Fujitsu MHX2300BT - Mobile 300 GB Hard Drive User manual

C141-E254-01EN
MHX2300BT, MHX2250BT
DISK DRIVES
PRODUCT MANUAL

FOR SAFE OPERATION
Handling of This Manual
This manual contains important information for using this product. Read thoroughly before using
the product. Use this product only after thoroughly reading and understanding especially the
section “Important Alert Items” in this manual. Keep this manual handy, and keep it carefully.
FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering
damage to their property. Use the product according to this manual.
IMPORTANT NOTE TO USERS
READ THE ENTIRE MANUAL CAREFULLY BEFORE USING THIS PRODUCT.
INCORRECT USE OF THE PRODUCT MAY RESULT IN INJURY OR DAMAGE TO
USERS, BYSTANDERS OR PROPERTY.
While FUJITSU has sought to ensure the accuracy of all information in this manual, FUJITSU
assumes no liability to any party for any damage caused by any error or omission contained in this
manual, its updates or supplements, whether such errors or omissions result from negligence,
accident, or any other cause. In addition, FUJITSU assumes no liability with respect to the
application or use of any product or system in accordance with the descriptions or instructions
contained herein; including any liability for incidental or consequential damages arising therefrom.
FUJITSU DISCLAIMS ALL WARRANTIES REGARDING THE INFORMATION CONTAINED
HEREIN, WHETHER EXPRESSED, IMPLIED, OR STATUTORY.
FUJITSU reserves the right to make changes to any products described herein without further notice
and without obligation.
This product is designed and manufactured for use in standard applications such as office work,
personal devices and household appliances. This product is not intended for special uses (atomic
controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices for
life support, or weapons firing controls) where particularly high reliability requirements exist,
where the pertinent levels of safety are not guaranteed, or where a failure or operational error could
threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers
considering the use of these products for mission-critical applications must have safety-assurance
measures in place beforehand. Moreover, they are requested to consult our sales representative
before embarking on such specialized use.
The contents of this manual may be revised without prior notice.
The contents of this manual shall not be disclosed in any way or reproduced in any media without
the express written permission of Fujitsu Limited.
All Rights Reserved, Copyright FUJITSU LIMITED 2006

Revision History
(1/1)
Edition Date Revised section (*1)
(Added/Deleted/Altered) Details
01 2006-10-20
*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.
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Preface
This manual describes MHX2300BT, MHX2250BT model of the MHX Series, 2.5-
inch hard disk drives. These drives have a built-in controller that is compatible
with the Serial-ATA interface.
This manual describes the specifications and functions of the drives and explains
in detail how to incorporate the drives into user systems. This manual assumes
that the reader has a basic knowledge of hard disk drives and their
implementations in computer systems.
This manual consists of seven chapters and sections explaining the special
terminology and abbreviations used in this manual:
Overview of Manual
CHAPTER 1 Device Overview
This chapter gives an overview of the disk drive and describes their features.
CHAPTER 2 Device Configuration
This chapter describes the internal configurations of the disk drive and the
configuration of the systems in which they operate.
CHAPTER 3 Installation Conditions
This chapter describes the external dimensions, installation conditions, and switch
settings of the disk drive.
CHAPTER 4 Theory of Device Operation
This chapter describes the operation theory of the disk drive.
CHAPTER 5 Interface
This chapter describes the interface specifications of the disk drive.
CHAPTER 6 Operations
This chapter describes the operations of the disk drive.
Glossary
The glossary describes the technical terms that need to be understood to read this
manual.
Acronyms and Abbreviations
This section gives the meanings of the definitions used in this manual.
C141-E254 i

Preface
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert
message consists of an alert signal and alert statements. The alert signal consists
of an alert symbol and a signal word or just a signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation could result in
minor or moderate personal injury if the user does
not perform the procedure correctly. This alert signal
also indicates that damages to the product or other
property may occur if the user does not perform the
procedure correctly.
This indicates information that could help the user
use the product more efficiently.
In the text, the alert signal is centered, followed below by the indented message.
A wider line space precedes and follows the alert message to show where the alert
message begins and ends. The following is an example:
(Example)
Data corruption: Avoid mounting the disk drive near strong
magnetic sources such as loud speakers. Ensure that the disk drive
is not affected by external magnetic fields.
The main alert messages in the text are also listed in the “Important Alert Items.”
Operating Environment
This product is designed to be used in offices or computer rooms.
Conventions
An MHW series device is sometimes simply referred to as a "hard disk drive,"
"HDD," "drive," or "device" in this document.
Decimal numbers are represented normally.
Hexadecimal numbers are represented as shown in the following examples:
X'17B9', 17B9h, 17B9H, or 17B9H.
Binary numbers are represented as shown in the following examples: 010 or 010b.
Serial-ATA may be referred to as "SATA".
ii C141-E254

Preface
Attention
Please forward any comments you may have regarding this manual.
To make this manual easier for users to understand, opinions from readers are
needed. Please write your opinions or requests on the Comment at the back of this
manual and forward it to the address described in the sheet.
Liability Exception
“Disk drive defects” refers to defects that involve adjustment, repair, or
replacement.
Fujitsu is not liable for any other disk drive defects, such as those caused by user
misoperation or mishandling, inappropriate operating environments, defects in the
power supply or cable, problems of the host system, or other causes outside the
disk drive.
C141-E254 iii

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Important Alert Items
Important Alert Messages
The important alert messages in this manual are as follows:
A hazardous situation could result in minor or moderate personal
injury if the user does not perform the procedure correctly. Also,
damage to the product or other property, may occur if the user does not
perform the procedure correctly.
Task Alert message Page
Normal Operation Data corruption: Avoid mounting the disk near strong
magnetic sources such as loud speakers. Ensure that the disk
drive is not affected by external magnetic fields.
Damage: Do not press the cover of the disk drive. Pressing
it too hard, the cover and the spindle motor contact, which
may cause damage to the disk drive.
Static: When handling the device, disconnect the body
ground (500 kΩor greater). Do not touch the printed circuit
board, but hold it by the edges.
3-7
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Manual Organization
MHX2300BT, MHX2250BT
DISK DRIVES
PRODUCT MANUAL
(C141-E254)
<This manual>
• Device Overview
• Device Configuration
• Installation Conditions
• Theory of Device Operation
• Interface
• Operations
MHX2300BT, MHX2250BT
DISK DRIVES
MAINTENANCE MANUAL
(C141-F085)
• Maintenance and Diagnosis
• Removal and Replacement Procedure
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Contents
CHAPTER 1 Device Overview ....................................................................... 1-1
1.1 Features .............................................................................................................. 1-2
1.1.1 Functions and performance ..................................................................... 1-2
1.1.2 Adaptability............................................................................................. 1-2
1.1.3 Interface................................................................................................... 1-3
1.2 Device Specifications......................................................................................... 1-4
1.2.1 Specifications summary .......................................................................... 1-4
1.2.2 Model and product number ..................................................................... 1-5
1.3 Power Requirements .......................................................................................... 1-6
1.4 Environmental Specifications ............................................................................ 1-9
1.5 Acoustic Noise ................................................................................................. 1-10
1.6 Shock and Vibration......................................................................................... 1-10
1.7 Reliability......................................................................................................... 1-11
1.8 Error Rate ......................................................................................................... 1-12
1.9 Media Defects .................................................................................................. 1-12
1.10 Load/Unload Function.................................................................................... 1-12
1.10.1 Recommended power-off sequence ................................................... 1-13
1.11 Advanced Power Management (APM) .......................................................... 1-13
1.12 Interface Power Management (IPM)............................................................. 1-15
1.12.1 Host-initiated interface power management (HIPM) ......................... 1-15
1.12.2 Device-initiated interface power management (DIPM) ..................... 1-15
CHAPTER 2 Device Configuration................................................................ 2-1
2.1 Device Configuration ........................................................................................ 2-2
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Contents
2.2 System Configuration........................................................................................2-3
2.2.1 SATA interface .....................................................................................2-3
2.2.2 Drive connection ...................................................................................2-3
CHAPTER 3 Installation Conditions.............................................................. 3-1
3.1 Dimensions........................................................................................................3-2
3.2 Mounting ...........................................................................................................3-3
3.3 Connections with Host System..........................................................................3-9
3.3.1 Device connector...................................................................................3-9
3.3.2 Signal segment and power supply segment.........................................3-10
3.3.3 Connector specifications for host system............................................3-10
3.3.4 SATA interface cable connection .......................................................3-11
3.3.5 Note about SATA interface cable connection.....................................3-11
CHAPTER 4 Theory of Device Operation......................................................4-1
4.1 Outline ................................................................................................................4-2
4.2 Subassemblies.....................................................................................................4-2
4.2.1 Disk .........................................................................................................4-2
4.2.2 Spindle.....................................................................................................4-2
4.2.3 Actuator ...................................................................................................4-2
4.2.4 Air filter...................................................................................................4-3
4.3 Circuit Configuration..........................................................................................4-3
4.4 Power-on Sequence ............................................................................................4-6
4.5 Self-calibration ...................................................................................................4-8
4.5.1 Self-calibration contents..........................................................................4-8
4.5.2 Execution timing of self-calibration ........................................................4-9
4.5.3 Command processing during self-calibration..........................................4-9
4.6 Read/write Circuit ............................................................................................4-10
4.6.1 Read/write preamplifier (PreAMP) .......................................................4-10
4.6.2 Write circuit...........................................................................................4-10
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4.6.3 Read circuit ........................................................................................... 4-11
4.6.4 Digital PLL circuit ................................................................................ 4-12
4.7 Servo Control ................................................................................................... 4-13
4.7.1 Servo control circuit .............................................................................. 4-13
4.7.2 Data-surface servo format ..................................................................... 4-15
4.7.3 Servo frame format................................................................................ 4-17
4.7.4 Actuator motor control .......................................................................... 4-18
4.7.5 Spindle motor control............................................................................ 4-19
CHAPTER 5 Interface..................................................................................... 5-1
5.1 Physical Interface .............................................................................................. 5-2
5.1.1 Interface signals .................................................................................... 5-2
5.1.2 Signal interface regulation .................................................................... 5-4
5.1.2.1 Out of band signaling................................................................. 5-4
5.1.2.2 Primitives descriptions ............................................................... 5-5
5.1.3 Electrical specifications ........................................................................ 5-7
5.1.4 Connector pinouts ............................................................................... 5-10
5.1.5 P11 function........................................................................................ 5-11
5.1.5.1 Staggered Spin-up .................................................................... 5-11
5.1.5.2 Driving Activity LED .............................................................. 5-11
5.1.6 Hot Plug .............................................................................................. 5-13
5.2 Logical Interface ............................................................................................. 5-14
5.2.1 Communication layers ........................................................................ 5-15
5.2.2 Outline of the Shadow Block Register................................................ 5-16
5.2.3 Outline of the frame information structure (FIS)................................ 5-17
5.2.3.1 FIS types .................................................................................. 5-17
5.2.3.2 Register - Host to Device ......................................................... 5-17
5.2.3.3 Register - Device to Host ......................................................... 5-18
5.2.3.4 DMA Active - Device to Host.................................................. 5-18
5.2.3.5 DMA Setup - Device to Host or Host to Device
(Bidirectional) .......................................................................... 5-19
5.2.3.6 BIST Active - Bidirectional ..................................................... 5-20
5.2.3.7 Data - Host to Device or Device to Host (Bidirectional) ......... 5-21
5.2.3.8 PIO Setup – Device to Host ..................................................... 5-21
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Contents
5.2.3.9 Set Device Bits – Device to Host .............................................5-23
5.2.4 Shadow block registers .......................................................................5-24
5.3 Host Commands ..............................................................................................5-29
5.3.1 Command code and parameters ..........................................................5-29
5.3.2 Command descriptions........................................................................5-32
(1) RECALIBRATE (X’10’ to X’1F’)................................................ 5-33
(2) READ SECTOR(S) (X’20’ or X’21’) ......................................... 5-34
(3) WRITE SECTOR(S) (X’30’ or X’31’) ........................................ 5-36
(4) WRITE VERIFY (X’3C’) ............................................................ 5-38
(5) READ VERIFY SECTOR(S) (X’40’ or X’41’)........................... 5-40
(6) SEEK (X’70’ to X’7F’) ................................................................. 5-42
(7) EXECUTE DEVICE DIAGNOSTIC (X’90’)............................... 5-43
(8) INITIALIZE DEVICE PARAMETERS (X’91’) .......................... 5-44
(9) DOWNLOAD MICROCODE (X’92’).......................................... 5-45
(10) STANDBY IMMEDIATE (X’94’ or X’E0’) ................................ 5-47
(11) IDLE IMMEDIATE (X’95’ or X’E1’) /UNLOAD
IMMEDIATE (X’95’ or X’E1’).................................................... 5-48
(12) STANDBY (X’96’ or X’E2’)........................................................ 5-50
(13) IDLE (X’97’ or X’E3’).................................................................. 5-51
(14) CHECK POWER MODE (X’98’ or X’E5’) ................................. 5-53
(15) SLEEP (X’99’ or X’E6’).............................................................. 5-54
(16) SMART (X’B0’)............................................................................ 5-55
(17) DEVICE CONFIGURATION (X'B1') .......................................... 5-85
(18) READ MULTIPLE (X’C4’).......................................................... 5-90
(19) WRITE MULTIPLE (X’C5’)........................................................ 5-93
(20) SET MULTIPLE MODE (X’C6’)................................................. 5-95
(21) READ DMA (X’C8’ or X’C9’)..................................................... 5-97
(22) WRITE DMA (X’CA’ or X’CB’) ................................................. 5-99
(23) READ BUFFER (X’E4’)............................................................. 5-101
(24) FLUSH CACHE (X’E7’) ........................................................... 5-102
(25) WRITE BUFFER (X’E8’)........................................................... 5-103
(26) IDENTIFY DEVICE (X’EC’)..................................................... 5-104
(27) IDENTIFY DEVICE DMA (X’EE’).......................................... 5-105
(28) SET FEATURES (X’EF’) ........................................................... 5-119
(29) SECURITY SET PASSWORD (X’F1’) ..................................... 5-126
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Contents
(30) SECURITY UNLOCK(X’F2’) ................................................... 5-128
(31) SECURITY ERASE PREPARE (X’F3’).................................... 5-130
(32) SECURITY ERASE UNIT (X’F4’)............................................ 5-131
(33) SECURITY FREEZE LOCK (X’F5’)......................................... 5-132
(34) SECURITY DISABLE PASSWORD (X’F6’) ........................... 5-134
(35) READ NATIVE MAX ADDRESS (X’F8’) ............................... 5-136
(36) SET MAX (X’F9’) ...................................................................... 5-137
(37) READ SECTOR (S) EXT (X’24’).............................................. 5-143
(38) READ DMA EXT (X’25’).......................................................... 5-144
(39) READ NATIVE MAX ADDRESS EXT (X’27’)....................... 5-145
(40) READ MULTIPLE EXT (X’29’) ............................................... 5-146
(41) READ LOG EXT (X'2F')............................................................ 5-147
(42) WRITE SECTOR (S) EXT (X’34’) ............................................ 5-153
(43) WRITE DMA EXT (X’35’) ........................................................ 5-154
(44) SET MAX ADDRESS EXT (X’37’) .......................................... 5-155
(45) WRITE MULTIPLE EXT (X’39’).............................................. 5-157
(46) WRITE LOG EXT (X'3F') .......................................................... 5-158
(47) READ VERIFY SECTOR (S) EXT (X’42’).............................. 5-162
(48) FLUSH CACHE EXT (X’EA’).................................................. 5-163
(49) WRITE MULTIPLE FUA EXT (X'CE')..................................... 5-164
(50) WRITE DMA FUA EXT (X'3D') ............................................... 5-165
(51) READ FP DMA QUEUED (X'60') ............................................. 5-166
(52) WRITE FP DMA QUEUED (X'61') ........................................... 5-167
5.3.3 Error posting ..................................................................................... 5-168
5.4 Command Protocol........................................................................................ 5-170
5.4.1 Non-data command protocol............................................................. 5-170
5.4.2 PIO data-in command protocol ......................................................... 5-172
5.4.3 PIO data-out command protocol ....................................................... 5-173
5.4.4 DMA data-in command protocol ...................................................... 5-175
5.4.5 DMA data-out command protocol .................................................... 5-176
5.4.6 Native Command Queuing protocol ................................................. 5-177
5.5 Power-on and COMRESET .......................................................................... 5-180
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Contents
CHAPTER 6 Operations .................................................................................6-1
6.1 Reset and Diagnosis ..........................................................................................6-2
6.1.1 Response to power-on ...........................................................................6-2
6.1.2 Response to COMRESET .....................................................................6-4
6.1.2.1 Software settings preservation....................................................6-5
6.1.2.2 COMRESET preservation requirements ....................................6-5
6.1.3 Response to a software reset .................................................................6-7
6.2 Power Save ........................................................................................................6-8
6.2.1 Power save mode...................................................................................6-8
6.2.2 Power commands ................................................................................6-10
6.3 Power Save Controlled by Interface Power Management (IPM) ....................6-11
6.3.1 Power save mode of the interface .......................................................6-11
6.4 Read-ahead Cache ...........................................................................................6-13
6.4.1 Data buffer structure............................................................................6-13
6.4.2 Caching operation ...............................................................................6-14
6.4.3 Using the read segment buffer ............................................................6-16
6.4.3.1 Miss-hit.....................................................................................6-16
6.4.3.2 Sequential hit............................................................................6-17
6.4.3.3 Full hit ......................................................................................6-17
6.4.3.4 Partial hit ..................................................................................6-19
6.5 Write Cache .....................................................................................................6-20
6.5.1 Cache operation...................................................................................6-20
Glossary ...........................................................................................................GL-1
Acronyms and Abbreviations .........................................................................AB-1
Index ................................................................................................................. IN-1
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Contents
Illustrations
Figures
Figure 1.1 Permissible range of +5V rise slope..................................................... 1-6
Figure 1.2 The example of negative voltage waveform at +5 V when
power is turned off............................................................................. 1-7
Figure 1.3 Current fluctuation (Typ.) at +5 V when power is turned on............... 1-9
Figure 2.1 Disk drive outerview ............................................................................ 2-2
Figure 2.2 Drive system configuration .................................................................. 2-3
Figure 3.1 Dimensions........................................................................................... 3-2
Figure 3.2 Mounting frame structure..................................................................... 3-4
Figure 3.3 Location of breather ............................................................................. 3-5
Figure 3.4 Surface cover temperature measurement points................................... 3-6
Figure 3.5 Service area .......................................................................................... 3-7
Figure 3.6 Handling cautions................................................................................. 3-8
Figure 3.7 Connector locations.............................................................................. 3-9
Figure 3.8 Power supply pins (CN1) ................................................................... 3-10
Figure 4.1 Power supply configuration.................................................................. 4-4
Figure 4.2 Circuit configuration ............................................................................ 4-5
Figure 4.3 Power-on operation sequence............................................................... 4-7
Figure 4.4 Read/write circuit block diagram ....................................................... 4-10
Figure 4.5 Frequency characteristic of programmable filter................................ 4-11
Figure 4.6 Block diagram of servo control circuit............................................... 4-13
Figure 4.7 Physical sector servo configuration on disk surface........................... 4-16
Figure 4.8 Servo frame format............................................................................. 4-17
Figure 5.1 Interface signals.................................................................................... 5-2
Figure 5.2 Example of the circuit for driving Ready LED .................................. 5-12
Figure 5.3 Conceptual diagram of communication layers ................................... 5-14
Figure 5.4 Register - Host to Device FIS layout.................................................. 5-17
Figure 5.5 Register - Device to Host FIS layout.................................................. 5-18
Figure 5.6 DMA Active - Device to Host FIS layout .......................................... 5-18
Figure 5.7 DMA Setup - Device to Host or Host to Device FIS layout .............. 5-19
Figure 5.8 BIST Active - Bidirectional FIS layout.............................................. 5-20
Figure 5.9 Data FIS (Bidirectional) layout .......................................................... 5-21
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Contents
Figure 5.10 PIO Setup - Device to Host FIS layout.............................................5-21
Figure 5.11 Set Device Bits FIS...........................................................................5-23
Figure 5.12 Execution example of READ MULTIPLE command......................5-91
Figure 5.13 Non-data command protocol ..........................................................5-171
Figure 5.14 PIO data-in command protocol.......................................................5-173
Figure 5.15 PIO data-out command protocol.....................................................5-174
Figure 5.16 DMA data-in command protocol....................................................5-175
Figure 5.17 DMA data-out command protocol..................................................5-176
Figure 5.18 READ FP DMA QUEUED command protocol .............................5-178
Figure 5.19 WRITE FP DMA QUEUED command protocol ...........................5-179
Figure 5.20 Power-on sequence .........................................................................5-180
Figure 5.21 COMRESET sequence ...................................................................5-181
Figure 6.1 Response to power-on (when the host is powered on earlier
than the device) ..................................................................................6-2
Figure 6.2 Response to power-on (when the device is powered on
earlier than the host)...........................................................................6-3
Figure 6.3 Response to COMRESET ....................................................................6-4
Figure 6.4 Response to a software reset.................................................................6-7
Figure 6.5 Data buffer structure...........................................................................6-13
xvi C141-E254