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Chapter 1 Overview
1.1 Introduce
E22-900MM22S is based on the new generation of LoRaTM radio frequency
chip SX1262 produced by Semtech in the United States as the core of the
independent research and development of ultra-small volume, and is
suitable for 868MHz, 915MHz chip LoRaTM wireless module.
Since the original imported SX1262 is used as the module core,
compared with the last generation LoRaTM transceiver, the
anti-interference performance and communication distance are further
improved. Because it uses the new LoRaTM modulation technology, the
anti-interference performance and communication distance are far beyond
the current FSK, GFSK modulation products. This module is mainly aimed
at smart home, wireless meter reading, scientific research and medical, and medium and long range wireless
communication equipment. Because the RF performance and component selection are in accordance with industrial
standards, the product can cover the ultra-wide frequency range of 850~930MHz and downward compatible with SX1278
and SX1276. Use industrial grade high precision 32MHz crystal oscillator.
Since the module is a pure RF transceiver module, MCU driver or special SPI debugging tool should be used.
1.2 Features
The measured communication distance can reach 7km.
Maximum transmit power 160mW, multi-stage tunable software;
supports global license-free ISM 868/915MHz band;
LoRaTM supports data transfer rates ranging from 0.018 to 62.5kbps.
FSK mode supports up to 300kpbs data transfer rate.
Backwards compatible with SX1278/SX1276 series RF transceivers;
The FIFO has a large capacity and supports 256Byte data caching.
A new SF5 spreading factor that supports dense networks.
supports 1.8V to 3.7V power supply, and any power supply greater than 3.3V ensures the best performance.
Industrial-grade standard design, supporting long-term use at -40 ~ 85°C;
IPEX interface, stamp hole optional, easy to user secondary development, easy to integrate.
1.3 Application Scenarios
Home security alarm and remote keyless entry;
Smart home and industrial sensors, etc.
wireless alarm security system;
Building automation solutions;
Wireless industrial-grade remote control;

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Advanced Meter Reading Architecture (AMI);
Applications in the automotive industry.
Chapter 2 Specifications
2.1 Limit parameters
mainly parameters
Performance
Notes
Min
Max
Power Supply Voltage（V）
0
3.7
Permanently burn module over 3.7V
Blocking power（dBm）
-
10
At close range, the burn
probability is low
Operating temperature（℃）
-40
85
Product net weight
0.5g±0.02g
Product net weight
2.2 Working parameters
mainly parameters
Performance
Notes
Min
Typical
values
Max
Power Supply Voltage（V）
1.8
3.3
3.7
≥3.3V Can ensure the output power
communication level（V）
3.3
Using 5V TTL may burn out
Working temperature（℃）
-40
-
85
Industrial grade design
Working frequency bandGHz）
850
868/915
930
Support ISM Frequency
Power
consumption
Emission current（mA）
119
instantaneous power consumption
Receives the current（（mA）
6.8
Sleep current（μA）
185
software shut off
Maximum transmitted power（dBm）
21.4
21.5
22.3
Sensitivity of reception（dBm）
-144
-146
-147
air rate is 0.3kbps
air rate（bps）
0.6k
-
300k
User programming control
0.018k
62.5k
User programming control
mainly parameters
Description
Notes
Distance
7000m
Clear and open environment, antenna gain 5dBi, antenna
height 2.5m, air speed 0.3kbps.
FIFO
256Byte
Maximum sending length
Crystal frequency
32MHz

Chengdu Ebyte Electronic Technology Co.,Ltd E22-900M22S User manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
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Modulation method
LoRa(recommend)
Encapsulation way
SMD
Interface
1.27mm
Stamp hole
Communication interface
SPI
0-10Mbps
Modulation method
10* 10*2.5 mm
Antenna interface
Stamp hole/IPEX
The equivalent impedance is about 50 ohms
Chapter 3 machine dimensions and pin definition
Pin number
Pin name
Pin direction
Pin purposes
1
VCC
Power supply, range 1.8V~3.7V (external ceramic filter capacitor
is recommended)
2
GND
Ground wire, connected to the power reference ground
3
NRST
input
Chip reset triggers input pin, active low level
4
NC
5
NC
6
ANT
Radio frequency interface, stamp hole
7
GND
Ground wire, connected to the power reference ground
8
NC
9
TXEN
input
Rf switch transmitting control pin, connected to external
microcontroller IO or DIO2, high level effective
10
RXEN
input
Rf switch receiving control pin, connected to external
microcontroller IO, high level effective
11
BUSY
output
Used for status indication

Chengdu Ebyte Electronic Technology Co.,Ltd E22-900M22S User manual
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12
MISO
output
SPI data output pin
13
MOSI
input
SPI data input pin
14
NSS
input
The module chip selection pin is used to start an SPI
communication
15
SCK
input
SPI clock input pin
16
GND
Ground wire, connected to the power reference ground
17
NC
18
DIO3
Input/output
Configurable universal I/O port
19
DIO2
Input/output
Configurable universal I/O port
20
DIO1
Input/output
Configurable universal I/O port
Chapter 4 Basic operations
4.1 Hardware design
It is recommended to use DC regulated power supply to power the module, the ripple coefficient of the
power supply is as small as possible, and the module must be reliably grounded.
Pay attention to the correct connection of the positive and negative terminals of the power supply, such
as reverse connection may cause permanent damage to the module;
Check the power supply, making sure it's between recommended supply voltages, as exceeding the maximum
value can permanently damage the module.
Check the stability of the power supply, the voltage cannot fluctuate dramatically and frequently;
When designing a power supply circuit for a module, it is often recommended to retain more than 30% margin,
which is conducive to long-term and stable work of the whole machine.
The module should be kept away from parts with high electromagnetic interference, such as power supplies,
transformers, and high-frequency cables.
High-frequency digital cable routing, high-frequency analog cable routing, and power cable routing must
avoid under the module. If necessary, pass under the module, assuming that the module is welded at the Top
Layer, copper is laid on the Top Layer of the contact part of the module (all copper is laid and well grounded),
and it must be near the digital part of the module and wired at the Bottom Layer.
Assuming the module is welded or placed at the Top Layer, arbitrarily wiring at the Bottom Layer or other
layers is also wrong, affecting the module's stray and receiving sensitivity to varying degrees.
Assuming that there are large electromagnetic interference devices around the module will greatly affect
the performance of the module, and according to the strength of the interference suggest to stay away from
the module, if the circumstances allow for appropriate isolation and shielding;
Assuming that there are wires around the module with large electromagnetic interference (high-frequency
digital, high-frequency analog, power cable) will also greatly affect the performance of the module, it is
recommended to stay away from the module according to the strength of the interference, and do appropriate
isolation and shielding if circumstances permit.
Communication lines using 5V level must be connected in series with 1k-5.1k resistors (not recommended,
there is still a risk of damage);
Try to stay away from TTL protocols at the 2.4GHz physical layer, such as USB3.0.

Chengdu Ebyte Electronic Technology Co.,Ltd E22-900M22S User manual
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Antenna installation structure has a great impact on module performance, so make sure the antenna is exposed,
preferably vertically up. When the module is installed inside the enclosure, the antenna extension cable
can be used to extend the antenna outside the enclosure.
The antenna must not be mounted inside a metal shell, which weakens the transmission range.
It is recommended to add a 200R protection resistor to the RXD/TXD of the external MCU.
4.2 Software programming
This module is SX1268/SX1262+PA+LNA, and its driving mode is exactly the same as SX1268/SX1262, users
can operate in accordance with the SX1268/SX1262 chip volume.
DIO1, DIO2 are generic IO ports that can be configured for many functions. DIO2 can be connected with TXEN,
not with the IO port of MCU, and used to control the RF switch emission. See SX1262 manual for details. If
not used, it can be suspended.
Use a DIO3 to power a 32MHz TCXO crystal internally.
Chapter 5 basic application
5.1 Basic circuit

Chengdu Ebyte Electronic Technology Co.,Ltd E22-900M22S User manual
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Chapter 6 FAQ
6.1 Transmission distance is not ideal
When there is a straight-line communication obstacle, the communication distance will decay accordingly.
Temperature, humidity, and co-frequency interference increase the communication packet loss rate.
The ground absorbs and reflects radio waves, which is poor near the ground.
Sea water is extremely capable of absorbing radio waves, making seaside tests less effective.
Antenna near a metal object, or placed in a metal shell, the signal attenuation can be severe;
The power register is incorrectly set, or the air rate is set too high (the higher the air rate, the closer
the distance);
The low voltage of the power supply is lower than the recommended value at room temperature, and the lower
the voltage, the lower the power generation.
The matching degree between the antenna and the module is poor or the quality of the antenna itself is faulty.
6.2 Modules are easily damaged
Check the power supply to make sure it's between recommended supply voltages, as exceeding the maximum value
can permanently damage the module.
Check the stability of the power supply, the voltage shouldn't fluctuate wildly or frequently.
Ensure that high-frequency devices are electrostatic sensitive during installation and use using
anti-static operations.
Ensure that the humidity is not too high during installation and use, as some components are humidity
sensitive.
Do not use the device at too high or too low temperature if there are no special requirements.
6.3 Bit error rate is too high
Stay away from the interference source, or change the frequency and channel to avoid interference.
The clock waveform on the SPI is non-standard. Check whether there is interference on the SPI line, and
the SPI bus should not be too long.
A poor power supply can cause garbled , so ensure the reliability of the power supply.
Poor quality or too long extension wires or feeders will also cause high BER.

Chengdu Ebyte Electronic Technology Co.,Ltd E22-900M22S User manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
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Chapter 7 Welding operation guidance
7.1 Reflow soldering temperature
Profile Feature
curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Minimum preheating
temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheating
temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Warm up time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rate of rise
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Temperature of the
liquid phase
183℃
217℃
Time（tL）Maintained Above（TL）
Time above the liquidus
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average rate of decline
6℃/second max
6℃/second max
Time 25℃to peak temperature
Time from 25 °C to
peak temperature
6 minutes max
8 minutes max

Chengdu Ebyte Electronic Technology Co.,Ltd E22-900M22S User manual
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7.2 Diagram of reflow welding
Chapter 8 Related models
Model
IC
Frequency
Hz
Power dBm
Distance km
Package
Size mm
Antenna
interface
E22-400T22S
SX1268
430M 470M
22
4
SMD
16*26
Stamp
hole/IPEX
E22-400M30S
SX1268
433M 470M
30
12
SMD
24*38.5
Stamp
hole/IPEX
E22-900M30S
SX1262
868M 915M
30
12
SMD
24*38.5
Stamp
hole/IPEX
E22-900M22S
SX1262
868M 915M
22
6.5
SMD
14*20
Stamp
hole/IPEX
E22-400M22S
SX1268
433M 470M
22
6.5
SMD
14*20
Stamp
hole/IPEX

Chengdu Ebyte Electronic Technology Co.,Ltd E22-900M22S User manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
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Chapter 9 Antenna Guide
9.1 Antenna recommendation
Antennas play an important role in the communication process, and often inferior antennas will have a great
impact on the communication system. Therefore, our company recommends some antennas as supporting our
wireless module with excellent performance and reasonable price.
Model
Type
Frequency
Hz
Interface
Gain dBi
height
Feeder
Features
TX868-XP-100
Suker
antenna
868M
SMA-J
3.5
29cm
100cm
Suction cup antenna,
high gain
TX868-JK-20
Rubber
antenna
868M
SMA-J
3
200mm
-
Bendable adhesive rod,
omnidirectional
antenna
TX868-JZ-5
Rubber
antenna
868M
SMA-J
2
50mm
-
Ultra short straight,
omnidirectional
antenna
TX915-XP-100
Suker
antenna
915M
SMA-J
3.5
25cm
100cm
Suction cup antenna,
high gain 益
TX915-JK-20
Rubber
antenna
915M
SMA-J
3
210mm
-
Bendable adhesive rod,
omnidirectional
antenna
TX915-JK-11
Rubber
antenna
915M
SMA-J
2.5
110mm
-
Bendable adhesive rod,
omnidirectional
antenna
TX915-JZ-5
Rubber
antenna
915M
SMA-J
2
50mm
-
Ultra short straight,
omnidirectional
antenna
Revise history
Version
Revise date
Revise notes
maintainer
1.0
2022-10-21
Original version
Yan

Chengdu Ebyte Electronic Technology Co.,Ltd E22-900M22S User manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
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About us
Hotline：[phone]
Tel：[phone]
Support：[e-mail]
Website：https://www.cdebyte.com
Address：Building B5, No. 199, West District Avenue, High-tech West District, Chengdu City, Sichuan
Province