Ebyte E73-2G4M04S1F User manual

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M04S1F User manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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E73-2G4M04S1F User Manual
RF52811 2.4GHz BLE5.1/IEEE 802.15.4-2006 BLE Module

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M04S1F User manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
1
Contents
DISCLAIMER...................................................................................................................................................................... 2
1. OVERVIEW......................................................................................................................................................................3
1.1 INTRODUCTION (图片需更换)...................................................................................................................................... 3
1.2 FEATURES...................................................................................................................................................................... 3
1.3 APPLICATION..................................................................................................................................................................3
2. SPECIFICATION AND PARAMETER.........................................................................................................................4
2.1 LIMIT PARAMETER......................................................................................................................................................... 4
2.2 OPERATING PARAMETER................................................................................................................................................ 4
3. SIZE AND PIN DEFINITION.........................................................................................................................................5
4. BASIC OPERATION....................................................................................................................................................... 7
4.1 HARDWARE DESIGN.......................................................................................................................................................7
4.2 SOFTWARE PROGRAMMING........................................................................................................................................... 7
5. FAQ.................................................................................................................................................................................... 8
5.1 COMMUNICATION RANGE IS TOO SHORT........................................................................................................................8
5.2 MODULE IS EASY TO DAMAGE.......................................................................................................................................9
5.3 HIGH BIT ERROR RATE................................................................................................................................................... 9
6. WELDING OPERATION GUIDANCE......................................................................................................................... 9
6.1 REFLOW SOLDERING TEMPERATURE............................................................................................................................. 9
6.2 REFLOW SOLDERING CURVE....................................................................................................................................... 10
7. RELATED MODEL....................................................................................................................................................... 10
7.1 E73 HARDWARE MODULE...........................................................................................................................................10
7.2 E104 PROTOCAL MODULE.......................................................................................................................................... 10
8. ANTENNA TYPE........................................................................................................................................................... 11
8.1 ANTENNA RECOMMENDATION......................................................................................................................................11
8.2 ANTENNA.....................................................................................................................................................................11
9. BATCH PACKAGING...................................................................................................................................................11
REVISION HISTORY....................................................................................................................................................... 12
ABOUT US.......................................................................................................................................................................... 12

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M04S1F User manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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Disclaimer
The information in this document, including the URL address for reference, is subject
to change without notice. The document is provided "as is" without any guarantee
responsibility, including any guarantee for marketability, suitability for a specific
purpose, or non-infringement, and any guarantee for any proposal, specification or
sample mentioned elsewhere. This document does not bear any responsibility,
including the responsibility for infringement of any patent rights caused by the use of
the information in this document. This document does not grant any license for the use
of intellectual property rights in estoppel or other ways, whether express or implied.
The test data obtained in the article are all obtained by the Ebyte laboratory, and
the actual results may vary slightly.
We hereby declared that all brand names, trademarks and registered trademarks
mentioned in this document are the property of their respective owners.
The final interpretation right belongs to Chengdu Ebyte Electronic Technology Co.,
Ltd.
Notice :
Due to product version upgrades or other reasons, the contents of this manual may be changed. Ebyte
Electronic Technology Co., Ltd. reserves the right to modify the contents of this manual without any
hint or noticet. This manual is only used as a guide. Chengdu Ebyte Electronic Technology Co., Ltd.
makes every effort to provide accurate information in this manual. However, we does not guarantee
that the contents of the manual are completely free of errors. All statements, information and
suggestions in this manual do not constitute any express or implied guarantee.

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M04S1F User manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
3
1. Overview
1.1 Introduction
E73-2G4M04S1F is a small volume chip Bluetooth wireless module
independently developed based on nrf52811 chip of Nordic of Norway. It
adopts 32mhz industrial crystal oscillator to ensure its industrial
characteristics and stable performance.
NRF52811 comes with high-performance ARM CORTEX-M4 core,
IEEE 802.15.4-2006 RF transceiver and protocol stack of BLE 5.1.
Especially the direction finding function, pushing Bluetooth positioning to
a new height. It has rich peripheral resources such as UART, I2C, SPI,
ADC, DMA, PWM, etc. The module leads out almost all IO ports. Please check the pin definition for details, so as to
facilitate users to carry out multi-directional development. The module can be connected with other antennas through
IPEX.
Because the module is a pure hardware SOC module, it can be used only after the user programs it.
1.2 Features
Support BLE 5.1, all functions of bluetooth 5 and IEEE 802.15.4-2006;
Maximum transmission power is 2.5mW, is is multi-level adjustable by software;
Built-in 32.768 kHz clock crystal oscillator;
Support for the global license-free ISM 2.4GHz band;
Built in Cortex-M4 core processor with high performance and low power consumption;
Rich resources, 192KB FLASH, 24KB RAM;
Support 1.8V~3.6V power supply, more than 3.3V power supply can guarantee the best performance;
Industrial grade standard design, can work under -40 ~ 85 °C for a long time;
Under ideal conditions, the communication distance can reach 100m.
1.3 Application
Smart home and industrial sensors；
Security system and positioning system;
Wireless remote control, UAV；
Wireless Game Remote Controller；
Health care products；
Wireless voice, wireless headset；
Automotive industry applications.

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M04S1F User manual
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2. Specification and parameter
2.1 Limit parameter
Main parameter
Performance
Remark
Min.
Max.
Power supply（V）
0
3.6
Voltage over 3.6V will cause permanent
damage to module
Blocking power（dBm）
-
10
Chances of burn is slim when modules are
used in short distance
Operating temperature（℃）
-40
85
Industrial grade
2.2 Operating parameter
Main parameter
Performance
Remark
Min.
Typ.
Max.
Operating voltage（V）
1.8
3.3
3.6
≥3.3 V can ensures output power
Communication level（V）
-
3.0
-
For 5V TTL, it may be at risk of burning
down
Operating temperature（℃）
-40
-
85
Industrial design
Operating frequency（MHz）
2379
2430
2496
Support ISM band
Power
consumption
TX current（mA）
-
18
-
Instant power consumption
RX current（mA）
-
13
-
-
Sleep current （μA）
-
2
-
Software is shut down
Max Tx power（dBm）
3.8
4
4.1
-
Receiving sensitivity（dBm）
-104dBm @ BLE 125kbps
Long ditance mode
-97dBm @ BLE 1Mbps
-
Main parameter
Description
Remark
Distance for reference
120m
Test condition：clear and open area, antenna gain: 5dBi，
antenna height: 2.5m，air data rate: 1Mbps
Crystal frequency
32MHz / 32.768KHz
Support protocal
BLE 5.1/IEEE 802.15.4-2006
Package
SMD
Connector
1.27mm
IC
nRF52811-QFAA/QFN48
FLASH
192KB
RAM
24KB
kernel
ARM CORTEX-M4
Size
17.5 * 23.5 mm
Antenna
PCB/IPEX
Default PCB antenna; Impedance is about 50 ohms

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3. Size and pin definition
No.
Pin
Pin direction
Description
0
GND
Input
Ground, connected to reference ground of power
1
GND
Input
Ground, connected to reference ground of power
2
GND
Input
Ground, connected to reference ground of power
3
DEC2
-
1.3 V digital power decoupling regulator (see chip manual for details)
4
DEC3
-
Power supply decoupling (see chip manual for details)
5
P0.25
Input/Output
MCU GPIO
6
P0.26
Input/Output
MCU GPIO
7
P0.27
Input/Output
MCU GPIO
8
P0.28
Input/Output
MCU GPIO
9
P0.29
Input/Output
MCU GPIO

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Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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10
P0.30
Input/Output
MCU GPIO
11
P0.31
Input/Output
MCU GPIO
12
DEC4
1.3 V digital power decoupling regulator (see chip manual for details)
Input from DC/DC regulator, output from 1.3 V LDO
13
DCC
-
DC / DC regulator output (see chip manual for details)
14
DEC1
-
0.9 V digital power decoupling regulator (see chip manual for details)
15
GND
Input
Ground, connected to reference ground of power
16
VCC
Input
Power supply 1.8 ~ 3.6V DC（Note: The voltage higher 3.6V is forbidden）
17
P0.02
Input/Output
MCU GPIO
18
P0.03
Input/Output
MCU GPIO
19
P0.04
Input/Output
MCU GPIO
20
P0.05
Input/Output
MCU GPIO
21
P0.06
Input/Output
MCU GPIO
22
P0.07
Input/Output
MCU GPIO
23
P0.08
Input/Output
MCU GPIO
24
P0.09
Input/Output
MCU GPIO
25
P0.10
Input/Output
MCU GPIO
26
P0.11
Input/Output
MCU GPIO
27
P0.12
Input/Output
MCU GPIO
28
P0.13
Input/Output
MCU GPIO
29
P0.14
Input/Output
MCU GPIO
30
P0.15
Input/Output
MCU GPIO
31
P0.16
Input/Output
MCU GPIO
32
P0.17
Input/Output
MCU GPIO
33
P0.18
Input/Output
MCU GPIO
34
P0.19
Input/Output
MCU GPIO
35
P0.20
Input/Output
MCU GPIO
36
P0.21
Input/Output/RST
MCU GPIO
37
SWDCLK
Input
Serial Line Debugging / Clock Input Debugging and Programming
38
SWDIO
Input
Serial line debugging and programming debugging
39
P0.22
Input/Output
MCU GPIO
40
P0.23
Input/Output
MCU GPIO
41
P0.24
Input/Output
MCU GPIO
42
GND
Input
Ground, connected to reference ground of power
43
GND
Input
Ground, connected to reference ground of power

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M04S1F User manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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4. Basic Operation
4.1 Hardware Design
It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple
coefficient is as small as possible, and the module needs to be reliably grounded.
Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse
connection is connected, the module may be permanently damaged.
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged.
Please check the stability of the power supply, the voltage can not be significantly frequent.
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, and the whole machine is beneficial for long-term stable operation.
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.
High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If
it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is
spread on the Top Layer of the module contact part(All copper-covered and well grounded), and must be close to
the digital part of the module and routed in the Bottom Layer.
Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or
other layers, which will affect the module's spurs and receiving sensitivity to varying degrees.
Assume that there are traces with large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to
stay away from the module according to the strength of the interference. If possible, you can do it properly. Isolation
and shielding
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage).
Try to stay away from some physical layers and also have a 2.4GHz TTL protocol, for example: USB3.0
The antenna mounting structure has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside of the case.
The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.
4.2 Software Programming
The core of this module is nRF52811, which is completely equivalent to nRF52811. Users can operate according to
the nRF52811 chip manual (see nRF52811 manual for details).
Because the officially provided programming tool nRFgo Studio has poor compatibility, it is recommended to use
J-LINK-V8 or above for program burning.
About the issue that the old model can be programmed, while the new model can't be programmed, It is because the
new model being added with read/write protection during production. It needs to be properly connected to the line
and then use the official nRFgo Studio for Recover (Jlink supports the official nRFgo). Studio), as shown below:

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M04S1F User manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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5. FAQ
5.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is,
the lower the transmitting power is.
Due to antenna quality or poor matching between antenna and module.

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5.2 Module is easy to damage
Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will
lead to a permanent damage to the module.
Please check the stability of power supply and ensure the voltage not to fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range for some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
5.3 High bit error rate
There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel
to avoid interference.
The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus
line should not be too long.
Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.
If the extension cable or feeder is of poor quality or too long, the bit error rate will be high.
6. Welding operation guidance
6.1 Reflow Soldering Temperature
Profile Feature
Curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Minimum preheating temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheating temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temperature
183℃
217℃
Time（tL）Maintained Above（TL）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate（Tp to
Tsmax）
Average descent rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time of 25 ° C to peak temperature
6 minutes max
8 minutes max

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6.2 Reflow Soldering Curve
7. Related Model
7.1 E73 Hardware Module
7.2 E104 Protocal Module
Model
Chip
Proyocol
Size
Antenna
Features
E104-BT5005A
nRF52805
BLE5.0
9*9mm
Ceramic
master-slave integrated module, small size
Model
Chip
Proyocol
FLASH
RAM
TX
Size
Antenna
E73-2G4M04S1F
nRF52811
BLE5.1/IEEE
802.15.4-2006
192KB
24KB
4dBm
17.5*28.7mm
PCB/IPEX
E73-2G4M04S1FX
nRF52811
BLE5.1/IEEE
802.15.4-2006
192KB
24KB
4dBm
17.5*28.7mm
IPEX
E73-2G4M04S1B
nRF52832
BLE4.2/5.0
512KB
64KB
4dBm
17.5*28.7mm
PCB/IPEX
E73-2G4M04S1BX
nRF52832
BLE4.2/5.0
512KB
64KB
4dBm
17.5*28.7mm
IPEX
E73-2G4M08S1C
nRF52840
BLE4.2/5.0
1024KB
256KB
8dBm
13*18mm
Ceramic
E73-2G4M08S1CX
nRF52840
BLE4.2/5.0
1024KB
256KB
8dBm
13*18mm
IPEX
E73-2G4M04S1D
nRF52822
BLE4.2
256KB
16KB
4dBm
17.5*28.7mm
PCB/IPEX
E73-2G4M08S1E
nRF52833
BLE5.1、BLE Mesh、
Thread、Zigbee
512KB
128kB
8dBm
13*18mm
Ceramic

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E104-BT5010A
nRF52810
BLE5.0
11.5*16mm
Ceramic
master-slave integrated module
E104-BT5011A
nRF52810
BLE5.1
11.5*16mm
Ceramic
master-slave integrated module, support
Long Range
E104-BT5032A
nRF52832
BLE5.0
11.5*16mm
Ceramic
Multi-master and multi-slave coexistence
E104-BT5040U
nRF52840
BLE4.2/5.0
59*18mm
PCB
USB Dongle，support nRF Connect
E104-BT5040UA
nRF52840
BLE4.2/5.0
59*18mm
PCB
USB Dongle，support BLE5.0 packet
capture
8. Antenna Type
8.1 Antenna recommendation
The antenna plays an important role in the communication process. The inferior antenna often has a great impact on the
communication system. Therefore, we recommend some antennas that support our wireless modules and have excellent
performance and reasonable price.
Product
Type
Frequency
Hz
Gain
dBi
Size
mm
Wire
cm
Interf
ace
Feature
TX2400-NP-5010
Flexible antenna
2.4G
2.0
10*50
-
IPEX
Built-in flexible FPC soft
TX2400-JZ-3
Rubber antenna
2.4G
2.0
30
-
SMA-J
Short straight, omnidirectional
TX2400-JZ-5
Rubber antenna
2.4G
2.0
50
-
SMA-J
Short straight, omnidirectional
TX2400-JW-5
Rubber antenna
2.4G
2.0
50
-
SMA-J
Fixed bend, omnidirectional
TX2400-JK-11
Rubber antenna
2.4G
2.5
110
-
SMA-J
Bendable, omnidirectional
TX2400-JK-20
Rubber antenna
2.4G
3.0
200
-
SMA-J
Bendable, omnidirectional
TX2400-XPL-150
Sucker antenna
2.4G
3.5
150
150
SMA-J
Small sucker antenna, cost effective
8.2 Antenna
9. Batch packaging

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M04S1F User manual
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Revision history
Version
Date
Description
Issued by
1.0
2021-7-15
Initial version
Linson
About us
Sales hotline：[phone] Tel：[phone]
Technical support：[email protected] Website：www.ebyte.com/en
Address ：Building B5, Mould Industrial Park, 199# Xi-Qu Ave, West High-tech Zone, Chengdu,
611731, Sichuan, China