Laird BT830-SA Quick setup guide

Bluetooth v4.0 Dual-Mode UART HCI Module
Hardware Integration Guide (HIG)
Version 1.3
BT830 - SA BT830 - ST
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BT830 Hardware Integration Guide
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REVISION HISTORY
Revision
Date
Changes
Approved By
1.0
23 July 2014
Initial Version
Jonathan Kaye
1.1
10 Nov 2014
Updated pin definitions
Jonathan Kaye
1.2
10 Aug 2015
Added Tape/Reel information
Jonathan Kaye
1.3
30 Sept 2015
Added additional antenna information
Andrew Chen

BT830 Hardware Integration Guide
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CONTENTS
Revision History.....................................................................................................................................................2
Contents ................................................................................................................................................................3
Scope......................................................................................................................................................................5
Operational Description .......................................................................................................................................5
Features and Benefits ..........................................................................................................................................5
Application Areas ................................................................................................................................................5
Block Diagram and Descriptions...........................................................................................................................6
Specifications.........................................................................................................................................................7
Pin Definitions.......................................................................................................................................................8
DC Electrical Characteristic .................................................................................................................................10
RF Characteristics.................................................................................................................................................11
Interface ..............................................................................................................................................................12
PIO....................................................................................................................................................................12
WLAN Coexistence Interface..............................................................................................................................12
UART Interface ..................................................................................................................................................13
PCM Interface ...................................................................................................................................................13
GCI Interface .....................................................................................................................................................15
Slots and Sample Formats..................................................................................................................................16
PCM Timing Information .....................................................................................................................................17
PCM Slave Timing..............................................................................................................................................19
PCM Slave Mode Timing Parameters..................................................................................................................19
PCM_CLK and PCM_SYNC Generation ..............................................................................................................20
PCM Configuration ...........................................................................................................................................21
Digital Audio Interface (I²S) ................................................................................................................................21
Power Supply and Regulation ............................................................................................................................23
Voltage Regulator Enable and Reset...................................................................................................................23
Power Sequencing.............................................................................................................................................24
Antenna Performance.........................................................................................................................................24
Multilayer Chip Antenna....................................................................................................................................24
NanoBlade.........................................................................................................................................................26
Mechanical Dimensions and Land Pattern.........................................................................................................26
BT830-SA Mechanical Drawing..........................................................................................................................26
BT830-ST Mechanical Drawing ..........................................................................................................................28

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Implementation Note .........................................................................................................................................29
PCB Layout on Host PCB....................................................................................................................................29
Application Note for Surface Mount Modules ..................................................................................................30
Introduction ......................................................................................................................................................30
Shipping............................................................................................................................................................30
Reflow Parameters.............................................................................................................................................32
FCC and IC Regulatory ........................................................................................................................................34
Documentation Requirements............................................................................................................................34
European Union Regulatory...............................................................................................................................37
EU Declarations of Conformity...........................................................................................................................37
BT830-SA and BT830-ST....................................................................................................................................37
Ordering Information .........................................................................................................................................38
General Comments ...........................................................................................................................................38
Bluetooth SIG Approvals.....................................................................................................................................39
Application Note: Subsystem Combinations .......................................................................................................39
Additional Assistance.........................................................................................................................................40

BT830 Hardware Integration Guide
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SCOPE
This document describes key hardware aspects of the Laird BT830 Bluetooth HCI modules. This document is intended
to assist device manufacturers and related parties, with the integration of this module into their host devices. Data in
this document are drawn from a number of sources including data sheets for the CSR8811.
Because the BT830 is currently in development stage, this document is preliminary and the information in this
document is subject to change. Please contact Laird Technologies or visit the Laird website at www.lairdtech.com to
obtain the most recent version of this document.
OPERATIONAL DESCRIPTION
The BT830 series of UART HCI devices are designed to meet the needs of OEMs adding
robust Bluetooth connectivity and using embedded Bluetooth stacks within their
products.
Leveraging the market-leading CSR8811 chipset, the BT830 series provides exceptionally
low power consumption with outstanding range. Supporting the latest Bluetooth v4.0
specification with EDR (Enhanced Data Rate), the Laird BT830 series enables OEMs to
accelerate their development time for leveraging either Classic Bluetooth or Bluetooth
Low Energy (BLE) into their operating system-based devices.
With a footprint as small as 8.5 x 13 mm, yet output power at 7 dBm, these modules are
ideal for applications where designers need high performance in minimal size. For maximum
flexibility in systems integration, the modules are designed to support a UART interface plus
GPIO and additionally I2S and PCM audio interfaces.
These modules present an HCI interface and have native support for Windows and Linux
Bluetooth software stacks. All BT830 series devices are fully qualified as Bluetooth Hardware Controller Subsystem
products. This allows designers to integrate their existing pre-approved Bluetooth host and profile subsystem stacks
to gain a Bluetooth END product approval for their products.
The BT830 series is engineered to provide excellent RF performance with integrated antenna and additional band pass
filters. It further reduces regulatory and testing requirements for OEMs and ensures a hassle free development cycle.
A fully featured, low-cost developer’s kit is available for prototyping, debug, and integration testing of the BT830
series modules and further reduces risk and time in development cycles.
BT830-SA
BTv4.0 Dual Mode UART HCI Module (Integrated Antenna)
BT830-ST
BTv4.0 Dual Mode UART HCI Module (SMT Pad for External Antenna)
Features and Benefits
Application Areas
Bluetooth v4.0 - dual mode (Classic Bluetooth and BLE)
Compact footprint
3-wire Wi-Fi coexistence scheme
High antenna radiation gain and efficiency
Good interference rejection for multi-com system (GSM/WCDMA)
Class 1 output –7 dBm
UART, GPIO, I2S, and PCM
Industrial temperature range
Bluetooth hardware controller subsystem
FCC, IC, and CE approvals
Host Wake up
Medical devices
ePOS terminals
Barcode scanners
Industrial cable replacement
M2M connectivity
Automotive Diagnostic Equipment
Personal Digital Assistants (PDA)
Bluetooth HID device (keyboard,
mouse, and joystick)
BT830-SA module
BT830 –ST module

BT830 Hardware Integration Guide
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BLOCK DIAGRAM AND DESCRIPTIONS
Figure 2: BT830 module block diagram
CS8811A08
(Main chip)
The BT830 is based on the CSR8811A08 dual mode chip. The chip is a single-chip radio with
on-chip LDO regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to 3 Mbps.
Dedicated signal and baseband processing is included for full Bluetooth operation. The chip
provides PCM/I2S and UART interfaces. Up to four general purpose I/Os are available for general
use such as Wi-Fi coexistence or general indicators.
Note: The purpose of the SPI interface is to access the module’s inner settings such as selecting
different WLAN CO-EXIST scheme. The SPI interface can also be used to place the module in
RF test mode. You cannot use the module over the SPI interface for normal operation as the
main host interface.
Antenna
Options
BT830-SA –The antenna is a ceramic monopole chip antenna.
BT830-ST –Provides a SMT pad for connecting an external antenna.
Band Pass
Filter
The band pass filter filters the out-of-band emissions from the transmitter to meet the specific
regulations for type approvals of various countries.
Crystal
The embedded 26 MHz crystal is used for generating the clock for the entire module.

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SPECIFICATIONS
Table 1: BT830 specifications
CATEGORIES
FEATURE
IMPLEMENTATION
Wireless Specification
Bluetooth®
V4.0 Dual Mode
Frequency
2.402 - 2.480 GHz
Maximum Transmit
Power
Class 1
+7 dBm from antenna
Receive Sensitivity
-89 dBm
Range
Circa 100 meters
Data Rates
Up to 3 Mbps (over the air)
Host Interface
UART
RX, TX, CTS, RTS
GPIO
Six configurable lines
(1.8V/3.3V configurable by VDD_PADS)
Operational Modes
HCI
Host Controller Interface over UART
Coexistence
802.11 (Wi-Fi)
3 wire CSR schemes supported
(Unity-3 and Unity-3e)
Supply Voltage
Supply
3.3V +/-10%
Note: See Implementation Note for details on different DC
power selections on the BT830.
Power Consumption
Current
Idle Mode ~4.3 mA (Master; ACL link; No traffic)
File Transfer ~7.1 mA (Master; ACL link; Transmit)
Antenna Option
Internal (BT830-SA)
External (BT830-ST)
Multilayer ceramic antenna with up to 40% efficiency.
SMT pad for external antenna
Physical
Dimensions
8.5 x 13 x 1.6 mm (BT830 - module)
Environmental
Operating
-30°C to +85°C
Storage
-40°C to +85°C
Miscellaneous
Lead Free
Lead-free and RoHS compliant
Warranty
5-Year Limited Lifetime
Approvals
Bluetooth®
Hardware Controller Subsystem Approved
FCC / IC / CE
All BT830 series (BT830-SA; BT830-ST)

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PIN DEFINITIONS
Table 2: BT830 pin definitions
#
Pin Name
I/O
Supply
Domain
Description
If
Unused…
1
VDD_PADS
DC voltage input
(1.75V-3.6V)
Positive DC supply for configuring
digital I/O level.
N/A
2
GND
GND
-
Ground
GND
3
PIO2
Bidirectional,
tri-state, with
weak internal pull-
down
VDD_PADS
Programmable input/output line
NC
4
UART_RTS
Bidirectional,
tri-state,
with weak internal
pull-up
VDD_PADS
UART request to send, active low
NC
5
UART_TX
Bidirectional,
tri-state,
with weak internal
pull-up
VDD_PADS
UART data output, active high
NC
6
UART_CTS
Bidirectional,
tri-state,
with weak internal
pull-up
VDD_PADS
UART clear to send, active low
NC
7
UART_RX
Bidirectional,
tri-state,
with weak internal
pull-up
VDD_PADS
UART data input, active high
NC
8
VREG_EN_RST#
Input with strong
internal pull-down
VDD_PADS
Take high to enable internal
regulators. Also acts as active low
reset. Maximum voltage is
VDD_PADS.
N/A
9
VREG_IN_HV
Analogue
regulator input
3.3V
Module main DC power supply;
Input to internal high-voltage
regulator
N/A
10
VREG_OUT_HV
Analogue
regulator
input/output
1.8V
Output from internal high-voltage
regulator and input to low-voltage
internal regulators.
N/C
11
GND
GND
-
Ground
GND
12
GND
GND
-
Ground
GND
13
GND
GND
-
Ground
GND
14
GND
GND
-
Ground
GND
15
GND
GND
-
Ground
GND
16
GND
GND
-
Ground
GND
17
RF
BT830-ST –RF signal out (50 ohm)
BT830-SA –No connection

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#
Pin Name
I/O
Supply
Domain
Description
If
Unused…
18
GND
GND
-
Ground
GND
19
PCM_SYNC/
SPI_CS#/
PIO23
Bidirectional,
tri-state, with
weak internal
pull-down
VDD_PADS
PCM synchronous data sync SPI chip
select, active low programmable
input/output line
*See Note 1.
NC
20
PCM_CLK/
SPI_CLK/ PIO24
Bidirectional,
tri-state, with
weak internal
pull-down
VDD_PADS
PCM synchronous data clock
SPI clock
Programmable input/output line
*See Note 1.
NC
21
PCM_IN/
SPI_MOSI/
PIO21
Input, tri-state,
with weak internal
pull- down
VDD_PADS
PCM synchronous data input
SPI data input
Programmable input/output line
*See Note 1.
NC
22
PCM_OUT/
SPI_MISO/
PIO22
Output, tri-state,
with weak internal
pull- down
VDD_PADS
PCM synchronous data output
SPI data output
Programmable input/output line
*See Note 1.
NC
23
GND
GND
-
Ground
GND
24
PIO0/
32K_CLK_IN
Bidirectional,
tri-state, with
weak internal pull-
down
VDD_PADS
Programmable input/output line and
32kHz sleep clock input
NC
25
PIO1/
BT_ACTIVE
Bidirectional,
tri-state, with
weak internal pull-
down
VDD_PADS
Programmable input/output line;
Wi-Fi and BT 3-wire coexistance
NC
26
PIO9/
BT_PRIORITY
Bidirectional,
tri-state, with
weak internal pull-
down
VDD_PADS
Programmable input/output line;
Wi-Fi and BT 3-wire coexistance
NC
27
PIO4/
WLAN_ACTIVE
Bidirectional,
tri-state, with
weak internal pull-
down
VDD_PADS
Programmable input/output line;
Wi-Fi and BT 3-wire coexistance
NC
28
SPI_PCM#_SEL
Input with weak
internal pull-down
VDD_PADS
Control line to select SPI or PCM
interface, high = SPI, low = PCM
*See Note 1.
NC
29
PIO3/
Host Wake up
Bidirectional,
tri-state, with
weak internal pull-
down
VDD_PADS
Programmable input/output line;
Host wake up from BT, active High.
NC
30
GND
GND
-
Ground
GND
Note 1: The purpose of the SPI interface is to access the module’s inner settings such as selecting different WLAN
CO-EXIST scheme. The SPI interface can also be used to put the module in RF test mode. You cannot use
module over the SPI interface for normal operation as the main host interface.

BT830 Hardware Integration Guide
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DC ELECTRICAL CHARACTERISTIC
Table 3: Absolute maximum ratings
Rating
Min
Max
Unit
Storage temperature
-40
+85
⁰C
VREG_IN_HV
2.3
4.8
V
VREG_OUT_HV
1.7
2.0
V
VDD_PADS
-0.4
3.6
V
Other terminal voltages
-0.4
VDD_PADS + 0.4 V
V
Table 4: Recommended operating conditions
Rating
Min
Max
Unit
Operating temperature
-30
+85
⁰C
VREG_IN_HV
3.0
3.6
V
VREG_OUT_HV
1.75
1.95
V
VDD_PADS
1.75
3.6
V
VREG_EN_RST#
VDD_PADS
VDD_PADS
V
Table 5: High-voltage Linear Regulator
Normal Operation
Min
Typ
Max
Unit
Input voltage (VREG_IN_HV)
3.0
3.3
3.6
V
Output voltage (VREG_OUT_HV)
1.75
1.85
1.95
V
Temperature coefficient
-200
-
200
ppm/⁰C
Output noise
(frequency range 100Hz to100kHz)
-
-
0.4
mV rms
Settling time (settling time
within 10% of final value)
-
-
5
µs
Output current
-
-
100
mA