Espressif Systems ESP32-PICO-V3-ZERO User manual

ESP32-PICO-V3-ZERO
User Manual
Version 1.0
Espressif Systems
Copyright © 2020
www.espressif.com

About This Document
This document provides the specifications for the ESP32-PICO-V3-ZERO module.
Document Updates
Please always refer to the latest version on https://www.espressif.com/en/support/download/documents.
Revision History
For revision history of this document, please refer to the last page.
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Certification
Download certificates for Espressif products from www.espressif.com/en/certificates.
Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS
PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-
ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE
ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights
are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective
owners, and are hereby acknowledged.
Copyright © 2020 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.
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1. Module Overview
1. Module Overview
1.1 Features
MCU
• ESP32 embedded, Xtensa®dual-core 32-bit LX6
microprocessor, up to 240 MHz
• 448 KB ROM for booting and core functions
• 520 KB SRAM for data and instructions
• 16 KB SRAM in RTC
Wi-Fi
• 802.11b/g/n20/n40
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 µs guard interval support
•Center frequency range of operating channel:
2412 ~ 2462 MHz
Bluetooth®
• Bluetooth V4.2 BR/EDR and Bluetooth LE speci-
fication
• NZIF receiver with –97 dBm sensitivity
• Class-1, class-2 and class-3 transmitter
• AFH
• CVSD and SBC
Hardware
• Interfaces: 3 × UART, I2C, I2S, SPI, SDIO, touch
pin, EN pin, interrupt pin and other GPIOs
• 40 MHz crystal oscillator
• 4 MB SPI flash
• Operating voltage/Power supply: 3.0 ~3.6 V
• Operating temperature range: –40 ~85 °C
• Dimensions: (16 × 23 × 2.3) mm
Certification
• Bluetooth certification: BQB
• RF certification: FCC/CE-RED/SRRC/IC
• Green certification: REACH/RoHS
1.2 Description
The ESP32-PICO-V3-ZERO is a module that is based on ESP32-PICO-V3, a System-in-Package (SiP) device. It
provides complete Wi-Fi and Bluetooth®functionalities. The module integrates a 4 MB SPI flash.
At the core of this module is the ESP32 chip, which is a single 2.4 GHz Wi-Fi and Bluetooth combo chip designed
with TSMC’s 40 nm low-power technology. ESP32-PICO-V3-ZERO integrates all peripheral components seam-
lessly, including a crystal oscillator, flash, filter capacitors and RF matching links in one single package. Module
assembly and testing are already done at SiP level. As such, ESP32-PICO-V3-ZERO reduces the complexity of
supply chain and improves control efficiency.
With its ultra-small size, robust performance and low-energy consumption, ESP32-PICO-V3-ZERO is well suited
for any space-limited or battery-operated applications, such as wearable electronics, medical equipment, sensors
and other IoT products.
Note:
•For more information on ESP32, please refer to ESP32 User Manual.
•For more information on ESP32-PICO-V3, please refer to ESP32-PICO-V3 User Manual.
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1. Module Overview
1.3 Applications
• Generic Low-power IoT Sensor Hub
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• Over-the-top (OTT) Devices
• Speech Recognition
• Image Recognition
• Mesh Network
• Home Automation
• Smart Building
• Industrial Automation
• Smart Agriculture
• Audio Applications
• Health Care Applications
• Wi-Fi-enabled Toys
• Wearable Electronics
• Retail & Catering Applications
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3. Pin Definitions
2. Pin Definitions
2.1 Pin Layout
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin 9
Pin 10
Pin 11
Pin 12
Pin 13
Pin 14
Pin 15
Pin 16
Pin 48
Pin 47
Pin 46
Pin 45
Pin 44
Pin 43
Pin 42
Pin 41
Pin 40
Pin 39
Pin 38
Pin 37
Pin 36
Pin 35
Pin 34
Pin 33
Pin 64 Pin 63 Pin 62 Pin 61 Pin 60 Pin 59 Pin 58 Pin 57 Pin 56 Pin 55 Pin 54 Pin 53 Pin 52 Pin 51 Pin 50 Pin 49
Pin 17 Pin 18 Pin 19 Pin 20 Pin 21 Pin 22 Pin 23 Pin 25 Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 32
Pin 66
GND
Pin 67
GND
Pin 65
GND
Pin 68
GND
Pin 75
GND
Pin 72
GND
Pin 69
GND
Pin 70
GND
Pin 71
GND
Pin 73
GND
Pin 74
GND
Pin 77
GND
Pin 76
GND
I34
I35
DBG_RXD/IO3
DBG_TXD/IO1
IO32
IO33
IO25
IO26
MTMS/IO14
MTDI/IO12
MTCK/IO13
GND
MTDO/IO15
BOOT/IO0
IO4
IO2
IO5
IO20
EN
VDD33
GND
I38
INT_B/IO27
I39
U1RXD/IO22
GND
VDD33
GND
U1TXD/IO19
IO21
I37
I36
GND
IO8
IO7
IO10
IO9
GND
Pin 31 Pin 24
GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND
GND GND GND GND GND GND GND GND GND GND GND
Antenna area
Figure 1: Pin Layout of ESP32-PICO-V3-ZERO (Top View)
Note:
The pin diagram shows the approximate location of pins on the module. For the actual mechanical diagram, please refer
to Figure 7Physical Dimensions.
2.2 Pin Description
The ESP32-PICO-V3-ZERO module has 77 pins. See pin definitions in Table 1.
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2.Pin Definitions
Table 1: Pin Definitions
Name No. Type Function
I34 1 I GPIO34
I35 2 I GPIO35
DBG_RXD/IO3 3 I/O GPIO3, Debugging UART RX
DBG_TXD/IO0 4 I/O GPIO1, Debugging UART TX
IO32 5 I/O GPIO32
IO33 6 I/O GPIO33
IO25 7 I/O GPIO25
IO26 8 I/O GPIO26
MTMS/IO14 9 I/O GPIO14, MTMS
MTDI/IO12 10 I/O GPIO12, MTDI
MTCK/IO13 11 I/O GPIO13, MTCK
MTDO/IO15 13 I/O GPIO15, MTDO
BOOT/IO0 14 I/O GPIO0
IO4 15 I/O GPIO4
IO2 16 I/O GPIO2
IO5 17 I/O GPIO5
IO20 18 I/O GPIO20. See note 1 under the table.
EN 19 I
High: On; enables the module
Low: Off; the module powers off
Note: Do not leave this pin floating.
VDD33 22 P Power supply (3.0 V ~3.6 V)
IO9 33 I/O GPIO9. See note 1 under the table.
IO10 34 I/O GPIO10. See note 1 under the table.
IO7 35 I/O GPIO7. See note 1 under the table.
IO8 36 I/O GPIO8. See note 1 under the table.
I36 38 I GPIO36
I37 39 I GPIO37
IO21 40 I/O GPIO21
U1TXD/IO19 41 O UART TX, connected to host RX, GPIO19
VDD33 43 P Power supply (3.0 V ~3.6 V)
U1RXD/IO22 45 I UART RX, connected to host TX, GPIO22
I39 46 I GPIO39
INT_B/IO27 47 O Host interrupt, connected to host GPIO, GPIO27
I38 48 I GPIO38
GND 12, 20, 21, 23 ~32,
37, 42, 44, 49 ~77 P Ground
Note:
1. IO7/IO8/IO9/IO10/IO20 belong to VDD_SDIO power domain and cannot work when VDD_SDIO power shuts down.
2. For peripheral pin configurations, please refer to ESP32User Manual.
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2.Pin Definitions
2.3 Strapping Pins
ESP32 has five strapping pins: MTDI, GPIO0, GPIO2, MTDO, GPIO5. The pin-pin mapping between ESP32 and
the module is as follows, which can be seen in Chapter 5 Schematics:
• MTDI = IO12
• GPIO0 = BOOT/IO0
• GPIO2 = IO2
• MTDO = IO15
• GPIO5 = IO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches
of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip
is powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping
pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will
determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 2for a detailed boot-mode configuration by strapping pins.
Table 2: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Pin Default
FE Sampling
FE Output
FE Sampling
RE Output
RE Sampling
FE Output
RE Sampling
RE Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
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2.Pin Definitions
Note:
• FE: falling-edge, RE: rising-edge.
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave”, after booting.
• The operating voltage of ESP32-PICO-V3-ZERO’s integrated external SPI flash is 3.3 V. Therefore, the strapping
pin MTDI should hold bit ”0” during the module power-on reset.
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3.Electrical Characteristics
3. Electrical Characteristics
3.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 3: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage 3.0 3.6 V
TST ORE Storage temperature –40 85 °C
Note:
Please see Appendix IO_MUX of ESP32 User Manual for IO’s power domain.
3.2 Recommended Operating Conditions
Table 4: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
T Operating temperature –40 — 85 °C
Humidity Humidity condition — 85 — %RH
3.3 DC Characteristics (3.3 V, 25 °C)
Table 5: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance - 2 - pF
VIH High-level input voltage 0.75×VDD1- VDD1+0.3 V
VIL Low-level input voltage –0.3 - 0.25×VDD1V
IIH High-level input current - - 50 nA
IIL Low-level input current - - 50 nA
VOH High-level output voltage 0.8×VDD1- - V
VOL Low-level output voltage - - 0.1×VDD1V
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4. Electrical Characteristics
Symbol Parameter Min Typ Max Unit
IOH
High-level source current
(VDD1= 3.3 V,
VOH >= 2.64 V,
output drive strength set
to the maximum)
VDD3P3_CPU
power domain 1,2- 40 - mA
VDD3P3_RTC
power domain 1,2- 40 - mA
VDD_SDIO power
domain 1,3- 20 - mA
IOL
Low-level sink current
(VDD1= 3.3 V, VOL = 0.495 V,
output drive strength set to the maximum)
- 28 - mA
RP U Resistance of internal pull-up resistor - 45 - kΩ
RP D Resistance of internal pull-down resistor - 45 - kΩ
VIL_nRST
Low-level input voltage of CHIP_PU
to power off the chip - - 0.6 V
Note:
1. Please see Appendix IO_MUX of ESP32 User Manual for IO’s power domain. VDD is the I/O voltage for a
particular power domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually
reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
3.4 Current Consumption Characteristics
With the use of advanced power-management technologies, ESP32 can switch between different power modes. For
details on different power modes, please refer to Section RTC and Low-Power Management in ESP32 User Manual.
Table 6: Current Consumption Depending on RF Modes
Work mode Description Average (mA) Peak (mA)
Active (RF working)
TX
802.11b, 20 MHz, 1 Mbps 233 368
802.11g, 20 MHz, 54 Mbps 181 258
802.11n, 20 MHz, MCS7 178 248
802.11n, 40 MHz, MCS7 162 205
RX 802.11b/g/n, 20 MHz 110 111
802.11n, 40 MHz 116 117
Note:
• The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF
port. All transmitters’ measurements are based on a 50% duty cycle.
• The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.
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4. Electrical Characteristics
Table 7: Current Consumption Depending on Work Modes
Work mode Description Current consumption (Typ)
Modem-sleep The CPU is
powered on
240 MHz 30 ~68 mA
160 MHz 27 ~44 mA
Normal speed: 80 MHz 20 ~31 mA
Light-sleep — 0.8 mA
Deep-sleep
The ULP co-processor is powered on. 150 µA
ULP sensor-monitored pattern 100 µA @1% duty
RTC timer + RTC memory 10 µA
RTC timer only 5 µA
Power off CHIP_PU is set to low level, the chip is powered off. 1 µA
Note:
• The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache
idle.
• When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consump-
tion changes accordingly.
• In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and
the peripherals used.
• During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I²C are able to
operate.
• The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodi-
cally. When ADC works with a duty cycle of 1%, the typical current consumption is 100 µA.
3.5 Wi-Fi RF Characteristics
3.5.1 Wi-Fi RF Standards
Table 8: Wi-Fi RF Standards
Name Description
Center frequency range of operating channel note12412 ~ 2462MHz
Wi-Fi wireless standard IEEE 802.11b/g/n20/n40
Data rate 20 MHz
11b: 1, 2, 5.5 and 11 Mbps
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna
Note:
1. Device should operate in the center frequency range allocated by regional regulatory authorities. Target center
frequency range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas,
users do not need to concern about the output impedance.
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3.Electrical Characteristics
3.5.2 Transmitter Characteristics
Table 9: Transmitter Characteristics
Parameter Condition Unit
TX Power note dBm
802.11b: 24.41dBm
802.11g: 23.64dBm
802.11n20: 23.30dBm
802.11n40: 21.95dBm
Note:
Target TX power is configurable based on device or certification requirements.
3.5.3 Receiver Characteristics
Table 10: Receiver Characteristics
Parameter Rate Typ Unit
RX Sensitivity 1 Mbps –97 dBm
2 Mbps –94
5.5 Mbps –91
11 Mbps –88
6 Mbps –92
9 Mbps –91
12 Mbps –89
18 Mbps –87
24 Mbps –84
36 Mbps –80
48 Mbps –76
54 Mbps –75
11n, HT20, MCS0 –91
11n, HT20, MCS1 –88
11n, HT20, MCS2 –85
11n, HT20, MCS3 –83
11n, HT20, MCS4 –80
11n, HT20, MCS5 –75
11n, HT20, MCS6 –74
11n, HT20, MCS7 –72
11n, HT40, MCS0 –88
11n, HT40, MCS1 –85
11n, HT40, MCS2 –82
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3.Electrical Characteristics
Parameter Rate Typ Unit
11n, HT40, MCS3 –80
11n, HT40, MCS4 –76
11n, HT40, MCS5 –72
11n, HT40, MCS6 –71
11n, HT40, MCS7 –69
RX Maximum Input Level 11b, 1 Mbps 5 dBm
11b, 11 Mbps 5
11g, 6 Mbps 0
11g, 54 Mbps –8
11n, HT20, MCS0 0
11n, HT20, MCS7 –8
11n, HT40, MCS0 0
11n, HT40, MCS7 –8
Adjacent Channel Rejection 11b, 11 Mbps 35 dB
11g, 6 Mbps 27
11g, 54 Mbps 13
11n, HT20, MCS0 26
11n, HT20, MCS7 12
11n, HT40, MCS0 16
11n, HT40, MCS7 7
3.6 Bluetooth/LE Radio
3.6.1 Receiver – Basic Data Rate
Table 11: Receiver Characteristics – Basic Data Rate
Parameter Conditions Min Typ Max Unit
Sensitivity @0.1% BER - - –88 - dBm
Maximum received signal @0.1% BER - 0 - - dBm
Co-channel C/I - - +7 - dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz - - –6 dB
F = F0 – 1 MHz - - –6 dB
F = F0 + 2 MHz - - –25 dB
F = F0 – 2 MHz - - –33 dB
F = F0 + 3 MHz - - –25 dB
F = F0 – 3 MHz - - –45 dB
Out-of-band blocking performance
30 MHz ~2000 MHz –10 - - dBm
2000 MHz ~2400 MHz –27 - - dBm
2500 MHz ~3000 MHz –27 - - dBm
3000 MHz ~12.5 GHz –10 - - dBm
Intermodulation - –36 - - dBm
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4. Electrical Characteristics
Parameter Conditions Min Typ Max Unit
Intermodulation - –36 - - dBm
3.6.2 Transmitter
Table 16: Transmitter Characteristics
Parameter Conditions Min Typ Max Unit
RF Frequency -2402 2480 MHz
Gain control step - - 3 - dB
RF power - dBm
Adjacent channel transmit power
F = F0 ± 2 MHz - –55 - dBm
F = F0 ± 3 MHz - –57 - dBm
F = F0 ± > 3 MHz - –59 - dBm
∆f1avg - - - 265 kHz
∆f2max - 210 - - kHz
∆f2avg/∆f1avg - - +0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz
Note:
There are a total of eight power levels from 0 to 7, and the transmit power ranges from –12 dBm to 9 dBm. When the
power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used by default and the corresponding
transmit power is 0 dBm.
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-
BT3.0:8.74dBm;BLE:6.08dBm

4.Peripheral Schematics
Note:
To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin. The
recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 0.1 µF. However, specific parameters should
be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For
ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 User Manual.
VCC
GND
GND GND
VDD33
GND
ESP Module
Discharge Circuit CAP Added By User
Q1
R1
100K
D1SW1
1 2
R2
1K
+
C1
Bulk CAP
Figure 2: Discharge Circuit for VDD33 Rail
Note:
The discharge circuit can be applied in scenarios where ESP32 is powered on and off repeatedly by switching the
power rails, and there is a large capacitor on the VDD33 rail. For details, please refer to Section Power Scheme in
ESP32 User Manual.
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
CHIP_PU
VBAT
GND
GND
Title
Size Document Number Rev
Date: Sheet o f
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<ResetCirciut>
A4
1 1Thursday, May 31, 2018
Title
Size Document Number Rev
Date: Sheet o f
<Doc> V1
<ResetCirciut>
A4
1 1Thursday, May 31, 2018
Title
Size Document Number Rev
Date: Sheet o f
<Doc> V1
<ResetCirciut>
A4
1 1Thursday, May 31, 2018
R1 0R
R2
100K
U1
Power Supply Supervisor
GND 1
VCC
3
RESET# 2
Figure 3: Reset Circuit
Note:
When battery is used as the power supply for ESP32 series of chips and modules, a supply voltage supervisor is recom-
mended to avoid boot failure due to low voltage. Users are recommended to pull CHIP_PU low if the power supply for
ESP32 is below 3.0 V.
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5.Physical Dimensions and PCB Layout
5. Physical Dimensions and PCB Layout
5.1 Physical Dimensions
16±0.15
23±0.15
0.8±0.1
2.3±0.15
14
13.8
Top view Side view Bottom view
ESP32-PICO-V3-ZERO Module Dimensions
Unit: mm
Figure4: Physical Dimensions
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5.Physical Dimensions and PCB Layout
5.2 PCB Layout
5.2.1 Recommended PCB Land Pattern
16
23
5
5
0.6
1.2
1.2
16
0.6
15.4
13.8
12.4
11.6
10.8
15.4 13.8 12.4 11.6 10.8
Antenna Area
Unit: mm
: Pad
Figure 5: Recommended PCB Land Pattern
5.2.2 PCB Layout Guide
To achieve the optimum RF performance on a device with on-board antenna, please follow the guidelines be-
low.
The module uses an inverted-F antenna design, and the antenna area of the module should have specific placement
against the base board. The feed point of the antenna should be as close to the board as possible. The PCB
antenna area should be placed outside the base board whenever possible while the module be put as close as
possible to the edge of the base board.
As is shown in Figure 9, examples 3 and 4 of the module position on the base board are highly recommended,
while examples 1, 2, and 5 are not recommended.
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6.Product Handling
6. Product Handling
6.1 Storage Condition
The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment
of < 40 °C/90%RH.
The module is rated at moisture sensitivity level (MSL) 3.
After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C/60%RH. The
module needs to be baked if the above conditions are not met.
6.2 ESD
• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
• Air discharge: 6000 V
• Contact discharge: 4000 V
6.3 Reflow Profile
50 150
0
25
1 ~ 3℃/s
0
200
250
200
-1 ~ -5℃/s
Cooling zone
100
217
50
100 250
Reflow zone
!217℃60 ~ 90s
Temperature (℃)
Preheating zone
150 ~ 200℃60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250℃
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp.:<150℃Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃(<245℃recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180℃Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 6: Reflow Profile
Note:
Solder the module in a single reflow. If the PCBA requires multiple reflows, place the module on the PCB during the final
reflow.
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7.MAC Addresses and eFuse
7.MAC Addresses and eFuse
The eFuse in ESP32 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station, AP,
BLE, and Ethernet modes correspond to mac_address in the following way:
• Station mode: mac_address
• AP mode: mac_address + 1
• BLE mode: mac_address + 2
• Ethernet mode: mac_address + 3
In the 1 Kbit eFuse, 256 bits are used for the system (MAC address and chip configuration) and the remaining 768
bits are reserved for customer applications, including flash-encryption and chip-ID.
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8.Learning Resources
8. Learning Resources
8.1 Must-Read Documents
The following link provides documents related to ESP32.
•ESP32 User Manual
This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin
definitions, functional description, peripheral interface, electrical characteristics, etc.
•ESP32 ECO V3 User Guide
This document describes differences between V3 and previous ESP32 silicon wafer revisions.
•ECO and Workarounds for Bugs in ESP32
This document details hardware errata and workarounds in the ESP32.
•ESP-IDF Programming Guide
It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
•ESP32 Technical Reference Manual
The manual provides detailed information on how to use the ESP32 memory and peripherals.
•ESP32 Hardware Resources
The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.
•ESP32 Hardware Design Guidelines
The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.
•ESP32 AT Instruction Set and Examples
This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.
•Espressif Products Ordering Information
8.2 Must-Have Resources Here
are the ESP32-related must-have resources.
•ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge,
explore ideas, and help solve problems with fellow engineers.
•ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is established
to help developers get started with ESP32 and foster innovation and the growth of general knowledge about
the hardware and software surrounding ESP32 devices.
Espressif Systems