HP 406 Microtower Business Assembly instructions

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PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 406 Microtower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sqcm
MB, Memory,HDD PCA,ODD PCA,PSU PCA
5
Batteries
All types including standard alkaline and lithium
coin or button style batteriesMB
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
PSU
2
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardantsweighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
system fan, Cooler fan,PSU fan
3
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0

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Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1crisscross screw driver
2#
Description #2 hexagon screw driver
T15
Description #3 electric iron
QUICK 310
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel from the unit.
2. Remove front panel from the unit.
3. Remove all the cable from the unit.
4. Remove HDD from the unit.
5. Remove ODD from the unit.
6. Take off PSU from the unit.
7. Take off the system fan from the unit.
8. Take off Card Reader from the unit.
9. Take off FIO from the unit.
10. Take off Memory from the unit.
11. Take off CPU cooler from the unit.
12. Take off PCA from the unit.
13. Take off battery from the unit.
14. Open the PSU.
15. Take off PSU fan.
16. Take off PCA from the PSU.
17. Take off CAP using electric iron.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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1. Remove access panel
from the unit.
Release screw on the access
panel. Griping the tab at the
end of access panel, pull
towards the rear and remove it
from unit.

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2. Remove front panel
from the unit.
Release 3 bezellatches
from chassis by pulling the
bezellatches outwards.
3.Remove all the cable
from the unit.

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4.Remove HDD from the
unit.

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5. Remove ODD from the
unit.

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6.Take off PSU from the
unit.
Rotate the screw driver to
release PSU from the unit.

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7.Take off the system fan
from the unit
Rotate screw driver to
loose screw and take off the
system fan.
8. Take off Card Reader
from the unit.

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9. Take off FIO from the
unit.
10.Take off Memory from
the unit.
Release memory socket
levers by pulling outward.

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11. Take off CPU cooler
from the unit.
Rotate the screw driver to
release CPU cooler from the
unit.
12.Take off PCA from the
unit.
Rotate screw driver to
loose PCA from the unit.