Hitachi HX-RIO3 Series User manual

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HX-RIO3 Series
MODBUS RTU Network Adapter Light
RIO3-MBRL
User manual

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HX-RIO3 Series
DOCUMENT CHANGE SUMMARY
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REMARKS
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EDITOR
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New Document
Feb 2021
Faber

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HX-RIO3 Series
Contents
1. Important Note ..........................................................................................................................5
1.1. Safety Instruction...................................................................................................................6
1.1.1. Symbols...............................................................................................................................6
1.1.2. Safety Notes........................................................................................................................6
1.1.3. Certification.........................................................................................................................6
2. Specification..............................................................................................................................7
2.1. Interface..................................................................................................................................7
2.1.1. RIO3-MBRL..........................................................................................................................7
2.2. Specification...........................................................................................................................8
2.2.1. General Specification..........................................................................................................8
2.2.2. Interface Specification........................................................................................................9
2.3. LED Indicator........................................................................................................................10
2.3.1 MOD (Module Status LED).................................................................................................10
2.3.2 RXD (Receive Data LED)....................................................................................................10
2.3.3 TXD (Transmit Data LED)...................................................................................................10
2.3.4 IOS LED (Extension Module Status LED).........................................................................10
3. Dimension ...............................................................................................................................11
3.1. RIO3-MBRL...........................................................................................................................11
4. Mechanical Set Up ..................................................................................................................12
4.1. Total Expansion ...................................................................................................................12
4.2. Plugging and Removal of the Components .......................................................................12
5. MODBUS Electrical Interface .................................................................................................12
5.1. G-Bus System ......................................................................................................................14
5.3. RIO3-MBRL Electrical Interface...........................................................................................16
5.3.1. RJ-45 Socket .....................................................................................................................16
5.3.2. MODBUS Dip Switch Setup..............................................................................................16
5.3.3. Process Image Map...........................................................................................................17
5.3.4. MODBUS Interface Register/Bit Map ...............................................................................17
5.4. Example................................................................................................................................18
5.4.1. Example of Input Process Image (Input Register) Map..................................................18
5.4.2. Example of Output Process Image (Output Register) Map ............................................19
6. MODBUS TCP/UDP INTERFACE............................................................................................20
6.1 MODBUS TCP/ UDP Protocol...............................................................................................20

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HX-RIO3 Series
6.1.1. Comparison of MODBUS TCP/UDP and MODBUS/RTU .................................................20
6.1.2. MODBUS TCP/ UDP MBAP Header..................................................................................21
6.2 Supported MODBUS Function Codes..................................................................................21
6.2.1. 1(0x01) Read Coils ............................................................................................................22
6.2.2. 2(0x02) Read Discrete Inputs ...........................................................................................22
6.2.3. 3(0x03) Read Holding Registers.......................................................................................23
6.2.4. 4 (0x04) Read Input Registers..........................................................................................23
6.2.5. 5 (0x05) Write Single Coil .................................................................................................24
6.2.6. 6 (0x06) Write Single Register..........................................................................................25
6.2.7. 8 (0x08) Diagnostics .........................................................................................................25
6.2.8. 15 (0x0F) Write Multiple Coils...........................................................................................27
6.2.9. 16 (0x10) Read/Write Multiple Registers..........................................................................28
6.2.10. 23 (0x17) Read/Write Multiple Registers........................................................................29
6.2.11 Error Response................................................................................................................29
6.3 MODBUS Special Register Map ...........................................................................................30
6.3.1 Adapter Identification Special Register (0x1000, 4096)...................................................30
6.3.2 Adapter Watchdog Time, other Time Special Register (0x1020, 4128)...........................31
6.3.3 Adapter Information Special Register (0x1100, 4352)......................................................31
6.3.4 Expansion Slot Information Special Resister (0x2000, 8192)..........................................33
6.4. MODBUS Reference.............................................................................................................34
7. Troubleshooting......................................................................................................................35
How to diagnose by LED indicator............................................................................................35
How to diagnose when device couldn't communicate network ..............................................36
A.1 Product List ..........................................................................................................................37
A.2. Glossary...............................................................................................................................38

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HX-RIO3 Series
1. Important Note
Solid state equipment has operational characteristics differing from those of electromechanical equipment.
Safety Guidelines for the Application, Installation and Maintenance of Solid-State Controls describes some
important differences between solid state equipment and hard-wired electromechanical devices.
Because of this difference, and also because of the wide variety of uses for solid state equipment, all persons
responsible for applying this equipment must satisfy themselves that each intended application of this
equipment is acceptable.
In no event will HITACHI be responsible or liable for indirect or consequential damages resulting from the use
or application of this equipment.
The examples and diagrams in this manual are included solely for illustrative purposes. Because of the many
variables and requirements associated with any installation, HITACHI cannot assume responsibility or liability
for actual use based on the examples and diagrams.
✓If you don't follow the directions, it could cause a personal injury, damage to the equipment or
explosion
⚫Do not assemble the products and wire with power applied to the system. Else it may cause an
electric arc, which can result into unexpected and potentially dangerous action by field devices. Arching is
explosion risk in hazardous locations. Be sure that the area is non-hazardous or remove system power
appropriately before assembling or wiring the modules.
⚫Do not touch any terminal blocks or IO modules when system is running. Else it may cause the unit to
an electric shock or malfunction.
⚫Keep away from the strange metallic materials not related to the unit and wiring works should be
controlled by the electric expert engineer. Else it may cause the unit to a fire, electric shock or malfunction.
✓If you disobey the instructions, there may be possibility of personal injury, damage to equipment
or explosion. Please follow below Instructions.
⚫Check the rated voltage and terminal array before wiring. Avoid the circumstances over 55℃of
temperature. Avoid placing it directly in the sunlight.
⚫Avoid the place under circumstances over 85% of humidity.
⚫Do not place Modules near by the inflammable material. Else it may cause a fire.
⚫Do not permit any vibration approaching it directly.
⚫Go through module specification carefully, ensure inputs, output connections are made with the
specifications. Use standard cables for wiring.
⚫Use Product under pollution degree 2 environment.
Warning!
Caution!

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HX-RIO3 Series
1.1. Safety Instruction
1.1.1. Symbols
Information about practices or circumstances that can cause an explosion in a
hazardous environment, which may lead to personal injury or death property
damage, or economic loss.
Identifies information that is critical for successful application and understanding of
the Product.
Identifies information about practices or circumstances that can lead to personal
Injury, property damage, or economic loss.
Attentions help you to identity a hazard, avoid a hazard, and recognize the
consequences.
1.1.2. Safety Notes
The modules are equipped with electronic components that may be destroyed by
electrostatic discharge. When handling the modules, ensure that the environment
(persons, workplace and packing) is well grounded. Avoid touching conductive
components, e.g. G-BUS Pin.
1.1.3. Certification
Specification

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HX-RIO3 Series
2. Specification
2.1. Interface
2.1.1. RIO3-MBRL
Pin No.
Signal Description
1
System Power, 24V
2
System Power, 24V
3
F.G
4
Field Power, Ground
5
Field Power, 24V

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HX-RIO3 Series
2.2. Specification
2.2.1. General Specification
General specification
UL System Power
Supply voltage: 24Vdc nominal, Class 2
System Power
Supply voltage: 24Vdc nominal
Supply voltage range: 15~28.8Vdc
Reverse polarity protection
Power Dissipation
20mA typical @ 24Vdc
Current for I/O Module
1.0A @ 5Vdc
Isolation
System power to internal logic: Non-isolation
System power I/O driver: Isolation
UL Field Power
Supply voltage: 24Vdc nominal, Class 2
Field Power
Supply voltage: 24Vdc typical
* Field Power Range is different depending on IO Module series.
Refer to IO Module`s Specification.
Max. Current Field Power Contact
DC 8A Max
Wiring
I/O Cable Max. 2.0㎟(AWG14)
Torque
0.8Nm (7 lb-in)
Weight
77g
Module Size
22mm x 109mm x 70mm
Environmental specification
Operating Temperature
- 20℃~ 60 ℃: 1.0A full load is allowed.
UL Temperature
- 20℃~ 60 ℃
Storage Temperature
- 40℃~ 85 ℃
Relative Humidity
5% ~ 90% non-condensing
Mounting
DIN rail

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HX-RIO3 Series
2.2.2. Interface Specification
Interface Specification RIO3-MBRL (RS-485)
Adapter Type
Slave node (MODBUS Serial RTU/ASCII Server)
Protocol
MODBUS RTU and ASCII
Max. Expansion Module
16 slots
Max. Data Size (Input + Output)
Max. Input 256 bytes / Output 256 bytes
Max Length Bus Line
500m
Max. Nodes
8 nodes
Baud Rate
2400, 4800, 9600, 19200, 38400, 57600, 115200 bps
Interface Connector
RJ-45 socket * 2pcs
Settable Node Address
Via Dip switch
Indicator
4 LEDs
1 Green/Red, Module Status (MOD)
1 Green, Physical Connection (LINK)
1 Green, Exchange Date/Traffic Present (ACTIVE)
1 Green/Red, Expansion I/O Module Status (IOS)
Module Location
Starter module left side of RIO3 Series system
General specification
Shock Operating
IEC 60068-2-27
Vibration Resistance
Based on IEC 60068-2-6
Industrial Emissions
EN 61000-6-4/A11 : 2011
Industrial Immunity
EN 61000-6-2 : 2005
Installation Position
Vertical and horizontal installation is available
Product Certifications
CE, UL, EAC

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HX-RIO3 Series
2.3. LED Indicator
2.3.1 MOD (Module Status LED)
Status
LED
To indicate
Not Powered
OFF
Power is not supplied to the unit.
Device Operational
Green
The unit is operating in normal condition.
Unrecoverable Fault
Red
The device has an unrecoverable fault.
- Memory error or CPU watchdog error.
2.3.2 RXD (Receive Data LED)
Status
LED
To indicate
Not Powered or Not Linked
OFF
Device is idle or may not be powered.
Adapter received correct
message frame
Green
Adapter (Slave) received correct frame which address to the
slave or broadcast. About 20msec flashing
2.3.3 TXD (Transmit Data LED)
Status
LED
To indicate
Not Powered
OFF
Device is idle or may not be powered.
Adapter transmit frame
Flashing Green
Adapter (slave) transmit frame. About 20msec flashing.
2.3.4 IOS LED (Extension Module Status LED)
Status
LED
To indicate
Not Powered
OFF
Device may not be powered.
No Expansion Module
Flashing Red
Adapter has no expansion module
Internal Bus Connection,
Run Exchanging I/O
Green
Exchanging I/O data.
Expansion Configuration
Failed
Red
One or more expansion module occurred in fault state.
- Detected invalid expansion module ID.
- Overflowed Input /Output Size
- Too many expansion module
- Initialization failure
- Communication failure.
- Changed expansion module configuration.
- Mismatch vendor code between adapter and expansion
module.
LED
LED Function / Description
LED Color
MOD
Module Status
Green/Red
RXD
Physical Connection
Green
TXD
Exchange Data/Traffic Present
Green
IOS
Expansion Module Status
Green/Red