HP Compaq Business Desktop dc7100 Series Assembly instructions

HP-00007-01, Appendix 3 19-July-2005
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
HP Compaq Business Desktop dc7100 Series - CMT HP business desktop PC – Convertible
Minitower Chassis
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes
Qty items in
product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
With a surface greater than 10
square cm
1 PCS
Batteries All types including standard
alkaline and lithium coin or button
style batteries
1 PCS
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Includes background illuminated
displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
greater than 2.5 cm in diameter or ht
External electrical cables and cords PSU cables, IDE cables, SATA
cables.
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
Components and waste containing
asbestos
Components, parts and materials
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances

HP-00007-01, Appendix 3 19-July-2005
HP Restricted
Page 2
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Flat blade screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
SYSTEM BOARD
1 To remove the access panel (see Figure 1 below):
a) Lift up on the access panel handle and slide the access panel back about
1 inch (2.5 cm).
b) Lift the access panel off the unit.
2 Remove all expansion cards, cables, and any other devices from the system board.
3 To remove the heatsink (see Figure 2 below):
a) Disconnect the heatsink control cable from the system board.
b) Unscrew the four captive screws that secure the heatsink to the system board.
c) Remove the heatsink from atop the processor.
4 To remove the system board (see Figure 3 below):
a) Compress the system board tray handle to release the latch and slide the system board
tray towards the front of the computer to free it from the back of the chassis.
b) Lift the system board out of the chassis.
BATTERY
Locate the battery and battery holder on the system board. Depending on the type of
battery holder on the system board, complete the following instructions to remove the
battery:
TYPE 1 BATTERY HOLDER (see Figure 4 below)
Lift the battery out of the holder.
TYPE 2 BATTERY HOLDER (see Figure 5 below)
To release the battery from its holder, squeeze the metal clamp that extends above one
edge of the battery. When the battery pops up, lift it out.

HP-00007-01, Appendix 3 19-July-2005
HP Restricted
Page 3
3.2 ILLUSTRATIONS
FIGURE 1: Removing the access panel
FIGURE 2: Removing the heatsink
FIGURE 3: Removing the system board
FIGURE 4: Type 1 battery holder
FIGURE 5: Type 2 battery holder