Global American Inc. 2808190 User manual

2808190

ii
Trademarks
Alltrademarksarethe propertiesoftheirrespectiveowners.
Intel and Pentium areregisteredtrademarks of IntelCorporation.
AMD, Athlon™,Athlon™XP, Thoroughbred™,andDuron™areregisteredtrade-
marks ofAMDCorporation.
NVIDIA,the NVDIAlogo,DualNet, andnForceareregistered trademarksortrade-
marks ofNVIDIACorporationintheUnitedStatesand/orothercountries.
PS/2and OS /2areregisteredtrademarksof InternationalBusiness Machines
Corporation.
Windows 2000/NT/XP/VistaareregisteredtrademarksofMicrosoftCorporation.
Netware isaregistered trademark ofNovell,Inc.
Award isaregisteredtrademarkof PhoenixTechnologiesLtd.
AMI isaregistered trademark ofAmericanMegatrendsInc.
Revision History
Revision RevisionHistory Date
V1.0 First release May2008

iii
SafetyInstructions
CAUTIONDangerofexplosionifbattery isincorrectlyreplaced.
Replaceonlywiththesameorequivalenttyperecommendedbythe
manufacturer.
1. Alwaysreadthe safetyinstructionscarefully.
2. KeepthisUser’sManualforfuturereference.
3. Keep thisequipmentawayfromhumidity.
4. Laythisequipmenton areliableflatsurfacebeforesettingitup.
5. Theopeningsontheenclosureareforairconvectionhenceprotectstheequip-
mentfromoverheating.DONOTCOVERTHEOPENNGS.
6. Makesurethevoltage ofthepowersourceandadjustproperly110/220Vbe-
foreconnecting theequipmenttothepowerinlet.
7. Placethepowercordsuchawaythatpeoplecannotstep on it.Donotplace
anythingoverthe powercord.
8. AlwaysUnplugthePowerCordbeforeinserting anyadd-oncardormodule.
9. Allcautionsandwarningson the equipment should benoted.
10.Neverpouranyliquidintothe openingthatcoulddamageorcauseelectrical
shock.
11. Ifanyofthefollowingsituationsarises,get theequipmentchecked byservice
personnel:
†Thepowercordorplug isdamaged.
†Liquidhaspenetrated intotheequipment.
†Theequipment hasbeen exposedtomoisture.
†Theequipmentdoesnotworkwelloryou cannotgetit workaccordingto
User’sManual.
†Theequpmenthasdroppedand damaged.
†Theequipment hasobvioussign of breakage.
12.DONOTLEAVETHISEQUPMENTINANENVRONMENTUNCONDITIONED,STOR-
AGETEMPERATUREABOVE600 C(1400F), ITMAYDAMAGETHEEQUIPMENT.

iv
FCC-BRadioFrequencyInterferenceStatement
Thisequipmenthasbeen
testedandfoundtocomply
withthe limitsforaClass B
digitaldevice,pursuanttoPart
15oftheFCCRules.Theselimitsaredesignedtoprovidereasonableprotection
againstharmfulinterferenceinaresidentialinstallation. Thisequipmentgenerates,
usesandcanradiateradio frequency energyand, ifnot installedand usedin accor-
dancewiththeinstructions,maycauseharmful interferencetoradio communications.
However,thereisnoguaranteethatinterferencewill notoccurinaparticular
installation.Ifthisequipmentdoescauseharmful interferencetoradio ortelevision
reception, whichcanbedeterminedbyturning theequipmentoff and on, theuseris
encouraged totrytocorrect theinterferencebyoneormoreofthe measureslisted
below. †Reorientorrelocatethereceivingantenna.
†Increasetheseparation between theequipmentandreceiver.
†Connectthe equipmentintoan outletonacircuitdifferentfromthat to
whichthereceiverisconnected.
†Consult thedealeroranexperiencedradio/televisiontechnician forhelp.
Notice1
Thechangesormodificationsnotexpresslyapprovedbythe partyresponsible for
compliancecouldvoidtheuser’sauthoritytooperatetheequipment.
Notice2
ShieldedinterfacecablesandA.C.powercord,if any,must beused in orderto
complywiththeemissionlimits.
VORLANOTICED’NSTALLATIONAVANTDERACCORDERAURESEAU.
ThisdevicecomplieswithPart15oftheFCCRules.Operationissubject tothe
followingtwo conditions:
(1)thisdevicemaynotcauseharmfulinterference,and
(2)thisdevicemustacceptanyinterferencereceived,includinginterferencethat
maycauseundesiredoperation.

viii
CONTENTS
CopyrightNotice....................................................................................................ii
Trademarks............................................................................................................ii
Revision History....................................................................................................ii
TechnicalSupport.................................................................................................ii
SafetyInstructions................................................................................................iii
FCC-BRadioFrequency InterferenceStatement...................................................iv
WEEE (WasteElectricaland ElectronicEquipment)Statement................................v
Chapter 1ProductOverview..........................................................................1-1
MainboardSpecifications.............................................................................1-2
BlockDiagram...............................................................................................1-4
MainboardLayout........................................................................................1-5
BoardDimension..........................................................................................1-6
Back Panel&/OShieldDrawing..................................................................1-7
PowerConsumption....................................................................................1-8
SafetyCompliance&MTBF..........................................................................1-9
Chapter 2Hardware Setup.............................................................................2-1
QuickComponentsGuide.............................................................................2-2
CPU(CentralProcessing Unit)......................................................................2-3
Memory.......................................................................................................2-7
PowerSupply..............................................................................................2-9
BackPanel.................................................................................................2-10
Connector..................................................................................................2-12
Jumper......................................................................................................2-18
Slot............................................................................................................2-19
Chapter3BIOSSetup......................................................................................3-1
EnteringSetup.............................................................................................3-2
TheMenu Bar..............................................................................................3-4
Main.............................................................................................................3-5
Advanced....................................................................................................3-6
Boot...........................................................................................................3-15
Security.....................................................................................................3-17
Chipset......................................................................................................3-18
Exit............................................................................................................3-21
Chapter4System Resources.......................................................................4-1
WatchDogTimerSetting..............................................................................4-2
AMIPOSTCode...........................................................................................4-3
ResourceList..............................................................................................4-7

1 - 1
Product Overview
Chapter 1
Product Overview
Thank you for choosing the 2808190 Mini ITX
mainboard.
Based on the innovative Intel Q35 &ICH9DO con-
trollers for optimal system efficiency, the 2808190 ac-
commodates the latest Intel Core M 2 Quad/Core M 2
Duo/Pentium Dual-Core /Celeron processors in
Socket 775 and supports two 240-pin DDR2 D MM
slots to provide the maximum of 4GB memory capacity.
In the entry-level and mid-range market segment, the
2808190 can provide a high-performance solution for
today’s front-end and general purpose workstation, as
well as in the future.

2808190 Mainboard
1 - 2
M a i n b o a r d S p e c i f i c a t i o n s
Processor Support
-Intel CoreTM2Quad/CoreTM 2Duo/Pentium Dual-Core/Celeron
processorsintheLGA775package
-Supports Intel Yorkfield, Wolfdale
- Supports up to 95W processors only.
Supported FSB
-1333/1066/ 800 MHz
Chipset
-NorthBridge:Intel Q35 chipset
-SouthBridge: Intel ICH9DO chipset
MemorySupport
-DDRII 667/800non-ECC memory (4GB Max)
- 2 * DDRII DIMMs (240pin / 1.8V)
LAN
- Supports PCIe GbE LAN by Intel 8 25 6 6 DM f o r v P r o
-Supports PCIeGbE LANby Intel 82573L
Audio
-RealtekALC888 HDaudio codec
- Flexible 5.1 channelaudio withjack sensing
I D E
- 1 * IDE port
-Supports UltraDMA66/100/133mode
-SupportsPIO,Bus Masteroperationmode
SATA
- 4 * SATAII ports by ICH9DO
- Supports storage and data transfers at up to 3Gb/s
R A I D
- SATA1~4 supports RAID 0/ 1/ 5/ 10 by ICH9DO
-Supports Intel Matrix Storage Technology.
Connectors
Backpanel
- 1 * PS/2 mouse port
- 1 * PS/2 keyboard port
-2*RJ45GigabitLAN
- 4 * USB 2.0 ports
- 1 * RS-232 port
- 1 * VGA port
-3 * flexible audio jacks

1-3
ProductOverview
On-BoardPinheaders/Connectors
-2*USB2.0pinheaders
-1*ChassisIntrusionSwitchpinheader
-1*RS-232connector
-1*FrontPanelAudiopinheader
-1*TPMconnector
Slots
-1*PCIex16slot
-1*Mini-PCIeslot
FormFactor
-Mini-ITX(17.0cmX17.0cm)
Mounting
-4*mountingholes

2808190 Mainboard
1 - 4
Block Diagram

1 - 5
Product Overview
2808190Mainboard (Mini ITX)
M a i nb o a r d L a y o u t
PCI E1
ALC 88
Fintek
F71882FG
JAMP1
JPWR2
AUD1
COM1
CPUFAN1
JMB368
SYSFAN1
JFP1
IDE2
JPWR1
DIMM_B1 DIMM A1
USB2
SATA1
JBAT1
JCI1
SATA SATA2SATA3
JUSB1
BATT
To p : m o u s e
Bottom:
keyboard
Top: LAN Jack
Botom:USBports
Top: LAN Jack
Botom:USBports
To p : C O M P o r t
Bottom VGAPort
T: L ine-In
M:Line-Out
B:Mc-In Intel
Q35
Intel
ICH9DO

2808190 Mainboard
1 - 6
Board Dimension

1-7
ProductOverview
Back Panel& I/O Shield Drawing

2808190 Mainboard
1 - 8
Power Consumption
Current(A) Current(A) Current(A) Current(A) Current(A) Current(A)
EnterDOS(Stable) 0.86 3.4 2.35 0.46 0.068 0.037
EnterBIOS(Stable) 0.89 3.38 2.58 0.48 0.083 0.038
I d l e 0.86 3.39 0.89 0.51 0.091 0.016
CPUStress100% 0.9 3.47 5.92 0.5 0.075 0.016
Windows stress(3dMARK2006) 0.89 4.82 3.34 0.5 0.075 0.029
Windows Desktop StandbyS1
with/without two LANs connected
(stable)
0.67 2 5 1.87 0.29 0.065 0.026
Windows Desktop StandbyS3
with/without two LANs connected
(stable)
0 0 0 0 0.666 0
Windows Desktop Hibernate S4
with/without two LANs connected
(stable)
0 0 0 0 0.453 0
Windows Desktop Soft Off S5
with/without two LANs connected
(stable)
0 0 0 0 0.457 0
(-)12 V5VStandby
12VMain
Connector
MS -9820 3.3V 5V 12V
Condition
Ma i n b o a r d 2808190
C P U Y o r k f i e l d Q 9 4 5 0 2 . 6 6 G
Me m o r y DDRII 1GB*2
H D D WD40G

1-9
ProductOverview
Safety Compliance &MTBF
Certification Titleof standard
EN55022:1998+A1:2000+A2:2003Class BProductfamlystandard
EN6100-3-2:2000ClassD
Limitsforharmoniccurrent
emission
EN6100-3-3:1995+A1:2001
Limitationofvoltage
fluctuationand flickerinlow-
voltagesupplysystem
ImmunityEN55024:1998+A1:2001+A2:2003 Productfamlystandard
BSMI
C-Tick
CE RFI
VCCI VCCIV-3:2004, ClassB
VCCIV-4:2004, ClassB
Standardnumber
FCC
AS/NZSCISPR22:2004
CNS13438 類(1997年版)
FCC CFRTitle47 Part 15SubpartB:2005ClassB
CISPR22: 2005

2-1
HardwareSetup
HardwareSetup
Chapter2
Thischapterprovidesyouwiththeinformationabout
hardwaresetup procedures.Whiledoing theinstallation,
becarefulinholdingthe componentsandfollowthe
installationprocedures.Forsomecomponents, if you
install inthewrong orientation,thecomponentswill not
workproperly.
Useagrounded wriststrapbeforehandlingcomputer
components.Staticelectricitymaydamagethe
components.

2808190 Mainboard
2 - 2
Quick Components Guide
JPW1,
p.2-9
BackPanel,
p.2-10
JUSB1~2,
p.2-16 CPU, p.2-3 SATA1~4, p.2-13 DDR2, p.2-7
JPWR1,
p.2-9
IDE2,
p.2-12
JF P1 ,
p.2-14
SYSFAN1,
p.2-14
JC I 1 ,
p.2-17
JBAT1,
p.2-18
CPUFAN1,
p.2-14
PCI_E,
p.2-19
JSPD1,
p.2-17
JCOM1
p.2-15
JAUD1
p.2-15
JAMP1,
p.2-17

2-3
HardwareSetup
CPU (CentralProcessing Unit)
Whenyou areinstalling theCPU, make sure to install thecooler toprevent
overheating. Ifyoudonot havetheCPUcooler, consultyourdealerbeforeturning
onthecomputer.
Introduction toLGA775CPU The surfaceof LGA775 CPU.
Remembertoapplysomether-
mal pasteonitforbetterheat
dispersion.
Yellow triangle isthe Pin 1indicator
Thepin-padsideofLGA775
CPU.
Yellow triangle isthe Pin 1indicator
AlignmentKey Alignment Key
Important
Overheating
OverheatingwillseriouslydamagetheCPUandsystem. Alwaysmakesure
thecoolingfancanwork properlytoprotectthe CPUfromoverheating. Make
surethatyou applyaneven layerofthermalpaste(orthermaltape)between
theCPUandtheheatsinktoenhanceheatdissipation.
ReplaceingtheCPU
WhilereplacingtheCPU,alwaysturnofftheATXpowersupplyorunplug the
powersupplyspowercordfromthegrounded outlet firsttoensurethe safety
ofCPU.
Overclocking
Thismainboardisdesignedtosupportoverclocking.However,pleasemake
sureyourcomponentsareabletotoleratesuchabnormalsetting,while
doingoverclocking.Anyattempttooperatebeyondproductspecificationsis
notrecommended. Wedonotguaranteethedamages orriskscaused
byinadequateoperationorbeyond productspecifications.

2808190 Mainboard
2 - 4
Important
1. Confirm if your CPU cooler is firmly installed before turning on your system.
2. Do not touch the CPU socket pins to avoid damaging.
3. The availability of the CPU land side cover depends on your CPU packing.
2. Remove the cap from lever hinge
side(asthearrowshows).
1. The CPU socket has a plastic cap on
it to protect the contact from damage.
Before you install the CPU, always
cover it to protect the socket pin.
3. The pins of socket reveal.
CPU&Cooler Installation
When you are installing the CPU, make sure the CPU has a cooler attached on
the top to prevent overheating. Meanwhile, do not forget to apply some thermal
pasteonCPUbeforeinstallingtheheatsink/coolerfanforbetterheatdispersion.
Follow the steps belowto install the CPU & cooler correctly. Wrong installation will
cause the damage of your CPU & mainboard.
4. Open the load lever.