Ebyte E01C-ML01SP4 User manual

E01C-ML01SP4
SI24R1+ 2.4GHz 100mW SPI SMD Wireless Module

Chengdu Ebyte Electronic Technology Co.,Ltd.
E01C-ML01SP4 User Manual
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Copyright ©2012–2021 ， Chengdu Ebyte Electronic Technology Co.,Ltd.
Contents
Disclaimer...............................................................................................................................................................................2
1 Overview..............................................................................................................................................................................3
1.1 Introduction............................................................................................................................................................ 3
1.2 Features.................................................................................................................................................................. 3
1.3 Application.............................................................................................................................................................3
2 Technical Parameters........................................................................................................................................................... 4
2.1 Limit Parameter....................................................................................................................................................... 4
2.2 Working parameters................................................................................................................................................. 4
3 Size and pin definition......................................................................................................................................................... 5
4 Basic operation.................................................................................................................................................................... 6
4.1 Hardware design...................................................................................................................................................... 6
4.2 Software programming............................................................................................................................................ 6
5 Basic application..................................................................................................................................................................7
6 FAQ......................................................................................................................................................................................8
6.1 Communication range is too short......................................................................................................................... 8
6.2 Module is easy to damage......................................................................................................................................8
6.3 BER(Bit Error Rate) is high...................................................................................................................................8
7 Welding guidance.................................................................................................................................................................9
7.1 Reflow Soldering Temperature................................................................................................................................ 9
7.2 Reflow Soldering Curve.......................................................................................................................................... 9
9 Antenna recommendation.................................................................................................................................................. 11
9.1 Recommendation................................................................................................................................................... 11
10 Batch packaging...............................................................................................................................................................11
Revision history.................................................................................................................................................................... 12
About us................................................................................................................................................................................12

Chengdu Ebyte Electronic Technology Co.,Ltd.
E01C-ML01SP4 User Manual
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Copyright ©2012–2021 ， Chengdu Ebyte Electronic Technology Co.,Ltd.
Disclaimer
EBYTE reserves all rights to this document and the information contained herein.
Products, names, logos and designs described herein may in whole or in part be
subject to intellectual property rights. Reproduction, use, modification or disclosure to
third parties of this document or any part thereof without the express permission of
EBYTE is strictly prohibited.
The information contained herein is provided “as is” and EBYTE assumes no
liability for the use of the information. No warranty, either express or implied, is given,
including but not limited, with respect to the accuracy, correctness, reliability and
fitness for a particular purpose of the information. This document may be revised by
EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd.
E01C-ML01SP4 User Manual
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Copyright ©2012–2021 ， Chengdu Ebyte Electronic Technology Co.,Ltd.
1 Overview
1.1 Introduction
E01C-ML01SP4 is a small size 2.4ghz SMD wireless module, maximum
transmitting power of 100mW, which is independently developed based on
domestic SI24R1.
Built-in power amplifier (PA) and low noise amplifier (LNA) on the
original basis, the maximum transmission power reaches 100mW, while the
receiving sensitivity is further improved, and the overall communication
stability is less than power amplifier and low noise amplifier The products have
been greatly improved.
This product uses industrial-grade high-precision 16MHz crystal.
Since E01C-ML01SP4 is a radio frequency transceiver module, it needs to
use MCU driver or use a dedicated SPI debugging tool.
1.2 Features
Small size 14.5*18mm;
The maximum transmit power is 100mW, software multi-level adjustable;
Communicationdistancecanreach2KMunderidealconditions;
Globallicense-freeISM2.4GHzband;
Air data rate : 2Mbps, 1Mbps and 250kbps;
125communicationchannelstomeettheneedsofmulti-pointcommunication,packet,frequencyhoppingandotherapplications;
Connect to MCU through SPI interface, the speed is 0 ～10Mbps;
Power supply 2.0～3.6V, more than 3.3V can guarantee the best performance;
Professional RF shielding cover, anti-interference, anti-static;
IPEX interface, convenient for connecting coaxial cable or external antenna (shared with IPEX interface);
1.3 Application
Smart home and industrial sensors;
Security system, positioning system;
Wireless remote control, drone;
Wireless game remote control;
Health care products;
Wireless voice, wireless headphones;
Automotive industry applications.

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2 Technical Parameters
2.1 Limit Parameter
Main parameter
Performance
Remarks
Min
Max
Voltage supply（V）
0
3.6
Voltage over 3.6V will cause permanent
damage to module
Blocking power（dBm）
-
10
Chances of burn is slim when modules
are used in short distance
Working temperature（℃）
-40
85
Industrial
2.2 Working parameters
Main parameter
Performance
Remarks
Min.
Typ.
Max.
Operating voltage（V）
2.0
3.3
3.6
≥3.3 V ensures output power
Communication level（V）
3.3
For 5V TTL, it may be at risk of burning down
Working temperature（℃）
-40
-
85
Industrial design
Operating frequency（GHz）
2.4
-
2.525
Support ISM band
Power
consumption
TX current（mA）
113
Instant power consumption
RX current（mA）
24
Sleep current
（μA）
2
Software shut off
Max Tx power（dBm）
19.7
20
20.2
Receiving sensitivity（dBm）
-96.5
-96
-97.5
Air data rate is 250kbps
Air data rate（bps）
250k
-
2M
User programming control
Main parameter
Value
Remarks
Distance
2000m
In open and clear air, at height of 2.5m，air data rate:250kbps
FIFO
32Byte
Max packet length per time
Crystal Frequency
16MHz
Modulation
GFSK
Package
SMD
Connector
1.27mm 插针
Communication interface
SPI
0～10Mbps
Size
14.5*18mm
Without SMA
Antenna
IPEX
50 ohm impedance match

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3 Size and pin definition
Pin No.
Pin item
Pin direction
Application
1
VCC
Power supply between 2.0 and 3.6V
2
CE
Input
Module control pin
3
CSN
Input
Chip select pin for starting new SPI communication
4
SCK
Input
SPI clock pin
5
MOSI
Input
SPI data input pin
6
MISO
Output
SPI data output pin
7
IRQ
Output
Interrupt request，valid in low level
8
GND
Ground, connected to power reference ground
9
GND
Ground, connected to power reference ground
10
GND
Ground, connected to power reference ground

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4 Basic operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible,
and the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module；
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged；
Please check the stability of the power supply, the voltage cannot be fluctuated frequently；
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of
the margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and
other parts with large electromagnetic interference;
Bottom Layer；High-frequency digital routing, high-frequency analog routing, and power routing must be
avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to
the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be
close to the digital part of the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or
other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done；Assume that there are traces with
large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the
module that will greatly affect the performance of the module. It is recommended to stay away from the
module according to the strength of the interference. If necessary, appropriate isolation and shielding can be
done;
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;
The antenna installation structure has a great impact on the performance of the module. Be sure to ensure that the
antenna is exposed, preferably vertically.When the module is installed inside the case, a high-quality antenna
extension cable can be used to extend the antenna to the outside of the case;
Do not install the antenna inside the metal case,it will greatly reduce the transmission distance.
4.2 Software programming
This module is SI24R1+PA+LNA, and its driving mode is exactly the same as SI24R1. Users can operate in
full accordance with the SI24R1 chip manual (see the SI24R1 manual for details);

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Power step:
SI24R1Register setting table：
Address(Hex)
Mnemonic
Bit
Reset Value
Description
06
RF_SETUP
Rf configuration
RF_PWR
2:0
110
TX transmitting power
111:7dBm 110:4dBm
101:3dBm 100:1dBm
011:0dBm 010:-4dBm
001:-6dBm 000:-12dBm
011：Front 0dBm, output 20dBm;
010：Front -4dBm，output 17dBm；
011：Front -6dBm，output 14dBm;
000：Front -12dBm，output 8dBm;
IRQ is an interrupt pin. It is used to wake up the microcontroller and achieve fast response; users can leave it
unconnected and use SPI to query the interrupt status (not recommended, not conducive to overall power
consumption, low efficiency);
CE can be connected to high level for a long time, but the module must be set to POWER DOWN power-
down mode when writing to the register. It is recommended that CE be controlled by MCU pin.
The CE pin is connected to the LNA enable pin. When CE=1, LNA is turned on, and when CE=0, LNA is
turned off. This operation is completely consistent with the transceiver mode of nRF24L01; in other words,
the user does not need to care about LNA operation at all;
If the user needs to answer automatically, the CE pin must remain high during transmission. The correct
operation is: CE=1 to trigger the transmission. After knowing that the transmission is completed, CE=0,
instead of CE=0 after 10us. The reason is: After SI24R1 is sent, it will immediately switch to receiving mode.
At this time, if CE= 0, the LNA has been turned off, which is not conducive to receiving sensitivity.
5 Basic application

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6 FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists;
Data lose rate will be affected by temperature, humidity and co-channel interference;
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near
ground.;
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the
sea;
The signal will be affected when the antenna is near metal object or put in a metal case;
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance);
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power;
Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
Please check the power supply to ensure that it is between the recommended power supply voltage. If the
maximum value is exceeded, the module will be permanently damaged;
Please check the stability of power source, the voltage cannot fluctuate too much;
Please make sure anti-static measure are taken when installing and using, high frequency devices have
electrostatic susceptibility;
Please ensure the humidity is within limited range, some parts are sensitive to humidity;
Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency
and channel to avoid interference;
The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus
line should not be too long;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is hig.

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E01C-ML01SP4 User Manual
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Copyright ©2012–2021 ， Chengdu Ebyte Electronic Technology Co.,Ltd.
7 Welding guidance
7.1 Reflow Soldering Temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time（tL）Maintained Above（TL）
60-90 sec
30-90 sec
Peak temperature（Tp）
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max
7.2 Reflow Soldering Curve

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8 E01 series
Model
IC
Frequency
Tx power
Distance
Package
Antenna
Hz
dBm
m
E01-ML01S
nRF24L01+
2.4G
0
100
SMD
PCB
E01-ML01D
nRF24L01+
2.4G
0
100
DIP
PCB
E01-ML01IPX
nRF24L01+
2.4G
0
200
SMD
IPEX
E01-2G4M13S
nRF24L01+
2.4G
13
1200
SMD
PCB
E01-ML01SP2
nRF24L01+
2.4G
20
1800
SMD
PCB/IPE
X
E01-ML01SP4
nRF24L01+
2.4G
20
2000
SMD
IPEX
E01-ML01DP4
nRF24L01+
2.4G
20
1800
DIP
PCB
E01-ML01DP5
nRF24L01+
2.4G
20
2500
DIP
SMA-K
E01-2G4M27D
nRF24L01+
2.4G
27
5000
DIP
SMA-K
All wireless modules of the E01 series can communicate with each other

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Copyright ©2012–2021 ， Chengdu Ebyte Electronic Technology Co.,Ltd.
9 Antenna recommendation
9.1 Recommendation
The antenna is an important role in the communication process. A good antenna can largely improve the
communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and
reasonable price.
Model No.
Type
Frequeny
Gain dBi
Size
Cable
Interface
Function feature
Hz
dBi
mm
cm
TX2400-NP-5010
Flexible
antenna
2.4G
2.0
10x50
-
IPEX
FPC soft antenna
TX2400-JZ-3
Rubber
antenna
2.4G
2.0
30
-
SMA-J
Short straight &
omnidirectional
TX2400-JZ-5
Rubber
antenna
2.4G
2.0
50
-
SMA-J
Short straight &
omnidirectional
TX2400-JW-5
Rubber
antenna
2.4G
2.0
50
-
SMA-J
Flexible & omnidirectional
TX2400-JK-11
Rubber
antenna
2.4G
2.5
110
-
SMA-J
Bendable glue stick &
omnidirectional
TX2400-JK-20
Rubber
antenna
2.4G
3.0
200
-
SMA-J
Bendable glue stick &
omnidirectional
TX2400-XPL-150
Sucker
antenna
2.4G
3.5
150
150
SMA-J
Small & cost-effective
10 Batch packaging

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Copyright ©2012–2021 ， Chengdu Ebyte Electronic Technology Co.,Ltd.
Revision history
Version
Date
Description
Issued by
1.0
2020-12-21
Initial version
Linson
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