Emerson ROC364 User manual

Flow Computer Division
Website: www.EmersonProcess.com/flow
Form A4193
Part Number D301060X012
June 2005
ROC364 REMOTE OPERATIONS CONTROLLER
Instruction Manual

ROC364 Instruction Manual
ii Rev Jun/05
Revision Tracking Sheet
June 2005
This manual is revised periodically to incorporate new or updated information. The date revision level
of each page is indicated at the bottom of the page opposite the page number. A major change in the
content of the manual also changes the date of the manual, which appears on the front cover. Listed
below is the date revision level of each page.
Page Revision
All Pages Jun/05
All Pages May/02
FloBoss and ROCLINK are marks of one of the Emerson Process Management companies. The Emerson logo is a trademark
and service mark of Emerson Electric Co. All other marks are the property of their respective owners.
© Fisher Controls International, Inc. 1992-2005. All rights reserved.
Printed in the U.S.A.
While this information is presented in good faith and believed to be accurate, Fisher Controls does not guarantee satisfactory
results from reliance upon such information. Nothing contained herein is to be construed as a warranty or guarantee,
express or implied, regarding the performance, merchantability, fitness or any other matter with respect to the products, nor
as a recommendation to use any product or process in conflict with any patent. Fisher Controls reserves the right, without
notice, to alter or improve the designs or specifications of the products described herein.

ROC364 Instruction Manual
iii Table of Contents Rev Jun/05
TABLE OF CONTENTS
Table of Contents ............................................................................................................. iii
Section 1 – General Information................................................................................... 1-1
1.1 Scope of Manual.............................................................................................................................1-1
1.2 Manual Contents.............................................................................................................................1-1
1.3 Product Overview ...........................................................................................................................1-2
1.4 Installation Guidelines....................................................................................................................1-3
1.5 Power Supply Requirements...........................................................................................................1-6
1.6 Startup and Operation................................................................................................................... 1-10
Section 2 – Master Controller Unit, I/O Module Rack, and Wiring......................... 2-1
2.1 Scope...............................................................................................................................................2-1
2.2 Product Description ........................................................................................................................2-1
2.3 Installation.......................................................................................................................................2-7
2.4 Connecting the MCU to Wiring......................................................................................................2-9
2.5 Troubleshooting and Repair..........................................................................................................2-12
2.6 ROC364 Specifications.................................................................................................................2-20
Section 3 – Input and Output Modules........................................................................ 3-1
3.1 Scope...............................................................................................................................................3-1
3.2 Product Descriptions.......................................................................................................................3-1
3.3 Initial Installation and Setup...........................................................................................................3-5
3.4 Connecting the I/O Modules to Wiring ..........................................................................................3-5
3.5 Troubleshooting and Repair..........................................................................................................3-21
3.6 Removal, Addition, and Replacement Procedures .......................................................................3-28
3.7 I/O Module Specifications............................................................................................................3-30
Section 4 – Communications Cards.............................................................................. 4-1
4.1 Scope...............................................................................................................................................4-1
4.2 Product Descriptions.......................................................................................................................4-1
4.3 Installing Communications Cards...................................................................................................4-8
4.4 Connecting Communications Cards to Wiring.............................................................................4-12
4.5 Troubleshooting and Repair..........................................................................................................4-19
4.6 Communication Card Specifications ............................................................................................4-21

ROC364 Instruction Manual
iv Table of Contents Rev Jun/05
Section 5 – I/O Converter Card.................................................................................... 5-1
5.1 Scope...............................................................................................................................................5-1
5.2 Product Description ........................................................................................................................5-1
5.3 Initial Installation and Setup...........................................................................................................5-2
5.4 Troubleshooting and Repair............................................................................................................5-3
5.5 I/O Converter Card Specification ...................................................................................................5-4
Appendix A – Lightning Protection Module...............................................................A-1
A.1 Product Description ....................................................................................................................... A-1
A.2 Connecting the LPM to Wiring...................................................................................................... A-2
A.3 Troubleshooting and Repair........................................................................................................... A-2
A.4 Lightning Protection Module Specifications................................................................................. A-3
Appendix B – Local Display Panel ...............................................................................B-1
B.1 Product Description ........................................................................................................................B-1
B.2 Installation.......................................................................................................................................B-2
B.3 Operation.........................................................................................................................................B-4
B.4 Troubleshooting and Repair..........................................................................................................B-22
B.5 Local Display Panel Specifications ..............................................................................................B-23
Appendix C – I/O Simulation........................................................................................C-1
C.1 Analog Outputs to Analog Inputs...................................................................................................C-1
C.2 Analog Outputs to Ammeter or Voltmeter.....................................................................................C-2
C.3 Discrete Outputs to Discrete Inputs................................................................................................C-3
C.4 Discrete Outputs to Pulse Inputs.....................................................................................................C-3
C.5 Potentiometer to Analog Inputs......................................................................................................C-4
C.6 Switch to Discrete Inputs................................................................................................................C-5
C.7 Switch to Pulse Inputs.....................................................................................................................C-5
Glossary.......................................................................................................................... G-1
Index.................................................................................................................................I-1

ROC364 Instruction Manual
1-1 General Information Rev Jun/05
SECTION 1 – GENERAL INFORMATION
1.1 Scope of Manual
This manual focuses on the hardware aspects of the ROC364 Remote Operations Controller (ROC)
manufactured by Flow Computer Division of Emerson Process Management. For software aspects, such
as configuration, refer to the respective ROCLINK configuration user manual.

NOTE: Certain hardware versions and functionality may require higher revisions of ROCLINK
configuration software. Verify the version of ROCLINK configuration software.
This section contains the following information:
Section Page
1.1 Scope of Manual 1-1
1.2 Manual Contents 1-1
1.3 Product Overview 1-2
1.4 Installation Guidelines 1-3
1.5 Power Supply Requirements 1-6
1.6 Startup and Operation 1-9
1.2 Manual Contents
This manual contains the following sections:
Section 2 details the Master Controller Unit (MCU), I/O Module Rack, wiring, troubleshooting, and
specifications.
Section 3 provides information and specifications for the I/O modules.
Section 4 provides details and specifications for the communications cards.
Appendix A describes the optional Lightning Protection Module (LPM) and specifications.
Appendix B describes specifications and how to use the optional Local Display Panel (LDP) to access
operational data and change configuration.
Appendix C shows various ways to set up I/O simulation for troubleshooting components and
configurations.
For more information on software or accessories, please refer to the following manuals.
♦ ROCLINK for Windows Configuration Software User Manual (Form A6091).
♦ ROCLINK 800 Configuration Software User Manual (Form A6121).
♦ ROC/ROC Accessories Instruction Manual (Form A4637).

ROC364 Instruction Manual
1-2 General Information Rev Jun/05
1.1.1 FCC Information
This equipment complies with Part 68 of the Federal Communications Commission (FCC) rules. On the
modem assembly is a label that contains, among other information, the FCC certification number and
Ringer Equivalence Number (REN) for this equipment. If requested, this information must be provided
to the telephone company.
A FCC compliant telephone modular plug is provided with this equipment. This equipment is designed
to be connected to the telephone network or premises’ wiring, using a compatible modular jack that is
Part 68 compliant. See Installation Instructions for details.
The REN is used to determine the quantity of devices that may be connected to the telephone line.
Excessive RENs on the telephone line may result in the devices not ringing in response to an incoming
call. Typically, the sum of the RENs should not exceed five (5.0). To be certain of the number of
devices that may be connected to a line (as determined by the total RENs), contact the local telephone
company.
If this equipment, dial-up modem, causes harm to the telephone network, the telephone company will
notify you in advance that temporary discontinuance of service may be required. But if advance notice is
not practical, the telephone company will notify the customer as soon as possible. Also, you will be
advised of your right to file a complaint with the FCC if you believe it necessary.
The telephone company may make changes to its facilities, equipment, operations, or procedures that
could affect the operation of the equipment. If this happens the telephone company will provide advance
notice so you can make the necessary modifications to maintain uninterrupted service.
If trouble is experienced with this equipment, dial-up modem, for repair or warranty information, please
contact Emerson Process Management, Flow Computer Division [phone]. If the equipment is
causing harm to the telephone network, the telephone company may request that you disconnect the
equipment until the problem is resolved.
1.3 Product Overview
The ROC364 is a microprocessor-based controller that provides the functions required for a variety of
field automation applications. The ROC364 is used primarily where there is a need for remote
monitoring, measurement, data archival, and control. You can configure the ROC364 for specific
applications including those requiring calculations, PID (Proportional, Integral, and Derivative) Loop
Control, and Function Sequence Tables (FSTs) logic/sequencing control.
The ROC364 features modularized field inputs and outputs (I/O), which provide the flexibility to meet
the requirements of a specific application. Up to 64 I/O modules can be used in any combination of
Discrete Inputs, Discrete Outputs, Analog Inputs, Analog Outputs, and Pulse Inputs.
The modular design of the ROC364 makes it cost-effective for both small and large applications. You
can select from a variety of communications and operator interface options to customize the installation
for a given system. The ROC is approved for use in Class I – Division 2 hazardous area locations.
The FlashPAC includes additional features contained in the firmware, such as 1992 American Gas
Association (AGA) flow calculations, Spontaneous-Report-by-Exception (SRBX or RBX) alarm
messaging, Local Display Panel configuring, and radio power control.
Figure 1-1 shows the major components that make up the ROC Master Controller Unit (MCU). Figure
2-6 shows the outline and mounting dimensions for the ROC364 controller. Refer to Section 2, Master
Controller Unit, I/O Module Rack, and Wiring, for further hardware and firmware details.

ROC364 Instruction Manual
1-3 General Information Rev Jun/05
1.4 Installation Guidelines
The design of the ROC makes it highly adaptable to a wide variety of installations; therefore, not all
possibilities can be covered in this manual. If additional information is required concerning a specific
installation, contact your local sales representative.
Planning is essential to a good installation. Because installation requirements depend on many factors
such as the application, location, ground conditions, climate, and accessibility, only generalized
guidelines can be provided in this document.
ROC364
SYSTEM
STATUS
GND
AUX PWR
OUT 1
DC PWR
IN
+
-
-
+
AUX PWR
OUT 2
AUX OUT 2
AUX OUT 1
-
-
+
+
POWER
OPERATOR
INTERFACE
COM2 COM1 DISPLAY
ROC
REMOTE OPERATIONS
CONTROLLER
RAM
MEMORY EXPANSION
321
F3
F2
F1
AUX OUT 2
5A, 32 VDC
5A, 32 VDC
AUX OUT 1
POWER
2A S.B., 32 VDC
®
FLASHPAC
12348
7
6
5914 15 16
13
12
11
10
ABC CBACBACBACBACBACBACBAABCABCABCABC CBACBACBACBA
GNDGND
®
Figure 1-1. ROC364 Controller Components Mounted on Backplate
MCU
I/O Modules
I/O Module Wiring /
Termination
I/O Rack
Backplate

ROC364 Instruction Manual
1-4 General Information Rev Jun/05
1.4.1 Environmental Requirements
The ROC364 requires protection from direct exposure to rain, snow, ice, blowing dust or debris,
and corrosive atmospheres. If the ROC is installed outside of a building, it must be placed in a
NEMA 3 or higher rated enclosure to ensure the necessary level of protection.

NOTE: In salt spray environments, it is especially important to ensure that the enclosure is sealed
properly, including all entry and exit points. If salt is allowed to enter, it can shorten the life of
the lithium battery in the ROC and cause the battery to leak corrosive chemicals.
The ROC units are designed to operate over a wide range of temperatures. However, in extreme climates
it may be necessary to provide temperature-controlling devices to maintain stable operating conditions.
In extremely hot climates, a filtered ventilation system or air conditioning may be required. In extremely
cold climates, it may be necessary to provide a thermostatically controlled heater in the same enclosure
as the ROC364. To maintain a non-condensing atmosphere inside the ROC enclosure in areas of high
humidity, it may be necessary to add heat or dehumidification.
1.4.2 Site Requirements
Careful consideration when locating the ROC on the site can help reduce future operational problems.
The following items should be considered when choosing a location:
♦ Local, state, and federal codes often place restrictions on ROC locations and dictate site
requirements. Examples of these restrictions are fall distance from a meter run, distance from
pipe flanges, and hazardous area classifications. Ensure that all code requirements are met.
♦ Locate the ROC to minimize the length of signal and power wiring. By code, line power wiring
must not cross meter runs.
♦ Solar panels must face due South (not magnetic South) in the northern hemisphere and due North
(not magnetic North) in the southern hemisphere. Make sure nothing blocks the sunlight during
any part of the day.
♦ ROC units equipped for radio communications should be located so the antenna has an
unobstructed signal path. Antennas should not be aimed into storage tanks, buildings, or other
tall structures. If possible, ROC units should be located at the highest point on the site. Overhead
clearance should be sufficient to allow the antenna to be raised to a height of at least twenty feet.
♦ To minimize interference with radio communications, locate the ROC away from electrical noise
sources, such as engines, large electric motors, and utility line transformers.
♦ Locate ROC units away from heavy traffic areas to reduce the risk of being damaged by
vehicles. However, provide adequate vehicle access to aid monitoring and maintenance.
1.4.3 Compliance with Hazardous Area Standards
The ROC364 hazardous location approval is for Class I, Division 2, Groups A, B, C, and D. The class,
division, and group terms are defined as follows:
1. Class defines the general nature of the hazardous material in the surrounding atmosphere. Class I
is for locations where flammable gases or vapors may be present in the air in quantities sufficient
to produce explosive or ignitable mixtures.
2. Division defines the probability of hazardous material being present in an ignitable concentration
in the surrounding atmosphere. Division 2 locations are locations that are presumed to be
hazardous only in an abnormal situation.

ROC364 Instruction Manual
1-5 General Information Rev Jun/05
3. Group defines the hazardous material in the surrounding atmosphere and include:
♦ Group A – Atmosphere containing acetylene.
♦ Group B – Atmosphere containing hydrogen, gases, or vapors of equivalent nature.
♦ Group C – Atmosphere containing ethylene, gases, or vapors of equivalent nature.
♦ Group D – Atmosphere containing propane, gases, or vapors of equivalent nature.
For the ROC to be approved for hazardous locations, it must be installed in accordance with the National
Electrical Code (NEC) guidelines or other applicable codes.
When working on units located in a hazardous area (where explosive gases may be present), make
sure the area is in a non-hazardous state before performing procedures. Performing procedures in
a hazardous area could result in personal injury or property damage.
1.4.4 Power Installation Requirements
Typical sources of primary power for ROC installations are line power and solar power. Be sure to route
line power away from hazardous areas, as well as sensitive monitoring and radio equipment. Local and
company codes generally provide guidelines for line power installations. Adhere rigorously to all local
and National Electrical Code (NEC) requirements for line power installations.
Solar power allows installation of the ROC in locations where line power is not available. The solar
panels and batteries must be properly sized for the application and geographic location to ensure
continuous reliable operation. Information contained in the ROC/ROC Accessories Instruction Manual
(Form 4637) can assist in determining the solar panel and battery requirements.
A site may have additional power requirements for radios, repeaters, and other monitoring devices.
Power supply and converter accessories can minimize the number of separate power sources required for
an installation.
The ROC364 can operate from either a 12-volt or a 24-volt nominal power source. If 24-volt transmitter
power is required when operating on 12-volt power, the ROC364 requires an I/O Converter Card to be
installed. Refer to Section 5. The ROC364 has a low-voltage cut-off circuit built in to guard against
draining down power supply batteries.
1.4.5 Grounding Installation Requirements
Ground wiring requirements for line-powered equipment are governed by the National Electrical Code
(NEC). When the equipment uses line power, the grounding system must terminate at the service
disconnect. All equipment grounding conductors must provide an uninterrupted electrical path to the
service disconnect. This includes wire or conduit carrying the power supply conductors.
The National Electrical Code Article 250-83 (1993), paragraph c, defines the material and
installation requirements for grounding electrodes.
The National Electrical Code Article 250-91 (1993), paragraph a, defines the material requirements
for grounding electrode conductors.
The National Electrical Code Article 250-92 (1993), paragraph a, provides installation requirements
for grounding electrode conductors.
The National Electrical Code Article 250-95 (1993) defines the size requirements for equipment
grounding conductors.

ROC364 Instruction Manual
1-6 General Information Rev Jun/05
Proper grounding of the ROC helps to reduce the effects of electrical noise on unit operation and helps
protect against lightning. Lightning Protection Modules are available to provide additional lightning
protection for field wiring inputs and outputs. Refer to Appendix A for information about lightning
protection. A surge protection device installed at the service disconnect on line-powered systems also
offers lightning and power surge protection for the installed equipment.
Telephone surge protectors should be installed for ROC units using modem communications cards.
All earth grounds must have an earth-to-ground rod or grid impedance of 25 ohms or less as measured
with a ground system tester. The grounding conductor should have a resistance of 1 ohm or less between
the ROC enclosure ground lug and the earth ground rod or grid.
1.4.6 I/O Wiring Requirements
I/O wiring requirements are site and application dependent. Local, state, and NEC requirements
determine the I/O wiring installation methods. Direct buried cable, conduit and cable, or overhead
cable are options for I/O wiring installations. Refer to Section 2, Master Controller Unit, I/O Module
Rack, and Wiring, and Section 3, Input/Output Modules.
1.5 Power Supply Requirements
The power consumption of a ROC and related devices determines the requirements for either line
or solar power supplies. Table 1-1 and Table 1-2 provide information to assist in determining power
supply requirements.
Table 1-1 lists the power consumption of the ROC364 and the optional devices available for it. Include
in the power consumption calculations of all device relays, meters, solenoids, radios, and other devices
that receive DC power from the ROC (excluding those connected to the I/O modules). Table 1-2 lists the
power consumption of the various I/O modules available.
A ROC systems power consumption determines power supply and battery size for both line and solar
power supplies. Use the information in Table 1-1 and Table 1-2 to determine power requirements.
For non-analog I/O, size the I/O module scaling resistors for optimal current to minimize current drain
on the power supply. Refer to Section 3.
1.5.1 Determining I/O Channel Power Consumption
To determine the I/O Channel Power:
1. Calculate the Duty Cycle of each I/O channel and enter the values in Table 1-1.
In estimating total I/O power requirements, the Duty Cycle of each I/O channel (built-in I/O or
modular I/O) must be estimated.
For a non-analog I/O channel, the Duty Cycle is the percentage of time that the I/O channel is
active (maximum power consumption). For example, if a Discrete Output is active for 15
seconds out of every 60 seconds, the Duty Cycle is:
Duty Cycle = Active time ÷(Active time + Inactive time) = 15 sec ÷60 sec = 0.25

NOTE: For non-analog I/O, size the I/O module scaling resistors for optimal current to
minimize current drain on the power supply.

ROC364 Instruction Manual
1-7 General Information Rev Jun/05
For an analog I/O channel, the Duty Cycle is approximated by estimating the percentage of
time the channel spends in the upper half of its range (span) of operation. For example, if an
Analog Input wired as a current loop (4 to 20 milliamps) device operates in the upper half of its
range 75% of the time, then 0.75 would be used as the Duty Cycle. If the analog channel
generally operates around the midpoint of its span, use 0.5 as the Duty Cycle.
2. To calculate the total power consumed by an I/O channel, first select either the 12 Volt or 24
Volt column in Table 1-1 or Table 1-2 and read the minimum (Pmin) and maximum (Pmax) power
consumption value from the table for the desired I/O channel.
3. Calculate the power consumption for a channel with the Duty Cycle using the following equation
taken into account:
Power = (Pmax xDuty Cycle) + [Pmin (1 – Duty Cycle)]
4. Multiply this value by the quantity (QTY) of I/O channels with the same Duty Cycle and enter
the calculated value in the Sub-Total column.
5. Repeat the procedure for all other I/O channels used.
6. Total the values in the I/O Modules Sub-Total column in Table 1-2.
7. Enter the I/O Modules Total value in Table 1-1.
8. Calculate the Radio Power Consumption total. Refer to Section 1.5.2, Determining Radio
Power Consumption, on page 1-8.
9. Enter the Radio Power Consumption Total value in Table 1-1.
10. Calculate Total power consumption in Table 1-1.
11. Add the power consumption (in mW) of any other devices used with the ROC in the same
power system, but not accounted for in the tables to the Total power consumption value in Table
1-1. Refer to Section 1.5.3, Totaling Power Requirements, on page 1-9.
Table 1-1. Power Consumption of the ROC364 and Powered Devices
Power Consumption (mW)
12 Volt 24 Volt
Device
Pmin P
max P min P max
QTY Duty
Cycle
Sub-
Total
(mW)
MCU and I/O Module Rack 915 1705 1 N/A
I/O Converter Card1230 N/A N/A
Local Display Panel 25 25 N/A
Serial Communications Card 135 135 N/A
Dial-up Modem Card 395 395 N/A
Leased Line Modem Card 110 110 N/A
Radio Modem Card 110 110 N/A
I/O Modules Total from Table 1-2 N/A N/A N/A
Radio (Section 1.5.2) N/A N/A N/A
TOTAL
NOTE: 1. The power drawn by field devices connected to I/O modules is included in the Pmax figures in Table
1-2.

ROC364 Instruction Manual
1-8 General Information Rev Jun/05
Table 1-2. Power Consumption of the I/O Modules
Power Consumption (mW)
12 Volt 24 Volt
I/O Module
Pmin P
max2P min P max2
QTY Duty
Cycle1
Sub-
Total
(mW)
AI Loop 170 495 170 495
AI Differential 75 75 75 75
AI Source 110 305 130 470
AO Source 145 585 145 585
RTD Input: Pmin is at –50°C
(–58°F); Pmax is at 100°C (212°F) 240 475 475 930
DI Isolated 1 10 1 10
DI Source 1 55 1 205
PI Isolated 1 30 1 30
PI Source 1 70 1 230
Low Level PI 1 45 1 45
SPI Isolated 1 10 1 10
SPI Source 1 55 1 205
DO Isolated 1 25 1 25
DO Source (Pmax is at 57 mA) 30 815 30 1585
DO Relay 12 Volts 20 420 N/A N/A
DO Relay 24 Volts N/A N/A 20 470
HART Interface Module 85 685 85 1285
I/O MODULES TOTAL
NOTES: 1. For analog I/O channels, the Duty Cycle is the percent of time spent in the upper half of the
operating range.
2. The Pmax amount includes any power drawn by a ROC-powered field device such as a
transmitter.
1.5.2 Determining Radio Power Consumption
In determining power requirements for radios:
1. Estimate the Duty Cycle for the radio.
The Duty Cycle is the percentage of time the radio is transmitting (TX). For example, if a radio
is transmitting 1 second out of every 60 seconds, and for the remaining 59 seconds the radio is
drawing receive (RX) power, the Duty Cycle is:
Duty Cycle = TX time ÷(TX time + RX time) = 1 sec ÷60 sec = 0.0167
2. Calculate the total power consumed by a radio, obtain the power (P) consumption values for
transmit and receive from the radio manufacturer’s literature, then use the following equation to
calculate the power consumption for a particular Duty Cycle:
Power = (PTX xDuty Cycle) + [PRX (1 – Duty Cycle)]
3. Determine the power consumption for all radios that use power from the ROC, and enter the total
calculated value in the Sub-Total column in Table 1-1.

ROC364 Instruction Manual
1-9 General Information Rev Jun/05
1.5.3 Totaling Power Requirements
To adequately meet the needs of the ROC system, it is important to determine the total power
consumption to size the solar panel and battery backup requirements accordingly. For total power
consumption, add the device values in Table 1-1.
Although Table 1-1 and Table 1-2 take into account the power supplied by the ROC to its connected
devices, be sure to add the power consumption (in mW) of any other devices used with the ROC in the
same power system, but not accounted for in the tables.
Convert the total value (in mW) to Watts by dividing it by 1000.
mW ÷1000 = Watts
For selecting an adequate power supply, use a safety factor (SF) of 1.25 to account for losses and other
variables not factored into the power consumption calculations. To incorporate the safety factor,
multiply the total power consumption (P) by 1.25.
P
SF = P x1.25 = _____ Watts
To convert PSF to current consumption in amps (ISF), divide PSF by the system voltage (V), either 12
volts or 24 volts.
I
SF = PSF / V = _____ Amps
1.6 Startup and Operation
Before starting up the ROC, perform the following checks to ensure the unit is properly installed.
♦ Make sure the enclosure has a good earth ground.
♦ Make sure the MCU is grounded at the power input connector.
♦ Make sure all I/O module racks are grounded at the GND screw.
♦ Make sure the MCU and I/O module racks are secured to the factory backplate.
♦ Ensure FlashPAC modules are seated in their connectors.
♦ Seat and secure all I/O modules in their sockets.
♦ Check the field wiring for proper installation.
♦ Make sure the input power has the correct polarity.
♦ Make sure the input power is fused at the power source.
Check the input power polarity before turning on the power switch. Incorrect polarity can
damage the ROC.
When installing units in a hazardous area, ensure that the components selected are labeled for use
in such areas. Change components only in an area known to be non-hazardous. Performing these
procedures in a hazardous area could result in personal injury or property damage.

ROC364 Instruction Manual
1-10 General Information Rev Jun/05
 NOTE: For proper startup, the minimum input voltage level must be 12.5 volts or more for a 12-
volt unit, and 25 volts or more for a 24-volt unit. Once the ROC364 has been successfully
started, the ROC continues to operate normally over the specified input voltage range. If you are
unsure of the input voltage setting for your ROC, refer to the paragraphs on setting the input
voltage jumpers in Section 2.
1.6.1 Startup
Apply power to the ROC364 by plugging in the power terminal block. The Power indicator should light
to indicate that the applied voltage is correct. Then, the System Status indicator should light, and stay
lit, to indicate a valid reset sequence has been completed. After internal checks have been completed,
both AUX PWR indicators should light. The startup sequence may take up to 5 seconds. If any of the
indicators do not light, refer to the Troubleshooting details in Section 2 for possible causes.
1.6.2 Operation
Once startup is successful, configure the ROC to meet the requirements of the application. The
appropriate ROCLINK configuration software user manual describes in detail the procedure for
configuring the ROC. Once the ROC is configured and I/O is calibrated, it can be placed into operation.
Local configuration or monitoring of the ROC through its Operator Interface must be performed
only in an area known to be non-hazardous. Performance of these procedures in a hazardous area
could result in personal injury or property damage.
The ROC can be operated from a host system using ROCLINK configuration software. Consult with
your local sales representative for more information on host system compatibility.
1.6.2.1 Local Display Panel
The Local Display Panel (LDP) is an ASCII terminal with a 4-line by 20-character Liquid Crystal
Display (LCD) and a 4-key keypad. Refer to Appendix B, Liquid Crystal Display (LCD).

ROC364 Instruction Manual
2-1 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05
SECTION 2 – MASTER CONTROLLER UNIT, I/O MODULE
RACK, AND WIRING
2.1 Scope
This section describes the core of the ROC364 components, including the Master Controller Unit
(MCU), the FlashPAC module, wiring, the I/O Module rack, the backplate, and the front panel. Topics
covered include:
Section Page
2.2 Product Description 2-1
2.3 Installation 2-7
2.4 Connecting the MCU to Wiring 2-9
2.5 Troubleshooting and Repair 2-12
2.6 ROC364 Specifications 2-20
2.2 Product Description
The following subsections describe components of the ROC364 including the Master Controller Unit,
FlashPACs, Diagnostic Analog Inputs, Auxiliary Discrete Outputs, I/O Module Rack, and Backplate.
2.2.1 Master Controller Unit
The Master Controller Unit (MCU) is the “brain” of the ROC. Figure 2-1 displays MCU. The MCU
consists of:
♦ NEC V25+ microprocessor. ♦ I/O converter card connector.
♦ On-board memory. ♦ I/O module rack connector.
♦ FlashPAC module sockets. ♦ Diagnostic Analog Inputs.
♦ Operator Interface port. ♦ Auxiliary Discrete Outputs.
♦ Local Display port. ♦ Status indicators.
♦ Communications ports. ♦ Metal housing.
♦ Power fusing and terminations.

ROC364 Instruction Manual
2-2 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05
DOC0119A
FLASHPAC
SYSTEM
STATUS
GND
AUX PWR
OUT 1
DC PWR
IN
+
-
-
+
AUX PWR
OUT 2
AUX OUT 2
AUX OUT 1
-
-
+
+
POWER
OPERATOR
INTERFACE
COM2 COM1 DISPLAY
ROC
REMOTE OPERATIONS
CONTROLLER
RAM
MEMORY EXPANSION
321
F3
F2
F1
AUX OUT 2
5A, 32 VDC
5A, 32 VDC
AUX OUT 1
POWER
2A S.B., 32 VDC
®
FLASHPAC
Figure 2-1. Master Controller Unit
The NEC V25+ is a 16-bit Complementary Metal Oxide Semiconductor (CMOS) microprocessor
featuring dual 16-bit internal data buses and a single 8-bit external data bus. The ROC364 can address
up to one megabyte of memory and features high-speed direct memory access.
The on-board memory on the MCU includes 128 kilobytes of battery-backed, random access memory
(RAM) for storing data and 32 kilobytes of electrically erasable programmable read only memory
(EEPROM) for storing configuration parameters. Plug-in sockets are provided for the FlashPAC
module. The ROC requires a FlashPAC to operate.
The Operator Interface connector provides direct communications between the ROC and the serial port
of an operator interface, such as a laptop, to provide access to the functionality of the ROC.
The Display connector links the MCU to an optional Local Display Panel (LDP), also called a Liquid
Crystal Display (LCD) panel. The LDP provides local monitoring of I/O and database parameters using
ROCLINK configuration software. Limited editing of parameter values can be performed with the LDP,
including a reset of the ROC. Refer to Appendix B, Resetting the ROC Using the LDP.
The communications connectors labeled COM1 and COM2 allow access to two optional
communications cards installed on the MCU board. The cards can provide serial data communications,
modem, radio modem, or leased-line modem communications.
The I/O Converter Card connector accommodates the optional I/O Converter Card, which provides 24-
volt transmitter power in 12-volt systems. The connector uses a jumper when the converter card is not
installed. Refer to Section 5.
The I/O module rack connector provides the connection point for the first I/O module rack. Up to three
additional I/O module racks are installed by plugging into a connector on the previous I/O rack.

ROC364 Instruction Manual
2-3 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05
Power fusing is accessible from the front of the MCU. Fuses are used for the input power and auxiliary
power outputs. Terminal blocks provide terminations for the input and auxiliary output power. The
source of auxiliary power is the input power, which can be a nominal 12 or 24 volts, depending on the
setting of jumpers located on the MCU. Refer to Section 2.3.3, Setting Voltage Jumpers in the MCU, on
page 2-8.
Indicators are provided for System Status, ROC Power, and auxiliary power (AUX OUT 1 and AUX
OUT 2). Refer to Section 2.5.1, LED Indicators, on page 2-12.
The MCU is housed in a metal case that protects the electronics from physical damage. For protection
from outdoor environments, the unit must be housed in an approved enclosure.
2.2.2 FlashPAC Module
The FlashPAC module contains the operating system, the applications firmware, and communications
protocol, as well as memory storage for history logs and user programs. A FlashPAC module contains
512 kilobytes of flash read-only memory (ROM) and 512 kilobytes of battery-backed Static Random
Access Memory (SRAM). A FlashPAC module is required for the ROC to operate. Back-up power for
the RAM is provided by a self-contained lithium battery. Figure 2-2 shows a FlashPAC module.
The applications firmware consists of functions contained in flash ROM such as:
♦ AGA3 (1985 and 1992 algorithms) and AGA7 Flow Calculations, with metric conversion.
♦ PID (Proportional, Integral, and Derivative) Loop Control.
♦ Support for Function Sequence Tables (FSTs).
♦ Communications Enhancement (dial-up Spontaneous-Report-by-Exception (SRBX) alarming).
♦ Local Display Panel Enhancement (database point monitoring along with configuration access).
♦ Radio Power Control (FlashPAC Version 2.1 or greater).
ROC300 SERIES
VER: 2.10
PATENT 5339425
FLASHPAC
®
DOC0292A
-------------
W20217X0012
Figure 2-2. Typical FlashPAC Module

ROC364 Instruction Manual
2-4 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05
The firmware is programmed into flash memory at the factory, but can be reprogrammed in the field.
The application programs are configured by using ROCLINK configuration software including user
programs, such as the Modbus communications protocol.
When used with ROCLINK configuration software, a FlashPAC module can save a configuration to
disk as an .FCF file and later restore these configuration files into a ROC.
The RAM in a FlashPAC can store 87 history points, each holding 35 days of hourly values. Besides
storing history data, the RAM in a FlashPAC stores user program data. The flash ROM portion of the
FlashPAC is programmed with firmware at the factory and can store user programs downloaded through
a communications port.
Table 2-1, ROC Memory Map, on page 2-4 shows how the ROC memory is allocated. Each memory
location range (for example, 00000 to 1FFFF) represents 128 kilobytes of memory.
Determining FlashPAC Version
To determine the version of a FlashPAC, use ROCLINK configuration software. Select ROC >
Information > Other Information > Version Name, which contains the part and version numbers.

NOTE: The version may have been updated by a download of upgrade firmware into the module,
so the label on the actual FlashPAC module might not be accurate.
Table 2-1. ROC Memory Map
Memory Location FlashPAC Usage
00000 to 1FFFF Base RAM Alarm Log, Event Log, and such.
20000 to 3FFFF RAM in FlashPAC History Data Area, part is for scratch-pad memory in FlashPAC
40000 to 5FFFF RAM in FlashPAC History Data Area
60000 to 7FFFF RAM in FlashPAC History Data in FlashPAC
80000 to 81FFF EEPROM (on-board) User Configuration Data
88000 to 9FFFF Flash ROM OperatingSystem and Applications
A0000 to BFFFF RAM in FlashPAC User Program Data in FlashPAC
C0000 to DFFFF Flash ROM User Program Code in FlashPAC
E0000 to FFFFF Flash ROM Operating System Firmware
2.2.3 Diagnostic Inputs and Auxiliary Outputs
The ROC364 MCU monitors the power input voltages, transmitter output voltage, and the board temperature
with diagnostic Analog Inputs designated as “E” points by the configuration software. The inputs can be
calibrated by using ROCLINK configuration software. Two auxiliary Discrete Outputs are also available.
The diagnostic Analog Inputs and auxiliary Discrete Outputs are:
♦ Transmitter supply output voltage – Point Number E1.
♦ Power input voltage – Point Number E2.
♦ Auxiliary Discrete Output #1 – Point Number E3.
♦ Auxiliary Discrete Output #2 – Point Number E4.
♦ MCU board temperature – Point Number E5.

ROC364 Instruction Manual
2-5 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05
2.2.4 I/O Module Rack
The I/O module rack provides sockets for up to 16 I/O modules. Refer to Figure 2-3. Up to 64 I/O
modules can be used in any combination of Discrete Inputs, Discrete Outputs, Analog Inputs, Analog
Outputs, and Pulse Inputs. A minimum of one rack is required for any ROC connected to field I/O, and a
maximum of four racks can be accommodated. The first rack plugs directly into the I/O module rack
connector on the bottom edge of the MCU. Additional racks plug into each other.
12348
7
6
5914
15 16 13
12
11
10
ABC CBACBACBACBACBACBACBAABCABCABCABC CBACBACBACBA
MODULE RACK
GNDGND
A®
DOC0030C
Figure 2-3. I/O Module Rack

ROC364 Instruction Manual
2-6 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05
2.2.5 Backplate
The ROC364 backplate is a mounting panel for an MCU and one or more I/O module racks. Backplates
are available in three sizes to accommodate the indicated number of I/O racks: one rack, two racks, and
three or four racks. Refer to Figure 2-4 for dimensions of the various backplates.
DIM A
DIM C
DIM B
DIM D
DIM G
MOUNTING STUD SIZE
DIM F
DIM E
DOC0243A
Figure 2-4. Backplate and Mounting Dimensions
Maximum I/O Points
DIM 16 32 64
A 12.40 11.60 11.25
B 11.34 21.46 28.58
C 13.34 13.00 12.25
D 13.12 22.26 29.38
E 3.94 3.94 4.06
F .38 .38 .50
G NO.10 5/16 5/16
DIM = Dimensions in inches