Ebyte E83-2G4M03S User manual

Chengdu Ebyte Electronic Technology Co., Ltd. E83-2G4M03S User Manual
E83-2G4M03S User Manual
nRF5340 2.4GHz BLE 5.2 Module

Chengdu Ebyte Electronic Technology Co., Ltd. E83-2G4M03S User Manual
Copyright ©2012 , Chengdu Ebyte Electronic Technology Co., Ltd.
1
Contents
Disclaimer and Copyright Notice ................................................................................................................................................................. 2
1 Overview ......................................................................................................................................................................................................... 3
1.1 Product introduction .........................................................................................................................................................................3
1.2 Features ............................................................................................................................................................................................... 3
1.3 Application scenarios .......................................................................................................................................................................3
2 Parameters....................................................................................................................................................................................................... 4
2.1 Limit parameters ...............................................................................................................................................................................4
2.2 Working Parameters......................................................................................................................................................................... 4
3 Size and Pin Definition ................................................................................................................................................................................ 6
4 Firmware flashing ..........................................................................................................................................................................................9
4.1 Installation and development environment ................................................................................................................................ 9
4.2 Program burning ............................................................................................................................................................................... 9
5 Developer Notes ..........................................................................................................................................................................................11
5.1 Hardware design and circuit schematic.................................................................................................................................... 11
6 FAQ................................................................................................................................................................................................................ 12
6.1 The transmission distance is not ideal.......................................................................................................................................12
6.2 Module is easily damaged ............................................................................................................................................................12
6.3 Bit error rate is too high ................................................................................................................................................................13
7 Soldering ....................................................................................................................................................................................................... 14
7.1 Reflow temperature ....................................................................................................................................................................... 14
7.2 Reflow Soldering Curve ...............................................................................................................................................................15
8 Similar Models ............................................................................................................................................................................................ 15
9 Standard Packing info ................................................................................................................................................................................16
Revision History ............................................................................................................................................................................................. 16
About ................................................................................................................................................................................................................. 17

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Copyright © 2002 , Chengdu Ebyte Electronic Technology Co., Ltd.
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Disclaimer and Copyright Notice
Information in this document, including URL addresses for reference, is subject to change without
notice. Documentation is provided "as is" without warranty of any kind, including any warranties of
merchantability, fitness for a particular purpose, or non-infringement, and any warranties referred to
elsewhere in any proposal, specification or sample. No responsibility is assumed in this document,
including any liability for infringement of any patent rights arising out of the use of the information
in this document. This document does not hereby grant, by estoppel or otherwise, any license,
express or implied, to use any intellectual property rights.
The test data obtained in this article are all obtained by the Ebyte laboratory test, and the actual
results may be slightly different. All trade names, trademarks and registered trademarks mentioned
herein are the property of their respective owners and are hereby acknowledged.
Ebyte Electronic Technology Co., Ltd.
Note :
Due to product version upgrade or other reasons, the contents of this manual may be changed. Ebyte Electronic
Technology Co., Ltd. reserves the right to modify the contents of this manual without any notice or prompt. This
manual is only used as a guide . Chengdu Ebyte Electronic Technology Co., Ltd. does its best to provide accurate
information in this manual. However, Chengdu Ebyte Electronic Technology Co., Ltd. does not ensure that the
contents of the manual are completely error-free. All statements in this manual , information and advice do not
create any express or implied warranties.

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Copyright © 2002 , Chengdu Ebyte Electronic Technology Co., Ltd.
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1 Overview
1.1 Product introduction
E83-2G4M03S is a small and low-power Bluetooth module developed
by EBT. It uses the nRF5340 RF chip imported from Nordic Company and
supports Bluetooth BLE5.2; The chip has a dual core high-performance
ARM CORTEX-M33 core, uses 32M industrial crystal oscillator, and has
rich peripheral resources such as UART, I2C, I2S, high-speed SPI, QSPI,
USB, ADC, DMA, PWM, PDM, etc; It also supports ZIGBEE, Thread,
NFC, ANT, 802.15.4 and 2.4 GHz proprietary protocols. Please refer to the
pin definitions for details; NRF5340 introduces most of the I/O ports to
facilitate users' all-round development.
E83-2G4M03S is a hardware platform, the module has no program by default, and users need to
develop firmware; please refer to the official Datasheet for nRF5340 chip information, and the
module has maximized the RF characteristics of the chip.
1.2 Features
Ultra-small size, only 16x16mm;
Support BLE5.2;
The maximum transmission power is 3dBm, and the software is adjustable at multiple levels;
Support global license-free ISM 2.4GHz frequency band;
Built-in 32MHz clock crystal oscillator;
Built in dual core high-performance low-power 128/64 MHz ARM ® Cortex ® - M33
processor;
Rich resources, application core: 1MB FLASH, 512KB RAM; Network core: 256KB FLASH,
64KB RAM;
Support 1.7 ~ 5.5V power supply, more than 3.3V power supply can ensure the best
performance;
Industrial-grade standard design, support long-term use at -40 ~ +105 ℃;
Generation 1 IPX interface, external antenna.
Under ideal conditions, the communication distance can reach 170m(Transmission power
0dBm);
Supported protocols: BLE5.2,ZIGBEE, Thread, NFC, ANT, 802.15.4 and 2.4 GHz proprietary
protocols.
The pure hardware platform requires secondary development by the customer.
1.3 Application scenarios
Smart home and industrial sensors, etc.;
Security system, positioning system;
Wireless remote control, drone;
wireless game remote control;
healthcare products;

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Wireless voice, wireless headset;
Automotive industry applications.
Wearable device.
Asset tracking and RTLS.
2 Parameters
2.1 Limit parameters
RF parameters
Model
Remark
Min
Max
Supply voltage (V)
1.7
5.5
More than 5.5V will permanently burn the module
Blocking power (dBm)
-
10
The probability of burning at close distance is small
Working temperature (℃)
-40
+105
Industrial grade
2.2 Working Parameters
The main parameters
performance
Remark
minimum
Typical
value
maximu
m value
Voltage mode
normal voltage mode
1.7
3.3
3.6
≥3.3V can ensure max TX power
high voltage mode
2.5
5
5.5
Communication level (V)
-
3.3
-
Risk of burnout with 5V TTL
Working temperature (℃)
-40
-
+ 10 5
Industrial grade design
Working frequency band (MHz)
2 360
-
2 500
Support ISM band
Emission current
TX only run current
(DC/DC, 3 V) PRF = + 3 dBm
-
5.1
-
mA
TX only run current PRF = +3 dBm
-
12.44
-
mA
TX only run current
(DC/DC, 3 V) PRF = 0 dBm
-
3.7
-
mA
TX only run current PRF = 0 dBm
-
9.1
-
mA
receive current
RX only run current (DC/DC, 3 V)
1 Mbps / 1 Mbps BLE
-
2.7
-
mA
RX only run current LDO,3V,
1 Mbps / 1 Mbps BLE
-
6.7
-
mA
RX only run current (DC/DC, 3 V)
2 Mbps / 2 Mbps BLE
-
3.1
-
mA
RX only run current LDO,3V,
2 Mbps / 2 Mbps BLE
-
7.9
-
mA

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Low power consumption current
-
0.7
-
uA
Transmit power (dBm)
-
0
3
dBm
Receive Sensitivity (dBm)
-104dBm @ BLE 125kbps
long distance mode
-98dBm @ BLE 1Mbps
The main parameters
describe
Remark
reference distance
170m
Transmission power 0dBm,Clear and open
environment, antenna gain 5dBi, height 2.5 meters, air
rate 1Mbps
Crystal frequency
32MHz/32.768KHz
-
supporting agreement
BLE 5.2
-
Communication interface
IO
-
Packaging method
SMD
-
IC full name
nRF5340-QKAA /aQFN™ 94
-
FLASH
1M
-
RAM
512KB _
-
kernel
Dual core 128/64 MHz ARM ®
Cortex ® - M33
-
Dimensions
1 6.0 * 1 6.0mm _
±0.1mm
Antenna interface
Generation 1 IPEX
Equivalent impedance is about 50Ω
product weight
1.2g
±0.1 g

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3 Size and Pin Definition
pin
number
pin name
Pin Orientation
Pin function
1
RESET
enter
Dedicated pin for external reset (see nRF5340 manual for details)
2
SWDIO
input Output
Serial debug interface , serial data input and output (see nRF5340
manual for details)
3
SWDCLK
input Output
Serial debug interface , serial wire clock (see nRF5340 manual
for details)
4
P1.10
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
5
P0.31
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
6
P1.12
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
7
P1.14
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
8
P0.04/AIN0
input Output
Configurable general-purpose IO port ; analog input (see
nRF5340 manual for details)
9
D+
input Output
USB D+; D+ data line directly connected to the UBS bus (see
nRF5340 manual for details)
10
VBUS
enter
USB power supply, range 4.35V-5.5V (see nRF5340 manual for
details)

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11
P0.28/AIN7
input Output
Configurable general-purpose IO port ; analog input (see
nRF5340 manual for details)
12
GND
-
Ground wire, connected to the power reference ground
13
P0.29
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
14
P0.30
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
15
P1.11
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
16
P1.13
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
17
P1.15
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
18
D-
input Output
USB D-; D- data line directly connected to the UBS bus (see
nRF5340 manual for details)
19
GND
-
Ground wire, connected to the power reference ground
20
GND
-
Ground wire, connected to the power reference ground
21
VDD_HV
enter
Power supply, range 2.5V-5.5V (see nRF5340 manual for details)
22
GND
-
Ground wire, connected to the power reference ground
23
VDD_nRF
enter
Power supply, range 1.7V-3.6V (see nRF5340 manual for details)
24
GND
-
Ground wire, connected to the power reference ground
25
P0.00/XL1
input Output
Configurable general IO port ; can be connected to 32KHz crystal
oscillator (see nRF5340 manual for details)
26
P0.01/XL2
input Output
Configurable general IO port ; can be connected to 32KHz crystal
oscillator (see nRF5340 manual for details)
27
P0.02/NFC1
input Output
Configurable general IO port ; NFC antenna interface (see
nRF5340 manual for details)
28
P0.03/NFC2
input Output
Configurable general IO port ; NFC antenna interface (see
nRF5340 manual for details)
29
P1.01
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
30
P1.00
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
31
P0.05/AIN1
input Output
Configurable general-purpose IO port ; analog input (see
nRF5340 manual for details)
32
P0.06/AIN2
input Output
Configurable general-purpose IO port ; analog input (see
nRF5340 manual for details)
33
P0.07/AIN3
input Output
Configurable general-purpose IO port ; analog input (see
nRF5340 manual for details)
34
P1.03/I²C
input Output
Configurable general-purpose IO port ; I²C bus interface (see
nRF5340 manual for details)
35
P1.02/I²C
input Output
Configurable general-purpose IO port ; I²C bus interface (see
nRF5340 manual for details)
36
P0.08/TRACEDATA3/SC
K
input Output
Configurable general-purpose IO port ; trace buffer
TRACEDATA[3]; SPIM4 (see nRF5340 manual for details)

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37
P0.09/TRACEDATA2/MO
SI
input Output
Configurable general-purpose IO port ; trace buffer
TRACEDATA[2]; SPIM4 (see nRF5340 manual for details)
38
P0.10/TRACEDATA1/MIS
O
input Output
Configurable general-purpose IO port ; trace buffer
TRACEDATA[1]; SPIM4 (see nRF5340 manual for details)
39
P0.11/TRACEDATA0/CS
N
input Output
Configurable general-purpose IO port ; trace buffer
TRACEDATA[0]; SPIM4 (see nRF5340 manual for details)
40
P0.13/QSPI0
input Output
Configurable general-purpose IO port ; queue serial peripheral
interface QSPI; (see nRF5340 manual for details)
41
P0.19
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
42
P1.04
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
43
P1.08
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
44
P0.20
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
45
P0.26/AIN5
input Output
Configurable general-purpose IO port ; analog input (see
nRF5340 manual for details)
46
GND
-
Ground wire, connected to the power reference ground
47
GND
-
Ground wire, connected to the power reference ground
48
P0.12/TRACECLK/DCX
input Output
Configurable general-purpose IO port ; tracking buffer clock;
SPIM4 (see nRF5340 manual for details)
49
P0.16/QSPI3
input Output
Configurable general-purpose IO port ; queue serial peripheral
interface QSPI; (see nRF5340 manual for details)
50
P0.21
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
51
P1.06
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
52
P0.14/QSPI1
input Output
Configurable general-purpose IO port ; queue serial peripheral
interface QSPI; (see nRF5340 manual for details)
53
P0.24
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
54
P0.22
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
55
GND
-
Ground wire, connected to the power reference ground
56
GND
-
Ground wire, connected to the power reference ground
57
P0.23
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
58
P1.05
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
59
P0.25/AIN4
input Output
Configurable general-purpose IO port ; analog input (see
nRF5340 manual for details)
60
P0.27/AIN6
input Output
Configurable general-purpose IO port ; analog input (see
nRF5340 manual for details)
61
P0.17/QSPI_CLK
input Output
Configurable general-purpose IO port ; queue serial peripheral

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interface QSPI; (see nRF5340 manual for details)
62
P0.15/QSPI2
input Output
Configurable general-purpose IO port ; queue serial peripheral
interface QSPI; (see nRF5340 manual for details)
63
P0.18/QSPI_CS
input Output
Configurable general-purpose IO port ; queue serial peripheral
interface QSPI; (see nRF5340 manual for details)
64
P1.09
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
65
P1.07
input Output
Configurable general-purpose IO port (see nRF5340 manual for
details)
4 Firmware flashing
4.1 Installation and development environment
1. Download SDK
The nFR5340 only supports nrfconnect sdk
Official download link:
https://academy.nordicsemi.com/lessons/lesson-1-nrf-connect-sdk-introduction/
For detailed environment installation tutorial, please refer to Nordic official:
https://academy.nordicsemi.com/topic/exercise-1-1/
2. Chip manual
Official download link:
https://infocenter.nordicsemi.com/index.jsp?topic=%2Fstruct_nrf53%2Fstruct%2Fnrf5340.html
4.2 Program burning

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No.
keywords
Precautions
1
Flashing
program
1. The module is built with ARM microcontroller, and the J-LINK downloader is used for program downloading.
Serial port or any other JTAG, ISP or ICP tools cannot be used.
2. Use the Programmer tool in the official burning tool nRF Connect Desktop to burn the program, or use the
VSCODE tool to burn the program. The official website tool can be downloaded at:
https://www.nordicsemi.com/Products/Development-tools/nrf-connect-for-desktop
2
Ebyte EVB
Not available for the moment.

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5 Developer Notes
5.1 Hardware design and circuit schematic
It is recommended to use a DC regulated power supply to supply power to the module, the
power supply ripple coefficient should be as small as possible, and the module should be reliably
grounded;
Please pay attention to the correct connection of the positive and negative poles of the power
supply, such as reverse connection may cause permanent damage to the module;
Please check the power supply to ensure that it is between the recommended supply voltages, if
exceeding the maximum value will cause permanent damage to the module;
Please check the stability of the power supply, the voltage should not fluctuate greatly and
frequently;
When designing the power supply circuit for the module, it is often recommended to reserve
more than 30% of the margin, so that the whole machine can work stably for a long time;
The module should be kept away from parts with large electromagnetic interference such as
power supply, transformer, and high-frequency wiring as far as possible;
High-frequency digital traces, high-frequency analog traces, and power traces must be avoided
under the module. If it is absolutely necessary to pass under the module, assuming that the
module is soldered on the Top Layer, the top layer of the contact part of the module should be

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covered with ground copper (all copper). And well grounded), it must be close to the digital part
of the module and routed on the Bottom Layer;
Assuming that the module is soldered or placed on the Top Layer, it is also wrong to arbitrarily
route wires on the Bottom Layer or other layers, which will affect the stray and receiving
sensitivity of the module to varying degrees;
Assuming that there are devices with large electromagnetic interference around the module, it
will also greatly affect the performance of the module. It is recommended to stay away from the
module according to the intensity of the interference. If the situation allows, appropriate
isolation and shielding can be done;
Assuming that there are traces with large electromagnetic interference around the module
(high-frequency digital, high-frequency analog, power traces), it will also greatly affect the
performance of the module. It is recommended to stay away from the module according to the
intensity of the interference. isolation and shielding;
If the communication line uses 5V level, a 1k-5.1k resistor must be connected in series (not
recommended, there is still a risk of damage);
Try to stay away from some TTL protocols whose physical layer is also 2.4GHz, for example:
USB3.0;
The antenna installation structure has a great influence on the performance of the module. Make
sure that the antenna is exposed, preferably vertically upward. When the module is installed
inside the casing, a high-quality antenna extension cable can be used to extend the antenna to the
outside of the casing;
The antenna must not be installed inside the metal shell, which will greatly reduce the
transmission distance.
6 FAQ
6.1 The transmission distance is not ideal
When there is a straight-line communication obstacle, the communication distance will be correspondingly
attenuated;
Temperature, humidity, and co-channel interference will increase the communication packet loss rate;
The ground absorbs and reflects radio waves, and the test effect close to the ground is poor;
Seawater has a strong ability to absorb radio waves, so the seaside test effect is poor;
If there is a metal object near the antenna, or placed in a metal shell, the signal attenuation will be very serious;
The power register is set incorrectly, and the air rate is set too high (the higher the air rate, the closer the distance);
The low voltage of the power supply at room temperature is lower than the recommended value, and the lower the
voltage, the lower the output power;
The antenna and the module are poorly matched or the quality of the antenna itself is a problem.
6.2 Module is easily damaged
Please check the power supply to ensure that it is between the recommended supply voltages, if exceeding the
maximum value will cause permanent damage to the module;

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Please check the stability of the power supply, the voltage should not fluctuate greatly and frequently;
Please ensure anti-static operation during installation and use, and high-frequency components are electrostatically
sensitive;
Please ensure that the humidity during installation and use should not be too high, and some components are
humidity-sensitive devices;
If there is no special requirement, it is not recommended to use it at too high or too low temperature.
6.3 Bit error rate is too high
There is co-frequency signal interference nearby, stay away from the interference source or modify the frequency and channel to
avoid interference;
If the power supply is not ideal, it may also cause garbled characters. Be sure to ensure the reliability of the power supply;
Poor quality or too long extension cables and feeders can also cause high bit error rates.

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7 Soldering
7.1 Reflow temperature
Reflow Profile Characteristics
Leaded process assembly
Lead-free process assembly
Preheat/Keep Warm
lowest temperature
（Tsmin）
100℃
150℃
maximum temperature
（TSMDx）
150℃
200℃
time（Tsmin~Tsmin）
60-120 seconds
60-120 seconds
Heating slope（TL~Tp）
3°C/sec, max
3°C/sec, max
liquidus temperature（TL）
183℃
217℃
Hold time above TL
60~90 seconds
60~90 seconds
Package body peak temperature Tp
The user cannot exceed the
temperature indicated on the
product's "Moisture Sensitivity"
label
The user cannot exceed the
temperature indicated on the
product's "Moisture Sensitivity"
label
Time (Tp) within 5°C of the specified
grading temperature (Tc), see the figure
below
20 seconds
30 seconds
cooling slope（Tp~TL）
6°C/sec, max
6°C/sec, max
Time from room temperature to peak
temperature
6 minutes, maximum
8 minutes, maximum
※The peak temperature (Tp) tolerance definition of the temperature profile is the upper limit of the user

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7.2 Reflow Soldering Curve
8 Similar Models
Product number
Chip solution
carrier
frequency
Hz
transmit
power
dBm
Bluetooth
protocol
BLE
Product Size
mm
Package form
Antenna form
E73-2G4M04S1
A
nRF52810
2.4G
4
4.2/5.0
17.5*28.7
patch
PCB/IPX
E73-2G4M04S1
B
nRF52832
2.4G
4
4.2/5.0
17.5*28.7
patch
PCB/IPX
E83-2G4M03S
nRF5340
2.4G
3
4.2/5.0
16 * 16
patch
Ceramic
Antenna
E73-2G4M04S1
D
nRF51822
2.4G
4
4.2
17.5*28.7
patch
PCB/IPX

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9 Standard Packing info
Revision History
Version
revision date
Revision Notes
Maintenance man
1.0
2022-09-29
initial version
Bin
1.1
2023-02-23
Error correction
Bin

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About
Sales Hotline: [phone] Company Tel: [phone]
Technical support: [e-mail] Official website: https://www.cdebyte.com
Company address: Building B5, 199 West Avenue, Gaoxin West District, Chengdu City,
Sichuan Province, China